FDC6325L [ONSEMI]
集成式负载开关;
| 型号： | FDC6325L |
| 厂家： | 
ONSEMI |
| 描述： | 集成式负载开关 开关 驱动 光电二极管 接口集成电路 驱动器 |
| 文件： | 总5页 (文件大小：304K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
www.onsemi.com
Integrated Load Switch
FDC6325L
1
TSOT23 6−Lead
CASE 419BL
General Description
This device is particularly suited for compact power management in
portable electronic equipment where 2.5 V to 8 V input and 1.8 A
output current capability are needed. This load switch integrates a
small N−Channel power MOSFET (Q1) which drives a large
P−Channel power MOSFET (Q2) in one tiny SUPERSOTt−6
package.
MARKING DIAGRAM
XXX MG
G
Features
1
• V
= 0.2 V @ V = 5 V, I = 1.5 A, R
= 0.13 W
DROP
DROP
DROP
IN
L
(ON)
XXX = Specific Device Code
M
= Date Code
V
= 0.2 V @ V = 3.3 V, I = 1.2 A, R = 0.16 W
IN
L
(ON)
G
= Pb−Free Package
(Note: Microdot may be in either location)
V
= 0.2 V @ V = 2.5 V, I = 1 A, R
= 0.18 W
IN
L
(ON)
• SUPERSOTt−6 Package Design Using Copper Lead Frame for
Superior Thermal and Electrical Capabilities
• This is a Pb−Free Device
PINOUT
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Vout,C1
3
2
1
Vin,R1
4
5
6
Symbol
Parameter
Input Voltage Range
On/Off Voltage Range
Load Current
Continuous (Note 1)
Pulsed (Notes 1 & 3)
Ratings
2.8 − 8
1.5 − 8
1.8
Unit
V
Q2
V
IN
ON/OFF
ON/OFF
Vout,C1
R2
V
V
Q1
I
L
A
R1,C1
5
P
Maximum Power Dissipation (Note 2)
0.7
W
°C
kV
D
T , T
Operating and Storage Temperature Range
−55 to 150
6
J
STG
(See Application Circuit)
ESD
Electrostatic Discharge Rating
MIL−STD−883D Human Body Model
(100 pF / 1500 W)
EQUIVALENT CIRCUIT
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
V
DROP
+
−
1. V = 8 V, V
= 8 V, TA = 25°C
IN
ON/OFF
OUT
IN
2. R
is the sum of the junction−to−case and case−to−ambient thermal
q
JA
resistance where the case thermal reference is defined as the solder
mounting surface of the drain pins. R
is guaranteed by design while R
q
CA
q
JC
ON/OFF
is determined by the user’s board design.
THERMAL CHARACTERISTICS
ORDERING INFORMATION
See detailed ordering and shipping information on page 2 of
this data sheet.
Symbol
Parameter
Ratings
Unit
RqJA
Thermal Resistance, Junction−to−Ambient
(Note 2)
180
°C/W
RqJC
Thermal Resistance, Junction−to−Case
(Note 2)
60
°C/W
© Semiconductor Components Industries, LLC, 1998
1
Publication Order Number:
March, 2022 − Rev. 5
FDC6325L/D
FDC6325L
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Symbol
OFF CHARACTERISTICS
Forward Leakage Current
ON CHARACTERISTICS (Note 3)
Conduction Voltage Drop
Parameter
Conditions
Min
Typ
Max
Unit
mA
V
I
V
= 8 V, V
= 5 V, V
= 0 V
1
FL
IN
ON/OFF
V
V
V
V
V
V
V
V
V
V
= 3.3 V, I = 1.5 A
0.15
0.145
0.13
0.2
0.2
DROP
IN
ON/OFF
L
= 3.3 V, V
= 2.5 V, V
= 3.3 V, I = 1.2 A
L
IN
ON/OFF
ON/OFF
= 3.3 V, I = 1 A
0.2
IN
L
R
Q
− Static On−Resistance
= −5 V, I = −1.8 A
0.115
0.13
0.13
0.16
0.18
W
(ON)
