CSPEMI400G [ONSEMI]
SIM Card EMI Filter Array with ESD Protection; 带ESD保护SIM卡的EMI滤波器阵列
| 型号： | CSPEMI400G |
| 厂家： | 
ONSEMI |
| 描述： | SIM Card EMI Filter Array with ESD Protection |
| 文件： | 总11页 (文件大小：1457K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SIM Card EMI Filter Array
with ESD Protection
CSPEMI400
Features
Product Description
•
Three channels of EMI filtering, each with ESD
protection
Two additional channels of ESD-only protection
10kV ESD protection (IEC 61000-4-2, contact
discharge)
25kV ESD protection (HBM)
Greater than 30dB of attenuation at 1GHz
10-bump, 1.960mm x 1.330mm footprint Chip
Scale Package (CSP)
The CSPEMI400 is an EMI filter array with ESD
protection, which integrates three pi filters (C-R-C)
and two additional channels of ESD protection. The
CSPEMI400 has component values of 20pF-47Ω-
20pF, and 20pF-100Ω-20pF. The parts include
avalanche-type ESD diodes on every pin, which
provide a very high level of protection for sensitive
electronic components that may be subjected to
electrostatic discharge (ESD). The ESD diodes
connected to the filter ports safely dissipate ESD
•
•
•
•
•
•
Lead-free version available
strikes of
10kV, exceeding the maximum
Applications
requirement of the IEC 61000-4-2 international
standard. Using the MIL-STD-883 (Method 3015)
specification for Human Body Model (HBM) ESD, the
pins are protected for contact discharges at greater
than 25kV.
•
•
SIM Card slot in mobile handsets
I/O port protection for mobile handsets, notebook
computers, PDAs, etc.
•
EMI filtering for data ports in cell phones, PDAs
or notebook computers
The ESD diodes on pins A4 and C4 ports are
designed and characterized to safely dissipate ESD
strikes of
10kV, well beyond the maximum
requirement of the IEC 61000-4-2 international
standard.
This device is particularly well suited for portable
electronics (e.g. mobile handsets, PDAs, notebook
computers) because of its small package format and
easy-to-use pin assignments.
In particular, the
CSPEMI400 is ideal for EMI filtering and protecting
data lines from ESD for the SIM card slot in mobile
handsets.
The CSPEMI400 is available in a space-saving, low-
profile Chip Scale Package with optional lead-free
finishing.
©2010 SCILLC. All rights reserved.
May 2010 Rev. 2
Publication Order Number:
CSPEMI400/D
CSPEMI400
Electrical Schematic
Lead-free devices are specified by using a "+" character for the top side orientation mark.
Rev. 2 | Page 2 of 11 | www.onsemi.com
CSPEMI400
PIN DESCRIPTIONS
TYPE
PIN
DESCRIPTION
A1
EMI Filter with ESD Protection for RST Signal
EMI
Filter
C1
A2
C2
B1
B2
A3
C3
A4
C4
EMI Filter with ESD Protection for RST Signal
EMI Filter with ESD Protection for CLK Signal
EMI Filter with ESD Protection for CLK Signal
Device Ground
EMI
Filter
Device
Ground
Device Ground
DAT EMI Filter with ESD Protection
DAT EMI Filter with ESD Protection
ESD Proection Channel - VCC Supply
ESD Proection Channel
EMI
Filter
ESD Channel
ESD Channel
Ordering Information
PART NUMBERING INFORMATION
Standard Finish
Lead-free Finish2
Ordering Part
Number1
Ordering Part
Number1
Bumps
Package
Part Marking
Part Marking
10
CSP
CSPEMI400
AG
CSPEMI400G
AG
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a " " character for the top side orientation mark.
+
Rev. 2 | Page 3 of 11 | www.onsemi.com
CSPEMI400
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
RATING
UNITS
Storage Temperature Range
-65 to +150
°C
DC Power per Resistor
100
300
mW
mW
DC Package Power Rating
STANDARD OPERATING CONDITIONS
PARAMETER
RATING
UNITS
Operating Temperature Range
-40 to +85
°C
Rev. 2 | Page 4 of 11 | www.onsemi.com
CSPEMI400
ELECTRICAL OPERATING CHARACTERISTICS1
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
R1
Resistance of R1
Resistance of R2
Capacitance
80
100
120
Ω
R2
C
38
16
47
20
56
24
Ω
VIN = 2.5VDC, 1MHz,
30mV ac
pF
VSTANDOFF
ILEAK
Stand-off Voltage
I = 10µA
6.0
V
Diode Leakage Current
VBIAS = 3.3V
300
nA
VSIG
Signal Voltage
Positive Clamp
Negative Clamp
ILOAD = 10mA
ILOAD = -10mA
5.6
-1.5
6.8
-0.8
9.0
-0.4
V
V
VESD
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
Notes 2 and 4
25
10
kV
kV
b) Contact Discharge per IEC
61000-4-2
VCL
Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Positive Transients
Notes 2,3 and 4
+12
-7
V
V
Negative Transients
fC1
Cut-off frequency
ZSOURCE = 50Ω, ZLOAD = 50Ω
R = 100Ω, C = 20pF
R = 47Ω, C = 20pF
77
85
MHz
MHz
fC2
Cut-off frequency
ZSOURCE = 50Ω, ZLOAD = 50Ω
Note 1: TA=25°C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin
A1, then clamping voltage is measured at Pin C1.
