FL7930BMX-G [ONSEMI]
单级反激和边界模式 PFC 控制器,用于照明;型号: | FL7930BMX-G |
厂家: | ONSEMI |
描述: | 单级反激和边界模式 PFC 控制器,用于照明 控制器 功率因数校正 光电二极管 |
文件: | 总25页 (文件大小:1785K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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October 2013
FL7930B
Single-Stage Flyback and Boundary-Mode PFC
Controller for Lighting
Description
Features
The FL7930B is an active power factor correction
(PFC) controller for boost PFC applications that
operate in critical conduction mode (CRM). It uses a
voltage-mode PWM that compares an internal ramp
signal with the error amplifier output to generate a
MOSFET turn-off signal. Because the voltage-mode
CRM PFC controller does not need rectified AC line
voltage information, it saves the power loss of an input
voltage sensing network necessary for a current-mode
CRM PFC controller.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
Additional OVP Detection Pin
VIN-Absent Detection
Maximum Switching Frequency Limitation
Internal Soft-Start and Startup without Overshoot
Internal Total Harmonic Distortion (THD) Optimizer
Precise Adjustable Output Over-Voltage Protection
Open-Feedback Protection and Disable Function
Zero Current Detector (ZCD)
FL7930B provides over-voltage protection (OVP), open-
feedback protection, over-current protection (OCP),
input-voltage-absent detection, and under-voltage
lockout protection (UVLO). The additional OVP pin can
be used to shut down the boost power stage when
output voltage exceeds OVP level due to the resistors
that are connected at INV pin are damaged. The
FL7930B can be disabled if the INV pin voltage is lower
than 0.45 V and the operating current decreases to a
very low level. Using a new variable on-time control
method, total harmonic distortion (THD) is lower than in
conventional CRM boost PFC ICs.
150 μs Internal Startup Timer
MOSFET Over-Current Protection (OCP)
Under-Voltage Lockout with 3.5 V Hysteresis
Low Startup and Operating Current
Totem-Pole Output with High State Clamp
+500/-800 mA Peak Gate Drive Current
8-Pin, Small-Outline Package (SOP)
Applications
.
.
.
.
Ballast
General LED Lighting
Industrial, Commercial, and Residential Fixtures
Outdoor Lighting: Street, Roadway, Parking,
Construction, Ornamental LED Lighting Fixtures
Ordering Information
Operating
Temperature Range
Packing
Part Number
Top Mark
Package
Method
FL7930BMX_G
-40 to +125°C
FL7930BG
8-Lead Small Outline Package (SOP) Tape & Reel
© 2010 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FL7930B • Rev. 1.0.4
Application Diagram
DC OUTPUT
Vcc
FL7930B
Line Filter
7
4
1
2
8
5
3
Out
VCC
CS
INV
ZCD
AC INPUT
COMP
OVP
GND
6
Figure 1.
Typical Boost PFC Application
FL7930B
1
2
3
4
8
7
6
5
INV
VCC
CF1
CF2
CHF
GATE
OVP
COMP
CS
GND
ZCD
Figure 2. Typical Application of Single-Stage Flyback Converter
© 2010 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FL7930B • Rev. 1.0.4
2
Internal Block Diagram
VCC
H:open
VREF
2.5VREF
8
VCC
VCC
-
VZ
Internal
Bias
VBIAS
reset
+
VTH(S/S)
8.5
12
5
-
ZCD
VCC
+
Restart
Tmer
Gate
VTH(ZCD)
7
OUT
Driver
fMAX
Limit
VO(MAX)
THD
Optimized
Sawtooth
Generator
S
Q
Q
Control Range
Compensation
+
R
-
40kW
8pF
Overshoot-less
Control
4
6
+
CS
-
1
-
VCS_LIM
INV
VREF
VREF
Stair
Step
GND
+
Clamp
Circuit
reset
VIN Absent
3
2
COMP
OVP
disable
disable
Thermal
Shutdown
-
0.35 0.45
VREF
2.5 2.675
+
INV_open
OVP
VOVP,LH
disable
+
-
2.5 2.88
Figure 3.
Functional Block Diagram
© 2010 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FL7930B • Rev. 1.0.4
3
Pin Configuration
VCC
OUT GND ZCD
FL7930BG
8-SOP
INV OVP COMP CS
Figure 4. Pin Configuration (Top View)
Pin Definitions
Pin # Name
Description
This pin is the inverting input of the error amplifier. The output voltage of the boost PFC converter
should be resistively divided to 2.5 V.
1
2
3
INV
OVP
This pin is used to detect PFC output over voltage when INV pin information is not correct.
This pin is the output of the transconductance error amplifier. Components for the output voltage
compensation should be connected between this pin and GND.
COMP
This pin is the input of the over-current protection comparator. The MOSFET current is sensed
using a sensing resistor and the resulting voltage is applied to this pin. An internal RC filter is
included to filter switching noise.
4
CS
This pin is the input of the zero-current detection (ZCD) block. If the voltage of this pin goes
higher than 1.5 V, then goes lower than 1.4 V, the MOSFET is turned on.
5
6
ZCD
GND
This pin is used for the ground potential of all the pins. For proper operation, the signal ground
and the power ground should be separated.
