FDBL0065N40 [ONSEMI]

N 沟道 PowerTrench® MOSFET,40V,300A,0.65mΩ;
FDBL0065N40
型号: FDBL0065N40
厂家: ONSEMI    ONSEMI
描述:

N 沟道 PowerTrench® MOSFET,40V,300A,0.65mΩ

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2014 11 月  
FDBL0065N40  
®
N 沟道 PowerTrench MOSFET  
40 V, 300 A, 0.65 mΩ  
特性  
典型值 R  
典型值 Q  
UIS 能力  
= 0.5 mΩ(在 V = 10 VI = 80 A)  
GS D  
DS(on)  
= 220 nC (在 V = 10 VI = 80 A)  
g(tot)  
GS  
D
D
符合 RoHS 标准  
应用  
工业电机驱动器  
工业电源  
G
工业自动化  
电动工具  
S
电池保护  
如需最新封装图纸,请访问 Fairchild 网站:  
https://www.fairchildsemi.com/evaluate/package-  
specifications/packageDetails.html?id=PN_PSOFA-008  
太阳能逆变器  
UPS 和能源逆变器  
储能  
负载开关  
MOSFET 最大额定值TJ = 25 °C 除非另有说明。  
符号  
VDSS  
VGS  
参数  
额定值  
单位  
40  
V
漏极至源极电压的关系  
栅极至源极电压  
±20  
300  
V
漏极电流 - VGS=101)  
脉冲漏电流  
TC = 25 °C  
TC = 25 °C  
ID  
A
见图 4  
1064  
429  
EAS  
PD  
mJ  
W
单脉冲雪崩能量  
功耗  
(注 2)  
(注 3)  
2.86  
W/°C  
°C  
超过 25 °C 时降额  
工作和存储温度  
结点 - 壳体的热阻  
结至环境热阻最大值  
TJ, TSTG  
RqJC  
-55 + 175  
0.35  
43  
°C/W  
°C/W  
RqJA  
注意:  
1: 电流受接合线配置限制。  
2: 电感充电期间,起始 T = 25 °CL = 0.3 mHI = 84 AV = 40 V,雪崩时间 V = 0 V。  
J
AS  
DD  
DD  
3: R  
等于结至壳体和壳体至环境热阻之和,其中,壳体热参考定义为漏极引脚的焊料安装表面。 R  
具备设计保证,其中 R  
由电路板  
θJA  
θJC  
θJA  
2
设计确定。此处的最大额定值基于安装在 2oz 铜的 1 in 焊盘上。  
封装标识与定购信息  
器件标识  
器件  
封装  
FDBL0065N40  
FDBL0065N40  
MO-299A  
-
-
-
1
www.fairchildsemi.com  
©2014 飞兆半导体公司  
FDBL0065N40 版本 C3  
电气特性TJ = 25 °C 除非另有说明。  
符号  
关断特性  
BVDSS  
IDSS  
参数  
测试条件  
最小值 典型值 最大值  
单位  
ID = 250 μA, VGS = 0 V  
40  
-
-
-
-
-
-
1
V
漏极至源极击穿电压  
T = 25 °C  
μA  
mA  
nA  
V
DS = 40 V,  
J
漏极至源极漏电流  
栅极至源极漏电流  
VGS = 0 V  
TJ = 175 °C (Note 4)  
-
1
IGSS  
VGS = ±20 V  
-
±100  
导通特性  
VGS(th)  
2.0  
3.0  
4.0  
V
栅极至源极阀值电压  
漏极至源极导通电阻  
VGS = VDSID = 250 μA  
TJ = 25 °C  
-
-
0.50  
0.86  
0.65  
1.10  
mΩ  
mΩ  
I
D = 80 A,  
RDS(on)  
VGS= 10 V  
TJ = 175 °C (注 4)  
动态特性  
Ciss  
-
-
-
-
-
15900  
4025  
604  
2.6  
-
pF  
pF  
pF  
Ω
nC  
nC  
nC  
nC  
输入电容  
VDS = 25 VVGS = 0 V,  
f = 1 MHz  
Coss  
Crss  
Rg  
-
输出电容  
-
-
反向传输电容  
f = 1 MHz  
栅极阻抗  
Qg(ToT)  
Qg(th)  
Qgs  
220  
29  
296  
39  
-
10 V 的栅极总电荷  
阀值栅极电荷  
VGS = 0 10 V  
VGS = 0 2 V  
V
DD = 20 V  
-
I
D = 80 A  
-
73  
栅极 - 源极栅极电荷  
栅极 - 漏极 米勒 电荷  
Qgd  
-
41  
-
开关特性  
ton  
td(on)  
tr  
-
-
-
-
-
-
-
54  
82  
106  
52  
-
221  
ns  
ns  
ns  
ns  
ns  
ns  
导通时间  
导通延迟  
上升时间  
关断延迟  
下降时间  
关断时间  
-
-
V
V
DD = 20 VID = 80 A,  
GS = 10 VRGEN = 6 Ω  
td(off)  
tf  
-
-
toff  
215  
Drain-Source Diode Characteristics  
