HUF76639S3ST [ONSEMI]
N 沟道,逻辑电平,UltraFET® Power MOSFET,100V,50A,26mΩ;型号: | HUF76639S3ST |
厂家: | ONSEMI |
描述: | N 沟道,逻辑电平,UltraFET® Power MOSFET,100V,50A,26mΩ 开关 晶体管 |
文件: | 总11页 (文件大小:390K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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HUF76639S3ST-F085
50A, 100V, 0.026 Ohm, N-Channel, Logic
Level UltraFET® Power MOSFET
Packaging
Features
JEDEC TO-263AB
• Ultra Low On-Resistance
DRAIN
(FLANGE)
- r
= 0.026Ω, VGS = 10V
DS(ON)
• Simulation Models
- Temperature Compensated PSPICE® and SABER™
Electrical Models
GATE
SOURCE
- Spice and SABER Thermal Impedance Models
- www.fairchildsemi.com
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
HUF76639S3S
• Switching Time vs R
Curves
GS
Symbol
D
Ordering Information
PART NUMBER
PACKAGE
TO-263AB
BRAND
G
HUF76639S3ST-F085
76639S
NOTE: When ordering, use the entire part number. Add the suffix T
to obtain the variant in tape and reel, e.g., HUF76639S3ST.
S
o
Absolute Maximum Ratings
T
= 25 C, Unless Otherwise Specified
C
HUF76639S3ST_F085
UNITS
Drain to Source Voltage (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
100
100
±16
V
V
V
DSS
Drain to Gate Voltage (R
= 20kΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
GS
DGR
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
GS
Drain Current
o
Continuous (T = 25 C, V
C
= 5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
= 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
50
51
35
A
A
A
A
GS
GS
D
D
o
Continuous (T = 25 C, V
C
o
Continuous (T = 100 C, V
= 5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
= 4.5V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
C
GS
D
o
Continuous (T = 100 C, V
34
C
GS
D
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Figure 4
DM
Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . UIS
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
Derate Above 25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figures 6, 17, 18
180
1.2
W
W/ C
D
o
o
o
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T , T
J
-55 to 175
C
STG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
Package Body for 10s, See Techbrief TB334. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
o
300
260
C
C
L
o
pkg
NOTES:
o
o
1. T = 25 C to 150 C.
J
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Publication Order Number:
HUF76639S3ST-F085/D
©2012 Semiconductor Components Industries, LLC.
September-2017, Rev. 3
HUF76639S3ST-F085
o
Electrical Specifications
T = 25 C, Unless Otherwise Specified
C
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
