NCP5392P_技术文档

NCP5392P

2/3/4-Phase Controller for

CPU Applications

The NCP5392P provides up to a four-phase buck solution which

combines differential voltage sensing, differential phase current

sensing, and adaptive voltage positioning to provide accurately

regulated power for both Intel and AMD processors. Dual-edge

pulse-width modulation (PWM) combined with inductor current

sensing reduces system cost by providing the fastest initial response

to dynamic load events. Dual-edge multiphase modulation reduces

the total bulk and ceramic output capacitance required to meet

transient regulation specifications.

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MARKING

DIAGRAM

1

A high performance operational error amplifier is provided to

simplify compensation of the system. Dynamic Reference Injection

further simplifies loop compensation by eliminating the need to

compromise between closed-loop transient response and Dynamic

VID performance.

1

40

NCP5392P

AWLYYWWG

40 PIN QFN, 6x6

MN SUFFIX

CASE 488AR

In addition, NCP5392P provides an automatic power saving

feature (Auto-PSI). When Auto-PSI function is enabled, NCP5392P

will automatically detect the VID transitions and direct the Vcore

regulator in or out of low power states. As a result, the best efficiency

scheme is always chosen.

NCP5392P = Specific Device

Code

A

= Assembly Location

= Wafer Lot

= Year

WL

YY

WW

G

= Work Week

= Pb-Free Package

Features

•ꢀMeets Intel's VR11.1 Specifications

*Pin 41 is the thermal pad on the bottom of the device.

•ꢀMeets AMD 6 Bit Code Specifications

•ꢀDual-edge PWM for Fastest Initial Response to Transient Loading

•ꢀHigh Performance Operational Error Amplifier

•ꢀInternal Soft Start

•ꢀDynamic Reference Injection (Patent #US07057381)

•ꢀDAC Range from 0.375 V to 1.6 V

•ꢀDAC Feed Forward Function (Patent Pending)

•ꢀ 0.5% DAC Voltage Accuracy from 1.0 V to 1.6 V

•ꢀTrue Differential Remote Voltage Sensing Amplifier

•ꢀPhase-to-Phase Current Balancing

ORDERING INFORMATION

†

Device

Package

Shipping

NCP5392PMNR2G* QFN-40 2500/Tape & Reel

(Pb-Free)

*TemperatureRange: 0°C to 85°C

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

•ꢀ“Lossless” Differential Inductor Current Sensing

•ꢀDifferential Current Sense Amplifiers for each Phase

•ꢀAdaptive Voltage Positioning (AVP)

•ꢀOscillator Frequency Range of 100 kHz – 1 MHz

•ꢀLatched Over Voltage Protection (OVP)

•ꢀGuaranteed Startup into Pre-Charged Loads

•ꢀThreshold Sensitive Enable Pin for VTT Sensing

•ꢀPower Good Output with Internal Delays

•ꢀThermally Compensated Current Monitoring

•ꢀAutomatic Power Saving (AUTO PSI Mode)

•ꢀCompatible to PSI Power Saving Requirements

•ꢀThis is a Pb-Free Device

Applications

•ꢀDesktop Processors

©ꢀ Semiconductor Components Industries, LLC, 2008

April, 2008 - Rev. 0

1

Publication Order Number:

NCP5392P/D

NCP5392P

PIN CONNECTIONS

1

2

3

4

5

6

30

29

28

27

EN

G1

VID0

VID1

VID2

VID3

VID4

DRVON

CS4

CS4N

CS3

26

25

24

23

NCP5392P

CS3N

2/3/4-PhaseBuck Controller

(QFN40)

7

8

VID5

VID6

VID7

ROSC

CS2

CS2N

CS1

9

22

21

10

CS1N

Figure 1. NCP5392P QFN40 Pin Connections (Top View)

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2

NCP5392P

VID0

VID1

VID2

VID3

VID4

Flexible DAC

VID5

VID6

VID7/AMD

Overvoltage

Protection

-

+

DAC

-

+

VSN

VSP

+

-

G1

G2

G3

Diff Amp

DIFFOUT

Error Amp

+

1.3 V

-

VFB

+

-

COMP

+

-

VDRP

Droop Amp

VDFB

-2/3

+

CSSUM

+

-

CS1P

CS1N

+

-

Gain = 6

CS2P

CS2N

+

-

+

CS3P

CS3N

+

-

+

Gain = 6

+

-

CS4P

CS4N

+

G4

+

-

+

Oscillator

IMON

ROSC

ILIM

DRVON

PSI

+

-

Control,

Fault Logic

and

APSI_EN

PH_PSI

ILimit

EN

Monitor

Circuits

12VMON

VR_RDY

VCC

+

-

+

4.25 V

UVLO

GND (FLAG)

