FDG6323L [ONSEMI]

集成式负载开关;
FDG6323L
型号: FDG6323L
厂家: ONSEMI    ONSEMI
描述:

集成式负载开关

开关 PC 驱动 光电二极管 接口集成电路 驱动器
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FDG6323L  
Integrated Load Switch  
Features  
VDROP=0.2V @ VIN=5V, IL=0.36A. R(ON) = 0.55W  
VDROP=0.2V @ VIN=2.5V, IL=0.27A. R(ON) = 0.75W.  
General Description  
This device is particularly suited for compact  
power management in portable electronic  
equipment where 2.5V to 8V input and 0.6A  
output current capability are needed. This load  
Very small package outline SC70-6.  
Control MOSFET (Q1) includes Zener protection for ESD  
ruggedness (>6KV Human Body Model).  
switch integrates  
a small N-Channel power  
High density cell design for extremely low  
on-resistance.  
MOSFET (Q1) which drives a large P-Channel  
power MOSFET (Q2) in one tiny SC70-6  
package.  
Compact industry standard SC70-6 surface mount package.  
SuperSOTTM-8  
SO-8  
SOT-23  
SuperSOTTM-6  
SC70-6  
SOT-223  
EQUIVALENT APPLICATION  
VOUT , C1  
VIN , R1  
3
4
5
6
Q2  
VDROP  
+
-
OUT  
IN  
VON/OFF  
VOUT , C1  
2
1
Q1  
ON/OFF  
1
R1 , C1  
R2  
pin  
SC70-6  
See Application Circuit  
Absolute Maximum Ratings TA = 25°C unless otherwise noted  
Symbol  
Parameter  
FDG6323L  
2.5 - 8  
1.5 - 8  
0.6  
Units  
V
VIN  
Input Voltage Range  
On/Off Voltage Range  
Load Current  
VON/OFF  
IL  
V
- Continuous (Note 1)  
- Pulsed  
A
(Note 1 & 3)  
1.8  
PD  
Maximum Power Dissipation  
(Note 2)  
0.3  
W
°C  
kV  
TJ,TSTG  
ESD  
Operating and Storage Temperature Range  
-55 to 150  
6
Electrostatic Discharge Rating MIL-STD-883D Human Body  
Model (100pf/1500Ohm)  
THERMAL CHARACTERISTICS  
RqJA  
Thermal Resistance, Junction-to-Ambient (Note 2)  
415  
°C/W  
Publication Order Number:  
FDG6323L/D  
© 1999 Semiconductor Components Industries, LLC.  
October-2017, Rev. 3  
Electrical Characteristics (TA = 25°C unless otherwise noted)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
µA  
OFF CHARACTERISTICS  
IFL  
Forward Leakage Current  
VIN = 8 V, VON/OFF = 0 V  
1
ON CHARACTERISTICS (Note 3)  
VDROP  
Conduction Voltage Drop  
VIN = 5 V, VON/OFF = 3.3 V, IL = 0.36 A  
VIN = 2.5 V, VON/OFF = 3.3 V, IL = 0.27 A  
VGS = -5 V, ID = -0.6 A  
0.14  
0.15  
0.41  
0.58  
0.2  
0.2  
V
R(ON)  
Q2 - Static On-Resistance  
Load Current  
0.55  
0.75  
W
VGS = -2.5 V, ID = -0.5 A  
IL  
VDROP = 0.2 V, VIN = 5 V, VON/OFF = 3.3 V  
VDROP = 0.2 V, VIN = 2.5 V, VON/OFF = 3.3 V  
0.36  
0.27  
A
Notes:  
1. Range of Vin can be up to 8V, but R1 and R2 must be scaled such that VGS of Q2 does not exceed -8V.  
2. RqJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins.  
RqJC is guaranteed by design while RqCA is determined by the user's board design.  
3. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%  
FDG6323L Load Switch Application  
APPLICATION CIRCUIT  
Q2  
IN  
OUT  
R1  
C1  
Co  
Q1  
LOAD  
ON/OFF  
R2  
External Component Recommendation  
R1 is required to turn Q2 off.  
R2 is optional for Slew Rate Control.  
For Co £ 1uF applications:  
First select R2,100 - 1KW, for Slew Rate control.  
Then select R1 such that R1/R2 ratio maintains between 10 - 100.  
www.onsemi.com  
2
Typical Electrical Characteristics (TA = 25 OC unless otherwise noted )  
1.5  
1.2  
0.9  
0.6  
0.3  
0
1.5  
1.2  
0.9  
0.6  
0.3  
0
T
= 125°C  
V
V
= 5V  
IN  
J
= 1.5 - 8V  
ON/OFF  
PW =300us, D 2%  
£
T
= 25°C  
J
T
= 125°C  
J
T
= 25°C  
J
V
V
= 2.5V  
IN  
= 1.5 - 8V  
ON/OFF  
PW =300us, D 2%  
£
0
0.4  
0.8  
1.2  
1.6  
2
0
0.4  
0.8  
1.2  
1.6  
2
I
,(A)  
I
, (A)  
L
L
Figure 2. Conduction Voltage Drop  
Variation with Load Current.  
Figure 1. Conduction Voltage Drop  
Variation with Load Current.  
1
I
= 1A  
L
V
= 1.5 - 8V  
ON/OFF  
PW =300us, D 2%  
£
0.8  
0.6  
0.4  
0.2  
T
= 125°C  
J
T
= 25°C  
8
J
0
2
4
6
10  
V
, (V)  
IN  
Figure 3. On-Resistance Variation  
with Input Voltage.  
1
D = 0.5  
0.5  
JA  
(t) = r(t) * R  
q
R
JA  
q
0.2  
0.2  
R
=415 °C/W  
JA  
q
0.1  
0.1  
0.05  
0.05  
P(pk)  
t1  
0.02  
0.01  
Single Pulse  
t2  
0.02  
0.01  
T - T = P * R  
(t)  
JA  
q
J
A
Duty Cycle, D = t1/ t 2  
0.005  
0.002  
0.0001  
0.001  
0.01  
0.1  
, TIME (sec)  
1
10  
100  
200  
t
1
Figure 4. Transient Thermal Response Curve.  
Thermal characterization performed using the conditions described in Note 2.  
Transient thermal response will change depending on the circuit board design.  
www.onsemi.com  
3
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
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