OFF STATE SPECIFICATIONS
Drain to Source Breakdown Voltage
BV
I
I
= 250µA, V
= 250µA, V
= 0V (Figure 12)
o
100
-
-
-
-
-
-
-
V
DSS
D
D
GS
GS
GS
GS
= 0V , T = -40 C (Figure 12)
C
90
-
V
Zero Gate Voltage Drain Current
I
V
V
V
= 95V, V
= 90V, V
= ±16V
= 0V
= 0V, T = 150 C
1
µA
µA
nA
DSS
DS
DS
GS
o
-
250
±100
C
Gate to Source Leakage Current
ON STATE SPECIFICATIONS
Gate to Source Threshold Voltage
Drain to Source On Resistance
I
-
GSS
V
r
V
I
= V , I = 250µA (Figure 11)
1
-
-
3
V
GS(TH)
GS
DS
D
= 51A, V
Ω
= 10V (Figures 9, 10)
0.023
0.026
DS(ON)
D
GS
THERMAL SPECIFICATIONS
o
Thermal Resistance Junction to Case
R
R
TO-263
-
-
-
-
0.83
62
C/W
θJC
o
Thermal Resistance Junction to
Ambient
C/W
θJA
SWITCHING SPECIFICATIONS (V
Turn-On Time
= 4.5V)
GS
t
V
V
= 50V, I = 34A
-
-
-
-
-
-
-
336
ns
ns
ns
ns
ns
ns
ON
DD
GS
D
= 4.5V, R
= 12Ω
GS
Turn-On Delay Time
Rise Time
t
17
207
83
136
-
-
d(ON)
(Figures 15, 21, 22)
t
-
r
Turn-Off Delay Time
Fall Time
t
-
-
d(OFF)
t
f
Turn-Off Time
t
328
OFF
SWITCHING SPECIFICATIONS (V
Turn-On Time
= 10V)
t
GS
V
V
= 50V, I = 51A
-
-
-
-
-
-
-
96
ns
ns
ns
ns
ns
ns
ON
DD
GS
D
= 10V, R
= 12Ω
GS
Turn-On Delay Time
Rise Time
t
10
55
151
110
-
-
d(ON)
(Figures 16, 21, 22)
t
-
r
Turn-Off Delay Time
Fall Time
t
-
-
d(OFF)
t
f
Turn-Off Time
t
392
OFF
GATE CHARGE SPECIFICATIONS
Total Gate Charge
Q
V
V
V
= 0V to 10V
= 0V to 5V
= 0V to 1V
V
= 50V,
-
-
-
-
-
71
39
2.0
6
86
47
2.4
-
nC
nC
nC
nC
nC
g(TOT)
GS
GS
GS
DD
= 35A,
I
I
D
Gate Charge at 5V
Q
g(5)
= 1.0mA
g(REF)
Threshold Gate Charge
Q
g(TH)
(Figures 14, 19, 20)
Gate to Source Gate Charge
Gate to Drain “Miller” Charge
CAPACITANCE SPECIFICATIONS
Input Capacitance
Q
gs
gd
Q
19
-
C
V
= 25V, V
GS
= 0V,
-
-
-
2400
520
-
-
-
pF
pF
pF
ISS
DS
f = 1MHz
(Figure 13)
Output Capacitance
C
C
OSS
Reverse Transfer Capacitance
140
RSS
Source to Drain Diode Specifications
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
1.25
1.0
UNITS
Source to Drain Diode Voltage
V
I
I
I
I
= 35A
= 15A
-
-
-
-
-
-
-
-
V
V
SD
SD
SD
SD
SD
Reverse Recovery Time
t
= 35A, dI /dt = 100A/µs
SD
137
503
ns
nC
rr
Reverse Recovered Charge
Q
= 35A, dI /dt = 100A/µs
RR
SD
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2
HUF76639S3ST-F085
Typical Performance Curves
1.2
1.0
0.8
0.6
0.4
0.2
0
60
50
40
30
20
10
0
V
= 10V
GS
V
= 4.5V
GS
0
25
50
75
100
150
175
25
50
75
100
125
o
150
175
125
o
T
, CASE TEMPERATURE ( C)
T , CASE TEMPERATURE ( C)
C
C
FIGURE 1. NORMALIZED POWER DISSIPATION vs CASE
TEMPERATURE
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs
CASE TEMPERATURE
