FGY40T120SMD [ONSEMI]

IGBT,1200V,40A,场截止沟槽;
FGY40T120SMD
型号: FGY40T120SMD
厂家: ONSEMI    ONSEMI
描述:

IGBT,1200V,40A,场截止沟槽

CD 双极性晶体管
文件: 总10页 (文件大小:656K)
中文:  中文翻译
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is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
March 2016  
FGY40T120SMD  
1200 V, 40 A Field Stop Trench IGBT  
Features  
General Description  
FS Trench Technology, Positive Temperature Coefficient  
Using innovative field stop trench IGBT technology, Fairchild’s  
new series of field stop trench IGBTs offer the optimum  
performance for hard switching application such as solar  
inverter, UPS, welder and PFC applications.  
High Speed Switching  
Low Saturation Voltage: VCE(sat) =1.8 V @ IC = 40 A  
100% of the Parts tested for ILM(1)  
High Input Impedance  
Applications  
RoHS Compliant  
Solar Inverter, Welder, UPS & PFC applications.  
C
G
Power TO247  
(TO-247H03)  
G
C
E
E
Absolute Maximum Ratings  
T
= 25°C unless otherwise noted  
C
Symbol  
Description  
FGY40T120SMD  
Unit  
VCES  
Collector to Emitter Voltage  
1200  
±25  
V
V
V
A
A
A
Gate to Emitter Voltage  
Transient Gate to Emitter Voltage  
Collector Current  
VGES  
±30  
@ TC = 25oC  
@ TC = 100oC  
80  
40  
IC  
Collector Current  
@ TC = 25oC  
ILM (1)  
Clamped Inductive Load Current  
Pulsed Collector Current  
160  
ICM (2)  
160  
80  
A
A
A
@ TC = 25oC  
@ TC = 100oC  
Diode Continuous Forward Current  
Diode Continuous Forward Current  
IF  
40  
IFM  
PD  
Diode Maximum Forward Current  
Maximum Power Dissipation  
Maximum Power Dissipation  
Operating Junction Temperature  
Storage Temperature Range  
240  
882  
A
@ TC = 25oC  
@ TC = 100oC  
W
W
oC  
oC  
441  
TJ  
-55 to +175  
-55 to +175  
Tstg  
Maximum Lead Temp. for soldering  
Purposes, 1/8” from case for 5 seconds  
oC  
TL  
300  
Thermal Characteristics  
Symbol  
Parameter  
Typ.  
Max.  
0.17  
0.55  
40  
Unit  
oC/W  
oC/W  
oC/W  
RθJC(IGBT)  
RθJC(Diode)  
RθJA  
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Ambient  
--  
--  
--  
Notes:  
1. Vcc = 600 V,V = 15 V, I = 160 A, R = 10 , Inductive Load  
GE  
C
G
2. Limited by Tjmax  
©2015 Fairchild Semiconductor Corporation  
FGY40T120SMD Rev. 1.2  
1
www.fairchildsemi.com  
Package Marking and Ordering Information  
Device Marking  
Device  
Package  
Reel Size  
Tape Width  
Quantity  
FGY40T120SMD  
FGY40T120SMD  
TP-247  
-
-
30  
Electrical Characteristics of the IGBT  
T
= 25°C unless otherwise noted  
C
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
Off Characteristics  
BVCES  
ICES  
Collector to Emitter Breakdown Voltage VGE = 0 V, IC = 250 uA  
