FGA5065ADF [ONSEMI]

IGBT,650 V,50A,场截止沟槽;
FGA5065ADF
型号: FGA5065ADF
厂家: ONSEMI    ONSEMI
描述:

IGBT,650 V,50A,场截止沟槽

局域网 通用开关 双极性晶体管
文件: 总10页 (文件大小:503K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Is Now Part of  
To learn more about ON Semiconductor, please visit our website at  
www.onsemi.com  
Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers  
will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor  
product management systems do not have the ability to manage part nomenclature that utilizes an underscore  
(_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain  
device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated  
device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please  
email any questions regarding the system integration to Fairchild_questions@onsemi.com.  
ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number  
of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right  
to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON  
Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON  
Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s  
technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA  
Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended  
or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out  
of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor  
is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
August 2015  
FGA5065ADF  
650 V, 50 A Field Stop Trench IGBT  
Features  
General Description  
Maximum Junction Temperature : TJ = 175oC  
Positive Temperaure Co-efficient for Easy Parallel Operating  
High Current Capability  
This ADF IGBT series adopted field stop trench 3rd generation  
IGBT which offer extreme low VCE(sat) and much faster switch-  
ing characteristics for outstanding efficiency. And this kind of  
technology is fully optimized to variety PFC (Power Factor Cor-  
rection) topology; Single Boost, Multi Channel Interleaved etc  
with over 20KHz switching performance. TO3P package provide  
super low thermal resistance for much wider SOA for system  
stability.  
Low Saturation Voltage: VCE(sat) = 1.7 V(Typ.) @ IC = 50 A  
100% of the Parts Tested for ILM(1)  
High Input Impedance  
Fast Switching  
Tighten Parameter Distribution  
Applications  
RoHS Compliant  
PFC topology for home applicnce: Single Boost, Multi Chan-  
nel Interleaved etc.  
C
G
G
C
TO-3PN  
E
E
Absolute Maximum Ratings  
T
= 25°C unless otherwise noted  
C
Symbol  
Description  
FGA5065ADF  
Unit  
V
VCES  
Collector to Emitter Voltage  
650  
20  
Gate to Emitter Voltage  
V
VGES  
Transient Gate to Emitter Voltage  
Collector Current  
30  
V
@ TC = 25oC  
@ TC = 100oC  
@ TC = 25oC  
100  
A
IC  
Collector Current  
50  
A
ILM (1)  
ICM (2)  
Pulsed Collector Current  
Pulsed Collector Current  
Diode Forward Current  
150  
A
150  
A
@ TC = 25oC  
@ TC = 100oC  
40  
A
IF (3)  
Diode Forward Current  
20  
A
IFM (2)  
PD  
Pulsed Diode Maximum Forward Current  
Maximum Power Dissipation  
Maximum Power Dissipation  
Operating Junction Temperature  
Storage Temperature Range  
120  
A
@ TC = 25oC  
@ TC = 100oC  
268  
W
W
oC  
oC  
134  
TJ  
-55 to +175  
-55 to +175  
Tstg  
Maximum Lead Temp. for soldering  
Purposes, 1/8” from case for 5 seconds  
oC  
TL  
300  
Notes:  
1. V = 400 V, V = 15 V, I =150 A, R = 55.9  Inductive Load.  
