FDD7N25LZTM [ONSEMI]

功率 MOSFET,N 沟道,UniFETTM,250 V,6.2A,550mΩ,DPAK;
FDD7N25LZTM
型号: FDD7N25LZTM
厂家: ONSEMI    ONSEMI
描述:

功率 MOSFET,N 沟道,UniFETTM,250 V,6.2A,550mΩ,DPAK

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June 2016  
FDD7N25LZ  
N-Channel UniFET MOSFET  
250 V, 6.2 A, 550 mΩ  
TM  
Features  
Description  
RDS(on) = 430 mΩ (Typ.) @ VGS = 10 V, ID = 3.1 A  
Low Gate Charge (Typ. 12 nC)  
Low Crss (Typ. 8 pF)  
UniFETTM MOSFET is Fairchild Semiconductor’s high voltage  
MOSFET family based on planar stripe and DMOS technology.  
This MOSFET is tailored to reduce on-state resistance, and to  
provide better switching performance and higher avalanche en-  
ergy strength. This device family is suitable for switching power  
converter applications such as power factor correction (PFC),  
flat panel display (FPD) TV power, ATX and electronic lamp bal-  
lasts.  
100% Avalanche Tested  
Improved dv/dt Capability  
ESD Improved Capability  
RoHS Compliant  
Applications  
LCD/LED/PDP TV  
Consumer Appliances  
Lighting  
Uninterruptible Power Supply  
AC-DC Power Supply  
D
D
G
G
S
D-PAK  
S
MOSFET Maximum Ratings TC = 25oC unless otherwise noted.  
Symbol  
VDSS  
VGSS  
Parameter  
FDD7N25LZTM  
Unit  
V
Drain to Source Voltage  
Gate to Source Voltage  
250  
±20  
V
- Continuous (TC = 25oC)  
- Continuous (TC = 100oC)  
- Pulsed  
6.2  
ID  
Drain Current  
A
3.7  
IDM  
Drain Current  
(Note 1)  
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
25  
A
mJ  
A
EAS  
IAR  
Single Pulsed Avalanche Energy  
Avalanche Current  
115  
5.5  
EAR  
dv/dt  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
5.6  
mJ  
V/ns  
W
W/oC  
oC  
10  
(TC = 25oC)  
- Derate Above 25oC  
56  
PD  
Power Dissipation  
0.45  
-55 to +150  
300  
TJ, TSTG  
TL  
Operating and Storage Temperature Range  
Maximum Lead Temperature for Soldering, 1/8” from Case for 5 Seconds  
oC  
Thermal Characteristics  
Symbol  
Parameter  
Unit  
FDD7N25LZTM  
RθJC  
RθJA  
Thermal Resistance, Junction to Case, Max.  
Thermal Resistance, Junction to Ambient, Max.  
2.2  
oC/W  
110  
www.fairchildsemi.com  
©2010 Fairchild Semiconductor Corporation  
FDD7N25LZ Rev. 1.5  
1
Package Marking and Ordering Information  
Part Number  
Top Mark  
Package  
Packing Method  
Reel Size  
Tape Width  
Quantity  
FDD7N25LZ  
DPAK  
Tape and Reel  
330 mm  
16 mm  
2500 units  
FDD7N25LZTM  
Electrical Characteristics TC = 25oC unless otherwise noted.  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
Off Characteristics  
BVDSS  
Drain to Source Breakdown Voltage  
ID = 250 μA, VGS = 0 V, TC = 25oC  
D = 250 μA, Referenced to 25oC  
