FDS8984 [ONSEMI]

N 沟道,PowerTrench® MOSFET,30V,7A,23mΩ;
FDS8984
型号: FDS8984
厂家: ONSEMI    ONSEMI
描述:

N 沟道,PowerTrench® MOSFET,30V,7A,23mΩ

PC 开关 脉冲 光电二极管 晶体管
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中文:  中文翻译
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DATA SHEET  
www.onsemi.com  
MOSFET – N-Channel,  
POWERTRENCH)  
V
R
MAX  
I MAX  
D
DSS  
DS(ON)  
30 V  
23 mW @ V = 10 V  
7.0 A  
6.0 A  
GS  
30 V, 7 A, 23 mW  
30 mW @ V = 4.5 V  
GS  
FDS8984, FDS8984-F40  
D2  
D2  
D1  
D1  
General Description  
This NChannel MOSFET has been designed specifically to  
improve the overall efficiency of dcdc converters using either  
synchronous or conventional switching PWM controllers. It has been  
G2  
S2  
G1  
S1  
Pin 1  
optimized for low gate charge, low R  
and fast switching speed.  
DS(ON)  
SOIC8  
CASE 751EB  
Features  
Max R  
Max R  
= 23 mW @ V = 10 V, I = 7 A  
GS D  
DS(ON)  
= 30 mW @ V = 4.5 V, I = 6 A  
DS(ON)  
GS  
D
MARKING DIAGRAM  
Low Gate Charge  
100% R Tested  
This Device is PbFree and Halogen Free  
G
FDS8984  
ALYW  
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted)  
Symbol  
Parameter  
Drain to Source Voltage  
Gate to Source Voltage  
Ratings  
Unit  
V
FDS8984  
A
L
YW  
= Specific Device Code  
= Assembly Site  
= Wafer Lot Number  
= Assembly Start Week  
V
DS  
V
GS  
30  
20  
V
I
D
Drain Current  
Continuous (Note 1a)  
Pulsed  
7
A
30  
E
Single Pulse Avalache Energy (Note 2)  
Power Dissipation for Single Operation  
Derate Above 25°C  
32  
1.6  
mJ  
W
AS  
PIN ASSIGNMENT  
P
D
13  
mW/°C  
°C  
5
6
7
8
4
3
2
1
T , T  
Operating and Storage Temperature  
55 to +150  
J
STG  
Q2  
Q1  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
THERMAL CHARACTERISTICS  
Symbol  
Parameter  
Ratings  
Unit  
NChannel MOSFET  
RqJA  
Thermal Resistance, JunctiontoAmbient  
78  
°C/W  
(Note 1a)  
RqJC  
Thermal Resistance, JunctiontoCase  
(Note 1)  
40  
°C/W  
ORDERING INFORMATION  
Device  
Package  
Shipping  
FDS8984  
SOIC8  
2500 /  
(PbFree)  
Tape & Reel  
FDS8984F40  
SOIC8  
2500 /  
(PbFree)  
Tape & Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2007  
1
Publication Order Number:  
February, 2022 Rev. 3  
FDS8984/D  
FDS8984, FDS8984F40  
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)  
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
BV  
Drain to Source Breakdown Voltage  
I
I
= 250 mA, V = 0 V  
30  
V
DSS  
D
GS  
Breakdown Voltage Temperature  
Coefficient  
= 250 mA, Referenced to 25°C  
23  
mV/°C  
DBVDSS  
DTJ  
D
I
Zero Gate Voltage Drain Current  
V
DS  
V
DS  
= 24 V, V = 0 V  
1
250  
mA  
DSS  
GS  
= 24 V, V = 0 V, T = 125°C  
GS  
J
I
Gate to Source Leakage Current  
V
GS  
=
20 V, V = 0 V  
100  
nA  
GSS  
DS  
ON CHARACTERISTICS (Note 3)  
V
Gate to Source Threshold Voltage  
V
I
= V , I = 250 mA  
1.2  
1.7  
2.5  
V
GS(th)  
DS  
GS  
D
Gate to Source Threshold Voltage  
Temperature Coefficient  
= 250 mA, Referenced to 25°C  