CC  
GE  
C
G
2. Repetitive rating: Pulse width limited by max. junction temperature.  
3. The purpose of diode is protection for negative voltage.  
©2015 Fairchild Semiconductor Corporation  
FGA5065ADF Rev. 1.0  
1
www.fairchildsemi.com  
Thermal Characteristics  
Symbol  
Parameter  
FGA5065ADF  
Unit  
oC/W  
oC/W  
oC/W  
RJC(IGBT)  
RJC(Diode)  
RJA  
Thermal Resistance, Junction to Case, Max.  
Thermal Resistance, Junction to Case, Max.  
Thermal Resistance, Junction to Ambient, Max.  
0.56  
1.71  
40  
Package Marking and Ordering Information  
Part Number  
Top Mark  
Package Packaging Method Reel Size Tape Width  
Quantity  
FGA5065ADF  
FGA5065ADF  
TO-3PN  
Tube  
-
-
30  
Electrical Characteristics of the IGBT  
T
= 25°C unless otherwise noted  
C
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
Off Characteristics  
BVCES  
Collector to Emitter Breakdown Voltage VGE = 0V, IC = 1 mA  
Temperature Coefficient of Breakdown  
650  
-
-
-
-
V
BVCES  
TJ  
C = 1 mA, Reference to 25oC  
/
V/oC  
I
0.58  
Voltage  
ICES  
IGES  
Collector Cut-Off Current  
G-E Leakage Current  
VCE = VCES, VGE = 0 V  
VGE = VGES, VCE = 0 V  
-
-
-
-
250  
A  
±400  
nA  
On Characteristics  
VGE(th)  
G-E Threshold Voltage  
IC = 50 mA, VCE = VGE  
IC = 50 A, VGE = 15 V  
IC = 50 A, VGE = 15 V,  
4.1  
-
5.6  
1.7  
7.6  
2.2  
V
V
VCE(sat)  
Collector to Emitter Saturation Voltage  
-
2.28  
-
V
T
C = 175oC  
Dynamic Characteristics  
Cies  
Coes  
Cres  
Input Capacitance  
-
-
-
1995  
70  
-
-
-
pF  
pF  
pF  
V
CE = 30 V VGE = 0 V,  
,
Output Capacitance  
f = 1MHz  
Reverse Transfer Capacitance  
23  
Switching Characteristics  
td(on) Turn-On Delay Time  
tr  
td(off)  
tf  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
20.8  
41.6  
62.4  
11.2  
1350  
309  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
ns  
ns  
ns  
ns  
uJ  
uJ  
uJ  
ns  
ns  
ns  
ns  
uJ  
uJ  
uJ  
Rise Time  
Turn-Off Delay Time  
Fall Time  
VCC = 400 V, IC = 50 A,  
R
G = 6 , VGE = 15 V,  
Inductive Load, TC = 25oC  
Eon  
Eoff  
Ets  
td(on)  
tr  
Turn-On Switching Loss  
Turn-Off Switching Loss  
Total Switching Loss  
Turn-On Delay Time  
Rise Time  
1659  
19.2  
38.4  
67.2  
12.8  
1820  
558  
td(off)  
tf  
Turn-Off Delay Time  
Fall Time  
VCC = 400 V, IC = 50 A,  
R
G = 6 , VGE = 15 V,  
Inductive Load, TC = 175oC  
Eon  
Eoff  
Ets  
Turn-On Switching Loss  
Turn-Off Switching Loss  
Total Switching Loss  
2378  
©2015 Fairchild Semiconductor Corporation  
FGA5065ADF Rev. 1.0  
2
www.fairchildsemi.com  
Electrical Characteristics of the IGBT (Continued)  
Symbol  
Qg  
Parameter  
Test Conditions  
Min.  
Typ.  
72.2  
13.5  
28.5  
Max Unit  
Total Gate Charge  
-
-
-
-
-
-
nC  
nC  
nC  
V
V
CE = 400 V, IC = 50 A,  
GE = 15 V  
Qge  
Gate to Emitter Charge  
Gate to Collector Charge  
Qgc  
Electrical Characteristics of the Diode  
T = 25°C unless otherwise noted  
C
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
2.1  
Max Unit  
T
T
T
T
C = 25oC  
C = 175oC  
C = 175oC  
C = 25oC  
C = 175oC  
C = 25oC  
-
-
-
-
-
-
-
2.6  
VFM  
Diode Forward Voltage  
IF = 20 A  
V
1.94  
50  
-
Erec  
trr  
Reverse Recovery Energy  
-
-
-
-
-
uJ  
ns  
31.8  
192  
50.6  
699  
Diode Reverse Recovery Time  
IF =20 A, dIF/dt = 200 A/s  
T
T
Qrr  
Diode Reverse Recovery Charge  