-
-
-
-
-
1.25  
1.2  
V
I
SD =80 AVGS = 0 V  
VSD  
源极 - 漏极二极管电压  
-
V
ISD = 40 AVGS = 0 V  
trr  
119  
228  
133  
274  
ns  
nC  
反向恢复时间  
反向恢复电荷  
IF = 80 AdISD/dt = 100 A/μs,  
VDD = 32 V  
Qrr  
说明:  
4: 其最大值根据 T = 175 °C 时的设计确定。 在生产中,未对此条件测试产品。  
J
2
www.fairchildsemi.com  
FDBL0065N40 版本 C3  
典型特性  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
700  
600  
500  
400  
300  
200  
100  
0
CURRENT LIMITED  
BY PACKAGE  
VGS = 10V  
CURRENT LIMITED  
BY SILICON  
0.0  
0
25  
50  
75  
100  
125  
150  
175  
25  
50  
75  
100  
125  
150  
175  
200  
TC, CASE TEMPERATURE(oC)  
TC, CASE TEMPERATURE(oC)  
2. 最大连续漏电流与壳体温度的关系  
1. 标准化功耗与壳体温度的关系  
2
DUTY CYCLE - DESCENDING ORDER  
1
D = 0.50  
0.20  
P
0.10  
DM  
0.05  
0.02  
0.01  
t
1
0.1  
t
2
注:  
占空比因D = t /t  
1
2
SINGLE PULSE  
峰值 T = P  
x Z  
x R  
+ T  
J
DM  
θJA  
θJA C  
0.01  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
101  
t, RECTANGULAR PULSE DURATION(s)  
3. 标准化最大瞬态热阻抗  
10000  
1000  
100  
VGS = 10V  
T
= 25 °C  
C
对于温度  
超过 25 °C 电流峰值降额  
:  
175 - T  
I = I  
C
2
150  
SINGLE PULSE  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
101  
t, RECTANGULAR PULSE DURATION(s)  
4. 峰值电流能力  
3
www.fairchildsemi.com  
FDBL0065N40 版本 C3  
典型特性  
10000  
1000  
100  
10  
2000  
1000  
t
R = 0  
= (L)(I )/(1.3*RATED BV  
- V  
)
AV  
AS  
DSS  
DD  
t
R 0  
= (L/R)ln[(I *R)/(1.3*RATED BV  
- V ) +1]  
DSS DD  
AV  
AS  
100  
10  
100us  
1ms  
STARTING TJ = 25oC  
OPERATION IN THIS  
AREA MAY BE  
LIMITED BY r  
DS(on)  
1
10ms  
STARTING TJ = 150oC  
SINGLE PULSE  
100ms  
T
J
= MAX RATED  
o
T
C
= 25  
C
1
0.1  
0.001 0.01  
0.1  
1
10  
100 1000 10000  
0.1  
1
10  
100 200  
tAV, TIME IN AVALANCHE (ms)  
VDS, DRAIN TO SOURCE VOLTAGE (V)  
注:请参考 Fairchild 应用指南 AN7514 AN7515  
5. 正向偏压安全工作区  
6. 非箝位感性开关性能  
300  
240  
180  
120  
60  
400  
PULSE DURATION = 80μs  
DUTY CYCLE = 0.5% MAX  
VGS = 0 V  
100  
VDD = 5V  
TJ = 175 o  
C
TJ = 25 o  
C
10  
1
TJ = 25oC  
TJ = -55oC  
TJ = 175oC  
0
0.1  
2
3
4
5
6
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
VGS, GATE TO SOURCE VOLTAGE (V)  
VSD, BODY DIODE FORWARD VOLTAGE (V)  
7. 传递特性  
8. 正向二极管特性  
400  
350  
300  
250  
200  
150  
100  
50  
VGS  
350  
300  
250  
200  
150  
100  
50  
15V Top  
10V  
8V  
7V  
6V  
VGS  
15V Top  
5V  
10V  
8V
7V  
6V  
5.5V  
5.5V  
5V Bottom  
5V Bottom  
5V  
80μs PULSE WIDTH  
80μs PULSE WIDTH  
Tj=175oC  
Tj=25oC  
0
0.0  
0
0.0  
0.5  