Figure 2. NCP5392P Block Diagram

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3

NCP5392P

12V_FILTER

+5V

VTT +5V

D1

C4

C3

VTT

BST

Q1

C1

VCC

OD

IN

U2

DRH

34

35

L1

NCP5359

37

38

2

PSI

SW

VID0

VID1

VID2

VID3

VID4

VID5

VID6

VID7

APSI_EN

PH_PSI

APSI_EN

3

4

5

6

7

8

9

40

DRL

Q2

R2

RS1

PH_PSI

PGND

12

IMON

G1

IMON

C2

CS1

30

22

21

31

24

23

32

26

25

33

28

27

CS1P

CS1N

12V_FILTER

1

EN

39

G2

VR_RDY

CS2P

CS2N

14

13

VSN

VSP

NCP5392P

BST

G3

CS3P

CS3N

G4

VCC

OD

IN

RFB

DRH

NCP5359

SW

CFB1

RFB1

RF

15

16

17

18

DRL

DIFFOUT

COMP

VFB

CS4P

CS4N

CF

PGND

CH

29

VDRP

VDFB

DRVON

RDRP

19

20

12V_FILTER

R6

RNOR

CDFB

CSSUM

+

36

DAC

RISO1 RT2 RISO2

41

11

10

BST

RDNP

VCC

OD

IN

DRH

RLIM1

RLIM2

NCP5359

SW

DRL

PGND

12V_FILTER

BST

VCC

OD

IN

DRH

NCP5359

SW

DRL

PGND

VCCP

VSSN

Figure 3. Application Schematic for Four Phases

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4

NCP5392P

12V_FILTER

+5V

VTT +5V

D1

C4

C3

VTT

BST

Q1

Q2

C1

U2

37

VCC

L1

DRH

34

35

NCP5359

PSI

2

SW

VID0

VID1

VID2

VID3

VID4

VID5

VID6

VID7

OD

3

4

5

6

7

8

9

38

40

APSI_EN

PH_PSI

APSI_EN

DRL

R2

RS1

CS1

IN

PH_PSI

PGND

12

IMON

G1

IMON

C2

30

22

21

31

24

23

32

26

25

33

28

27

CS1P

CS1N

12V_FILTER

1

EN

39

G2

VR_RDY

CS2P

CS2N

14

13

VSN

VSP

NCP5392

BST

G3

CS3P

CS3N

G4

VCC

OD

IN

RFB

DRH

NCP5359

SW

CFB1

RFB1

RF

15

16

17

18

19

20

DRL

DIFFOUT

COMP

VFB

CS4P

CS4N

CF

PGND

CH

29

VDRP

VDFB

DRVON

RDRP

12V_FILTER

R6

RNOR

CDFB

CSSUM

+

36

DAC

RISO1 RT2 RISO2

41

11

10

BST

RDNP

VCC

OD

IN

DRH

RLIM1

RLIM2

NCP5359

SW

DRL

PGND

VCCP

VSSN

Figure 4. Application Schematic for Three Phases

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5

NCP5392P

12V_FILTER

+5V

VTT +5V

D1

C4

C3

VTT

BST

Q1

Q2

C1

VCC

U2

37

RNTC1

PSI

APSI_EN

PH_PSI

L1

DRH

34

35

NCP5359

2

PSI

SW

VID0

VID1

VID2

VID3

VID4

VID5

VID6

VID7

OD

3

4

5

6

7

8

9

38

40

DRL

APSI_EN

PH_PSI

R2

RS1

CS1

IN

PGND

12

IMON

G1

IMON

C2

30

22

21

31

24

23

32

26

25

33

28

27

CS1P

CS1N

1

EN

39

G2

VR_RDY

CS2P

CS2N

14

13

VSN

VSP

NCP5392

G3

CS3P

CS3N

G4

RFB

CFB1

RFB1

RF

15

16

17

18

19

20

DIFFOUT

COMP

VFB

CS4P

CS4N

CF

CH

29

VDRP

VDFB

DRVON

RDRP

12V_FILTER

R6

RNOR

CDFB

CSSUM

+

36

DAC

RISO1 RT2 RISO2

41

11

10

BST

RDNP

VCC

OD

IN

DRH

RLIM1

RLIM2

NCP5359

SW

DRL

PGND

VCCP

VSSN

Figure 5. Application Schematic for Two Phases

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6

NCP5392P

PIN DESCRIPTIONS

Pin No.

Symbol

EN

Description

1

2

Threshold sensitive input. High = startup, Low = shutdown.

Voltage ID DAC input

VID0

3

VID1

Voltage ID DAC input

4

VID2

Voltage ID DAC input

5

VID3

Voltage ID DAC input

6

VID4

Voltage ID DAC input

7

VID5

Voltage ID DAC input

8

VID6

Voltage ID DAC input

9

VID7/AMD

ROSC

Voltage ID DAC input. Pull to V (5 V) to enable AMD 6-bit DAC code.

CC

10

A resistance from this pin to ground programs the oscillator frequency according to f . This pin supplies a

SW

trimmed output voltage of 2 V.

11

ILIM

Overcurrent shutdown threshold setting. Connect this pin to the ROSC pin via a resistor divider as shown in

the Application Schematics. To disable the overcurrent feature, connect this pin directly to the ROSC pin. To

guarantee correct operation, this pin should only be connected to the voltage generated by the ROSC pin; do

not connect this pin to any externally generated voltages.

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

IMON

VSP

0 mV to 900 mV analog signal proportional to the output load current. VSN referenced

Non-inverting input to the internal differential remote sense amplifier

Inverting input to the internal differential remote sense amplifier

Output of the differential remote sense amplifier

Output of the error amplifier

VSN

DIFFOUT

COMP

VFB

Compensation Amplifier Voltage feedback

VDRP

VDFB

CSSUM

CS1N

CS1

Voltage output signal proportional to current used for current limit and output voltage droop

Droop Amplifier Voltage Feedback

Inverted Sum of the Differential Current Sense inputs. Av=CSSUM/CSx = -4

Inverting input to current sense amplifier #1

Non-inverting input to current sense amplifier #1

Inverting input to current sense amplifier #2

CS2N

CS2

Non-inverting input to current sense amplifier #2

Inverting input to current sense amplifier #3

CS3N

CS3

Non-inverting input to current sense amplifier #3

Inverting input to current sense amplifier #4

CS4N

CS4

Non-inverting input to current sense amplifier #4

Bidirectional Gate Drive Enable

DRVON

G1

PWM output pulse to gate driver. 3-level output: Low = LSFET Enabled, Mid = Diode Emulation Enabled,

High = HSFET Enabled

31

32

33

34

35

36

37

G2

G3

PWM output pulse to gate driver. 3-level output (see G1)

Monitor a 12 V input through a resistor divider.

Power for the internal control circuits.

G4

12VMON

VCC

DAC

PSI

DAC Feed Forward Output

Power Saving Control. Low = power saving operation, High = normal operation. PSI signal has higher priority

over APSI_EN signal.

38

APSI_EN

APSI_EN High: Enable AUTO PSI function. When PSI = low, system will be forced into PSI mode, uncondi‐

tionally. When PSI = high, APSI_EN will determine if the system needs to be in AUTO PSI mode. Once in

AUTO PSI mode, system switches on/off PSI functions automatically based on VID change status.

39

40

VR_RDY

PH_PSI

Open collector output. High indicates that the output is regulating

PH_PSI Pin select one or two phase operation in PSI mode. PH_PSI = high, two phase operation, PH_PSI =

low, one phase operation.