DS = 250 V, VGS = 0 V  
VDS = 200 V, TC = 125oC  
VGS = 20 V, VDS = 0 V  
VGS = -20 V, VDS = 0 V  
250  
-
-
-
-
V
ΔBVDSS  
/ ΔTJ  
Breakdown Voltage Temperature  
Coefficient  
I
0.25  
V/oC  
V
-
-
-
-
-
-
-
-
1
IDSS  
Zero Gate Voltage Drain Current  
μA  
10  
10  
-10  
IGSSF  
IGSSR  
Gate to Body Leakage Current, Forward  
Gate to Body Leakage Current, Reverse  
μA  
μA  
On Characteristics  
VGS(th)  
RDS(on)  
gFS  
Gate Threshold Voltage  
VGS = VDS, ID = 250 μA  
1.0  
-
2.5  
0.55  
0.57  
-
V
Ω
S
V
GS = 10 V, ID = 3.1 A  
-
-
-
0.43  
0.45  
7
Static Drain to Source On Resistance  
Forward Transconductance  
VGS = 5 V, ID = 3.1 A  
VDS = 20 V, ID = 3.1 A  
Dynamic Characteristics  
Ciss  
Input Capacitance  
-
-
-
-
-
-
480  
65  
8
635  
85  
12  
16  
-
pF  
pF  
pF  
nC  
nC  
nC  
VDS = 25 V, VGS = 0 V,  
f = 1 MHz  
Coss  
Crss  
Qg(tot)  
Qgs  
Output Capacitance  
Reverse Transfer Capacitance  
Total Gate Charge at 10V  
Gate to Source Gate Charge  
Gate to Drain “Miller” Charge  
12  
1.5  
4
V
V
DS = 250 V ID = 6.2 A,  
GS = 10 V  
(Note 4)  
Qgd  
-
Switching Characteristics  
td(on)  
tr  
td(off)  
tf  
Turn-On Delay Time  
Turn-On Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
-
-
-
-
10  
15  
75  
30  
30  
40  
ns  
ns  
ns  
ns  
VDD = 250 V, ID = 6.2 A,  
GS = 10 V, RG = 25 Ω  
V
160  
70  
(Note 4)  
Drain-Source Diode Characteristics  
IS  
Maximum Continuous Drain to Source Diode Forward Current  
Maximum Pulsed Drain to Source Diode Forward Current  
-
-
-
-
-
-
-
6.2  
25  
1.4  
-
A
A
ISM  
VSD  
trr  
Drain to Source Diode Forward Voltage  
Reverse Recovery Time  
VGS = 0 V, ISD = 6.2 A  
-
V
130  
0.6  
ns  
μC  
V
GS = 0 V, ISD = 6.2 A,  
dIF/dt = 100 A/μs  
Qrr  
Reverse Recovery Charge  
-
Notes:  
1. Repetitive rating: pulse-width limited by maximum junction temperature.  
2. L = 6 mH, I = 6.2 A, V = 50 V, R = 25 Ω, starting T = 25°C.  
AS  
DD  
G
J
3. I 6.2 A, di/dt 200 A/μs, V BV  
, starting T = 25°C.  
SD  
DD  
DSS  
J
4. Essentially independent of operating temperature typical characteristics.  
www.fairchildsemi.com  
©2010 Fairchild Semiconductor Corporation  
FDD7N25LZ Rev. 1.5  
2
Typical Performance Characteristics  
Figure 1. On-Region Characteristics  
Figure 2. Transfer Characteristics  
30  
20  
VGS = 10.0V  
10  
7.0V  
5.0V  
3.5V  
3.0V  
2.5V  
10  
150oC  
25oC  
1
-55oC  
1
* Notes :  
1. VDS = 20V  
*Notes:  
1. 250μs Pulse Test  
2. TC = 25oC  
0.1  
2. 250μs Pulse Test  
0.1  
0.03  
1
2
3
4
5
0.03  
0.1  
1
10  
VGS, Gate-Source Voltage[V]  
VDS, Drain-Source Voltage[V]  
Figure 3. On-Resistance Variation vs.  