This pin is the gate drive output. The peak sourcing and sinking current levels are +500 mA and
-800 mA, respectively. For proper operation, the stray inductance in the gate driving path must be
minimized.
7
8
OUT
VCC
This is the IC supply pin. IC current and MOSFET drive current are supplied using this pin.
© 2010 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FL7930B • Rev. 1.0.4
4
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
Parameter
Min.
Max.
Unit
VCC
IOH, IOL
ICLAMP
IDET
Supply Voltage
VZ
+500
+10
+10
8.0
V
Peak Drive Output Current
-800
-10
mA
mA
mA
Driver Output Clamping Diodes VO>VCC or VO<-0.3 V
Detector Clamping Diodes
-10
Error Amplifier Input, Output, OVP Input, ZCD, RDY, and OVP Pins(1)
CS Input Voltage(2)
-0.3
-10.0
VIN
V
6.0
TJ
TA
Operating Junction Temperature
+150
+125
+150
2.5
°C
°C
°C
Operating Temperature Range
-40
-65
TSTG
Storage Temperature Range
Human Body Model, JESD22-A114
Charged Device Model, JESD22-C101
Electrostatic Discharge
Capability
ESD
kV
2.0
Notes:
1. When this pin is supplied by external power sources by accident, its maximum allowable current is 50 mA.
2. In case of DC input, the acceptable input range is -0.3 V~6 V: within 100 ns -10 V~6 V is acceptable, but
electrical specifications are not guaranteed during such a short time.
Thermal Impedance
Symbol
Parameter
Min.
Max.
Unit
Thermal Resistance, Junction-to-Ambient(3)
150
°C/W
JA
Note:
3. Regarding the test environment and PCB type, please refer to JESD51-2 and JESD51-10.
© 2010 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FL7930B • Rev. 1.0.4
5
Electrical Characteristics
VCC = 14 V and TA = -40°C~+125°C, unless otherwise specified.
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Unit
VCC Section
VSTART
VSTOP
Start Threshold Voltage
Stop Threshold Voltage
UVLO Hysteresis
VCC Increasing
VCC Decreasing
11
7.5
3.0
20
12
8.5
3.5
22
13
9.5
4.0
24
V
V
V
V
V
HYUVLO
VZ
Zener Voltage
ICC=20 mA
VOP
Recommended Operating Range
13
20
Supply Current Section
ISTART Startup Supply Current
IOP Operating Supply Current
VCC=VSTART-0.2 V
120
1.5
190
3.0
µA
mA
mA
µA
Output Not Switching
IDOP
Dynamic Operating Supply Current 50 kHz, CI=1 nF
Operating Current at Disable VINV=0 V
2.5
4.0
IOPDIS
90
160
230
Error Amplifier Section
VREF1
VREF1
VREF2
IEA,BS
Voltage Feedback Input Threshold1 TA=25°C
2.465
2.500
0.1
2.535
10.0
V
Line Regulation
VCC=14 V~20 V
mV
mV
µA
(4)
Temperature Stability of VREF1
Input Bias Current
20
VINV=1 V~4 V
-0.5
0.5
IEAS,SR
IEAS,SK
VEAH
VEAZ
gm
Output Source Current
Output Sink Current
VINV=VREF -0.1 V
VINV=VREF +0.1 V
VINV=1 V, VCS=0 V
-12
12
µA
µA
Output Upper Clamp Voltage
6.0
0.9
90
6.5
1.0
115
7.0
1.1
140
V
Zero Duty Cycle Output Voltage
Transconductance(4)
V
µmho
Maximum On-Time Section
tON,MAX1
tON,MAX2
Maximum On-Time Programming 1 TA=25°C, VZCD=1 V
35.5
11.2
41.5
13.0
47.5
14.8
µs
µs
TA=25°C,
Maximum On-Time Programming 2
IZCD=0.469 mA
Current-Sense Section
Current Sense Input Threshold
Voltage Limit
VCS
ICS,BS
tCS,D
0.7
0.8
-0.1
350
0.9
1.0
500
V
Input Bias Current
VCS=0~1 V
-1.0
µA
ns
dV/dt=1 V/100 ns,
from 0 V to 5 V
Current Sense Delay to Output(4)
Continued on the following page…
© 2010 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FL7930B • Rev. 1.0.4
6
Electrical Characteristics
VCC = 14 V and TA = -40°C~+125°C, unless otherwise specified.
Symbol
Parameter
Conditions
Min.
Typ. Max.