2
DUTY CYCLE - DESCENDING ORDER
0.5
1
0.2
0.1
0.05
0.02
0.01
P
DM
0.1
t
1
t
2
NOTES:
DUTY FACTOR: D = t /t
SINGLE PULSE
1
2
PEAK T = P
x Z
x R + T
J
DM
θJC
θJC C
0.01
-5
-4
-3
-2
10
-1
0
1
10
10
10
10
10
10
t, RECTANGULAR PULSE DURATION (s)
FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE
1000
o
T
= 25 C
C
FOR TEMPERATURES
o
ABOVE 25 C DERATE PEAK
CURRENT AS FOLLOWS:
175 - T
150
C
I = I
25
V
= 10V
GS
100
50
TRANSCONDUCTANCE
MAY LIMIT CURRENT
IN THIS REGION
V
= 5V
GS
-5
-4
10
-3
10
-2
-1
0
1
10
10
t, PULSE WIDTH (s)
10
10
10
FIGURE 4. PEAK CURRENT CAPABILITY
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3
HUF76639S3ST-F085
Typical Performance Curves (Continued)
500
300
100
If R = 0
= (L)(I )/(1.3*RATED BV
t
- V
)
DD
AV
If R ≠ 0
= (L/R)ln[(I *R)/(1.3*RATED BV - V ) +1]
DSS DD
AS
DSS
t
AV
AS
100
100µs
o
STARTING T = 25 C
J
OPERATION IN THIS
AREA MAY BE
10
10
1
1ms
LIMITED BY r
DS(ON)
10ms
o
SINGLE PULSE
= MAX RATED
STARTING T = 150 C
J
o
T
= 25 C
T
C
J
1
1
10
100
300
0.01
0.1
1
10
100
V
, DRAIN TO SOURCE VOLTAGE (V)
DS
FIGURE 6. UNCLAMPED INDUCTIVE SWITCHING
CAPABILITY
FIGURE 5. FORWARD BIAS SAFE OPERATING AREA
100
100
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
DD
V
= 10V
GS
V
= 5V
= 4V
GS
V
= 15V
V
= 3.5V
= 3V
GS
V
GS
75
50
25
0
75
50
25
0
V
GS
o
T
= 175 C
J
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
o
T
= 25 C
J
o
o
T
= -55 C
J
T
= 25 C
C
0
1
2
3
4
5
1.5
2.0
2.5
3.0
3.5
4.0
V
, GATE TO SOURCE VOLTAGE (V)
V
, DRAIN TO SOURCE VOLTAGE (V)
DS
GS
FIGURE 7. TRANSFER CHARACTERISTICS
FIGURE 8. SATURATION CHARACTERISTICS
40
3.0
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
PULSE DURATION = 80µs
DUTY CYCLE = 0.5% MAX
V
= 10V, I = 51A
D
GS
I
= 51A
D
o
T
= 25 C
2.5
C
35
30
25
20
2.0
1.5
1.0
0.5
I
= 35A
D
I
= 15A
D
-80
-40
0
40
80
120
160
200
2
4
6
8
10
o
V
, GATE TO SOURCE VOLTAGE (V)
T , JUNCTION TEMPERATURE ( C)
GS
J
FIGURE 9. DRAIN TO SOURCE ON RESISTANCE vs GATE
VOLTAGE AND DRAIN CURRENT
FIGURE 10. NORMALIZED DRAIN TO SOURCE ON
RESISTANCE vs JUNCTION TEMPERATURE
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4
HUF76639S3ST-F085
Typical Performance Curves (Continued)
1.2
1.0
0.8
0.6
0.4
1.2
1.1
1.0
0.9
V
= V , I = 250µA
DS
GS
D
I
= 250µA
D
-80
-40
0
40
80
120
160
200
-80
-40
0
40
80
120
160
200
o
o
T , JUNCTION TEMPERATURE ( C)
T , JUNCTION TEMPERATURE ( C)
J
J
FIGURE 11. NORMALIZED GATE THRESHOLD VOLTAGE vs
JUNCTION TEMPERATURE
FIGURE 12. NORMALIZED DRAIN TO SOURCE BREAKDOWN
VOLTAGE vs JUNCTION TEMPERATURE
10
5000
C
= C
+ C
GS GD
V
= 50V
ISS
DD
8
6
4
2
0
C
C
+ C
DS GD
OSS