Drain Current and Gate Voltage  
Figure 4. Body Diode Forward Voltage  
Variation vs. Source Current  
and Temperature  
1.5  
100  
1.2  
150oC  
10  
1
25oC  
0.9  
VGS = 10V  
VGS = 20V  
0.6  
Notes:  
1. VGS = 0V  
* Note : TJ = 25oC  
12 15  
2. 250μs Pulse Test  
0.3  
0.1  
0.0  
0
3
6
9
18  
0.4  
0.8  
1.2  
1.6  
ID, Drain Current [A]  
VSD, Body Diode Forward Voltage [V]  
Figure 5. Capacitance Characteristics  
Figure 6. Gate Charge Characteristics  
10  
1000  
Ciss  
VDS = 50V  
V
DS = 125V  
8
6
4
2
0
VDS = 200V  
Coss  
100  
* Note:  
1. VGS = 0V  
2. f = 1MHz  
Crss  
C
C
C
= C + C (C = shorted)  
gs gd ds  
iss  
10  
5
= C + C  
ds gd  
= C  
gd  
oss  
rss  
* Note : ID = 6.2A  
9
0
3
6
12  
0.1  
1
10  
30  
Qg, Total Gate Charge [nC]  
VDS, Drain-Source Voltage [V]  
www.fairchildsemi.com  
©2010 Fairchild Semiconductor Corporation  
FDD7N25LZ Rev. 1.5  
3
Typical Performance Characteristics (Continued)  
Figure 7. Breakdown Voltage Variation  
vs. Temperature  
Figure 8. On-Resistance Variation  
vs. Temperature  
3.0  
2.5  
2.0  
1.5  
1.0  
1.2  
1.1  
1.0  
0.9  
* Notes :  
1. VGS = 0V  
* Notes :  
1. VGS = 10V  
0.5  
2. ID = 250uA  
2. ID = 3.1A  
0.8  
-80  
0
-80  
-40  
0
40  
80  
120  
160  
-40  
0
40  
80  
120  
160  
o
o
TJ, Junction Temperature [C]  
TJ, Junction Temperature [C]  
Figure 9. Maximum Safe Operating Area  
Figure 10. Maximum Drain Current  
vs. Case Temperature  
40  
7
6
5
4
3
2
1
0
30μs  
10  
100μs  
1ms  
10ms  
1
DC  
Operation in This Area  
is Limited by R DS(on)  
0.1  
* Notes :  
1. TC = 25oC  
2. TJ = 150oC  
3. Single Pulse  
0.01  
0.1  
1
10  
100  
400  
25  
50  
75  
100  
125  
150  
TC, Case Temperature [oC]  
VDS, Drain-Source Voltage [V]  
Figure 11. Transient Thermal Response Curve  
5
1
0.5  
0.2  
0.1  
PDM  
t1  
0.05  
t2  
0.1  
0.02  
0.01  
* Notes :  
1. ZθJC(t) = 2.2oC/W Max.  
2. Duty Factor, D=t1/t2  
3. TJM - TC = PDM * ZθJC(t)  
Single pulse  
0.01  
10-5  
10-4  
10-3  
10-2  
10-1  
1
t , Rectangular Pulse Duration [sec]  
1
www.fairchildsemi.com  
©2010 Fairchild Semiconductor Corporation  
FDD7N25LZ Rev. 1.5  
4
I
= const.  
G
Figure 12. Gate Charge Test Circuit & Waveform  
RL  
VDS  
90%  
VDS  
VDD  
VGS  
RG  
10%  
VGS  
DUT  
V
GS  
td(on)  
tr  
td(off)  
tf  
t on  
t off  
Figure 13. Resistive Switching Test Circuit & Waveforms  
VGS  
Figure 14. Unclamped Inductive Switching Test Circuit & Waveforms  
www.fairchildsemi.com  
©2010 Fairchild Semiconductor Corporation  
FDD7N25LZ Rev. 1.5  
5
+
DUT  
VDS  
_
I SD  
L
Driver  
RG  
Same Type  
as DUT  
VDD  
VGS  
• dv/dt controlled by RG  
• ISD controlled by pulse period  
Gate Pulse Width  
--------------------------  
VGS  
D =  
Gate Pulse Period  
10V  
( Driver )  
IFM , Body Diode Forward Current  
I SD  
di/dt  
( DUT )  
IRM  
Body Diode Reverse Current  
Body Diode Recovery dv/dt  
VSD  
VDS  
( DUT )  
VDD  
Body Diode  
Forward Voltage Drop  
Figure 15. Peak Diode Recovery dv/dt Test Circuit & Waveforms  
www.fairchildsemi.com  
©2010 Fairchild Semiconductor Corporation  
FDD7N25LZ Rev. 1.5  
6
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
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