FLAG

GND

Power supply return (QFN Flag)

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7

NCP5392P

PIN CONNECTIONS VS. PHASE COUNT

Number of Phases

G4

G3

G2

G1

CS4-CS4N

CS3-CS3N

CS2-CS2N

CS1-CS1N

4

Phase 4

Out

Phase 3

Out

Phase 2

Out

Phase 1

Out

Phase 4 CS

input

Phase 3 CS

input

Phase 2 CS

input

Phase 1 CS

input

3

2

Tie to

GND

Phase 3

Out

Phase 2

Out

Phase 1

Out

Tie to CSN

pin used

Phase 3 CS

input

Phase 2 CS

input

Phase 1 CS

input

Tie to

GND

Phase 2

Out

Tie to

GND

Phase 1

Out

Tie to CSN

pin used

Phase 2 CS

input

Tie to CSN

pin used

Phase 1 CS

input

MAXIMUM RATINGS

ELECTRICAL INFORMATION

Pin Symbol

V

MAX

V

MIN

I

SINK

SOURCE

COMP

5.5 V

-0.3 V

10 mA

V

DRP

-0.3 V

5 mA

1 mA

20 mA

N/A

5 mA

1 mA

20 mA

10 mA

N/A

V–

GND + 300 mV

5.5 V

GND – 300 mV

-0.3 V

DIFFOUT

VR_RDY

VCC

5.5 V

-0.3 V

7.0 V

-0.3 V

N/A

ROSC

5.5 V

-0.3 V

1 mA

IMON Output

All Other Pins

1.1 V

5.5 V

-0.3 V

*All signals referenced to AGND unless otherwise noted.

THERMAL INFORMATION

Rating

Symbol

Value

34

Unit

°C/W

°C

Thermal Characteristic, QFN Package (Note 1)

Operating Junction Temperature Range (Note 2)

Operating Ambient Temperature Range

Maximum Storage Temperature Range

Moisture Sensitivity Level, QFN Package

R

q

JA

T

J

0 to 125

0 to +85

-55 to +150

1

T

A

°C

T

STG

°C

MSL

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

RecommendedOperating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

*The maximum package power dissipation must be observed.

1. JESD 51-5 (1S2P Direct-Attach Method) with 0 LFM.

2. JESD 51-7 (1S2P Direct-Attach Method) with 0 LFM.

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8

NCP5392P

ELECTRICAL CHARACTERISTICS

(Unless otherwise stated: 0°C < T < 85°C; 4.75 V < V < 5.25 V; All DAC Codes; C

= 0.1 mF)

A

CC

VCC

Parameter

ERROR AMPLIFIER

Input Bias Current (Note 3)

Test Conditions

Min

Typ

Max

Unit

-200

0

200

3

nA

V

Noninverting Voltage Range (Note 3)

Input Offset Voltage (Note 3)

Open Loop DC Gain

1.3

-

V+ = V- = 1.1 V

C = 60 pF to GND,

R = 10 KW to GND

-1.0

-

1.0

mV

dB

100

L

Open Loop Unity Gain Bandwidth

Open Loop Phase Margin

Slew Rate

C = 60 pF to GND,

L

R = 10 KW to GND

-

10

80

5

-

MHz

°

L

C = 60 pF to GND,

L

R = 10 KW to GND

L

DV = 100 mV, G = - 10 V/V,

in

DV = 1.5 V – 2.5 V,

V/ms

out

C = 60 pF to GND,

L

DC Load = 125 mA to GND

Maximum Output Voltage

Minimum Output Voltage

I

= 2.0 mA

3.5

-

50

-

V

SOURCE

= 0.2 mA

mV

mA

SINK

Output source current (Note 3)

Output sink current (Note 3)

DIFFERENTIAL SUMMING AMPLIFIER

VSN Input Bias Current

V

= 3.5 V

2

out

V

= 1.0 V

2

-

out

VSN Voltage = 0 V

30

mA

kW

VSP Input Resistance

DRVON = Low

DRVON = High

1.5

17

VSP Input Bias Voltage

DRVON = Low

DRVON = High

0.09

0.66

V

Input Voltage Range (Note 3)

-3 dB Bandwidth

-0.3

-

3.0

-

V

C = 80 pF to GND,

L

R = 10 KW to GND

10

MHz

L

Closed Loop DC Gain VS to Diffout

Maximum Output Voltage

VS+ to VS- = 0.5 to 1.6 V

0.98

3.0

-

1.0

-

1.025

V/V

V

I

= 2 mA

-

0.5

-

SOURCE

Minimum Output Voltage

I

= 2 mA

-

V

SINK

Output source current (Note 3)

Output sink current (Note 3)

INTERNAL OFFSET VOLTAGE

V

out

= 3 V

2.0

-

mA

V

out

= 0.5 V

-

Offset Voltage to the (+) Pin of the

Error Amp and the VDRP pin

-

1.30

-

V

VDROOP AMPLIFIER

Input Bias Current (Note 3)

Non-inverting Voltage Range (Note 3)

Input Offset Voltage (Note 3)

Open Loop DC Gain

-200

0

200

3

nA

V

1.3

-

V+ = V- = 1.1 V

C = 20 pF to GND including

ESD, R = 1 kW to GND

-4.0

-

4.0

mV

dB

100

L

Open Loop Unity Gain Bandwidth

Slew Rate

C = 20 pF to GND including

L

ESD, R = 1 kW to GND

-

10

5

-

MHz

L

C = 20 pF to GND including

L

ESD, R = 1 kW to GND

V/ms

L

Maximum Output Voltage

Minimum Output Voltage

I

= 4.0 mA

3

-

1

V

SOURCE

= 1.0 mA

SINK

3. Guaranteed by design, not tested in production.

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9

NCP5392P

ELECTRICAL CHARACTERISTICS

(Unless otherwise stated: 0°C < T < 85°C; 4.75 V < V < 5.25 V; All DAC Codes; C

= 0.1 mF)

A

CC

VCC

Parameter

Test Conditions

Min

Typ

Max

Unit

VDROOP AMPLIFIER

Output source current (Note 3)

Output sink current (Note 3)