4.3  
mV/°C  
DVGS(th)  
DTJ  
D
R
Drain to Source On–Resistance  
V
GS  
V
GS  
V
GS  
= 10 V, I = 7 A  
19  
24  
26  
23  
30  
32  
mW  
DS(on)  
D
= 4.5 V, I = 6 A  
D
= 10 V, I = 7 A, T = 125°C  
D
J
DYNAMIC CHARACTERISTICS  
C
Input Capacitance  
V
= 15 V, V = 0 V,  
475  
100  
65  
635  
135  
100  
1.6  
pF  
pF  
pF  
W
iss  
DS  
GS  
f = 1.0 MHz  
C
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
oss  
C
rss  
R
f = 1.0 MHz  
0.9  
G
SWITCHING CHARACTERISTICS (Note 3)  
t
Turn–On Delay Time  
Rise Time  
V
V
= 15 V, I = 7 A,  
5
10  
18  
68  
34  
13  
7
ns  
ns  
d(on)  
DD  
GS  
D
= 10 V, R = 33 W  
GS  
t
r
9
t
Turn–Off Delay Time  
Fall Time  
42  
21  
9.2  
5.0  
1.5  
2.0  
ns  
d(off)  
t
f
ns  
Q
Q
Total Gate Charge  
Total Gate Charge  
Gate to Source Gate Charge  
Gate to Drain “Miller” Charge  
V
V
= 15 V, V = 10 V, I = 7 A  
nC  
nC  
nC  
nC  
g
g
DS  
GS  
D
= 15 V, V = 5 V, I = 7 A  
DS  
GS  
D
Q
gs  
gd  
Q
DRAINSOURCE DIODE CHARACTERISTICS  
V
Source to Drain Diode Voltage  
I
I
= 7 A  
0.9  
0.8  
1.25  
1.0  
33  
V
V
SD  
SD  
= 2.1 A  
SD  
t
Diode Reverse Recovery Time  
Diode Reverse Recovery Charge  
I = 7 A, d / = 100 A/ms  
F
ns  
nC  
rr  
i dt  
Q
20  
rr  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
NOTES:  
1. R  
is the sum of the junctiontocase and casetoambient thermal resistance where the case thermal reference is defined as the solder  
q
JA  
mounting surface of the drain pins. R  
is guaranteed by design while R  
is determined by the user’s board design.  
q
q
JC  
CA  
a. 78°C/W when  
mounted on a 0.5 in  
pad of 2 oz copper  
b. 125°C/W when  
mounted on a 0.02 in  
pad of 2 oz copper  
c. 135°C/W when  
mounted on  
a minimum pad.  
2
2
Scale 1 : 1 on letter size paper  
2. Starting T = 25°C, L = 1 mH, I = 8 A, V = 27 V, V = 10 V.  
J
AS  
DD  
GS  
3. Pulse Test: Pulse Width < 300 ms, Duty Cycle < 2.0%.  
www.onsemi.com  
2
 
FDS8984, FDS8984F40  
TYPICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)  
3.0  
30  
20  
PULSE DURATION = 80 ms  
DUTY CYCLE = 0.5% MAX  
V
V
= 10.0 V  
= 5.0 V  
GS  
V
= 3.5 V  
= 3.0 V  
GS  
V
= 3.0 V  
GS  
GS  
2.5  
2.0  
1.5  
V
= 4.5 V  
V
= 4.5 V  
= 10 V  
GS  
GS  
V
= 3.5 V  
GS  
V
= 4.0 V  
GS  
V
GS  
V
V
= 4.0 V  
= 5.0 V  
GS  
10  
0
1.0  
0.5  
V
GS  
PULSE DURATION = 80 ms  
DUTY CYCLE = 0.5% MAX  
GS  
5
10  
15  
20  
25  
30  
0.0  
0.5  
1.0  
1.5 2.0  
2.5  
3.0  
3.5  
4.0  
V
DS  
, DRAIN TO SOURCE VOLTAGE (V)  
I , DRAIN CURRENT (A)  
D
Figure 1. On Region Characteristics  
Figure 2. OnResistance vs. Drain Current  
and Gate Voltage  
1.6  
1.4  
60  
55  
50  
45  
40  
35  
30  
25  
20  
15  
I
V
= 7 A  
PULSE DURATION = 80 ms  
DUTY CYCLE = 0.5% MAX  
I
D
= 7 A  
D
= 10 V  
GS  
1.2  
1.0  
0.8  
0.6  
T = 125°C  
J
T = 25°C  
J
80  
40  
0
40  
80  
120  
160  
2
4
6
8
10  
T , JUNCTION TEMPERATURE (°C)  
J
V
GS  
, GATE TO SOURCE VOLTAGE (V)  
Figure 3. OnResistance vs. Temperature  