Unit
Zero-Current Detect Section
VZCD
Input Voltage Threshold(4)
1.35
0.05
5.5
0
1.50
0.10
6.2
1.65
0.15
7.5
1.00
1.0
-4
V
V
HYZCD Detect Hysteresis(4)
VCLAMPH Input High Clamp Voltage
VCLAMPL Input Low Clamp Voltage
IZCD,BS Input Bias Current
IZCD,SR Source Current Capability(4)
IZCD,SK Sink Current Capability(4)
IDET=3 mA
V
IDET=-3 mA
VZCD=1 V~5 V
TA=25°C
0.65
-0.1
V
-1.0
µA
mA
mA
TA=25°C
10
Maximum Delay From ZCD to Output
Turn-On(4)
dV/dt=-1 V/100 ns, from
5 V to 0 V
tZCD,D
100
9.2
200
ns
Output Section
VOH
VOL
Output Voltage High
IO=-100 mA, TA=25°C
IO=200 mA, TA=25°C
CIN=1 nF
11.0
1.0
50
12.8
2.5
V
V
Output Voltage Low
Rising Time(4)
Falling Time(4)
tRISE
tFALL
100
100
14.5
1
ns
ns
V
CIN=1 nF
50
VO,MAX Maximum Output Voltage
VCC=20 V, IO=100 µA
VCC=5 V, IO=100 µA
11.5
13.0
VO,UVLO Output Voltage with UVLO Activated
V
Restart / Maximum Switching Frequency Limit Section
tRST
fMAX
Restart Timer Delay
Maximum Switching Frequency(4)
50
150
300
300
350
µs
250
kHz
Soft-Start Timer Section
tSS
Internal Soft-Soft(4)
3
5
7
ms
Protections
VOVP,INV OVP Threshold Voltage at INV Pin
HYOVP,INV OVP Hysteresis at INV Pin
VOVP,OVP OVP Threshold Voltage at OVP Pin
HYOVP,OVP OVP Hysteresis at OVP Pin
TA=25°C
TA=25°C
TA=25°C
TA=25°C
2.620 2.675 2.730
0.120 0.175 0.230
2.740 2.845 2.960
0.345
V
V
V
V
VEN
HYEN
TSD
Enable Threshold Voltage
0.40
0.05
125
0.45
0.10
140
60
0.50
0.15
155
V
Enable Hysteresis
V
Thermal Shutdown Temperature(4)
Hysteresis Temperature of TSD(4)
°C
°C
THYS
Note:
4. These parameters, although guaranteed by design, are not production tested.
© 2010 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FL7930B • Rev. 1.0.4
7
Comparison of FL6961 and FL7930B
Function
FL6961
FL7930B
FL7930B Advantages
.
.
No External Circuit for additional OVP
OVP Pin
None
Integrated
Reduction of Power Loss and BOM Cost Caused by
Additional OVP Circuit
.
.
Abnormal CCM Operation Prohibited
Frequency Limit
None
None
None
None
Integrated
Integrated
Integrated
Abnormal Inductor Current Accumulation Can Be
Prohibited
.
.
Increase System Reliability by Testing for Input Supply
Voltage
VIN-Absent Detection
Guarantee Stable Operation at Short Electric Power
Failure
.
.
Reduce Voltage and Current Stress at Startup
Soft-Start and
Startup without
Overshoot
Eliminate Audible Noise Due to Unwanted OVP
Triggering
.
.
Can Avoid Burst Operation at Light Load and High Input
Voltage
Control Range
Compensation
Integrated
Internal
Reduce Probability of Audible Noise Due to Burst
Operation
.
.
.
No External Resistor is Needed
THD Optimizer
TSD
External
None
Stable and Reliable TSD Operation
Converter Temperature Range Limited Range
140°C with
60°C Hysteresis
Control Range
Compensation
None
Integrated
Comparison of FL7930B and FL7930C
Function
RDY Pin
OVP Pin
FL7930B
None
FL7930C
Integrated
None
FL7930B Remark
.
User Choice for the Use of Number #2 Pin
Integrated
© 2010 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FL7930B • Rev. 1.0.4
8
Typical Performance Characteristics
Figure 5. Voltage Feedback Input Threshold 1
(VREF1) vs. TA
Figure 6.
Start Threshold Voltage (VSTART) vs. TA
Figure 7.
Stop Threshold Voltage (VSTOP) vs. TA
Figure 8.
Startup Supply Current (ISTART) vs. TA
Figure 9.
Operating Supply Current (IOP) vs. TA
Figure 10. Output Upper Clamp Voltage (VEAH) vs. TA
© 2010 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FL7930B • Rev. 1.0.4
9
Typical Performance Characteristics
Figure 11. Zero Duty Cycle Output Voltage (VEAZ
vs. TA
)
Figure 12. Maximum On-Time Program 1 (tON,MAX1
vs. TA
)
Figure 13.Maximum On-Time Program 2 (tON,MAX2
vs. TA
)
Figure 14. Current-Sense Input Threshold Voltage
Limit (VCS) vs. TA
Figure 15. Input High Clamp Voltage (VCLAMPH
)
Figure 16. Input Low Clamp Voltage (VCLAMPL) vs. TA
vs. TA
© 2010 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FL7930B • Rev. 1.0.4
10
Typical Performance Characteristics
Figure 17. Output Voltage High (VOH) vs. TA
Figure 18. Output Voltage Low (VOL) vs. TA
Figure 19. Restart Timer Delay (tRST) vs. TA
Figure 20. OVP Threshold at OVP Pin (VOVP,OVP
)
vs. TA
Figure 21. Output Saturation Voltage (VRDY,SAT
vs. TA
)
Figure 22. OVP Threshold Voltage (VOVP) vs. TA
© 2010 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FL7930B • Rev. 1.0.4
11
Applications Information
PFC
VOUT
1. Startup: Normally, supply voltage (VCC) of a PFC
block is fed from the additional power supply, which can
be called standby power. Without this standby power,
auxiliary winding for zero current detection can be used
as a supply source. Once the supply voltage of the PFC
block exceeds 12 V, internal operation is enabled until
the voltage drops to 8.5 V. If VCC exceeds VZ, 20 mA
-
2.885V
2nd OVP
+
high
disable
disable
2.885
OVP
-
2
2.675V/2.5V
2.5 2.675
OVP
+
-
INV Open
0.35 0.45
current is sinking from VCC
.
