FGHL50T65MQD [ONSEMI]

IGBT - 650 V 50 A FS4 medium switching speed IGBT;
FGHL50T65MQD
型号: FGHL50T65MQD
厂家: ONSEMI    ONSEMI
描述:

IGBT - 650 V 50 A FS4 medium switching speed IGBT

双极性晶体管
文件: 总9页 (文件大小:333K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Field Stop Trench IGBT  
650 V, 50 A  
FGHL50T65MQD  
Field stop 4th generation mid speed IGBT technology and full  
current rated copak Diode technology.  
Features  
www.onsemi.com  
Maximum Junction Temperature: T = 175°C  
J
Positive Temperature Coefficient for Easy Parallel Operating  
High Current Capability  
BV  
V
TYP  
I MAX  
C
CES  
CE(sat)  
650 V  
1.45 V  
50 A  
Low Saturation Voltage: V  
= 1.45 V (Typ.) @ I = 50 A  
C
CE(sat)  
100% of the Parts are Tested for I (Note 2)  
LM  
C
E
Smooth & Optimized Switching  
Tight Parameter Distribution  
RoHS Compliant  
G
Typical Applications  
Solar Inverter  
UPS, ESS  
PFC, Converters  
MAXIMUM RATINGS  
Parameter  
CollectortoEmitter Voltage  
GatetoEmitter Voltage  
Symbol  
Value  
650  
20  
Unit  
V
G
V
CES  
V
GES  
V
GES  
C
E
V
TO247 LONG LEADS  
Transient GatetoEmitter Voltage  
Collector Current (Note 1)  
30  
V
CASE 340CX  
T
C
= 25°C  
I
C
80  
A
T
C
= 100°C  
50  
MARKING DIAGRAM  
Pulsed Collector Current (Note 2)  
Pulsed Collector Current (Note 3)  
Diode Forward Current (Note 1)  
I
200  
200  
55  
A
A
A
LM  
I
CM  
T
T
= 25°C  
= 65°C  
I
F
C
&Z&3&K  
FGHL  
50T65MQD  
40  
C
Pulsed Diode Maximum Forward Current  
I
200  
A
A
FM  
NonRepetitive Forward Surge Current  
I
F,SM  
(HalfSine Pulse, t = 8.3 ms, T = 25°C)  
135  
120  
p
C
(HalfSine Pulse, t = 8.3 ms, T = 150°C)  
p
C
Maximum Power Dissipation  
T
= 25°C  
P
268  
134  
W
C
D
&Z  
&3  
&K  
= Assembly Plant Code  
= 3Digit Date Code  
= 2Digit Lot Traceability Code  
T
C
= 100°C  
Operating Junction and Storage Temperature  
Range  
T , T  
J
55 to  
+175  
°C  
°C  
stg  
FGHL50T65MQD = Specific Device Code  
Maximum Lead Temperature for Soldering  
Purposes (1/8from case for 5 s)  
T
300  
L
ORDERING INFORMATION  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. Value limit by bond wire  
Device  
Package  
Shipping  
FGHL50T65MQD TO2473L  
30 Units / Rail  
2. V = 400 V, V = 15 V, I = 200 A, R = 14 W, Inductive Load, 100% Tested  
CC  
GE  
C
G
3. Repetitive rating: Pulse width limited by max. junction temperature  
© Semiconductor Components Industries, LLC, 2019  
1
Publication Order Number:  
February, 2020 Rev. 1  
FGHL50T65MQD/D  
 
FGHL50T65MQD  
Table 1. THERMAL CHARACTERISTICS  
Parameter  
Symbol  
Value  
0.56  
1.07  
40  
Unit  
Thermal Resistance JunctiontoCase, for IGBT  
Thermal Resistance JunctiontoCase, for Diode  
Thermal Resistance JunctiontoAmbient  
R
θJC  
R
θJC  
R
θJA  
