MC74HCT366A_14 [ONSEMI]
Hex 3-State Inverting Buffer;
| 型号： | MC74HCT366A_14 |
| 厂家： | 
ONSEMI |
| 描述： | Hex 3-State Inverting Buffer |
| 文件： | 总7页 (文件大小：131K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MC74HCT366A
Hex 3-State Inverting
Buffer with Common
Enables and LSTTL
Compatible Inputs
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MARKING
High−Performance Silicon−Gate CMOS
The MC74HCT366A is identical in pinout to the LS366. The device
inputs are compatible with standard CMOS or LSTTL outputs.
This device is a high−speed hex buffer with 3−state outputs and two
common active−low Output Enables. When either of the enables is
high, the buffer outputs are placed into high−impedance states. The
HCT366A has inverting outputs.
DIAGRAMS
16
1
SOIC−16
D SUFFIX
CASE 751B
HCT366AG
AWLYWW
16
1
Features
16
• Output Drive Capability: 15 LSTTL Loads
• Outputs Directly Interface to CMOS, NMOS, and TTL
• Operating Voltage Range: 2.0 to 6.0 V
TSSOP−16
DT SUFFIX
CASE 948F
HCT
366A
ALYWG
G
16
1
• Low Input Current: 1.0 mA
1
• High Noise Immunity Characteristic of CMOS Devices
A
= Assembly Location
= Wafer Lot
= Year
• In Compliance with the Requirements Defined by JEDEC Standard
WL, L
Y
No. 7A
• Chip Complexity: 90 FETs or 22.5 Equivalent Gates
• NLV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
WW, W = Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
G or G
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
• These are Pb−Free Devices*
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2014
1
Publication Order Number:
March, 2014 − Rev. 2
MC74HCT366A/D
MC74HCT366A
OUTPUT
ENABLE 1
2
3
5
7
1
2
3
4
5
6
7
8
16
15
V
CC
A0
A1
A2
A3
A4
A5
Y0
Y1
Y2
Y3
Y4
Y5
OUTPUT
ENABLE 2
A0
4
Y0
14 A5
13 Y5
12 A4
11 Y4
10 A3
A1
6
Y1
A2
10
12
14
9
Y2
GND
9
Y3
11
13
Figure 1. Pin Assignment
1
OUTPUT ENABLE 1
PIN 16 = V
CC
PIN 8 = GND
FUNCTION TABLE
15
OUTPUT ENABLE 2
Inputs
Output
Enable Enable
Figure 2. Logic Diagram
1
2
A
Y
L
L
H
X
L
L
X
H
L
H
X
X
H
L
Z
Z
X = don’t care
Z = high impedance
ORDERING INFORMATION
Device
†
Package
Shipping
MC74HCT366ADG
MC74HCT366ADR2G
MC74HCT366ADTR2G
NLVHCT366ADTRG*
48 Units / Rail
2500 Units / Reel
2500 Units / Reel
2500 Units / Reel
SOIC−16
(Pb−Free)
TSSOP−16
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
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2
MC74HCT366A
MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
V
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high−impedance cir-
V
DC Supply Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Output Voltage (Referenced to GND)
DC Input Current, per Pin
– 0.5 to + 7.0
CC
V
– 0.5 to V + 0.5
V
in
CC
V
out
– 0.5 to V + 0.5
V
CC
I
20
25
50
mA
mA
mA
mW
in
cuit. For proper operation, V and
in
I
I
DC Output Current, per Pin
out
V
out
should be constrained to the
range GND v (V or V ) v V
.
DC Supply Current, V and GND Pins
in
out
CC
CC
CC
Unused inputs must always be
tied to an appropriate logic voltage
P
D
Power Dissipation in Still Air,
SOIC Package†
TSSOP Package†
500
450
level (e.g., either GND or V ).
CC
Unused outputs must be left open.
T
Storage Temperature
– 65 to + 150
_C
stg
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of
these limits are exceeded, device functionality should not be assumed, damage may occur and
reliability may be affected.