1200  
-
-
-
-
V
Collector Cut-Off Current  
G-E Leakage Current  
VCE = VCES, VGE = 0 V  
VGE = VGES, VCE = 0 V  
-
-
250  
±400  
uA  
nA  
IGES  
On Characteristics  
VGE(th)  
G-E Threshold Voltage  
IC = 40 mA, VCE = VGE  
4.9  
-
6.2  
1.8  
7.5  
2.4  
V
V
I
C = 40 A, VGE = 15 V  
TC = 25oC  
VCE(sat)  
Collector to Emitter Saturation Voltage  
I
T
C = 40 A, VGE = 15 V,  
C = 175oC  
-
2.0  
-
V
Dynamic Characteristics  
Cies  
Coes  
Cres  
Input Capacitance  
-
-
-
4300  
180  
-
-
-
pF  
pF  
pF  
VCE = 30 V, VGE = 0 V,  
f = 1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
100  
Switching Characcteristics  
td(on)  
tr  
td(off)  
tf  
Turn-On Delay Time  
Rise Time  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
40  
47  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
ns  
ns  
Turn-Off Delay Time  
Fall Time  
475  
10  
ns  
V
CC = 600 V, IC = 40 A,  
RG = 10 Ω, VGE = 15 V,  
ns  
Inductive Load, TC = 25oC  
Eon  
Eoff  
Ets  
td(on)  
tr  
Turn-On Switching Loss  
Turn-Off Switching Loss  
Total Switching Loss  
Turn-On Delay Time  
Rise Time  
2.7  
1.1  
3.8  
40  
mJ  
mJ  
mJ  
ns  
55  
ns  
td(off)  
tf  
Turn-Off Delay Time  
Fall Time  
520  
50  
ns  
V
CC = 600 V, IC = 40 A,  
RG = 10 Ω, VGE = 15 V,  
ns  
Inductive Load, TC = 175oC  
Eon  
Eoff  
Ets  
Qg  
Turn-On Switching Loss  
Turn-Off Switching Loss  
Total Switching Loss  
Total Gate Charge  
Gate to Emitter Charge  
Gate to Collector Charge  
3.4  
2.5  
5.9  
370  
23  
mJ  
mJ  
mJ  
nC  
nC  
nC  
V
CE = 600 V, IC = 40 A,  
Qge  
Qgc  
VGE = 15 V  
210  
©2015 Fairchild Semiconductor Corporation  
FGY40T120SMD Rev. 1.2  
2
www.fairchildsemi.com  
Electrical Characteristics of the DIODE  
T = 25°C unless otherwise noted  
C
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
IF = 40 A, TC = 25oC  
-
3.8  
4.8  
V
VFM  
Diode Forward Voltage  
IF = 40 A, TC = 175oC  
-
-
-
-
-
-
2.7  
65  
-
-
-
-
-
-
V
trr  
Diode Reverse Recovery Time  
Diode Reverse Recovery Charge  
Reverse Recovery Energy  
VR = 600 V, IF = 40 A,  
ns  
nC  
uJ  
ns  
nC  
diF/dt = 200 A/us, TC = 25oC  
Qrr  
Erec  
trr  
234  
97  
VR = 600 V, IF = 40 A,  
diF/dt = 200 A/us, TC = 175oC  
Diode Reverse Recovery Time  
Diode Reverse Recovery Charge  
200  
1800  
Qrr  
©2015 Fairchild Semiconductor Corporation  
FGY40T120SMD Rev. 1.2  
3
www.fairchildsemi.com  
Typical Performance Characteristics  
Figure 1. Typical Output Characteristics  
Figure 2. Typical Output Characteristics  
300  
300  
TC = 175oC  
TC = 25oC  
20V  
17V  
20V  
15V  
17V  
250  
200  
150  
100  
50  
