MMVL3700T1G [ONSEMI]
High Voltage Silicon Pin Diode; 高压硅PIN二极管
| 型号： | MMVL3700T1G |
| 厂家： | 
ONSEMI |
| 描述： | High Voltage Silicon Pin Diode |
| 文件： | 总3页 (文件大小：44K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MMVL3700T1
High Voltage
Silicon Pin Diode
These devices are designed primarily for VHF band switching
applications but are also suitable for use in general−purpose switching
circuits. They are supplied in a cost−effective plastic surface mount
package for economical, high−volume consumer and industrial
requirements.
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SILICON PIN SWITCHING DIODE
Features
• Long Reverse Recovery Time: t = 300 ns (Typ)
rr
1
CATHODE
2
ANODE
• Rugged PIN Structure Coupled with Wirebond Construction
for Optimum Reliability
• Low Series Resistance @ 100 MHz:
R = 0.7 W (Typ) @ I = 10 mAdc
S
F
2
• Reverse Breakdown Voltage = 200 V (Min)
• Pb−Free Package is Available
1
PLASTIC
SOD−323
CASE 477
STYLE 1
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Continuous Reverse Voltage
V
200
Vdc
R
Peak Forward Current
I
20
mAdc
F
MARKING DIAGRAM
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Total Device Dissipation FR−5 Board,
P
D
T = 25°C (Note 1)
200
1.57
mW
mW/°C
4R M G
A
Derate above 25°C
G
Thermal Resistance, Junction−to−Ambient
Junction and Storage Temperature
R
q
JA
635
150
°C/W
°C
T , T
J
stg
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
4R = Device Code
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
1. FR−4 Minimum Pad
ORDERING INFORMATION
†
Device
Package
Shipping
MMVL3700T1
SOD−323
3000/Tape & Reel
MMVL3700T1G
SOD−323
(Pb−Free)
3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
February, 2006 − Rev. 2
MMVL3700T1/D
MMVL3700T1
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)
A
Characteristic
Symbol
Min
Typ
Max
Unit
Reverse Breakdown Voltage
V
200
−
−
Vdc
(BR)R
(I = 10 mAdc)
R
Diode Capacitance
C
−
−
−
−
−
0.7
−
1.0
1.0
0.1
−
pF
W
T
(V = 20 Vdc, f = 1.0 MHz)
R
Series Resistance
R
S
(I = 10 mAdc)
F
Reverse Leakage Current
I
mAdc
ns
R
(V = 150 Vdc)
R
Reverse Recovery Time
t
300
rr
(I = I = 10 mAdc)
F
R
TYPICAL CHARACTERISTICS
800
700
600
500
400
300
200
100
0
3.2
2.8
2.4
2.0
1.6
1.2
T
A
= 25°C
T
= 25°C
A
0.8
0.4
0
0.7
0.8
0.9
1.0
0
2.0
4.0
6.0
8.0
10
12
14
16
V , FORWARD VOLTAGE (VOLTS)
F
I , FORWARD CURRENT (mA)
F
Figure 1. Series Resistance
Figure 2. Forward Voltage
10
8.0
6.0
100
40
10
4.0
2.0
4.0
V
= 15 Vdc
R
T
A
= 25°C
1.0
0.4
1.0
0.8
0.6
0.1
0.04
0.4
0.01
0.2
0.004
0.1
0.001
0
−10 −20 −30 −40 −50
−60
−20
0
+20
+60
+100
+140
V , REVERSE VOLTAGE (VOLTS)
R
T , AMBIENT TEMPERATURE (°C)
A
Figure 3. Diode Capacitance
Figure 4. Leakage Current
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2
MMVL3700T1
PACKAGE DIMENSIONS
SOD−323
CASE 477−02
ISSUE G
NOTES:
H
E
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. LEAD THICKNESS SPECIFIED PER L/F DRAWING
WITH SOLDER PLATING.
D
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
5. DIMENSION L IS MEASURED FROM END OF
RADIUS.
1
E
b
2
MILLIMETERS
DIM MIN NOM MAX MIN
0.80
INCHES
NOM MAX
1.00 0.031 0.035 0.040
0.10 0.000 0.002 0.004
0.006 REF
A3
A
A
0.90
0.05
A1 0.00
A3
0.15 REF
0.32
0.12 0.177 0.003 0.005 0.007
1.70
1.25
b
C
D
E
L
0.25
0.089
1.60
1.15
0.08
2.30
0.4 0.010 0.012 0.016
1.80 0.062 0.066 0.070
1.35 0.045 0.049 0.053
0.003
L
A1
C
NOTE 5
NOTE 3
H
E
2.50
2.70 0.090 0.098 0.105
STYLE 1:
PIN 1. CATHODE
2. ANODE
SOLDERING FOOTPRINT*
0.63
0.025
0.83
0.033
1.60
0.063
2.85
0.112
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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MMVL3700T1/D
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