+
+
0.45V/0.35V
2.5V
PFC Inductor
PFC
PFC
INV
VIN
VOUT
-
1
Aux. Winding
3
FL7930B Rev. 00
COMP
External VCC circuit
when no standby power exists.
Figure 24. Circuit Around INV Pin
PFC
VOUT
390VDC
413V
390V
VCC
H:open
VCC
’
2.5VREF
8
VREF
VBIAS
-
VZ
internal
bias
70V
reset
55V
+
VTH(S/S)
20mA
VINV
2.50V
2.65V
2.50V
8.5
12
2.24V
1.64V
0.45V
0.35V
Figure 23. Startup Circuit
VCC
15V
2. INV Block: Scaled-down voltage from the output is
the input for the INV pin. Many functions are embedded
based on the INV pin: transconductance amplifier,
output OVP comparator, and disable comparator.
2.0V
COMP
IOUT
Current Sourcing
Current Sourcing
Disable
OVP
I sinking
For the output voltage control, a transconductance
amplifier is used instead of the conventional voltage
amplifier. The transconductance amplifier (voltage-
controlled current source) aids the implementation of
the OVP and disable functions. The output current of
the amplifier changes according to the voltage
difference of the inverting and non-inverting input of
the amplifier. To cancel down the line input voltage
effect on power factor correction, the effective control
response of the PFC block should be slower than the
line frequency and this conflicts with the transient
response of the controller. Two-pole one-zero type
compensation can meet both requirements.
VCC<2V, internal logic is not alive.
- Internal signals are unknown.
t
Figure 25. Timing Chart for INV Block
3. OVP Pin: Over-Voltage Protection (OVP) is
embedded by the information at the INV pin. That
information comes from the output through the voltage
dividing resistors. To scale down from a high voltage to
a low one, high resistance is normally used with low
resistance. If the resistor of high resistance gets
damaged and resistance is changed to high, though INV
pin information is normal, output voltage exceeds its
rated output. If this occurs, the output electrolytic
The OVP comparator shuts down the output drive block
when the voltage of the INV pin is higher than 2.675 V
and there is 0.175 V hysteresis. The disable comparator
disables operation when the voltage of the inverting input
is lower than 0.35 V and there is 100 mV hysteresis. An
external small-signal MOSFET can be used to disable the
IC, as shown in Figure 24. The IC operating current
decreases to reduce power consumption if the IC is
disabled. Figure 25 is the timing chart of the internal
circuit near the INV pin when rated PFC output voltage is
390 VDC and VCC supply voltage is 15 V.
capacitor may be damaged. To prevent such
a
catastrophe additional OVP pin is assigned to double-
check output voltage. Additional OVP may be called
“second” OVP, while INV pin OVP is called “first” OVP.
Since the two OVP conditions are quite different, the
protection recovering mode is different.
© 2010 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FL7930B • Rev. 1.0.4
12
Once the first OVP triggers, switching stops immediately
and recovers switching when the output voltage is
decreased with a hysteresis. When the second OVP
triggers, switching can be recovered only when the VCC
supply voltage falls below VSTOP and builds up higher
than VSTART again and VOVP should be lower than
hysteresis. If the second OVP is not used, the OVP pin
must be connected to the INV pin or to the ground.
where, VAUX is the auxiliary winding voltage; TIND and
TAUX are boost inductor turns and auxiliary winding turns,
respectively; VAC is input voltage for PFC converter; and
VOUT_PFC is output voltage from the PFC converter.
PFC Inductor
PFC
PFC
VIN
VOUT
Aux. Winding
VCC
VCC
RZCD
VSTART
Negative Clamp
VSTOP
Circuit
ZCD
5
-
Error on INV
Resistors
Happens
VINV
INV OVP
Level
+
CZCD
Restart
Timer
hysteresis
VTH(ZCD)
Positive Clamp
Circuit
Optional
Gate
Driver
fMAX
Limit
S
R
Q
Q
THD
Optimized
Sawtooth
Generator
Though Output-
Voltage Reduced,
no Switching.
VOVP
OVP Level
OVP Level
Figure 27. Circuit Near ZCD
Because auxiliary winding voltage can swing from
negative to positive voltage, the internal block in ZCD
pin has both positive and negative voltage clamping
circuits. When the auxiliary voltage is negative, an
internal circuit clamps the negative voltage at the ZCD
pin around 0.65 V by sourcing current to the serial
resistor between the ZCD pin and the auxiliary winding.
When the auxiliary voltage is higher than 6.5 V, current
is sinked through a resistor from the auxiliary winding to
the ZCD pin.