1.0  
1.5  
2.0  
0.5  
1.0  
1.5  
2.0  
VDS, DRAIN TO SOURCE VOLTAGE (V)  
VDS, DRAIN TO SOURCE VOLTAGE (V)  
9. 饱和特性  
10. 饱和特性  
4
www.fairchildsemi.com  
FDBL0065N40 版本 C3  
典型特性  
5
4
3
2
1
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
PULSE DURATION = 80μs  
DUTY CYCLE = 0.5% MAX  
ID = 80A  
PULSE DURATION = 80μs  
DUTY CYCLE = 0.5% MAX  
TJ = 175oC  
TJ = 25oC  
ID = 80A  
VGS = 10V  
0
2
4
6
8
10  
-80  
-40  
0
40  
80  
120  
160  
200  
TJ, JUNCTION TEMPERATURE(oC)  
VGS, GATE TO SOURCE VOLTAGE (V)  
11.RDSON 与栅极电压的关系  
12. 标准化 RDSON 与结温的关系  
1.5  
1.2  
0.9  
0.6  
0.3  
0.0  
1.10  
1.05  
1.00  
0.95  
0.90  
VGS = VDS  
ID = 1mA  
I
D
= 250μA  
-80  
-40  
0
40  
80  
120  
160  
200  
-80  
-40  
0
40  
80  
120  
160  
200  
TJ, JUNCTION TEMPERATURE (oC)  
TJ, JUNCTION TEMPERATURE(oC)  
13. 标准化栅极阀值电压与温度的关系  
14. 标准化漏极至源极击穿电压与结温的关系  
100000  
10  
ID = 80A  
VDD =16V  
8
Ciss  
VDD = 20V  
10000  
1000  
100  
VDD = 24V  
6
Coss  
4
2
0
Crss  
f = 1MHz  
GS = 0V  
V
0.1  
1
10  
100  
0
20 40 60 80 100 120 140 160 180 200 220  
Qg, GATE CHARGE(nC)  
VDS, DRAIN TO SOURCE VOLTAGE (V)  
15. 电容与漏极-源极电压的关系  
16. 栅极电荷与栅极-源极电压的关系  
5
www.fairchildsemi.com  
FDBL0065N40 版本 C3  
9.70  
9.90  
DETAIL "A"  
B
0.60  
0.80  
0.40  
0.60  
(0.40)  
10°  
0.60  
0.80  
(2X)  
11.58  
11.78  
(3.30)  
10.28  
10.48  
0.50  
0.70  
0.20  
C A B  
DETAIL "A"  
1
8
0.60  
0.70  
0.90 (8X)  
0.25  
1.20  
7X  
C
C
A B  
(0.35)  
0.20  
8.40  
10.20  
TOP VIEW  
5.10  
4.45  
DETAIL "B"  
6.64  
6.64  
2.95  
2.90  
0.20  
0.10  
C
0.40  
0.60  
8.10  
4.99  
2.20  
2.40  
C
2.04  
13.28  
1.46  
C
0.86  
0.60  
SIDE VIEW  
2.80  
1
8
1.20  
0.80  
9.80  
10.00  
A
0.20  
C
A B  
(8.00)  
LAND PATTERN  
RECOMMENDATION  
1.90  
2.10  
5.19  
5.89  
4.73  
(2X)  
0.10  
2.60  
(2X)  
(2X)  
6.55  
6.75  
(7.15)  
3.30  
NOTES: UNLESS OTHERWISE SPECIFIED  
A) PACKAGE STANDARD REFERENCE:  
1.20  
0.65  
JEDEC MO-299, ISSUE A, DATED NOVEMBER  
2009.  
3X  
2X  
3.75  
7.40  
7.60  
B) ALL DIMENSIONS ARE IN MILLIMETERS.  
C) DIMENSIONS DO NOT INCLUDE BURRS  
OR MOLD FLASH. MOLD FLASH OR  
BURRS DOES NOT EXCEED 0.10MM.  
D) DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M-1994.  
(8.30)  
BOTTOM VIEW  
10°  
E) DRAWING FILE NAME: MKT-PSOF08AREV3  
(0.35)  
DETAIL "B"  
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are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
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