CSSUM AMPLIFIER

V

= 3.0 V

4

1

-

mA

out

V

out

= 1.0 V

Current Sense Input to CSSUM Gain

-60 mV < CS < 60 mV

C = 10 pF to GND,

R = 10 kW to GND

-4.00

-

-3.88

4

-3.76

-

V/V

Current Sense Input to CSSUM -3 dB

Bandwidth

MHz

L

Current Sense Input to CSSUM

Output Slew Rate

DV = 25 mV, CL = 10 pF to

in

GND, Load = 1 k to 1.3 V

-

-15

3.0

-

4

-

+15

-

V/s

mV

V

Current Summing Amp Output Offset

Voltage

CSx – CSNx = 0, CSx = 1.1 V

Maximum CSSUM Output Voltage

CSx – CSxN = -0.15 V

(All Phases) I

= 1 mA

SOURCE

Minimum CSSUM Output Voltage

CSx – CSxN = 0.066 V

(All Phases) I = 1 mA

0.3

V

SINK

Output source current (Note 3)

Output sink current (Note 3)

PSI (Power Saving Control, Active Low)

Enable High Input Leakage Current

Upper Threshold

V

= 3.0 V

= 0.3 V

1

-

mA

out

V

out

External 1 K Pullup to 3.3 V

-

1.0

770

-

mA

mV

V

650

550

100

UPPER

LOWER

UPPER

Lower Threshold

450

-

Hysteresis

- V

-

LOWER

APSI_EN (AUTO PSI Function Enable, Active High)

Enable High Input Leakage Current

Upper Threshold

External 1k Pullup to 3.3 V

-

1.0

770

-

mA

mV

V

650

550

100

UPPER

LOWER

UPPER

Lower Threshold

450

-

Hysteresis

- V

-

LOWER

PH_PSI (PSI Phase Selection)

Enable High Input Leakage Current

Upper Threshold

External 1k Pullup to 3.3 V

-

1.0

0.7

-

mA

V

UPPER

LOWER

CC

Lower Threshold

V

0.3

V

DRVON

Output High Voltage

Sourcing Current for Output High

Output Low Voltage

Sinking Current for Output Low

Delay Time

Sourcing 500 mA

= 5 V

3.0

-

2.5

-

4.0

0.7

-

V

mA

V

CC

Sinking 500 mA

-

2.5

-

mA

ns

Propagation Delay from EN Low

to DRVON

10

-

Rise Time

C (PCB) = 20 pF, DV = 10% to

o

-

130

10

-

ns

L

90%

Fall Time

C (PCB) = 20 pF, DV = 10% to

L o

90%

Internal Pulldown Resistance

35

-

70

-

140

2.0

kW

V Voltage when DRVON

CC

Output Valid

V

3. Guaranteed by design, not tested in production.

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10

NCP5392P

ELECTRICAL CHARACTERISTICS

(Unless otherwise stated: 0°C < T < 85°C; 4.75 V < V < 5.25 V; All DAC Codes; C

= 0.1 mF)

A

CC

VCC

Parameter

Test Conditions

Min

Typ

Max

Unit

CURRENT SENSE AMPLIFIERS

Input Bias Current (Note 3)

CSx = CSxN = 1.4 V

-

0

-

nA

V

Common Mode Input Voltage Range

(Note 3)

-0.3

2.0

Differential Mode Input Voltage Range

(Note 3)

-120

-

120

mV

Input Offset Voltage

CSx = CSxN = 1.1 V,

-1.0

5.7

-

1.0

6.3

mV

V/V

Current Sense Input to PWM Gain

(Note 3)

0 V < CSx - CSxN < 0.1 V,

6.0

Current Sharing Offset CS1 to CSx

All VID codes

-2.5

-

2.5

mV

IMON

V

DRP

V

DRP

to IMON Gain

1.325 V< V

< 1.8 V

1.98

-

2

4

2.02

V/V

DRP

to IMON -3 dB Bandwidth

C = 30 pF to GND,

L

R = 100 kW to GND

MHz

L

Output Referred Offset Voltage

Minimum Output Voltage

V

= 1.6 V, I

= 0 mA

SOURCE

81

-

90

-

99

0.11

-

mV

V

DRP

= 1.2 V, I

= 100 mA

DRP

SINK

Output source current (Note 3)

Output sink current (Note 3)

Maximum Clamp Voltage

V

out

= 1 V

300

-

mA

V

out

= 0.3 V

-

V

DRP

Voltage = 2 V,

= 100 k

-

1.15

R

LOAD

OSCILLATOR

Switching Frequency Range (Note 3)

100

200

374

800

191

354

755

1.95

-

1000

224

kHz

Switching Frequency Accuracy 2- or

4-Phase

R

OSC

R

OSC

R

OSC

R

OSC

R

OSC

R

OSC

= 49.9 kW

= 24.9 kW

= 10 kW

-

414

-

978

Switching Frequency Accuracy

3-Phase

kHz

V

= 49.9 kW

= 24.9 kW

= 10 kW

-

234

-

434

-

1000

2.065

R

OSC

Output Voltage

2.01

MODULATORS (PWM Comparators)

Minimum Pulse Width

Propagation Delay

F

= 800 KHz

-

30

10

-

ns

V

SW

20 mV of Overdrive

0% Duty Cycle

COMP Voltage when the PWM

Outputs Remain LO

1.3

100% Duty Cycle

COMP Voltage when the PWM

Outputs Remain HI

-

2.3

-

V

PWM Ramp Duty Cycle Matching

PWM Phase Angle Error (Note 3)

VR_RDY (POWER GOOD) OUTPUT

VR_RDY Output Saturation Voltage

VR_RDY Rise Time (Note 3)

Between Any Two Phases

Between Adjacent Phases

-

90

-

%

15

°

I

= 10 mA,

-

0.4

V

PGD

External Pullup of 1 kW to 1.25

V, C = 45ꢀpF, DV = 10% to

90%

100

150

ns

TOT

o

VR_RDY Output Voltage at Powerup

(Note 3)

VR_RDY Pulled up to 5 V via

2ꢀkW, t ≤ 3 x t

-

1.0

V

R(VCC)

R(5V)

100 ms ≤ t

≤ 20 ms

CC

R(V

)

3. Guaranteed by design, not tested in production.

http://onsemi.com

11

NCP5392P

ELECTRICAL CHARACTERISTICS

(Unless otherwise stated: 0°C < T < 85°C; 4.75 V < V < 5.25 V; All DAC Codes; C

= 0.1 mF)