Switching stop
If error
IMOSFET
Switching stop
only during
OVP
until VCC drops
below VSTOP and
recovers to
still exist,
OVP
triggers
again
VSTART
t
Figure 26. Comparison of First and Second
OVP Recovery Modes
ISW
4. Control Range Compensation: On time is controlled
by the output voltage compensator with FL7930B. Due
to this when input voltage is high and load is light,
control range becomes narrow compared to when input
voltage is low. That control range decrease is inversely
IDIODE
VACIN
IMOSFET
VAUX & VZCD
proportional to the double square of the input voltage
1
( control range ∝ input
). Thus at high line,
VAUX
2
voltage
VZCD
unwanted burst operation easily happens at light load
and audible noise may be generated from the boost
inductor or inductor at input filter. Different from the
other converters, burst operation in PFC block is not
needed because the PFC block itself is normally
disabled during standby mode. To reduce unwanted
burst operation at light load, an internal control range
compensation function is implemented and shows no
burst operation until 5% load at high line.
6.2V
0.65V
t
Figure 28. Auxiliary Voltage Depends
on MOSFET Switching
The auxiliary winding voltage is used to check the boost
inductor current zero instance. When boost inductor
current becomes zero, there is a resonance between
boost inductor and all capacitors at the MOSFET drain
pin, including COSS of the MOSFET; an external
capacitor at the D-S pin to reduce the voltage rising and
falling slope of the MOSFET; a parasitic capacitor at
inductor; and so on to improve performance. Resonated
voltage is reflected to the auxiliary winding and can be
used for detecting zero current of boost inductor and
valley position of MOSFET voltage stress. For valley
detection, a minor delay by the resistor and capacitor is
needed. A capacitor increases the noise immunity at the
ZCD pin. If ZCD voltage is higher than 1.5 V, an internal
ZCD comparator output becomes HIGH and LOW when
the ZCD goes below 1.4 V. At the falling edge of
comparator output, internal logic turns on the MOSFET.
5. Zero-Current Detection: Zero-current detection
(ZCD) generates the turn-on signal of the MOSFET
when the boost inductor current reaches zero using an
auxiliary winding coupled with the inductor. When the
power switch turns on, negative voltage is induced at the
auxiliary winding due to the opposite winding direction
(see Equation 1). Positive voltage is induced (see
Equation 2) when the power switch turns off:
T
AUX
V
V
AC
AUX
(1)
(2)
T
IND
T
AUX
V
V
V
AC
AUX
PFCOUT
T
IND
© 2010 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FL7930B • Rev. 1.0.4
13
VDS
Ignores ZCD
Noise
ZCD after COMPARATOR
VOUTPFC - VIN
VOUTPFC - VIN
VIN
MOSFET Gate
Max fSW Limit
Error Happens!
IINDUCTOR
t
IDIODE
IMOSFET
Inhibit Region
Figure 31. Maximum Switching Frequency
Limit Operation
VZCD
6. Control: The scaled output is compared with the
internal reference voltage and sinking or sourcing
current is generated from the COMP pin by the
transconductance amplifier. The error amplifier output is
compared with the internal sawtooth waveform to give
proper turn-on time based on the controller.
1.5V
1.4V
MOSFET gate
ON
150ns Delay
PFC
VOUT
ON
t
Figure 29. Auxiliary Voltage Threshold
6.2V
THD optimized
Sawtooth
Generator
1V
When no ZCD signal is available, the PFC controller
cannot turn on the MOSFET, so the controller checks
every switching off time and forces MOSFET turn on
when the off time is longer than 150 μs. This restart
timer triggers MOSFET turn-on at startup and may be
used at the input voltage zero cross period.
+
-
MOSFET Off
Sawtooth
INV
1
3
-
VREF
Stair
Step
+
Clamp
Circuit
COMP
VOUT
VIN
R1
C1
C2
VCC
Figure 32. Control Circuit
Unlike a conventional voltage-mode PWM controller,
FL7930B turns on the MOSFET at the falling edge of
ZCD signal. The “ON” instant is determined by the
external signal and the turn-on time lasts until the error
amplifier output (VCOMP) and sawtooth waveform meet.
When load is heavy, output voltage decreases, scaled
output decreases, COMP voltage increases to
compensate low output, turn-on time lengthens to give
more inductor turn-on time, and increased inductor
current raises the output voltage. This is how a PFC
negative feedback controller regulates output.
tRESTART
150s
MOSFET Gate
ZCD after COMPARATOR
t
Figure 30. Restart Timer at Startup
Because the MOSFET turn-on depends on the ZCD
input, switching frequency may increase to higher than
several megahertz due to the mis-triggering or noise on
the nearby ZCD pin. If the switching frequency is higher
than needed for critical conduction mode (CRM),
operation mode shifts to continuous conduction mode
(CCM). In CCM, unlike CRM where the boost inductor
current is reset to zero at the next switch on; inductor
current builds up at every switching cycle and can be
raised to very high current that exceeds the current
rating of the power switch or diode. This can seriously
damage the power switch. To avoid this, maximum
switching frequency limitation is embedded. If ZCD
signal is applied again within 3.3 μs after the previous
rising edge of gate signal, this signal is ignored
internally and FL7930B waits for another ZCD signal.
This slightly degrades the power factor performance at
light load and high input voltage.
The maximum of VCOMP is limited to 6.5 V, which
dictates the maximum turn-on time. Switching stops
when VCOMP is lower than 1.0 V.