°C/W  
Table 2. ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise specified)  
J
Parameter  
Test Conditions  
Symbol  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTIC  
Collectoremitter breakdown voltage,  
gateemitter shortcircuited  
V
V
= 0 V, I = 1 mA  
BV  
CES  
650  
0.6  
V
V/°C  
mA  
GE  
C
Temperature Coefficient of  
Breakdown Voltage  
= 0 V, I = 1 mA  
DBV  
/
GE  
C
CES  
J
DT  
Collectoremitter cutoff current,  
gateemitter shortcircuited  
V
GE  
= 0 V, V = 650 V  
I
250  
400  
CE  
CES  
Gate leakage current, collectoremit-  
ter shortcircuited  
V
GE  
= 20 V, V = 0 V  
I
nA  
CE  
GES  
ON CHARACTERISTIC  
Gateemitter threshold voltage  
Collectoremitter saturation voltage  
V
= V , I = 50 mA  
V
GE(th)  
3.0  
4.5  
6.0  
V
V
GE  
CE  
C
V
= 15 V, I = 50 A  
V
CE(sat)  
1.45  
1.77  
1.8  
GE  
C
V
GE  
= 15 V, I = 50 A, T = 175°C  
C
J
DYNAMIC CHARACTERISTIC  
Input capacitance  
V
= 30 V, V = 0 V, f = 1 MHz  
C
3226  
85  
pF  
nC  
CE  
GE  
ies  
Output capacitance  
C
oes  
Reverse transfer capacitance  
Gate charge total  
C
10  
res  
V
CE  
= 400 V, I = 50 A, V = 15 V  
Q
94  
C
GE  
g
GatetoEmitter charge  
GatetoCollector charge  
Q
Q
17  
ge  
gc  
22  
SWITCHING CHARACTERISTIC, INDUCTIVE LOAD  
Turnon delay time  
T
= 25°C  
t
21  
15  
ns  
C
d(on)  
V
= 400 V, I = 25 A  
CC  
C
Rise time  
t
r
R
= 10 W  
G
V
GE  
= 15 V  
Turnoff delay time  
Fall time  
t
128  
50  
d(off)  
Inductive Load  
t
f
Turnon switching loss  
Turnoff switching loss  
Total switching loss  
Turnon delay time  
Rise time  
E
on  
E
off  
0.41  
0.31  
0.72  
23  
mJ  
ns  
E
ts  
T
C
= 25°C  
t
t
d(on)  
V
CC  
= 400 V, I = 50 A  
C
t
r
34  
R
= 10 W  
G
V
GE  
= 15 V  
Turnoff delay time  
Fall time  
120  
46  
d(off)  
Inductive Load  
t
f
Turnon switching loss  
Turnoff switching loss  
Total switching loss  
E
on  
E
off  
1.05  
0.70  
1.75  
mJ  
E
ts  
www.onsemi.com  
2
 
FGHL50T65MQD  
Table 2. ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise specified) (continued)  
J
Parameter  
Test Conditions  
Symbol  
Min  
Typ  
Max  
Unit  
SWITCHING CHARACTERISTIC, INDUCTIVE LOAD  
Turnon delay time  
T
= 175°C  
t
t
20  
17  
ns  
C
d(on)  
V
= 400 V, I = 25 A  
CC  
C
Rise time  
t
r
R
V
= 10 W  
GE  
G
= 15 V  
Turnoff delay time  
Fall time  
146  
75  
d(off)  
Inductive Load  
t
f
Turnon switching loss  
Turnoff switching loss  
Total switching loss  
Turnon delay time  
Rise time  
E
on  
E
off  
0.75  
0.53  
1.28  
22  
mJ  
ns  
E
ts  
T
C
= 175°C  
t
t
d(on)  
V
CC  
= 400 V, I = 50 A  
C
t
r
36  
R
V
= 10 W  
GE  
G
= 15 V  
Turnoff delay time  
Fall time  
130  
58  
d(off)  
Inductive Load  
t
f
Turnon switching loss  
Turnoff switching loss  