Figure 4. OnResistance vs. Gate to Source  
Voltage  
30  
10  
30  
25  
20  
15  
10  
5
PULSE DURATION = 80 ms  
DUTY CYCLE = 0.5% MAX  
V
GS  
= 0 V  
V
DD  
= 5 V  
T = 150°C  
J
1
0.1  
T = 25°C  
J
T = 25°C  
J
T = 150°C  
J
0.01  
0.001  
T = 55°C  
J
T = 55°C  
J
0
1
2
3
4
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
1.4  
V
GS  
, GATE TO SOURCE VOLTAGE (V)  
V
SD  
, BODY DIODE FORWARD VOLTAGE (V)  
Figure 5. Transfer Characteristics  
Figure 6. Source to Drain Forward Voltage  
vs. Source Current  
www.onsemi.com  
3
FDS8984, FDS8984F40  
TYPICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted) (continued)  
700  
10  
8
V
= 10 V  
DD  
600  
500  
400  
300  
200  
100  
0
C
ISS  
f = 1 MHz  
= 0 V  
V
GS  
6
V
= 15 V  
DD  
4
C
OSS  
V
DD  
= 20 V  
2
C
RSS  
0
0
2
4
6
8
10  
0.1  
1
10  
30  
Q , GATE CHARGE (nC)  
g
V
DS  
, DRAIN TO SOURCE VOLTAGE (V)  
Figure 7. Gate Charge Characteristics  
Figure 8. Capacitance vs. Drain to Source  
Voltage  
20  
10  
8
7
6
5
4
3
2
1
0
V
GS  
= 10 V  
STARTING T = 25°C  
J
V
GS  
= 4.5 V  
STARTING T = 125°C  
J
1
0.01  
0.1  
1
10 20  
25  
50  
75  
100  
125  
150  
t , TIME IN AVALANCHE (ms)  
AV  
T , AMBIENT TEMPERATURE (°C)  
A
Figure 9. Unclamped Inductive Switching  
Capability  
Figure 10. Maximum Continuous Drain Current  
vs. Ambient Temperature  
100  
10  
3000  
1000  
T
A
= 25°C  
FOR TEMPERATURES  
ABOVE 25°C DERATE PEAK  
CURRENT AS FOLLOWS:  
10 ms  
100 ms  
150 * TA  
Ǹ
100  
10  
1
I + I25ƪ ƫ  
1 ms  
1
125  
V
= 10 V  
GS  
10 ms  
100 ms  
1 s  
OPERATION IN THIS  
AREA MAY BE  
LIMITED BY r  
DS(on)  
0.1  
0.01  
DC  
SINGLE PULSE  
SINGLE PULSE  
T
J
= MAX RATED  
T
A
= 25°C  
0.1  
1
10  
100  
5  
4  
3  
2  
1  
0
1
2
3
10  
10  
10  
10  
10  
10  
10  
10  
10  
V
DS  
, DRAIN TO SOURCE VOLTAGE (V)  
t, PULSE WIDTH (s)  
Figure 11. Forward Bias Safe Operating Area  
Figure 12. Single Pulse Maximum Power  
Dissipation  
www.onsemi.com  
4
FDS8984, FDS8984F40  
TYPICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted) (continued)  
2
1
DUTY CYCLE DESCENDING ORDER  
D = 0.5  
0.2  
0.1  
0.05  
0.02  
0.01  
0.1  
0.01  
t
1
t
2
SINGLE PULSE  
1E3  
DUTY FACTOR: D = t /t  
1
2
PEAK T = P  
× Z  
× R + T  
q
JA JA A  
q
J
DM  
1E4  
5  
4  
3  
2  
1  
0
1
2
3
10  
10  
10  
10  
10  
10  
10  
10  
10  
t, RECTANGULAR PULSE DURATION (s)  
Figure 13. Transient Thermal Response Curve  
POWERTRENCH is a registered trademark of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States  
and/or other countries.  
www.onsemi.com  
5
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
SOIC8  
CASE 751EB  
ISSUE A  
DATE 24 AUG 2017  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13735G  
SOIC8  
PAGE 1 OF 1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
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© Semiconductor Components Industries, LLC, 2019  
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