ZCD after COMPARATOR
VCOMP & Sawtooth
0.155 V / s
MOSFET Gate
t
Figure 33. Turn-On Time Determination
© 2010 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FL7930B • Rev. 1.0.4
14
VCC
The roles of PFC controller are regulating output voltage
and input current shaping to increase power factor. Duty
control based on the output voltage should be fast
enough to compensate output voltage dip or overshoot.
For the power factor, however, the control loop must not
react to the fluctuating AC input voltage. These two
requirements conflict; therefore, when designing a
feedback loop, the feedback loop should be least ten
times slower than AC line frequency. That slow
response is made by C1 at the compensator. R1 makes
gain boost around operation region and C2 attenuates
gain at higher frequency. Boost gain by R1 helps raise
the response time and improves phase margin.
VSTART=12V
SS
VREFEND=2.5V
VREF
5ms
VINV=0.4V
gM
Gain
COMP
COMP
(VREFSS-VINV
)
gM=ISOURCE
ISOURCE
Integrator
C1
Proportional
Gain
R1
COMP
VCOMP
ISOURCE
RCOMP=VCOMP
Freq.
C2
High-Frequency
Noise Filter
t
Figure 36. Soft-Start Sequence
Figure 34. Compensators Gain Curve
8. Startup without Overshoot: Feedback control speed
of PFC is quite slow. Due to the slow response, there is
a gap between output voltage and feedback control.
That is why over-voltage protection (OVP) is critical at
the PFC controller and voltage dip caused by fast load
changes from light to heavy is diminished by a bulk
capacitor. OVP can be triggered during startup phase.
Operation on and off by OVP at startup may cause
audible noise and can increase voltage stress at startup,
which is normally higher than in normal operation. This
operation is improved when soft start time is very long.
However, too much startup time enlarges the output
voltage building time at light load. FL7930B has
overshoot protection at startup. During startup, the
feedback loop is controlled by an internal proportional
gain controller and when the output voltage reaches the
rated value, it switches to an external compensator after
a transition time of 30 ms. This internal proportional gain
controller eliminates overshoot at startup and an
external conventional compensator takes over
successfully afterward.
For the transconductance error amplifier side, gain
changes based on differential input. When the error is
large, gain is large to suppress the output dip or peak
quickly. When the error is small, low gain is used to
improve power factor performance.
ICOMP
Powering
250mho
115mho
Braking
VOUT
Conventional Controller
Startup
Figure 35. Gain Characteristic
Overshoot
7. Soft-Start: When VCC reaches VSTART, the internal
reference voltage is increased like a stair step for 5 ms.
As a result, VCOMP is also raised gradually and MOSFET
turn-on time increases smoothly. This reduces voltage
and current stress on the power switch during startup.
Overshoot-less Startup Control
Control Transition
VCOMP
Depend on Load
Internal Controller
t
Figure 37. Startup without Overshoot
© 2010 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FL7930B • Rev. 1.0.4
15
9. THD Optimization: Total harmonic distortion (THD)
is the factor that dictates how closely input current
shape matches sinusoidal form. The turn-on time of the
PFC controller is almost constant over one AC line
period due to the extremely low feedback control
response. The turn-off time is determined by the current
decrease slope of the boost inductor made by the input
voltage and output voltage. Once inductor current
becomes zero, resonance between COSS and the boost
inductor makes oscillating waveforms at the drain pin
and auxiliary winding. By checking the auxiliary winding
voltage through the ZCD pin, the controller can check
the zero current of boost inductor. At the same time, a
minor delay is inserted to determine the valley position
of drain voltage. The input and output voltage difference
is at its maximum at the zero cross point of AC input
voltage. The current decrease slope is steep near the
zero cross region and more negative inductor current
flows during a drain voltage valley detection time. Such
a negative inductor current cancels down the positive
current flows and input current becomes zero, called
“zero-cross distortion” in PFC.
To improve this, lengthened turn-on time near the zero
cross region is a well-known technique, though the
method may vary and may be proprietary. FL7930B
optimizes this by sourcing current through the ZCD pin.
Auxiliary winding voltage becomes negative when the
MOSFET turns on and is proportional to input voltage.
The negative clamping circuit of ZCD outputs the
current to maintain the ZCD voltage at a fixed value.
The sourcing current from the ZCD is directly
proportional to the input voltage. Some portion of this
current is applied to the internal sawtooth generator
together with a fixed-current source. Theoretically the
fixed-current source and the capacitor at sawtooth
generator determine the maximum turn-on time when no
current is sourcing at ZCD clamp circuit and available
turn-on time gets shorter proportional to the ZCD
sourcing current.
VAUX
RZCD
VCC
IIN
THD Optimizer
N
1
IINDUCTOR
ZCD
5
IDIODE
IMOSFET
VZCD
INEGATIVE
Zero Current
Detect
VREF
1.5V
IMOT
1.4V
150ns
MOSFET Gate
CMOT
reset
ON
ON
Sawtooth Generator
t
Figure 40. Circuit of THD Optimizer
Figure 38.
Input and Output Current
Near Input Voltage Peak
tON is typically constant over 1 AC line frequency
but tON is changed by ZCD voltage.
VZCD
tON
IIN
IINDUCTOR
VZCD
t
INEGATIVE
tON not shortter
tON get shortter
VZCD at FET on
1.5V
1.4V
Figure 41. Effect of THD Optimizer
150ns
MOSFET Gate
ON
By THD optimizer, turn-on time over one AC line period
is proportionally changed, depending on input voltage.