1000
WAVEFORMS IN
DESCENDING ORDER:
C
= C
GD
RSS
I
I
I
= 51A
= 35A
= 15A
100
40
D
D
V
= 0V, f = 1MHz
1
D
GS
0.1
10
100
0
15
30
45
60
75
Q , GATE CHARGE (nC)
V
, DRAIN TO SOURCE VOLTAGE (V)
g
DS
FIGURE 14. GATE CHARGE WAVEFORMS FOR CONSTANT
FIGURE 13. CAPACITANCE vs DRAIN TO SOURCE VOLTAGE
GATE CURRENT
400
600
V
= 4.5V, V = 50V, I = 34A
DD D
V
= 10V, V
DD
= 50V, I = 51A
D
GS
GS
500
400
300
200
100
0
t
d(OFF)
300
200
100
0
t
f
r
t
t
f
t
d(OFF)
t
r
t
d(ON)
t
d(ON)
0
10
20
30
40
50
0
10
20
30
40
50
R
, GATE TO SOURCE RESISTANCE (Ω)
R
, GATE TO SOURCE RESISTANCE (Ω)
GS
GS
FIGURE 15. SWITCHING TIME vs GATE RESISTANCE
FIGURE 16. SWITCHING TIME vs GATE RESISTANCE
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5
HUF76639S3ST-F085
Test Circuits and Waveforms
V
DS
BV
DSS
L
t
P
V
DS
I
VARY t TO OBTAIN
P
AS
+
V
DD
R
REQUIRED PEAK I
AS
G
V
DD
-
V
GS
DUT
t
P
I
AS
0V
0
0.01Ω
t
AV
FIGURE 17. UNCLAMPED ENERGY TEST CIRCUIT
FIGURE 18. UNCLAMPED ENERGY WAVEFORMS
V
DS
V
Q
DD
R
g(TOT)
L
V
DS
V
= 10V
GS
V
Q
GS
g(5)
+
-
V
DD
V
= 5V
V
GS
GS
DUT
V
= 1V
GS
I
0
g(REF)
Q
g(TH)
Q
Q
gd
gs
I
g(REF)
0
FIGURE 19. GATE CHARGE TEST CIRCUIT
FIGURE 20. GATE CHARGE WAVEFORMS
V
t
t
DS
ON
OFF
t
d(OFF)
t
d(ON)
t
t
f
R
L
r
V
DS
90%
90%
+
V
GS
V
DD
10%
10%
0
-
DUT
90%
50%
R
GS
V
GS
50%
PULSE WIDTH
10%
V
GS
0
FIGURE 21. SWITCHING TIME TEST CIRCUIT
FIGURE 22. SWITCHING TIME WAVEFORM
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6
HUF76639S3ST-F085
PSPICE Electrical Model
.SUBCKT HUF76639 2 1 3 ;
rev 26 July 1999
CA 12 8 4.2e-9
CB 15 14 4.2e-9
CIN 6 8 2.27e-9
DBODY 7 5 DBODYMOD
DBREAK 5 11 DBREAKMOD
DPLCAP 10 5 DPLCAPMOD
LDRAIN
DPLCAP
10
DRAIN
2
5
EBREAK 11 7 17 18 118.2
EDS 14 8 5 8 1
EGS 13 8 6 8 1
ESG 6 10 6 8 1
EVTHRES 6 21 19 8 1
EVTEMP 20 6 18 22 1
RLDRAIN
RSLC1
51
DBREAK
+
RSLC2
5
51
ESLC
11
-
50
+
IT 8 17 1
-
17
18
-
DBODY
RDRAIN
6
ESG
8
LDRAIN 2 5 1.0e-9
LGATE 1 9 5.1e-9
LSOURCE 3 7 3.1e-9
EBREAK
EVTHRES
+
+
16
21
-
19
8
MWEAK
LGATE
EVTEMP
+
MMED 16 6 8 8 MMEDMOD
MSTRO 16 6 8 8 MSTROMOD
MWEAK 16 21 8 8 MWEAKMOD
RGATE
GATE
1
6
-
18
22
MMED
9
20
MSTRO
8
RLGATE
LSOURCE
RBREAK 17 18 RBREAKMOD 1
RDRAIN 50 16 RDRAINMOD 15.8e-3
RGATE 9 20 1.94
RLDRAIN 2 5 10
RLGATE 1 9 51
RLSOURCE 3 7 31
RSLC1 5 51 RSLCMOD 1e-6
RSLC2 5 50 1e3
CIN
SOURCE
3
7
RSOURCE
RLSOURCE
S1A
S2A
RBREAK
12
15
13
8
14
13
17
18
RSOURCE 8 7 RSOURCEMOD 3.6e-3
RVTHRES 22 8 RVTHRESMOD 1
RVTEMP 18 19 RVTEMPMOD 1
RVTEMP
19
-
S1B
S2B
13
CB
CA
IT
14
+
+
S1A 6 12 13 8 S1AMOD
S1B 13 12 13 8 S1BMOD
S2A 6 15 14 13 S2AMOD
S2B 13 15 14 13 S2BMOD
VBAT
6
8
5
8
EGS
EDS
+
-
-
8
22
RVTHRES
VBAT 22 19 DC 1
