FGB3056-F085 [ONSEMI]

IGBT,EcoSPARK® 300mJ,560V,N 沟道点火;
FGB3056-F085
型号: FGB3056-F085
厂家: ONSEMI    ONSEMI
描述:

IGBT,EcoSPARK® 300mJ,560V,N 沟道点火

双极性晶体管
文件: 总8页 (文件大小:2955K)
中文:  中文翻译
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FGB3056-F085  
®
EcoSPARK 300mJ, 560V, N-Channel Ignition IGBT  
Features  
Applications  
„ Automotive lgnition Coil Driver Circuits  
„ SCIS Energy = 300mJ at TJ = 25oC  
„ Logic Level Gate Drive  
„ Coil On Plug Applications  
Package  
JEDEC TO-263AB  
2
D -Pak  
GATE  
COLLECTOR  
(FLANGE)  
EMITTER  
Absolute Maximum Ratings TA = 25°C unless otherwise noted  
Symbol  
Parameter  
Ratings  
Units  
V
BVCER Collector to Emitter Breakdown Voltage (IC = 2mA)  
560  
20  
BVECS Emitter to Collector Voltage - Reverse Battery Condition (IC = -20mA)  
V
ESCIS25 ISCIS = 14.2A, L = 3.0mHy, RGE = 1KΩ  
ESCIS150 ISCIS = 10.8A, L = 3.0mHy, RGE = 1KΩ  
TC = 25°C  
300  
mJ  
mJ  
A
TC = 150°C  
170  
IC25  
Collector Current Continuous, at VGE = 5V, TC = 25°C  
Collector Current Continuous, at VGE = 5V, TC = 110°C  
Gate to Emitter Voltage Continuous  
29  
IC110  
VGEM  
24  
A
±10  
V
Power Dissipation Total, at TC = 25°C  
Power Dissipation Derating, for TC > 25oC  
TC = 25°C  
TC > 25°C  
200  
W
PD  
1.33  
-40 to +175  
-40 to +175  
300  
W/oC  
oC  
oC  
oC  
oC  
kV  
TJ  
Operating Junction Temperature Range  
TSTG  
TL  
Storage Junction Temperature Range  
Max. Lead Temp. for Soldering (Leads at 1.6mm from case for 10s)  
Reflow soldering according to JESD020C  
TPKG  
ESD  
260  
HBM-Electrostatic Discharge Voltage at100pF, 1500Ω  
4
@2016 Semiconductor Components Industries, LLC.  
Publication Order Number:  
August-2017, Rev. 2  
FGB3056-F085/D  
Thermal Characteristics  
RθJC  
Thermal Resistance Junction to Case  
0.75  
oC/W  
Electrical Characteristics of the IGBT TA = 25°C unless otherwise noted  
Symbol  
Parameter  
Test Conditions  
Min Typ Max Units  
Off State Characteristics  
V
GE = 0V,ICE = 2mA,  
BVCER Collector to Emitter Breakdown Voltage RGE = 1KΩ,  
TJ = -40 to 150oC  
VGE = 0V, ICE = 10mA,  
530 560 600  
V
BVCES Collector to Emitter Breakdown Voltage RGE = 0Ω,  
-
595  
26  
-
-
V
V
TJ = -40 to 150oC  
VGE = 0V, ICE = -75mA,  
TJ = 25°C  
BVECS Emitter to Collector Breakdown Voltage  
BVGES Gate to Emitter Breakdown Voltage  
20  
IGES = ±5mA  
±12 ±14  
-
40  
1
V
TJ = 25oC  
TJ = 150oC  
TJ = 25oC  
TJ = 150oC  
-
-
-
μA  
mA  
V
CE = 250V, RGE = 1K  
ICER  
Collector to Emitter Leakage Current  
-
-
-
-
1
V
EC = 20V  
IECS  
R1  
Emitter to Collector Leakage Current  
Series Gate Resistance  
mA  
-
-
40  
-
100  
Ω
On State Characteristics  
VCE(SAT) Collector to Emitter Saturation Voltage VGE = 5V, ICE = 2A  
VCE(SAT) Collector to Emitter Saturation Voltage VGE = 5V, ICE = 8A  
TJ = 2 5 oC  
TJ = 150oC  
-
-
1 . 0  
1 . 1  
V
V
1.3 1.55  
Dynamic Characteristics  
QG(ON) Gate Charge  
VGE = 5V, VCE = 12V, ICE = 10A  
-
15.6  
1.6  
20  
2.2  
-
nC  
V
TJ = 25oC  
1.3  
VGE(TH) Gate to Emitter Threshold Voltage  
ICE = 1mA, VCE = VGE,  
VCE = 12V, ICE = 1 0 A  
TJ = 150oC  
-
-
1.1  
2 . 8  
VGEP  
Gate to Emitter Plateau Voltage  
-
V
Switching Characteristics  
td(ON)R Current Turn-On Delay Time-Resistive  
-
-
-
-
0.8  
1.3  
μs  
μs  
μs  
μs  
VCE = 14V, RL = 1Ω  
V
GE = 5V, RG = 1KΩ  
VCE = 300V, L = 1mH,  
GE = 5V, RG = 1KΩ  
trR  
Current Rise Time-Resistive  
1.48 2.4  
td(OFF)L Current Turn-Off Delay Time-Inductive  
5.1  
1.1  
8.2  
1.8  
V
tfL  
Current Fall Time-Inductive  
Ordering Information  
Device Marking  
Device  
Package  
Reel Size  
Tape Width  
Quantity  
FGB3056  
FGB3056-F085  
TO-263AB  
330mm  
24mm  
800units  
www.onsemi.com  
2
Typical Performance Curves  
Figure 1. Self Clamped Inductive Switching  
Current vs. Time in Clamp  
Figure 2. Self Clamped Inductive Switching  
Current vs. Inductance  
Figure 3. Collector to Emitter On-State Voltage  
vs. Junction Temperature  
Figure 4. Collector to Emitter On-State Voltage  
vs. Junction Temperature  
Figure 5. Collector to Emitter On-State Voltage  
vs. Collector Current  
Figure 6. Collector to Emitter On-State Voltage  
vs. Collector Current  
www.onsemi.com  
3
(Continued)  
Typical Performance Curves  
Figure 7. Collector to Emitter On-State Voltage  
vs. Collector Current  
Figure 8. Transfer Characteristics  
Figure 9. DC Collector Current vs. Case  
Temperature  
Figure 10. Threshold Voltage vs. Junction  
Temperature  
Figure 11. Leakage Current vs. Junction  
Temperature  
Figure 12. Switching Time vs. Junction  
Temperature  
www.onsemi.com  
4
(Continued)  
Typical Performance Curves  
Figure 13. Capacitance vs. Collector to Emitter  
Voltage  
Figure 14. Gate Charge  
Figure 15. Break down Voltage vs. Series Gate Resistance  
Figure 16. IGBT Normalized Transient Thermal Impedance, Junction to Case  
www.onsemi.com  
5
Typical Performance Curves  
Figure 17. Forward Safe Operating Area  
www.onsemi.com  
6
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are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
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