Total switching loss  
DIODE CHARACTERISTIC  
Diode Forward Voltage  
E
on  
E
off  
1.63  
0.94  
2.57  
mJ  
E
ts  
I = 50 A, T = 25°C  
I = 50 A, T = 175°C  
V
2.45  
2.2  
2.75  
V
F
C
C
FM  
F
Reverse Recovery Energy  
I = 50 A, dl /dt = 200 A/ms, T = 175°C  
E
57  
mJ  
F
F
C
rec  
Diode Reverse Recovery Time  
I = 50 A, dl /dt = 200 A/ms, T = 25°C  
T
rr  
32  
202  
ns  
F
F
C
I = 50 A, dl /dt = 200 A/ms, T = 175°C  
F
F
C
Diode Reverse Recovery Charge  
I = 50 A, dl /dt = 200 A/ms, T = 25°C  
Q
rr  
46  
814  
nC  
F
F
C
I = 50 A, dl /dt = 200 A/ms, T = 175°C  
F
F
C
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
www.onsemi.com  
3
FGHL50T65MQD  
TYPICAL CHARACTERISTICS  
200  
150  
100  
200  
20V  
15V  
20V  
15V  
T
C = 255C  
TC  
= 1755C  
12V  
10V  
12V  
10V  
150  
100  
VGE = 8V  
VGE = 8V  
50  
0
50  
0
0
1
2
3
4
5
0
1
2
3
4
5
CollectorEmitter Voltage, VCE [V]  
[V]  
CollectorEmitter Voltage, VCE  
Figure 1. Typical Output Characteristics  
Figure 2. Typical Output Characteristics  
(TJ = 255C)  
(TJ = 1755C)  
3
2
200  
150  
100  
Common Emitter  
VGE = 15V  
Common Emitter  
VGE = 15V  
TC  
TC  
= 25°C  
= 175°C  
100A  
50A  
50  
0
IC = 25A  
1
100  
50  
0
50  
100  
150  
200  
0
1
2
3
4
5
CollectorEmitter Voltage, V [V]  
CE  
CollectorEmitter Case Temperature, T [°C]  
C
Figure 3. Typical Saturation Voltage  
Characteristics  
Figure 4. Saturation Voltage vs. Case Temperature  
at Variant Current Level  
20  
16  
12  
8
20  
Common Emitter  
TC = 25°C  
Common Emitter  
TC = 175°C  
16  
12  
IC = 25A  
50A  
IC = 25A  
8
50A  
100A  
4
0
100A  
4
0
4
8
12  
16  
20  
4
8
12  
16  
20  
GateEmitter Voltage, VGE [V]  
GateEmitter Voltage, VGE [V]  
Figure 5. Saturation Voltage vs. VGE (TJ = 255C)  
Figure 6. Saturation Voltage vs. VGE (TJ = 1755C)  
www.onsemi.com  
4
FGHL50T65MQD  
TYPICAL CHARACTERISTICS (continued)  
15  
10000  
1000  
100  
Common Emitter  
TC  
= 25°C  
VCC = 200V  
Cies  
12  
9
300V  
400V  
Coes  
6
Cres  
10  
1
3
0
Common Emitter  
VGE = 0V, f = 1Mhz  
TC  
= 25°C  
1
10  
CollectorEmitter Voltage, VCE [V]  
0
20  
40  
60  
80  
100  
30  
Gate Charge, Qg [nC]  
Figure 7. Capacitance Characteristics  
Figure 8. Gate Charge Characteristics  
100  
1000  
td(off)  
tr  
100  
tf  
td(on)  
Common Emitter  
Common Emitter  
VCC = 400V, VGE = 15V,  
IC = 50A  
VCC = 400V, VGE = 15V  
IC = 50A  
TC  
TC  
T C  
T C  
= 25°C  
= 175°C  
= 25°C  
= 175°C  
10  
10  
50  
5
15  
25  
35  
45  
10  
20  
30  
Gate Resistance, Rg  
40  
[W]  
50  
Gate Resistance, Rg [ W]  
Figure 9. TurnOn Characteristics  
Figure 10. TurnOff Characteristics  
vs. Gate Resistance  
vs. Gate Resistance  
500  
100  
Common Emitter  
VCC = 400V, VGE = 15V,  