Note 4: Unused pins are left open.
Rev. 2 | Page 5 of 11 | www.onsemi.com
CSPEMI400
Performance Information
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 1. A1-C1 EMI Filter Performance
Figure 2. A2-C2 EMI Filter Performance
Rev. 2 | Page 6 of 11 | www.onsemi.com
CSPEMI400
Performance Information (cont’d)
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 3. A3-C3 EMI Filter Performance
Figure 4. Typical Diode Capacitance vs. Input Voltage (normalized to 2.5VDC)
Rev. 2 | Page 7 of 11 | www.onsemi.com
CSPEMI400
Application Information
The CSPEMI400 provides a bidirectional filter and protector for all the signals and the power line on the SIM
(subscriber identity module) card connector. SIM cards are found in all GSM cellular phones and in some other
handheld devices or card readers. The ESD diodes protect the controller against possible ESD strikes that may
occur when the connector pins are exposed during direct contact, or during insertion of the SIM card into the card
slot. The EMI filter suppresses all high-frequency noise, preventing the unwanted EMI signals from both entering
and exiting the main board. The signals that interface with the SIM card are the Reset, the Clock and the
bidirectional data I/O, as shown in Typical Application Diagram for the SIM Card Interface
.
Note: One channel of the CSPEMI400 with a zener
diode is not shown on the diagram.
Figure 5. Typical Application Diagram for the SIM Card Interface
For best filter and ESD performance, both GND bumps (B1, B2) of the CSPEMI400 should be directly
connected to the Ground plane. A small capacitor of about 1 F is required next to the VCC pin of the SIM
µ
connector in order to improve stability of the SIM card supply rail.
Rev. 2 | Page 8 of 11 | www.onsemi.com
CSPEMI400
Application Information
PARAMETER
VALUE
Pad Size on PCB
0.240mm
Round
Pad Shape
Pad Definition
Non-Solder Mask defined pads
0.290mm Round
Solder Mask Opening
Solder Stencil Thickness
0.125mm - 0.150mm
0.300mm Round
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
50/50 by volume
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball
+50
+20
µ
m
m
Solder Ball Side Coplanarity
µ
Maximum Dwell Time Above Liquidous
60 seconds
260°C
Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder
Paste
Non-Solder MaskDefinedPad
0.240mmDIA.
Solder Stencil Opening
0.300mmDIA.
SolderMaskOpening
0.290mmDIA.
Figure 8. Recommended Non-Solder Mask Defined Pad Illustration
Figure 9. Lead-free (SnAgCu) Solder Ball Reflow Profile
Rev. 2 | Page 9 of 11 | www.onsemi.com
CSPEMI400
CSP Mechanical Specifications
The CSPEMI400 is supplied in a custom Chip Scale Package (CSP). Dimensions are presented below. For
complete information on CSP, see the California Micro Devices CSP Package Information document.
Controlling dimension: millimeters
PACKAGE DIMENSIONS
Custom CSP
10
Package
Bumps
BOTTOM VIEW
A1
SIDE
VIEW
C1
Millimeters
Min Nom Max
Inches
Nom
B2
B1
Dim
Min
Max
C
B
A
1.915 1.960 2.005 0.0754 0.0772 0.0789
1.285 1.330 1.375 0.0506 0.0524 0.0541
0.495 0.500 0.505 0.0195 0.0197 0.0199
0.245 0.250 0.255 0.0096 0.0098 0.0100
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.430 0.435 0.440 0.0169 0.0171 0.0173
0.180 0.230 0.280 0.0071 0.0091 0.0110
0.180 0.230 0.280 0.0071 0.091 0.0110
0.562 0.606 0.650 0.0221 0.0239 0.0256
0.356 0.381 0.406 0.0140 0.0150 0.0160
A1
A2
B1
B2
B3
B4
C1
C2
D1
D2
1
2
3
4
D1
D2
0.30 DIA.
63/37 Sn/Pb (Eutectic) or
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
SOLDER BUMPS
DIMENSIONS IN MILLIMETERS
Package Dimensions for CSPEMI400
Chip Scale Package
3500 pieces
# per tape and
reel
Rev. 2 | Page 10 of 11 | www.onsemi.com
CSPEMI400
CSP Tape and Reel Specifications
POCKET SIZE (mm) TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
PART NUMBER
CHIP SIZE (mm)
B0 X A0 X K0
P0
P1
CSPEMI400
1.96 X 1.33 X 0.606
2.08 X 1.45 X 0.71
8mm
178mm (7")
3500
4mm 4mm
Figure 9. Tape and Reel Mechanical Data
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any
products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising
out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical”
parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating
parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the
rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to
support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or
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Rev. 2 | Page 11 of 11 | www.onsemi.com
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