A

CC

VCC

Parameter

Test Conditions

Min

Typ

Max

Unit

VR_RDY (POWER GOOD) OUTPUT

VR_RDY High – Output Leakage

Current (Note 3)

VR_RDY = 5.5 V via 1 K

-

0.2

mA

VR_RDY Upper Threshold Voltage

VCore Increasing, DAC = 1.3 V

310

270

mV

Below

DAC

VR_RDY Lower Threshold Voltage

VCore Decreasing

DAC = 1.3 V

410

370

mV

Below

DAC

VR_RDY Rising Delay

VR_RDY Falling Delay

PWM OUTPUTS

VCore Increasing

VCore Decreasing

-

500

5

-

ms

Output High Voltage

Mid Output Voltage

Sourcing 500 mA

Sinking 500 mA

3.0

1.4

-

1.5

-

V

1.6

0.7

15

Output Low Voltage

Delay + Fall Time (Note 3)

V

C (PCB) = 50 pF,

L

DVo = V to GND

-

10

ns

CC

Delay + Rise Time (Note 3)

C (PCB) = 50 pF,

L

DVo = GND to V

-

10

75

15

-

ns

CC

Output Impedance – HI or LO State

Resistance to V (HI) or GND

CC

(LO)

W

2/3/4-PhASE DETECTION

Gate Pin Source Current

Gate Pin Threshold Voltage

Phase Detect Timer

60

210

15

80

240

20

150

265

27

mA

mV

ms

DIGITAL SOFT-START

Soft-Start Ramp Time

VR11 Vboot time

DAC = 0 to DAC = 1.1 V

1.0

-

1.5

ms

400

500

600

ms

VID7/VR11/AMD INPUT

VID Upper Threshold

VID Lower Threshold

VID Hysteresis

V

-

450

-

650

550

100

-

770

-

mV

mA

UPPER

LOWER

UPPER

- V

-

LOWER

AMD Input Bias Current

VR11 Input Bias Current (Note 3)

10

20

200

300

nA

ns

Delay before Latching VID Change

(VID De-Skewing) (Note 3)

Measured from the edge of the

st

200

-

1

VID change

AMD Upper Threshold (Note 3)

AMD Lower Threshold (Note 3)

ENABLE INPUT

2.9

V

2.4

-

Enable High Input Leakage Current

(Note 3)

Pullup to 1.3 V

-

200

nA

VR11 Rising Threshold

VR11 Falling Threshold

VR11 Total Hysteresis

AMD Upper Threshold

AMD Lower Threshold

-

450

-

650

550

100

1.3

770

-

mV

V

Rising- Falling Threshold

-

1.5

-

0.9

1.1

V

3. Guaranteed by design, not tested in production.

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12

NCP5392P

ELECTRICAL CHARACTERISTICS

(Unless otherwise stated: 0°C < T < 85°C; 4.75 V < V < 5.25 V; All DAC Codes; C

= 0.1 mF)

A

CC

VCC

Parameter

ENABLE INPUT

Test Conditions

Min

Typ

Max

Unit

AMD Total Hysteresis

Enable Delay Time

Rising - Falling Threshold

200

mV

ms

Measure Time from Enable

Transitioning HI to when Output

Begins

2.5

4.0

CURRENT LIMIT

I

to V

Gain

Between V

and V

- V = 450 mV

DFB

= 650 mV

0.95

1

1.05

V/V

LIM

DRP

- V

DRP

DFB

Gain in PSI 4 phase

Gain in PSI 3 phase

Gain in PSI 2 phase

Between V

and V

- V

= 450 mV

-

0.25

0.33

0.5

-

DRP

- V

DFB

= 650 mV

DRP

DFB

Between V

and V

- V

= 450 mV

DRP

- V

DFB

= 650 mV

DRP

DFB

Between V

and V

- V

= 450 mV

DRP

- V

DFB

= 650 mV

DRP

DFB

Offset

V

DRP

- V

= 520 mV

-50

-

0

50

-

mV

ns

DFB

Delay

100

OVERVOLTAGE PROTECTION

VR11 Overvoltage Threshold

DAC +150

DAC +185

DAC +200

mV

VR11 PSI Overvoltage Threshold

(Note 3)

(1.6ꢀV DAC)

+150

(1.6ꢀV DAC)

+200

AMD Overvoltage Threshold (Note 3)

DAC +200

DAC +235

DAC +305

mV

AMD PSI Overvoltage Threshold

(Note 3)

(1.55ꢀV DAC)

+200

(1.55ꢀV DAC)

+235

(1.55ꢀV DAC)

+305

Delay

100

ns

UNDERVOLTAGE PROTECTION

VCC UVLO Start Threshold

VCC UVLO Stop Threshold

VCC UVLO Hysteresis

DAC (FEED FORWARD FUNCTION)

Output Source Current

Output Sink Current

4

4.25

4.05

200

4.5

4.3

V

3.8

mV

V

= 3 V

0.25

1.5

3

mA

V

OUT

= 0.3 V

OUT

Max Output Voltage (Note 3)

Min Output Voltage (Note 3)

VRM 11 DAC

I = 2 mA

source

I

= 2 mA

0.5

V

sink

Positive DAC Slew Rate

11

-

16.5

mV/ms

System Voltage Accuracy

(DAC Value has a 19 mV Offset Over

the Output Value)

1.0 V < DAC < 1.6 V

0.8 V < DAC < 1.0 V

0.5 V < DAC < 0.8 V

-

0.5

5

8

%

mV

AMD DAC

Positive DAC Slew Rate

-

3.5

-

5

mV/ms

System Voltage Accuracy

(DAC Value has a 19 mV Offset Over

the Output Value)

1.0 V < DAC < 1.55 V

0.3750 < DAC < 0.8 V

0.5

5.0

%

mV

V

CC

V

CC

Operating Current

EN Low, No PWM

-

15

30

mA

3. Guaranteed by design, not tested in production.

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13

NCP5392P

Table 1. VRM11 VID Codes

VID7

800 mV

VID6

400 mV

VID5

200 mV

VID4

100 mV

VID3

VID2

25 mV

VID1

12.5 mV

VID0

6.25 mV

Voltage

(V)