Near zero cross, lengthened turn-on time improves
THD performance.
ON
ON
ON
t
Figure 39. Input and Output Current Near
Input Voltage Peak Zero Cross
© 2010 Fairchild Semiconductor Corporation
FL7930B • Rev. 1.0.4
www.fairchildsemi.com
16
VOUT
VIN
10. VIN-Absent Detection: To reduce power loss
caused by input voltage sensing resistors and to
optimize THD, the FL7930B omits AC input voltage
detection. Therefore, no information about AC input is
available from the internal controller. In many cases, the
VCC of PFC controller is supplied by an independent
power source like standby power. In this scheme, some
mismatch may exist. For example, when the electric
power is suddenly interrupted during two or three AC
line periods; VCC is still live during that time, but output
voltage drops because there is no input power source.
Consequently, the control loop tries to compensate for
the output voltage drop and VCOMP reaches its
maximum. This lasts until AC input voltage is live again.
When AC input voltage is live again, high VCOMP allows
high switching current and more stress is put on the
MOSFET and diode. To protect against this, FL7930B
checks if the input AC voltage exists. If input does not
exist, soft-start is reset and waits until AC input is live
again. Soft-start manages the turn-on time for smooth
operation when it detects AC input is applied again and
applies less voltage and current stress on startup.
Though VIN is eliminated,
operation of controller is
normal due to the large
bypass capacitor.
VAUX
DMAX
fMIN
DMIN
MOSFET Gate
NewVCOMP
fMIN
Input Voltage Absent Detected
IDS
VOUT
VIN
Smooth Soft-
Start
t
Though VIN is eliminated,
operation of controller is
normal due to the large
bypass capacitor.
Figure 43. With VIN-Absent Circuit
11. Current Sense: The MOSFET current is sensed
using an external sensing resistor for over-current
protection. If the CS pin voltage is higher than 0.8 V, the
VAUX
over-current protection comparator generates
a
protection signal. An internal RC filter of 40 kΩ and 8 pF
is included to filter switching noise.
12. Gate Driver Output: FL7930B contains a single
totem-pole output stage designed for a direct drive of
the power MOSFET. The drive output is capable of up
to +500 / -800 mA peak current with a typical rise and
fall time of 50 ns with 1 nF load. The output voltage is
clamped to 13 V to protect the MOSFET gate even if the
VCC voltage is higher than 13 V.
DMAX
MOSFET Gate
VCOMP
fMIN
IDS
High Drain
Current!
t
Figure 42. Without VIN-Absent Circuit
© 2010 Fairchild Semiconductor Corporation
FL7930B • Rev. 1.0.4
www.fairchildsemi.com
17
PCB Layout Guide
PFC block normally handles high switching current and
the voltage low-energy signal path can be affected by
the high-energy path. Cautious PCB layout is mandatory
for stable operation.
5
A stabilizing capacitor for VCC is recommended as
close as possible to the VCC and ground pins. If it is
difficult, place the SMD capacitor as close to the
corresponding pins as possible.
1
The gate drive path should be as short as possible.
The closed-loop that starts from the gate driver,
MOSFET gate, and MOSFET source to ground of
PFC controller should be as close as possible. This
is also crossing point between power ground and
signal ground. Power ground path from the bridge
diode to the output bulk capacitor should be short
and wide. The sharing position between power
ground and signal ground should be only at one
position to avoid ground loop noise. Signal path of
the PFC controller should be short and wide for
external components to contact.
2
The PFC output voltage sensing resistor is normally
high to reduce current consumption. This path can
be affected by external noise. To reduce noise
potential at the INV pin, a shorter path for output
sensing is recommended. If a shorter path is not
possible, place some dividing resistors between
PFC output and the INV pin — closer to the INV pin
is better. Relative high voltage close to the INV pin
can be helpful.
3
4
The ZCD path is recommended close to auxiliary
winding from boost inductor and to the ZCD pin. If
that is difficult, place a small capacitor (below
50 pF) to reduce noise.
Figure 44. Recommended PCB Layout
The switching current sense path should not share
with another path to avoid interference. Some
additional components may be needed to reduce
the noise level applied to the CS pin.
© 2010 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FL7930B • Rev. 1.0.4
18
Typical Application Circuit
Input Voltage
Range
Rated Output
Power
Output Voltage
(Maximum Current)
Application
Device
LED Lighting
FL7930B
90-265 VAC
195 W
390 V (0.5 A)
Features
.
.
.
Average efficiency of 25%, 50%, 75%, and 100% load conditions is higher than 95% at universal input.
Power factor at rated load is higher than 0.98 at universal input.
Total Harmonic Distortion (THD) at rated load is lower than 15% at universal input.
Key Design Notes
.
When auxiliary VCC supply is not available, VCC power can be supplied through Zero Current Detect (ZCD)
winding. The power consumption of R103 is quite high, so its power rating needs checking.
.
Because the input bias current of INV pin is almost zero, output voltage sensing resistors (R112~R115) should
be as high as possible. However, too-high resistance makes the node susceptible to noise. Resistor values need
to strike a balance between power consumption and noise immunity.
.
Quick charge diode (D106) can be eliminated if output diode inrush current capability is sufficient. Through D106,
system operation is normal due to the controller’s highly reliable protection features.