RG = 10 W  
TC = 25°C  
TC = 175°C  
td(off)  
tr  
100  
tf  
td(on)  
10  
1
Common Emitter  
VCC = 400V, VGE = 15V,  
RG = 10 W  
TC  
TC  
= 25°C  
= 175°C  
10  
25  
50  
75  
100  
125  
150  
25  
50  
75  
100  
125  
150  
Collector Current, IC [A]  
[A]  
Collector Current, IC  
Figure 11. TurnOn Characteristics  
Figure 12. TurnOff Characteristics  
vs. Collector Current  
vs. Collector Current  
www.onsemi.com  
5
FGHL50T65MQD  
TYPICAL CHARACTERISTICS (continued)  
10  
10000  
Eon  
Eon  
1
1000  
Eoff  
Common Emitter  
Common Emitter  
Eoff  
VCC = 400V, VGE = 15V,  
VCC = 400V, VGE = 15V,  
IC = 50A  
RG = 10W  
T
C = 25°C  
TC  
TC  
= 25°C  
= 175°C  
TC = 175°C  
0.1  
100  
25  
50  
75  
100  
125  
150  
10  
20  
30  
Gate Resistance, R g  
40  
50  
[ W]  
[A]  
Collector Current, IC  
Figure 13. Switching Loss vs. Gate Resistance  
Figure 14. Switching Loss vs. Collector  
Current  
150  
100  
10  
8
TC  
= 25°C  
TC = 175°C  
di/dt = 200A/uS  
TC=175°C  
6
di/dt = 100A/uS  
10  
TC =75°C  
4
di/dt = 200A/uS  
di/dt = 100A/uS  
TC =25°C  
Common Emitter  
TC  
TC  
TC  
= 25°C  
= 75°C  
= 175°C  
2
1
0
0
1
2
3
4
5
0
20  
40  
60  
80  
100  
Forward Voltage, VF [V]  
Forward Current, VF [V]  
Figure 15. Forward Characteristics  
Figure 16. Reverse Recovery Current  
1200  
900  
350  
TC  
TC  
= 25°C  
= 25°C  
TC= 175°C  
TC= 175°C  
280  
210  
140  
600  
300  
0
di/dt = 200A/uS  
di/dt = 100A/uS  
di/dt = 200A/uS  
di/dt = 100A/uS  
70  
0
0
30  
60  
90  
0
30  
60  
90  
Forward Current, VF [V]  
Forward Current, V [V]  
F
Figure 18. Stored Charge  
Figure 17. Reverse Recovery Time  
www.onsemi.com  
6
FGHL50T65MQD  
TYPICAL CHARACTERISTICS (continued)  
1
0.5  
0.2  
0.1  
0.1  
PDM  
0.05  
t1  
t2  
0.02  
0.01  
Duty Factor, D = t1/t2  
Peak T = Pdm x Zthjc + Tc  
j
Single Pulse  
104  
0.01  
105  
103  
102  
10 1  
10 0  
10 1  
Rectangular Pulse Duration [sec]  
Figure 19. Transient Thermal Impedance of IGBT  
2
1
0.5  
0.2  
0.1  
0.05  
0.02  
0.1  
PDM  
0.01  
0.01  
t1  
Single Pulse  
t2  
Duty Factor, D = t1/t2  
Peak T = Pdm x Zthjc + Tc  
j
0.001  
105  
104  
103  
102  
101  
100  
101  
Rectangular Pulse Duration [sec]  
Figure 20. Transient Thermal Impedance of Diode  
www.onsemi.com  
7
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
TO2473LD  
CASE 340CX  
ISSUE A  
DATE 06 JUL 2020  
GENERIC  
MARKING DIAGRAM*  
XXXXX = Specific Device Code  
A
Y
= Assembly Location  
= Year  
WW  
G
= Work Week  
= PbFree Package  
XXXXXXXXX  
AYWWG  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “ G”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON93302G  
TO2473LD  
PAGE 1 OF 1  
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