M74VHC1GU04DFT1G-L22038 [ONSEMI]
Unbuffered Single Inverter;
| 型号： | M74VHC1GU04DFT1G-L22038 |
| 厂家： | 
ONSEMI |
| 描述： | Unbuffered Single Inverter 栅 栅极 |
| 文件： | 总6页 (文件大小：78K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MC74VHC1GU04
Single Unbuffered Inverter
The MC74VHC1GU04 is an advanced high speed CMOS
Unbuffered inverter fabricated with silicon gate CMOS technology.
This device consists of a single unbuffered inverter. In combination
with others, or in the MC74VHCU04 Hex Unbuffered Inverter, these
devices are well suited for use as oscillators, pulse shapers, and in
many other applications requiring a high−input impedance amplifier.
For digital applications, the MC74VHC1G04 or the MC74VHC04 are
recommended.
The internal circuit is composed of three stages, including a buffer
output which provides high noise immunity and stable output.
The MC74VHC1GU04 input structure provides protection when
voltages up to 7 V are applied, regardless of the supply voltage. This
allows the MC74VHC1GU04 to be used to interface 5 V circuits to
3 V circuits.
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MARKING
DIAGRAMS
5
5
1
V6 M G
SC−88A/SOT−353/SC−70
DF SUFFIX
G
CASE 419A
1
5
Features
• High Speed: t = 2.5 ns (Typ) at V = 5 V
PD
CC
5
V6 M G
• Low Power Dissipation: I = 1 mA (Max) at T = 25°C
CC
A
G
• Power Down Protection Provided on Inputs
1
TSOP−5/SOT−23/SC−59
DT SUFFIX
1
• Balanced Propagation Delays
• Pin and Function Compatible with Other Standard Logic Families
• Chip Complexity: FETs = 105
CASE 483
• Pb−Free Packages are Available
V6 = Device Code
M
G
= Date Code*
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may vary
depending upon manufacturing location.
V
1
2
3
NC
IN A
GND
CC
5
4
PIN ASSIGNMENT
1
2
3
4
5
NC
IN A
OUT Y
GND
OUT Y
V
CC
Figure 1. Pinout
FUNCTION TABLE
1
A Input
Y Output
IN A
OUT Y
L
H
L
Figure 2. Logic Symbol
H
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2007
1
Publication Order Number:
February, 2007 − Rev. 16
MC74VHC1GU04/D
MC74VHC1GU04
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
V
V
CC
DC Supply Voltage
*0.5 to )7.0
−0.5 to +7.0
V
IN
DC Input Voltage
V
V
OUT
DC Output Voltage
*0.5 to V )0.5
V
CC
I
DC Input Diode Current
DC Output Diode Current
DC Output Sink Current
DC Supply Current per Supply Pin
Storage Temperature Range
−20
$20
mA
mA
mA
mA
°C
IK
I
OK
I
$12.5
$25
OUT
I
CC
T
*65 to )150
260
STG
T
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
Thermal Resistance
°C
L
T
)150
°C
J
q
SC70−5/SC−88A (Note 1)
TSOP−5
350
230
°C/W
JA
P
D
Power Dissipation in Still Air at 85°C
SC70−5/SC−88A
TSOP−5
150
200
mW
MSL
Moisture Sensitivity
Flammability Rating
ESD Withstand Voltage
Level 1
F
R
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
V
ESD
Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
u1500
u200
N/A
V
I
Latchup Performance
Above V and Below GND at 125°C (Note 5)
$500
mA
LATCHUP
CC
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
2.0
Max
5.5
Unit
V
V
CC
DC Supply Voltage
V
IN
DC Input Voltage
0.0
5.5
V
V
OUT
DC Output Voltage
0.0
V
CC
V
T
Operating Temperature Range
Input Rise and Fall Time
*55
)125
°C
ns/V
A
t , t
r
V
CC
V
CC
= 3.3 V 0.3 V
= 5.0 V 0.5 V
0
0
100
20
f
Device Junction Temperature versus
Time to 0.1% Bond Failures
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
Junction
Temperature 5C
Time, Hours
Time, Years
117.8
47.9
80
1,032,200
419,300
178,700
79,600
37,000
17,800
8,900
90
100
110
120
130
140
20.4
1
9.4
4.2
1
10
100
1000
2.0
TIME, YEARS
1.0
Figure 3. Failure Rate vs. Time Junction Temperature
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2
MC74VHC1GU04
DC ELECTRICAL CHARACTERISTICS
T
A
= 25°C
T
A
≤ 85°C
−55 ≤ T ≤ 125°C
A
V
CC
Min
Typ
Max
Min
Max
Min
Max
(V)
Symbol
Parameter
Test Conditions
Unit
V
IH
Minimum High−Level