2
GS
D
= −3.3 V, I = −1.6 A
GS
D
= −2.5 V, I = −1.5 A
0.155
GS
D
I
L
Load Current
= 0.13 V, V = 5 V, V = 3.3 V
ON/OFF
1
1
1
A
DROP
DROP
DROP
IN
= 0.16 V, V = 3.3 V, V
= 3.3 V
IN
ON/OFF
= 0.2 V, V = 2.5 V, V
= 3.3 V
IN
ON/OFF
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
3. Pulse Test: Pulse Width ≤ 300 ms, Duty cycle ≤ 2.0 %.
ORDERING INFORMATION
†
Device
Device Marking
Package Type
Shipping
FDC6325L
.325
TSOT−23−6 (Pb−free)
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
FDC6325L Load Switch Application
Q2
IN
OUT
C1
R1
ON/OFF
LOAD
Ci
Q1
Co
R2
Figure 1. Application Circuit
External Component Recommendation
For Co £ 1 mF applications:
Then select R1 such that R1/R2 ratio maintains between
10 − 100. R1 is required to turn Q2 off. For SPICE
simulation, users can download a “FDC6325L.MOD” Spice
model from onsemi Web Site at www.onsemi.com
First select R2, 100 − 1 kW, for Slew Rate control.
C1 £ 1000 pF can be added in addition to R2 for further
In−rush current control.
www.onsemi.com
2
FDC6325L
TYPICAL ELECTRICAL CHARACTERISTICS
(TA = 25°C unless otherwise noted)
0.5
0.4
0.3
0.2
0.1
0
0.5
0.4
T
A
= 125°C
T = 125°C
A
0.3
0.2
0.1
0
T
= 25°C
T = 25°C
A
A
V
V
= 5 V
V
IN
= 3.3 V
IN
= 1.5 − 8 V
V
= 1.5 − 8 V
ON/OFF
ON/OFF
PW = 300 ms, D ≤ 2%
PW = 300 ms, D ≤ 2%
0
1
2
3
4
0
1
2
3
4
I , (A)
L
I , (A)
L
Figure 1. Conduction Voltage Drop Variation
with Load Current
Figure 2. Conduction Voltage Drop Variation
with Load Current
0.5
0.4
0.6
I
V
= 1 A
L
= 1.5 − 8 V
0.5
0.4
0.3
0.2
0.1
0
ON/OFF
PW = 300 ms, D ≤ 2%
T
A
= 125°C
0.3
0.2
0.1
0
T
= 25°C
A
T
= 125°C
A
V
V
= 2.5 V
IN
= 1.5 − 8 V
ON/OFF
T
= 25°C
A
PW = 300 ms, D ≤ 2%
0
1
2
3
4
1
2
3
4
5
I , (A)
L
V , (V)
IN
Figure 3. Conduction Voltage Drop Variation
with Load Current
Figure 4. On−Resistance Variation with
Input Voltage
1
D = 0.5
0.5
R
ꢀ(t) = r(t) * R
JA
θ
JA
θ
0.2
0.1
0.2
0.1
R
= See Note 2
JA
θ
P(pk)
0.05
0.05
t1
0.02
0.01
t2
0.02
0.01
T − T = P * R
(t)
JA
θ
J
A
Single Pulse
Duty Cycle, D = t1 / t2
0.005
0.00001
0.0001
0.001
0.01
0.1
1
10
100
300
t 1, TIME (s)
Figure 5. Transient Thermal Response Curve
Note: Thermal characterization performed using the conditions described in Note 2.
Transient thermal response will change depending on the circuit board design.
SUPERSOT is a trademark of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other
countries.
www.onsemi.com
3
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TSOT23 6−Lead
CASE 419BL
ISSUE A
1
DATE 31 AUG 2020
SCALE 2:1
GENERIC
MARKING DIAGRAM*
XXX MG
G
1
XXX = Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present. Some products
may not follow the Generic Marking.
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
DOCUMENT NUMBER:
DESCRIPTION:
98AON83292G
TSOT23 6−Lead
PAGE 1 OF 1
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
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rights of others.
© Semiconductor Components Industries, LLC, 2018
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相关型号：
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FAIRCHILD
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