50 mV

0

1

0

1

0

1

HEX

00

01

02

03

04

05

06

07

08

09

0A

0B

0C

0D

0E

0F

10

11

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

1.60000

1.59375

1.58750

1.58125

1.57500

1.56875

1.56250

1.55625

1.55000

1.54375

1.53750

1.53125

1.52500

1.51875

1.51250

1.50625

1.50000

1.49375

1.48750

1.48125

1.47500

1.46875

1.46250

1.45625

1.45000

1.44375

1.43750

1.43125

1.42500

1.41875

1.41250

1.40625

1.40000

1.39375

1.38750

1.38125

1.37500

1.36875

1.36250

1.35625

1.35000

1.34375

1.33750

1.33125

1.32500

1.31875

12

13

14

15

16

17

18

19

1A

1B

1C

1D

1E

1F

20

21

22

23

24

25

26

27

28

29

2A

2B

2C

2D

2E

2F

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14

NCP5392P

Table 1. VRM11 VID Codes

VID7

800 mV

VID6

400 mV

VID5

200 mV

VID4

100 mV

VID3

50 mV

VID2

25 mV

VID1

12.5 mV

VID0

6.25 mV

Voltage

(V)

HEX

30

31

32

33

34

35

36

37

38

39

3A

3B

3C

3D

3E

3F

40

41

42

43

44

45

46

47

48

49

4A

4B

4C

4D

4E

4F

50

51

52

53

54

55

56

57

58

59

5A

5B

5C

5D

5E

5F

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

1.31250

1.30625

1.30000

1.29375

1.28750

1.28125

1.27500

1.26875

1.26250

1.25625

1.25000

1.24375

1.23750

1.23125

1.22500

1.21875

1.21250

1.20625

1.20000

1.19375

1.18750

1.18125

1.17500

1.16875

1.16250

1.15625

1.15000

1.14375

1.13750

1.13125

1.12500

1.11875

1.11250

1.10625

1.10000

1.09375

1.08750

1.08125

1.07500

1.06875

1.06250

1.05625

1.05000

1.04375

1.03750

1.03125

1.02500

1.01875

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15

NCP5392P

Table 1. VRM11 VID Codes

VID7

800 mV

VID6

400 mV

VID5

200 mV

VID4

100 mV

VID3

50 mV

VID2

25 mV

VID1

12.5 mV

VID0

6.25 mV

Voltage

(V)

HEX

60

61

62

63

64

65

66

67

68

69

6A

6B

6C

6D

6E

6F

70

71

72

73

74

75

76

77

78

79

7A

7B

7C

7D

7E

7F

80

81

82

83

84

85

86

87

88

89

8A

8B

8C

8D

8E

8F

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

1.01250

1.00625

1.00000

0.99375

0.98750

0.98125

0.97500

0.96875

0.96250

0.95625

0.95000

0.94375

0.93750

0.93125

0.92500

0.91875

0.91250

0.90625

0.90000

0.89375

0.88750

0.88125

0.87500

0.86875

0.86250

0.85625

0.85000

0.84375

0.83750

0.83125

0.82500

0.81875

0.81250

0.80625

0.80000

0.79375

0.78750

0.78125

0.77500

0.76875

0.76250

0.75625

0.75000

0.74375

0.73750

0.73125

0.72500

0.71875

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16

NCP5392P

Table 1. VRM11 VID Codes

VID7

800 mV

VID6

400 mV

VID5

200 mV

VID4

100 mV

VID3

50 mV

VID2

25 mV

VID1

12.5 mV

VID0

6.25 mV

Voltage

(V)

HEX

90

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0.71250

0.70625

0.70000

0.69375

0.68750

0.68125

0.67500

0.66875

0.66250

0.65625

0.65000

0.64375

0.63750

0.63125

0.62500

0.61875

0.61250

0.60625

0.60000

0.59375

0.58750

0.58125

0.57500

0.56875

0.56250

0.55625

0.55000

0.54375

0.53750

0.53125

0.52500

0.51875

0.51250

0.50625

0.50000

OFF

91

92

93

94

95

96

97

98

99

9A

9B

9C

9D

9E

9F

A0

A1

A2

A3

A4

A5

A6

A7

A8

A9

AA

AB

AC

AD

AE

AF

B0

B1

B2

FE

FF

OFF

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17

NCP5392P

Table 2. AMD Processor 6-bit VID Code

(VID) Codes

Nominal V

Units

out

V

ID5

V

ID4

V

ID3

V

ID2

V

ID1

V

ID0

0

1.550

1.525

1.500

1.475

1.450

1.425

1.400

1.375

1.350

1.325

1.300

1.275

1.250

1.225

1.200

1.175

1.150

1.125

1.100

1.075

1.050

1.025

1.000

0.975

0.950

0.925

0.900

0.875

0.850

0.825

0.800

0.775

0.7625

0.7500

0.7375

0.7250

0.7125

0.7000

0.6875

0.6750

0.6625

V

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

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18

NCP5392P

Table 2. AMD Processor 6-bit VID Code

(VID) Codes

Nominal V

Units

out

V

ID5

V

ID4

V

ID3

V

ID2

V

ID1

V

ID0

1

0

1

0

1

0.6500

0.6375

0.6250

0.6125

0.6000

0.5875

0.5750

0.5625

0.5500

0.5375

0.5250

0.5125

0.5000

0.4875

0.4750

0.4625

0.4500

0.4375

0.4250

0.4125

0.4000

0.3875

0.3750

V

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

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19

NCP5392P

FUNCTIONAL DESCRIPTION

General

High Performance Voltage Error Amplifier

The NCP5392P provides up to four-phase buck solution

The error amplifier is designed to provide high slew rate

and bandwidth. Although not required when operating as

the controller of a voltage regulator, a capacitor from

COMP to VFB is required for stable unity gain test

configurations.

which combines differential voltage sensing, differential

phase current sensing, and adaptive voltage positioning to

provide accurately regulated power necessary for both

Intel VR11.1 and AMD CPU power system. NCP5392P has

been designed to work with the NCP5359 driver.