nC  
TC = 175oC  
©2015 Fairchild Semiconductor Corporation  
FGA5065ADF Rev. 1.0  
3
www.fairchildsemi.com  
Typical Performance Characteristics  
Figure 1. Typical Output Characteristics  
Figure 2. Typical Output Characteristics  
120  
150  
TC = 175oC  
TC = 25oC  
20V  
20V  
15V  
12V  
10V  
15V  
10V  
12V  
120  
90  
90  
60  
30  
0
VGE = 8V  
60  
VGE = 8V  
30  
0
0
1
2
3
4
5
0
1
2
3
4
5
Collector-Emitter Voltage, VCE [V]  
Collector-Emitter Voltage, VCE [V]  
Figure 3. Typical Saturation Voltage  
Characteristics  
Figure 4. Saturation Voltage vs. Case  
Temperature at Variant Current Level  
150  
Common Emitter  
VGE = 15V  
TC = 25oC  
120  
TC = 175oC  
90  
60  
30  
0
0
1
2
3
4
5
Collector-Emitter Voltage, VCE [V]  
Figure 5. Saturation Voltage vs. V  
Figure 6. Saturation Voltage vs. V  
GE  
GE  
20  
16  
12  
8
20  
Common Emitter  
TC = 175oC  
Common Emitter  
TC = 25oC  
16  
12  
8
50A  
50A  
IC = 25A  
100A  
100A  
IC = 25A  
4
4
0
0
4
8
12  
16  
20  
4
8
12  
16  
20  
Gate-Emitter Voltage, VGE [V]  
Gate-Emitter Voltage, VGE [V]  
©2015 Fairchild Semiconductor Corporation  
FGA5065ADF Rev. 1.0  
4
www.fairchildsemi.com  
Typical Performance Characteristics  
Figure 7. Capacitance Characteristics  
Figure 8. Gate charge Characteristics  
15  
10000  
Common Emitter  
TC = 25oC  
Cies  
12  
300V  
VCC = 200V  
1000  
400V  
9
6
3
0
Coes  
100  
Common Emitter  
Cres  
VGE = 0V, f = 1MHz  
TC = 25oC  
10  
0
20  
40  
60  
80  
1
10  
30  
Collector-Emitter Voltage, VCE [V]  
Gate Charge, Qg [nC]  
Figure 9. Turn-on Characteristics vs.  
Gate Resistance  
Figure 10. Turn-off Characteristics vs.  
Gate Resistance  
1000  
100  
td(off)  
tr  
100  
tf  
td(on)  
Common Emitter  
VCC = 400V, VGE = 15V  
Common Emitter  
VCC = 400V, VGE = 15V  
IC = 50A  
IC = 50A  
TC = 25oC  
TC = 175oC  
TC = 25oC  
TC = 175oC  
10  
10  
4
8
0
10  
20  
30  
40  
50  
0
10  
20  
30  
40  
50  
Gate Resistance, RG []  
Gate Resistance, RG []  
Figure 11. Switching Loss vs.  
Gate Resistance  
Figure 12. Turn-on Characteristics vs.  
Collector Current  
500  
4
Common Emitter  
VGE = 15V, RG = 6  
TC = 25oC  
TC = 175oC  
Eon  
tr  
1
100  
Eoff  
Common Emitter  
VCC = 400V, VGE = 15V  
td(on)  
IC = 50A  
TC = 25oC  
TC = 175oC  
10  
0.1  
0
30  
60  
90  
120  
150  
0
10  
20  
30  
40  
50  
Gate Resistance, RG []  
Collector Current, IC [A]  
©2015 Fairchild Semiconductor Corporation  
FGA5065ADF Rev. 1.0  
5
www.fairchildsemi.com  
Typical Performance Characteristics  
Figure 13. Turn-off Characteristics vs.  
Collector Current  
Figure 14. Switching Loss vs.  
Collector Current  
10  
200  
100  
td(off)  
Eon  
1
tf  
Common Emitter  
Common Emitter  
VGE = 15V, RG = 6  
TC = 25oC  
Eoff  
VGE = 15V, RG = 6  
TC = 25oC  
10  
TC = 175oC  
TC = 175oC  
0.1  
4
0
30  
60  
90  
120  
150  
0
30  
60  
90  
120  
150  
Collector Current, IC [A]  
Collector Current, IC [A]  
Figure 15. Load Current Vs. Frequency  
Figure 16. SOA Characteristic s  
200  
250  
Square Wave  
TJ <= 175oC, D = 0.5, VCE = 400V  
100  
10s  
200  
150  
100  
50  
VGE = 15/0V, RG = 6  
100s  
TC = 25oC  
1ms  
10 ms  
10  
1
DC  
TC = 75oC  
TC = 100oC  
*Notes:  
1. TC = 25oC  
2. TJ = 175oC  
3. Single Pulse  
0.1  
0
1k  
1
10  
100  
1000  
10k  
100k  
1M  
Collector-Emitter Voltage, VCE [V]  