Input Voltage
2.0
3.0
4.5
5.5
1.7
2.4
3.6
4.4
1.7
2.4
3.6
4.4
1.7
2.4
3.6
4.4
V
V
IL
Maximum Low−Level
Input Voltage
2.0
3.0
4.5
5.5
0.3
0.6
0.9
1.1
0.3
0.6
0.9
1.1
0.3
0.6
0.9
1.1
V
V
Minimum High−Level
Output Voltage
V
= V or V
= −50 mA
2.0
3.0
4.5
1.9
2.9
4.4
2.0
3.0
4.5
1.9
2.9
4.4
1.9
2.9
4.4
V
V
V
V
OH
IN
IH
IL
IL
IL
IL
I
OH
V
IN
= V or V
IH IL
V
= V or V
IN
OH
OH
IH
I
I
= −4 mA
= −8 mA
3.0
4.5
2.58
3.94
2.48
3.80
2.34
3.66
V
Maximum Low−Level
Output Voltage
V
IN
= V or V
2.0
3.0
4.5
0.0
0.0
0.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
OL
IH
I
OL
= 50 mA
V
IN
= V or V
IH IL
V
= V or V
IN
OL
OL
IH
I
I
= 4 mA
= 8 mA
3.0
4.5
0.36
0.36
0.44
0.44
0.52
0.52
I
Maximum Input
Leakage Current
V
= 5.5 V or GND
0 to
5.5
0.1
1.0
1.0
mA
mA
IN
IN
I
Maximum Quiescent
Supply Current
V
IN
= V or GND
5.5
1.0
20
40
CC
CC
AC ELECTRICAL CHARACTERISTICS Input t = t = 3.0 ns
r
f
T
A
= 25°C
T
A
≤ 85°C
−55 ≤ T ≤ 125°C
A
Min
Typ
Max
Min
Max
Min
Max
Symbol
Parameter
Test Conditions
= 3.3 0.3 V C = 15 pF
Unit
t
,
Maximum Propagation
Delay, Input A to Y
V
V
3.5
4.8
8.9
11.4
10.5
13.0
12.0
15.5
ns
PLH
CC
L
t
C = 50 pF
L
PHL
= 5.0 0.5 V C = 15 pF
2.5
3.8
5.5
7.0
6.5
8.0
8.0
9.5
CC
L
C = 50 pF
L
C
Maximum Input
Capacitance
4
10
10
10
pF
pF
IN
Typical @ 25°C, V = 5.0V
CC
22
C
Power Dissipation Capacitance (Note 6)
PD
6. C is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
PD
Average operating current can be obtained by the equation: I
power consumption; P = C ꢀ V
) = C ꢀ V ꢀ f + I . C is used to determine the no−load dynamic
CC(OPR
PD CC in CC PD
2
ꢀ f + I ꢀ V
.
D
PD
CC
in
CC
CC
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3
MC74VHC1GU04
V
CC
A
Y
50% V
CC
GND
t
t
PLH
PHL
V
V
OH
50% V
CC
OL
Figure 4. Switching Waveforms
OUTPUT
INPUT
C
L*
*Includes all probe and jig capacitance.
A 1−MHz square input wave is recommended for propagation delay tests.
Figure 5. Test Circuit
ORDERING INFORMATION
Device
†
Package
Shipping
MC74VHC1GU04DFT1
M74VHC1GU04DFT1G
SC70−5/SC−88A/SOT−353
SC70−5/SC−88A/SOT−353
(Pb−Free)
MC74VHC1GU04DFT2
M74VHC1GU04DFT2G
SC70−5/SC−88A/SOT−353
3000 / Tape & Reel
SC70−5/SC−88A/SOT−353
(Pb−Free)
MC74VHC1GU04DTT1
M74VHC1GU04DTT1G
TSOP−5/SOT23−5/SC59−5
TSOP−5/SOT23−5/SC59−5
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
MC74VHC1GU04
PACKAGE DIMENSIONS
SC−88A, SOT−353, SC−70
CASE 419A−02
ISSUE J
A
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
G
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
5
4
3
−B−
S
INCHES
DIM MIN MAX
MILLIMETERS
MIN
1.80
1.15
0.80
0.10
MAX
2.20
1.35
1.10
0.30
1
2
A
B
C
D
G
H
J
0.071
0.045
0.031
0.004
0.087
0.053
0.043
0.012
0.026 BSC
0.65 BSC
M
M
D 5 PL
0.2 (0.008)
B
−−−
0.004
0.004
0.004
0.010
0.012
−−−
0.10
0.10
0.10
0.25
0.30
K
N
S
N
0.008 REF
0.20 REF
0.079
0.087
2.00
2.20
J
C
K
H
SOLDERING FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
mm
inches
ǒ
Ǔ
1.9
0.0748
SCALE 20:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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5
MC74VHC1GU04
PACKAGE DIMENSIONS
TSOP−5
CASE 483−02
ISSUE G
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
NOTE 5
5X
D
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
5. OPTIONAL CONSTRUCTION: AN
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
0.20 C A B
2X
2X
0.10
T
T
M
5
4
3
0.20
B
S
1
2
K
L
DETAIL Z
G
A
MILLIMETERS
DIM
A
B
MIN
3.00 BSC
1.50 BSC
MAX
DETAIL Z
J
C
D
G
H
J
K
L
M
S
0.90
0.25
0.95 BSC
1.10
0.50
C
SEATING
PLANE
0.05
H
0.01
0.10
0.20
1.25
0
0.10
0.26
0.60
1.55
T
10
3.00
_
_
2.50
SOLDERING FOOTPRINT*
1.9
0.074
0.95
0.037
2.4
0.094
1.0
0.039
0.7
0.028
mm
inches
ǒ
Ǔ
SCALE 10:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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MC74VHC1GU04/D
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