Gate Driver Outputs and 2/3/4 Phase Operation

The part can be configured to run in 2-, 3-, or 4-phase

mode. In 2-phase mode, phases 1 and 3 should be used to

drive the external gate drivers as shown in the 2-phase

Applications Schematic, G2 and G4 must be grounded. In

3-phase mode, gate output G4 must be grounded as shown

in the 3-phase Applications Schematic. In 4-phase mode

all 4 gate outputs are used as shown in the 4-phase

Applications Schematic. The Current Sense inputs of

unused channels should be connected to VCCP shown in

the Application Schematics. Please refer to table “PIN

CONNECTIONS vs. PHASE COUNTS” for details.

AUTO-PSI Function

NCP5392P makes energy saving possible without

receiving PSI signal from the CPU by wisely introducing

Auto-PSI feature. The device will monitor VID lines for

transition into/out-of Low Power States. When the VID

drops (An indication of entering power saving state), the

Auot-PSI logic will detect the transition and enable PSI

mode. On the other hand, when the VID rises (exiting

power saving mode), the Auto-PSI logic detects the

transition and exit PSI mode automatically. Auto-PSI uses

the dynamic VID(DVID) transitions of VR11.0 and

VR11.1 to shed phases. The phase shedding improves the

efficiency of the Vcore regulator eventually. In PSI mode,

the total current limit is reduced by the ratio of the phase

count left after phase shedding.

Differential Current Sense Amplifiers and Summing

Amplifier

Four differential amplifiers are provided to sense the output

current of each phase. The inputs of each current sense

amplifier must be connected across the current sensing

element of the phase controlled by the corresponding gate

output (G1, G2, G3, or G4). If a phase is unused, the

differential inputs to that phase's current sense amplifier must

be shorted together and connected to the output as shown in

the 2- and 3-phase Application Schematics.

Auto-PSI function can be activated and deactivated by

toggling APSI_EN (PIN38), but with lower priority

compared to PSI signal. When PSI (PIN37) is pulled to low,

the system will be forced into PSI mode unconditionally,

and APSI_EN signal will be shielded.

NCP5392P can be operated up to four phases. It can be

configured as 1 or 2 phase operation when the system enter

PSI mode automatically (for example, VID down from 1.2ꢁV

to 1.1ꢁV). Choice of going down to 1 or 2 phases can be set

up by Pin40-PH_PSI. PH_PSI=high means one-phase

operation. PH_PSI=low means two-phase operation.

The current signals sensed from inductor DCR are fed into

a summing amplifier to have a summed-up output (CSSUM).

Signal of CSSUM combines information of total current of all

phases in operation.

The outputs of current sense amplifiers control three

functions. First, the summing current signal (CCSUM) of

all phases will go through DROOP amplifier and join the

voltage feedback loop for output voltage positioning.

Second, the output signal from DROOP amplifier also goes

to ILIM amplifier to monitor the output current limit.

Finally, the individual phase current contributes to the

current balance of all phases by offsetting their ramp

signals of PWM comparators.

Remote Output Sensing Amplifier(RSA)

A true differential amplifier allows the NCP5392P to

voltage feedback with respect to the V

core

measure V

ground reference point by connecting the V

core

reference

ground reference point to VSN.

core

point to VSP, and the V

core

This configuration keeps ground potential differences

between the local controller ground and the V ground

core

reference point from affecting regulation of V

and V

between

ground reference points. The RSA also

core

V

core

Thermal Compensation Amplifier with VDRP and VDFB

Pins

subtracts the DAC (minus VID offset) voltage, thereby

producing an unamplified output error voltage at the

DIFFOUT pin. This output also has a 1.3 V bias voltage as

the floating ground to allow both positive and negative

error voltages.

Thermal compensation amplifier is an internal amplifier

in the path of droop current feedback for additional

adjustment of the gain of summing current and temperature

compensation. The way thermal compensation is

implemented separately ensures minimum interference to

the voltage loop compensation network.

Precision Programmable DAC

A precision programmable DAC is provided and system

trimmed. This DAC has 0.5% accuracy over the entire

operating temperature range of the part. The DAC can be

programmed to support either Intel VR11 or AMD 6-bit

VID code specifications.

Oscillator and Triangle Wave Generator

A programmable precision oscillator is provided. The

oscillator's frequency is programmed by the resistance

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NCP5392P

Output Overvoltage and Undervoltage Protection and

Power Good Monitor

connected from the ROSC pin to ground. The user will

usually form this resistance from two resistors in order to

create a voltage divider that uses the ROSC output voltage

as the reference for creating the current limit setpoint

voltage. The oscillator frequency range is 100ꢁkHz per

phase to 1.0ꢁMHz per phase. The oscillator generates up to

4 symmetrical triangle waveforms with amplitude between

1.3ꢁV and 2.3ꢁV. The triangle waves have a phase delay

between them such that for 2-, 3- and 4-phase operation

the PWM outputs are separated by 180, 120, and 90 angular

degrees, respectively.

An output voltage monitor is incorporated. During normal

operation, if the output voltage is 180ꢁmV (typical) over the

DAC voltage, the VR_RDY goes low, the DRVON signal

remains high, the PWM outputs are set low. The outputs will

remain disabled until the V

voltage is removed and

CC

reapplied. During normal operation, if the output voltage falls

more than 350ꢁmV below the DAC setting, the VR_RDY pin

will be set low until the output voltage rises.

Soft-Start

There are two possible soft-start modes: AMD and

from 0 V directly

PWM Comparators with Hysteresis

VR11. AMD mode simply ramps V

to the DAC setting at a fixed rate. The VR11 mode ramps

to 1.1ꢁV boot voltage at a fixed rate of 0.8ꢁmV/mS,

core

Four PWM comparators receive an error signal at their

noninverting input. Each comparator receives one of the

triangle waves at its inverting output. The output of each

comparator generates the PWM outputs G1, G2, G3, and G4.

During steady state operation, the duty cycle will center

on the valley of the triangle waveform, with steady state

V

core

pauses at 1.1ꢁV for around 500ꢁmS, reads the VID pins to

determine the DAC setting. Then ramps V to the final

core

DAC setting at the Dynamic VID slew rate of up to

12.5ꢁmV/mS. Typical AMD and VR11 soft-start sequences

are shown in the following graphs (Figure 9 and 10).

duty cycle calculated by V /V . During a transient event,

out in

both high and low comparator output transitions shift phase

to the points where the error signal intersects the down and

up ramp of the triangle wave.