†Derating — SOIC Package: – 7 mW/_C from 65_ to 125_C
TSSOP Package: − 6.1 mW/_C from 65_ to 125_C
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
2.0
0
Max
Unit
V
V
CC
DC Supply Voltage (Referenced to GND)
DC Input Voltage, Output Voltage (Referenced to GND)
Operating Temperature, All Package Types
6.0
V , V
in out
V
CC
V
T
A
– 55 + 125
_C
ns
t , t
Input Rise and Fall Time
(Figure 1)
V
CC
V
CC
V
CC
V
CC
= 2.0 V
= 3.0 V
= 4.5 V
= 6.0 V
0
0
0
0
1000
600
500
400
r
f
Functional operation above the stresses listed in the Recommended Operating Ranges is not
implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may
affect device reliability.
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
– 55 to
V
CC
25_C
2.0
V
v 85_C v 125_C
Symbol
Parameter
Test Conditions
= V – 0.1 V
|I | v 20 μA
Unit
V
IH
Minimum High−Level Input
V
4.5
to
5.5
2.0
2.0
V
out
CC
Voltage
out
V
Maximum Low−Level Input
Voltage
V
= 0.1 V
4.5
to
5.5
0.80
0.80
0.80
V
V
IL
out
|I | v 20 μA
out
V
OH
Minimum High−Level Output
Voltage
V
in
= V
IH
2.0
4.5
6.0
1.9
4.4
5.9
1.9
4.4
5.9
1.9
4.4
5.9
|I | v 20 μA
out
V
= V
|I | v 3.6 mA
3.0
4.5
6.0
2.48
3.98
5.48
2.34
3.84
5.34
2.20
3.70
5.20
in
IH
out
|I | v 6.0 mA
out
|I | v 7.8 mA
out
V
OL
Maximum Low−Level Output
V
in
= V
2.0
4.5
6.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
V
IL
Voltage
|I | v 20 μA
out
V
= V
|I | v 3.6 mA
3.0
4.5
6.0
0.26
0.26
0.26
0.33
0.33
0.33
0.40
0.40
0.40
in
IL
out
|I | v 6.0 mA
out
|I | v 7.8 mA
out
I
in
Maximum Input Leakage Current
V
in
= V or GND
6.0
0.1
1.0
1.0
μA
CC
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3
MC74HCT366A
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
– 55 to
V
CC
25_C
0.5
v 85_C
v 125_C
V
Symbol
Parameter
Test Conditions
Unit
I
Maximum Three−State
Leakage Current
Output in High−Impedance State
V = V or V
in IL IH
6.0
5.0
10
μA
OZ
V
out
= V or GND
CC
I
Maximum Quiescent Supply
Current (per Package)
V
= V or GND
= 0 μA
6.0
4
40
160
μA
CC
in
CC
I
out
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
AC ELECTRICAL CHARACTERISTICS (C = 50 pF, Input t = t = 6 ns)
L
r
f
Guaranteed Limit
– 55 to
V
CC
25_C
120
60
24
20
V
v 85_C v 125_C
Symbol
Parameter
Unit
t
t
t
,
Maximum Propagation Delay, Input A to Output Y
(Figures 1 and 3)
2.0
3.0
4.5
6.0
150
75
180
90
ns
PLH
t
PHL
30
36
26
31
,
Maximum Propagation Delay, Output Enable to Output Y
(Figures 2 and 4)
2.0
3.0
4.5
6.0
220
110
44
275
140
55
330
170
66
ns
ns
ns
PLZ
t
PHZ
37
47
56
,
Maximum Propagation Delay, Output Enable to Output Y
(Figures 2 and 4)
2.0
3.0
4.5
6.0
220
110
44
275
140
55
330
170
66
PZL
t
PZH
37
47
56
t
,
Maximum Output Transition Time, Any Output
(Figures 1 and 3)
2.0
3.0
4.5
6.0
60
22
12
10
75
28
15
13
90
34
18
15
TLH
t
THL
C
Maximum Input Capacitance
—
—
10
15
10
15
10
15
pF
pF
in
C
Maximum Three−State Output Capacitance
(Output in High−Impedance State)
out
Typical @ 25°C, V = 5.0 V
CC
60
C
Power Dissipation Capacitance (Per Buffer)*
pF
PD
2
* Used to determine the no−load dynamic power consumption: P = C
V
f + I
V
.