Schematic
Optional
D106
600V 3A
D105
600V 8A
194H, 39:5
DC OUTPUT
LP101,EER3124N
BD101,
600V,15A
VAUX
R103,
10k,1W
C104,
12nF
R109
47
Q101
FCPF
20N60
D102,
UF4004
R108
4.7
D103,1N4148
8
7
VCC
Out
C102,
680nF
5
ZCD
4
CS
3
Comp
1
INV
2
OVP
GND
6
C114, C115,
2.2nF 2.2nF
C101,
220nF
R101,1M-J
ZNR101,
10D471
Circuit for VCC. If external VCC is used, this circuit is not needed.
Figure 45. Demonstration Circuit
© 2010 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FL7930B • Rev. 1.0.4
19
Transformer
EER3019N
9,10
1,2
Naux
9,10
1,2
6,7
NP
Naux
Np
6,7
3,4
3,4
Figure 46. Transformer Schematic Diagram
Winding Specifications
Position
Bottom
Top
No
Pin (S → F)
Wire
Turns
Winding Method
Np
3, 4 → 1, 2
0.1φ×50
39
Solenoid Winding
Insulation: Polyester Tape t = 0.05mm, 3 Layers
NAUX 9,10 → 6,7 0.3φ
Insulation: Polyester Tape t = 0.05 mm, 4 Layers
5
Solenoid Winding
Electrical Characteristics
Pin
Specification
Remark
100 kHz, 1 V
Inductance
3, 4 → 1, 2
194 H ± 5%
Core & Bobbin
Core: EER3019, Samhwa (PL-7) (Ae=137.0mm2)
Bobbin: EER3019
© 2010 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FL7930B • Rev. 1.0.4
20
Bill of Materials
Part #
Value
Note
Part #
Value
Note
Resistor
Switch
R101
R102
R103
R104
1W
1/2W
1W
Q101 FCPF20N60
20 A, 600 V, SuperFET®
1 MW
330 kW
10 kW
Diode
D101
D102
1N4746
UF4004
1 W, 18 V, Zener Diode
1 A, 400 V Glass Passivated
High-Efficiency Rectifier
1/4W
30 kW
R107
R108
R109
1/4W
1/4W
1/4W
D103
D104
1N4148
1N4148
1 A, 100 V Small-Signal Diode
1 A, 100 V Small-Signal Diode
10 kW
4.7 kW
8 A, 600 V, General-Purpose
Rectifier
D105
D106
47 kW
R110
1/4W
3 A, 600 V, General-Purpose
Rectifier
10 kW
0.80 kW
3.9 kW
R111
5W
R112, 113,
114,116,117,118
1/4W
IC101
FL7930B
CRM PFC Controller
R115,119
1/4W
75 kW
Capacitor
Fuse
NTC
C101
C102
220 nF / 275 VAC
680 nF / 275 VAC
0.68 µF / 630 V
12 nF / 50 V
Box Capacitor
Box Capacitor
FS101
TH101
BD101
LF101
T1
5 A / 250 V
5D-15
C103
C104
Box Capacitor
Ceramic Capacitor
SMD (1206)
Bridge Diode
15 A, 600 V
C105
C107
100 nF / 50 V
33 µF / 50 V
Electrolytic Capacitor
Line Filter
C108
C109
220 nF / 50 V
47 nF / 50 V
Ceramic Capacitor
Ceramic Capacitor
23 mH
EER3019
10D471
Transformer
C110,116
C112
1 nF / 50 V
Ceramic Capacitor
Ceramic Capacitor
Ae=137.0 mm2
47 nF / 50 V
ZNR
C111
C114
C115
220 µF / 450 V
2.2 nF / 450 V
2.2 nF / 450 V
Electrolytic Capacitor ZNR101
Box Capacitor
Box Capacitor
© 2010 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FL7930B • Rev. 1.0.4
21
Physical Dimensions
5.00
4.80
A
0.65
3.81
8
5
B
1.75
6.20
5.80
4.00
3.80
5.60
1
4
PIN ONE
INDICATOR
1.27
1.27
(0.33)
0.25
C B A
LAND PATTERN RECOMMENDATION
SEE DETAIL A
0.25
0.10
0.25
0.19
C
1.75 MAX
0.10
0.51
0.33
OPTION A - BEVEL EDGE
0.50
0.25
x 45°
R0.10
R0.10
GAGE PLANE
OPTION B - NO BEVEL EDGE
0.36
NOTES: UNLESS OTHERWISE SPECIFIED
8°
0°
0.90
0.40
A) THIS PACKAGE CONFORMS TO JEDEC
MS-012, VARIATION AA.
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS DO NOT INCLUDE MOLD
FLASH OR BURRS.
D) LANDPATTERN STANDARD: SOIC127P600X175-8M.
E) DRAWING FILENAME: M08Arev14
F) FAIRCHILD SEMICONDUCTOR.
SEATING PLANE
(1.04)
DETAIL A
SCALE: 2:1
Figure 47. 8-Lead, Small Outline Package (SOP)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/dwg/M0/M08A.pdf.
© 2010 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FL7930B • Rev. 1.0.4
22
© 2010 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FL7930B • Rev. 1.0.4
23
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