250  
200  
150  
100  
50  
15V  
12V  
12V  
VGE=10V  
VGE=10V  
0
0
0
1
2
3
4
5
6
7
8
9
10  
0
1
2
3
4
5
6
7
8
9
10  
Collector-Emitter Voltage, VCE [V]  
Collector-Emitter Voltage, VCE [V]  
Figure 3. Typical Saturation Voltage  
Characteristics  
Figure 4. Saturation Voltage vs. Case  
Temperature at Variant Current Level  
4
3
2
1
160  
Common Emitter  
VGE = 15V  
Common Emitter  
VGE = 15V  
TC  
TC = 175oC ---  
=
25oC  
120  
80  
40  
0
80A  
40A  
IC=20A  
0
1
2
3
4
5
25  
50  
75  
100  
125  
150  
GE  
175  
Case Temperature TC [oC]  
Collector-Emitter Voltage, VCE [V]  
Figure 5. Saturation Voltage vs. V  
Figure 6. Saturation Voltage vs. V  
GE  
20  
20  
Common Emitter  
Common Emitter  
TC = 25oC  
TC = 175oC  
16  
16  
80A  
80A  
12  
12  
40A  
40A  
8
8
IC=20A  
IC=20A  
4
4
0
0
0
4
8
12  
16  
20  
0
4
8
12  
16  
20  
Gate-Emitter Voltage, VGE [V]  
Gate-Emitter Voltage, VGE [V]  
©2015 Fairchild Semiconductor Corporation  
FGY40T120SMD Rev. 1.2  
4
www.fairchildsemi.com  
Typical Performance Characteristics  
Figure 7. Capacitance Characteristics  
Figure 8. Load Current vs. Frequency  
300  
6000  
VCC = 600 V  
Common Emitter  
VGE = 0V , f = 1MHz  
TC = 25oC  
Load Current: peak of square wave  
250  
5000  
4000  
3000  
2000  
1000  
Ciss  
200  
TC = 100oC  
150  
100  
Coss  
Crss  
Duty Cycle: 50%  
50  
TC = 100oC  
Power Dissipation = 441 W  
0
1
10  
1k  
10k  
100k  
1M  
Collector-Emitter Voltage, VCE [V]  
Switching Frequency, f [Hz]  
Figure 9. Turn-on Characteristics vs.  
Gate Resistance  
Figure 10. Turn-off Characteristics vs.  
Gate Resistance  
1000  
1000  
tr  
td(off)  
100  
100  
td(on)  
tf  
Common Emitter  
10  
VCC = 600V, VGE = 15V  
10  
IC = 40A  
Common Emitter  
VCC = 600V, VGE = 15V, IC = 40A  
TC = 25oC  
TC = 175oC  
TC = 25oC  
,
TC = 175oC  
1
1
0
10  
20  
30  
40  
50 60  
70  
0
10  
20  
30  
40  
50  
Gate Resistance, RG [Ω]  
Gate Resistance, RG [Ω]  
Figure 11. Swithcing Loss vs.  
Gate Resistance  
Figure 12. Turn-on Characteristics vs.  
Collector Current  
tr  
10  
Eon  
100  
Eoff  
td(on)  
1
Common Emitter  
VCC = 600V, VGE = 15V  
Common Emitter  
VGE = 15V, RG = 10Ω  
TC = 25oC  
TC = 175oC  
IC = 40A  
TC = 25oC  
TC = 175oC  
10  
0.1  
10  
20  
30  
40  
50  
60  
70  
80  
0
10  
20  
30  
40  
50  
60  
70  
Gate Resistance, RG [Ω]  
Collector Current, IC [A]  
©2015 Fairchild Semiconductor Corporation  
FGY40T120SMD Rev. 1.2  
5
www.fairchildsemi.com  
Typical Performance Characteristics  
Figure 13. Turn-off Characteristics vs.  
Collector Current  
Figure 14. Swithcing Loss vs.  