ESLC 51 50 VALUE = {(V(5,51)/ABS(V(5,51)))*(PWR(V(5,51)/(1e-6*99),3.5))}
.MODEL DBODYMOD D (IS = 2.6e-12 RS = 2.65e-3 IKF = 6 TRS1 = 1.5e-3 TRS2 = 3.5e-6 CJO = 2.1e-9 TT = 5.6e-8 M = 0.52)
.MODEL DBREAKMOD D (RS = 2.5e-1 TRS1 = 1e-4 TRS2 = -1e-6)
.MODEL DPLCAPMOD D (CJO = 2.6e-9 IS = 1e-30 M = 0.89 N = 10)
.MODEL MMEDMOD NMOS (VTO = 1.77 KP = 7 IS = 1e-30 N = 10 TOX = 1 L = 1U W = 1U RG = 1.94)
.MODEL MSTROMOD NMOS (VTO = 2.06 KP = 95 IS = 1e-30 N = 10 TOX = 1 L = 1U W = 1U)
.MODEL MWEAKMOD NMOS (VTO = 1.48 KP = 0.12 IS = 1e-30 N = 10 TOX = 1 L = 1U W = 1U RG = 19.4 RS = .1)
.MODEL RBREAKMOD RES (TC1 = 1.05e-3 TC2 = -5e-7)
.MODEL RDRAINMOD RES (TC1 = 8.5e-3 TC2 = 2.3e-5)
.MODEL RSLCMOD RES (TC1 = 3.4e-3 TC2 = 2.5e-6)
.MODEL RSOURCEMOD RES (TC1 = 1e-3 TC2 = 1e-6)
.MODEL RVTHRESMOD RES (TC1 = -1.9e-3 TC2 = -4.5e-6)
.MODEL RVTEMPMOD RES (TC1 = -1.7e-3 TC2 = 1.5e-6)
.MODEL S1AMOD VSWITCH (RON = 1e-5 ROFF = 0.1 VON = -4.5 VOFF = -2.0)
.MODEL S1BMOD VSWITCH (RON = 1e-5 ROFF = 0.1 VON = -2.0 VOFF = -4.5)
.MODEL S2AMOD VSWITCH (RON = 1e-5 ROFF = 0.1 VON = -0.5 VOFF = 0.3)
.MODEL S2BMOD VSWITCH (RON = 1e-5 ROFF = 0.1 VON = 0.3 VOFF = -0.5)
.ENDS
NOTE: For further discussion of the PSPICE model, consult A New PSPICE Sub-Circuit for the Power MOSFET Featuring Global
Temperature Options; IEEEPower Electronics Specialist Conference Records, 1991, written by William J. Hepp and C. Frank Wheatley.
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7
HUF76639S3ST-F085
SABER Electrical Model
REV 26 July 1999
template huf76639 n2,n1,n3
electrical n2,n1,n3
{
var i iscl
d..model dbodymod = (is = 2.6e-12, cjo = 2.1e-9, tt = 5.6e-8, m = 0.52, n=10)
d..model dbreakmod = ()
d..model dplcapmod = (cjo = 2.6e-9, is = 1e-30, m = 0.89)
m..model mmedmod = (type=_n, vto = 1.77, kp = 7, is = 1e-30, tox = 1)
m..model mstrongmod = (type=_n, vto = 2.06,kp = 95, is = 1e-30, tox = 1)
m..model mweakmod = (type=_n, vto = 1.48, kp = 0.12,is = 1e-30, tox = 1)
sw_vcsp..model s1amod = (ron = 1e-5, roff = 0.1, von = -4.5, voff = -2.0)
sw_vcsp..model s1bmod = (ron = 1e-5, roff = 0.1, von = -2.0, voff = -4.5)
sw_vcsp..model s2amod = (ron = 1e-5, roff = 0.1, von = -0.5, voff = 0.3)
sw_vcsp..model s2bmod = (ron = 1e-5, roff = 0.1, von = 0.3, voff = -0.5)
LDRAIN
RLDRAIN
RDBODY
DPLCAP
DRAIN
2
5
10
RSLC1
51
RDBREAK
72
DBREAK
11
c.ca n12 n8 = 4.2e-9
c.cb n15 n14 = 4.2e-9
c.cin n6 n8 = 2.27e-9
RSLC2
ISCL
50
-
d.dbody n7 n71 = model = dbodymod
71
RDRAIN
6
8
d.dbreak n72 n11 = model = dbreakmod
ESG
d.dplcap n10 n5 = model = dplcapmod
i.it n8 n17 = 1
EVTHRES
+
+