D
PD CC
CC CC
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4
MC74HCT366A
SWITCHING WAVEFORMS
(V = 0 to 3 V, V = 1.3 V)
I
M
V
CC
V
M
t
r
t
f
OUTPUT ENABLE
(V )
GND
V
CC
INPUT A
(V )
I
90%
M
10%
t
t
PLZ
PZL
V
HIGH
IMPEDANCE
I
GND
50%
t
t
PHL
PLH
OUTPUT Y
OUTPUT Y
10%
90%
V
V
OL
90%
50%
10%
t
t
PHZ
PZH
OUTPUT Y
OH
50%
HIGH
IMPEDANCE
t
t
THL
TLH
Figure 1.
Figure 2.
TEST CIRCUITS
TEST POINT
OUTPUT
TEST POINT
1 kΩ
CONNECT TO V WHEN
.
CC
TESTING t AND t
OUTPUT
PLZ
PZL
DEVICE
UNDER
TEST
DEVICE
UNDER
TEST
CONNECT TO GND WHEN
TESTING t AND t
.
PZH
PHZ
C *
L
C *
L
*Includes all probe and jig capacitance
*Includes all probe and jig capacitance
Figure 3.
Figure 4.
LOGIC DETAIL
TO OTHER
FIVE BUFFERS
ONE OF 6
BUFFERS
V
CC
Y
INPUT A
OUTPUT ENABLE 1
OUTPUT ENABLE 2
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5
MC74HCT366A
PACKAGE DIMENSIONS
TSSOP−16
DT SUFFIX
CASE 948F
ISSUE B
NOTES:
16X KREF
1. DIMENSIONING AND TOLERANCING PER
M
S
S
V
ANSI Y14.5M, 1982.
0.10 (0.004)
T
U
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
S
U
0.15 (0.006) T
K
K1
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
16
9
2X L/2
J1
B
−U−
SECTION N−N
L
J
PIN 1
IDENT.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
8
1
N
0.25 (0.010)
S
0.15 (0.006) T
U
A
M
MILLIMETERS
DIM MIN MAX
INCHES
MIN MAX
−V−
A
B
C
D
F
4.90
4.30
−−−
0.05
0.50
5.10 0.193 0.200
4.50 0.169 0.177
N
1.20
−−− 0.047
F
0.15 0.002 0.006
0.75 0.020 0.030
G
H
J
J1
K
K1
L
0.65 BSC
0.026 BSC
DETAIL E
0.18
0.09
0.09
0.19
0.19
0.28 0.007 0.011
0.20 0.004 0.008
0.16 0.004 0.006
0.30 0.007 0.012
0.25 0.007 0.010
−W−
C
6.40 BSC
0.252 BSC
M
0
8
0
8
_
_
_
_
0.10 (0.004)
DETAIL E
H
SEATING
PLANE
−T−
D
G
SOLDERING FOOTPRINT
7.06
1
0.65
PITCH
01.36X6
16X
1.26
DIMENSIONS: MILLIMETERS
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6
MC74HCT366A
PACKAGE DIMENSIONS
SOIC−16
D SUFFIX
CASE 751B−05
ISSUE K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
−A−
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
16
9
8
−B−
P 8 PL
M
S
B
0.25 (0.010)
1
MILLIMETERS
INCHES
MIN
G
DIM MIN
MAX
10.00
4.00
1.75
0.49
1.25
MAX
0.393
0.157
0.068
0.019
0.049
A
B
C
D
F
9.80
3.80
1.35
0.35
0.40
0.386
0.150
0.054
0.014
0.016
F
R X 45
K
_
G
J
1.27 BSC
0.050 BSC
C
0.19
0.10
0
0.25
0.25
7
0.008
0.004
0
0.009
0.009
7
−T−
SEATING
PLANE
K
M
P
R
J
M
_
_
_
_
5.80
0.25
6.20
0.50
0.229
0.010
0.244
0.019
D
16 PL
M
S
S
0.25 (0.010)
T
B
A
SOLDERING FOOTPRINT
8X
6.40
16X
1.12
1
16
16X
0.58
1.27
PITCH
8
9
DIMENSIONS: MILLIMETERS
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MC74HCT366A/D
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