Collector Current  
30  
1000  
td(off)  
10  
Eon  
100  
Eoff  
1
tf  
Common Emitter  
VGE = 15V, RG = 10Ω  
10  
TC = 25oC  
TC = 175oC  
Common Emitter  
VGE = 15V, RG = 10Ω  
TC = 25oC  
,
TC = 175oC  
0.1  
1
10  
20  
30  
40  
50  
60  
70  
80  
20  
40  
60  
80  
Collector Current, IC [A]  
Collector Current, IC [A]  
Figure 15. Gate Charge Characteristics  
Figure 16. SOA Characteristics  
500  
15  
IcMAX (Pulsed)  
100  
10μs  
12  
200V  
400V  
100μs  
1ms  
10ms  
DC  
IcMAX (Continuous)  
VCC = 600V  
10  
1
9
6
3
0
Single Nonrepetitive  
Pulse TC = 25oC  
0.1  
0.01  
Curves must be derated  
linearly with increase  
in temperature  
Common Emitter  
TC = 25oC  
1
10  
100  
1000  
0
50 100 150 200 250 300 350 400  
Gate Charge, Qg [nC]  
Collector-Emitter Voltage, VCE [V]  
Figure 17. Forward Characteristics  
Figure 18. Reverse Recovery Current  
21  
TC = 25oC  
TC = 175oC  
18  
100  
diF/dt = 200A/μs  
15  
12  
diF/dt = 100A/μs  
9
10  
diF/dt = 200A/μs  
6
diF/dt = 100A/μs  
TC = 25oC  
3
TC = 175oC ---  
0
1
0
1
2
3
4
5
0
20  
40  
60  
80  
Forward Voltage, VF [V]  
Forward Current, IF [A]  
©2015 Fairchild Semiconductor Corporation  
FGY40T120SMD Rev. 1.2  
6
www.fairchildsemi.com  
Typical Performance Characteristics  
Figure 19. Reverse Recovery Time  
Figure 20. Stored Charge  
360  
3000  
TC = 25oC  
TC = 25oC  
TC = 175oC ---  
TC = 175oC ---  
2500  
300  
240  
180  
2000  
1500  
di/dt = 100A/μs  
di/dt = 200A/μs  
di/dt = 100A/μs  
120  
60  
0
1000  
di/dt = 200A/μs  
500  
0
0
20  
40  
60  
80  
0
20  
40  
60  
80  
Forward Current, IF [A]  
Forward Current, IF [A]  
Figure 21. Transient Thermal Impedance of IGBT  
0.3  
0.1  
0.5  
0.3  
0.1  
0.05  
0.02  
0.01  
P
DM
0.01  
t1
t2
single pulse  
Duty Factor, D = t1/t2  
Peak Tj = Pdm x Zthjc + TC  
1E-3  
1E-5  
1E-4  
1E-3  
0.01  
0.1  
1
Rectangular Pulse Duration [sec]  
Figure 22. Transient Thermal Impedance of Diode  
0.8  
0.1  
0.5  
0.3  
0.1  
0.05  
PDM  
0.02  
t1  
0.01  
t2  
Duty Factor, D = t1/t2  
0.01  
single pulse  
Peak Tj = Pdm x Zthjc + TC  
0.005  
1E-5  
1E-4  
1E-3  
0.01  
0.1 1  
Rectangular Pulse Duration [sec]  
©2015 Fairchild Semiconductor Corporation  
FGY40T120SMD Rev. 1.2  
7
www.fairchildsemi.com  
15.87  
15.37  
4.82  
4.58  
B
A
13.80  
13.40  
1.35  
0.51  
12.25  
11.75  
5.58  
5.34  
2.20  
1.80  
4.52  
4.12  
17.03  
16.63  
20.82  
20.32  
3.93  
3.69  
2.39  
2.10  
2.66  
2.29  
1.75  
20.10  
19.90  
3.20  
2.87  
1.30  
1.10  
0.71  
0.51  
2X 5.45  
M
M
B A  
0.254  
FRONT VIEW  
SIDE VIEW  
BOTTOM VIEW  
NOTES:  
A. THIS PACKAGE DOES NOT CONFORM TO  
ANY STANDARDS.  
B. ALL DIMENSIONS ARE IN MILLIMETERS.  
C. DIMENSIONS ARE EXCLUSIVE OF BURRS,  
MOLD FLASH AND TIE BAR PROTRUSIONS.  
D. DIMENSION AND TOLERANCE AS PER ASME  
Y14.5-2009.  
E. DRAWING FILE NAME: TO247H03REV1  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
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