16
21
-
19
8
MWEAK
LGATE
EVTEMP
+
DBODY
RGATE
GATE
1
6
-
18
22
EBREAK
+
l.ldrain n2 n5 = 1.0e-9
l.lgate n1 n9 = 5.1e-9
l.lsource n3 n7 = 3.1e-9
MMED
9
20
MSTRO
8
17
18
-
RLGATE
LSOURCE
CIN
SOURCE
3
m.mmed n16 n6 n8 n8 = model = mmedmod, l = 1u, w = 1u
m.mstrong n16 n6 n8 n8 = model = mstrongmod, l = 1u, w = 1u
m.mweak n16 n21 n8 n8 = model = mweakmod, l = 1u, w = 1u
7
RSOURCE
RLSOURCE
S1A
S2A
res.rbreak n17 n18 = 1, tc1 = 1.05e-3, tc2 = -5e-7
res.rdbody n71 n5 = 2.65e-3, tc1 = 1.5e-3, tc2 = 3.5e-6
res.rdbreak n72 n5 = 2.5e-1, tc1 = 1e-4, tc2 = -1e-6
res.rdrain n50 n16 = 15.8e-3, tc1 = 8.5e-3, tc2 = 2.3e-5
res.rgate n9 n20 = 1.94
res.rldrain n2 n5 = 10
res.rlgate n1 n9 = 51
res.rlsource n3 n7 = 31
res.rslc1 n5 n51 = 1e-6, tc1 = 3.4e-3, tc2 = 2.5e-6
res.rslc2 n5 n50 = 1e3
RBREAK
12
15
13
14
13
17
18
8
RVTEMP
19
S1B
S2B
13
CB
CA
IT
14
-
+
+
VBAT
6
8
5
8
EGS
EDS
+
-
-
8
22
res.rsource n8 n7 = 3.6e-3, tc1 = 1e-3, tc2 = 1e-6
res.rvtemp n18 n19 = 1, tc1 = -1.7e-3, tc2 = 1.5e-6
res.rvthres n22 n8 = 1, tc1 = -1.9e-3, tc2 = -4.5e-6
RVTHRES
spe.ebreak n11 n7 n17 n18 = 118.2
spe.eds n14 n8 n5 n8 = 1
spe.egs n13 n8 n6 n8 = 1
spe.esg n6 n10 n6 n8 = 1
spe.evtemp n20 n6 n18 n22 = 1
spe.evthres n6 n21 n19 n8 = 1
sw_vcsp.s1a n6 n12 n13 n8 = model = s1amod
sw_vcsp.s1b n13 n12 n13 n8 = model = s1bmod
sw_vcsp.s2a n6 n15 n14 n13 = model = s2amod
sw_vcsp.s2b n13 n15 n14 n13 = model = s2bmod
v.vbat n22 n19 = dc = 1
equations {
i (n51->n50) + = iscl
iscl: v(n51,n50) = ((v(n5,n51)/(1e-9+abs(v(n5,n51))))*((abs(v(n5,n51)*1e6/99))** 3.5))
}
}
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8
HUF76639S3ST-F085
SPICE Thermal Model
JUNCTION
th
REV 26 July 1999
HUF76639T
RTHERM1
CTHERM1
CTHERM1 th 6 3.2e-3
CTHERM2 6 5 8.5e-3
CTHERM3 5 4 1.2e-2
CTHERM4 4 3 1.6e-2
CTHERM5 3 2 5.5e-2
CTHERM6 2 tl 1.5
6
RTHERM2
RTHERM3
RTHERM4
RTHERM5
RTHERM6
CTHERM2
CTHERM3
CTHERM4
CTHERM5
CTHERM6
RTHERM1 th 6 8.0e-3
RTHERM2 6 5 6.8e-2
RTHERM3 5 4 9.2e-2
RTHERM4 4 3 2.0e-1
RTHERM5 3 2 2.4e-1
RTHERM6 2 tl 5.2e-2
5
SABER Thermal Model
SABER thermal model HUF76639T
4
3
2
template thermal_model th tl
thermal_c th, tl
{
ctherm.ctherm1 th 6 = 3.2e-3
ctherm.ctherm2 6 5 = 8.5e-3
ctherm.ctherm3 5 4 = 1.2e-2
ctherm.ctherm4 4 3 = 1.6e-2
ctherm.ctherm5 3 2 = 5.5e-2
ctherm.ctherm6 2 tl = 1.5
rtherm.rtherm1 th 6 = 8.0e-3
rtherm.rtherm2 6 5 = 6.8e-2
rtherm.rtherm3 5 4 = 9.2e-2
rtherm.rtherm4 4 3 = 2.0e-1
rtherm.rtherm5 3 2 = 2.4e-1
rtherm.rtherm6 2 tl = 5.2e-2
}
tl
CASE
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9
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