Switching Frequency, f[Hz]  
Figure 17. Forward Characteristics  
Figure 18. Reverse Recovery Current  
10  
80  
TC = 25oC  
TC = 175oC  
8
di/dt = 200A/s  
TJ = 175oC  
TJ = 25oC  
6
10  
di/dt = 100A/s  
TJ = 75oC  
4
di/dt = 200A/s  
TC = 25oC  
di/dt = 100A/s  
2
TC = 75oC  
TC = 175oC  
4
0
1
0
10  
20  
30  
40  
0
1
2
3
5
Forward Current, IF [A]  
Forward Voltage, VF [V]  
©2015 Fairchild Semiconductor Corporation  
FGA5065ADF Rev. 1.0  
6
www.fairchildsemi.com  
Typical Performance Characteristics  
Figure 19. Reverse Recovery Time  
Figure 20. Stored Charge  
300  
1000  
TC = 25oC  
TC = 25oC  
250 TC = 175oC  
TC = 175oC  
800  
200  
150  
600  
400  
di/dt = 200A/s  
di/dt = 100A/s  
100  
50  
0
di/dt = 200A/s  
di/dt = 100A/s  
200  
0
0
10  
20  
30  
40  
0
10  
20  
30  
40  
Forward Current, IF [A]  
Forward Current, IF [A]  
Figure 21.Transient Thermal Impedance of IGBT  
0.6  
0.1  
0.5  
0.2  
0.1  
0.05  
0.02  
PDM  
t1  
t2  
0.01  
Duty Factor, D = t1/t2  
Peak Tj = Pdm x Zthjc + TC  
0.01  
single pulse  
0.005  
10-5  
10-4  
10-3  
10-2  
10-1 100  
Rectangular Pulse Duration [sec]  
Figure 22.Transient Thermal Impedance of Diode  
2
1
0.5  
0.2  
0.1  
0.05  
0.1  
PDM  
0.02  
t1  
0.01  
t2  
Duty Factor, D = t1/t2  
single pulse  
Peak Tj = Pdm x Zthjc + TC  
0.01  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
Rectangular Pulse Duration [sec]  
©2015 Fairchild Semiconductor Corporation  
FGA5065ADF Rev. 1.0  
7
www.fairchildsemi.com  
5.00  
4.60  
13.80  
13.40  
1.65  
1.45  
3.30  
3.10  
16.20  
15.40  
5.20  
4.80  
R0.50  
3°  
16.96  
16.56  
20.10  
19.70  
18.90  
18.50  
7.20  
6.80  
3°  
4°  
1
3
2.00  
1.60  
3.70  
3.30  
1.85  
2.60  
2.20  
20.30  
19.70  
2.20  
1.80  
3.20  
2.80  
1.20  
0.80  
M
0.55  
0.75  
0.55  
5.45  
5.45  
NOTES: UNLESS OTHERW ISE SPECIFIED  
A) THIS PACKAGE CONFORMS TO EIAJ  
SC-65 PACKAGING STANDARD.  
B) ALL DIMENSIONS ARE IN MILLIMETERS.  
C) DIMENSION AND TOLERANCING PER  
ASME14.5-2009.  
D) DIMENSIONS ARE EXCLUSSIVE OF BURRS,  
MOLD FLASH, AND TIE BAR EXTRUSSIONS.  
E) DRAW ING FILE NAME: TO3PN03AREV2.  
F) FAIRCHILD SEMICONDUCTOR.  
R0.50  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 8002829855 Toll Free  
USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
Japan Customer Focus Center  
Phone: 81358171050  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
Literature Distribution Center for ON Semiconductor  
19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA  
Phone: 3036752175 or 8003443860 Toll Free USA/Canada  
Fax: 3036752176 or 8003443867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
© Semiconductor Components Industries, LLC  
www.onsemi.com  

相关型号:

FGA50N100BNT

1000V, 50A NPT-Trench IGBT CO-PAK
FAIRCHILD

FGA50N100BNTD

1000V, 50A NPT-Trench IGBT CO-PAK
FAIRCHILD

FGA50N100BNTD2

1000V, 50A NPT-Trench IGBT CO-PAK
FAIRCHILD

FGA50N100BNTD2

IGBT,1000V,NPT 沟槽
ONSEMI

FGA50N100BNTDTU

Insulated Gate Bipolar Transistor, 50A I(C), 1000V V(BR)CES, N-Channel, TO-3P, 3 PIN
FAIRCHILD

FGA50N100BNTDTU

IGBT,1000V,NPT 沟槽
ONSEMI

FGA50N100BNTTU

1000V, 50A NPT-Trench IGBT CO-PAK
FAIRCHILD
FAIRCHILD

FGA50S110P

IGBT,1100V,50A,短路阳极
ONSEMI

FGA50T65SHD

650 V, 50 A 场截止沟道 IGBT
ONSEMI

FGA6065ADF

IGBT,650V,60A,场截止沟槽
ONSEMI

FGA60N60UFD

600V, 60A Field Stop IGBT
FAIRCHILD