APPLICATION INFORMATION

The NCP5392P demo board for the NCP5392P is

available by request. It is configured as a four phase

solution with decoupling designed to provide a 1ꢁmW load

line under a 100ꢁA step load.

PROTECTION FEATURES

Undervoltage Lockout

An undervoltage lockout (UVLO) senses the V input.

CC

Startup Procedure

During power-up, the input voltage to the controller is

monitored, and the PWM outputs and the soft-start circuit

are disabled until the input voltage exceeds the threshold

voltage of the UVLO comparator. The UVLO comparator

incorporates hysteresis to avoid chattering.

Start by installing the test tool software. It is best to

power the test tool from a separate ATX power supply. The

test tool should be set to a valid VID code of 0.5ꢁV or above

in order for the controller to start. Consult the VTT help

manual for more detailed instruction.

Overcurrent Shutdown

Step Load Testing

A programmable overcurrent function is incorporated

within the IC. A comparator and latch make up this

function. The inverting input of the comparator is

connected to the ILIM pin. The voltage at this pin sets the

maximum output current the converter can produce. The

ROSC pin provides a convenient and accurate reference

voltage from which a resistor divider can create the

overcurrent setpoint voltage. Although not actually

disabled, tying the ILIM pin directly to the ROSC pin sets

the limit above useful levels - effectively disabling

overcurrent shutdown. The comparator noninverting input

is the summed current information from the VDRP minus

offset voltage. The overcurrent latch is set when the current

information exceeds the voltage at the ILIM pin. The

outputs are pulled low, and the soft-start is pulled low. The

The VTT tool is used to generate the d /d step load.

t

i

Select the dynamic loading option in the VTT test tool

software. Set the desired step load size, frequency, duty,

and slew rate. See Figure 6.

outputs will remain disabled until the V

voltage is

CC

removed and re-applied, or the ENABLE input is brought

low and then high.

Figure 6. Typical Load Step Response

(full load, 35 A - 100 A)

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NCP5392P

Dynamic VID Testing

Understanding Soft-Start

The VTT tool provides for VID stepping based on the

Intel Requirements. Select the Dynamic VID option.

Before enabling the test set the lowest VID to 0.5ꢁV or

greater and set the highest VID to a value that is greater than

the lowest VID selection, then enable the test. See Figures

7 and 8.

The controller supports two different startup routines. An

AMD ramp to the initial VID code, or a VR11 Ramp to the

1.1ꢁV boot voltage, with a pause to capture the VID code

then resume ramping to target value based on internal slew

rate limit. The initial ramp rate was set to be 0.8 mV/mS.

Figure 9. VR11.1 Startup

Figure 7. 1.6 V to 0.5 V Dynamic VID response

Figure 10. AMD Startup

Figure 8. Dynamic VID Settling Time Rising

(CH1: VID1, CH2: DAC, CH3:VCCP)

Programming the Current Limit and the Oscillator

Frequency

The demo board is set for an operating frequency of

pin provides a 2.0ꢁV

Design Methodology

approximately 330ꢁkHz. The R

OSC

reference voltage which is divided down with a resistor

divider and fed into the current limit pin ILIM. Then

calculate the individual RLIM1 and RLIM2 values for the

divider. The series resistors RLIM1 and RLIM2 sink

current from the ILIM pin to ground. This current is

Decoupling the V_CCPin on the IC

An RC input filter is required as shown in the V pin to

minimize supply noise on the IC. The resistor should be

sized such that it does not generate a large voltage drop

between 5ꢁV supply and the IC.

CC

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NCP5392P

internally mirrored into a capacitor to create an oscillator.

The current limit function is based on the total sensed

current of all phases multiplied by a controlled gain

(Acssum*Adrp). DCR sensed inductor current is a function

of the winding temperature. The best approach is to set the

maximum current limit based on expected average

maximum temperature of the inductor windings,

The period is proportional to the resistance and frequency

is inversely proportional to the total resistance. The total

resistance may be estimated by Equation 1. This equation

is valid for the individual phase frequency in both three and

four phase mode.

R_osc^ 20947 F_SWā^*1.1262

30.5ꢀkW ^ 20947 330^*1.1262

(eq. 1)

(eq. 2)

DCR_Tmax+ DCR_25C(1 ) 0.00393 @ (T_max* 25))

60

50

40

30

20

10

Calculation

Real

0

100

1000

Freq-kHz

Figure 11. ROSC vs. Frequency

For multiphase controller, the ripple current can be calculated as,

(V_in* N @ V_out) @ V_out

(eq. 3)

(eq. 4)

Ipp +

L @ F_SW@ V_in

Therefore calculate the current limit voltage as below,

V_LIMIT^ A_CSSUM@ A_DRP@ DCR_Tmax@ (I_{MIN_OCP}@ ) 0.5 @ Ipp)

(V_in* N @ V_out) @ V_out

_@ǒ

are the gain of current summing amplifier and droop amplifier.

Ǔ

V_LIMIT^ A_CSSUM@ A_DRP@ DCR_Tmax

I_{MIN_OCP}@ ) 0.5 @

L @ F_SW@ V_in

In Equation 4, A

and A

CSSUM

DRP

Acssum

Adrp

RNOR

R

temperature sense resistor placed near inductor. R

and R

are in series with R , the NTC

is

ISO1

ISO2 T2

SUM

RISO1

RSUM

the resistor connecting between pin VDFB and pin

CSSUM. If PSI = 1, PSI function is off, the current limit

follows the Equation 7; if PSI = 0, the power saving mode

will be enabled, COEpsi is a coefficient for the current

limiting related with power saving function (PSI), the

current limit can be calculated from Equation 8. COEpsi

value is one over the original phase count N. Refer to the

PSI and phase shedding section for more details.

RISO2

I1

RT2

-

+

I2

I3

I4

+

-

OCP

event

Ilim

Figure 12. ACSSUM and ADRP

As introduced before, V

comes from a resistor

LIMIT

divider connected to Rosc pin, thus,

R_LIM2

(eq. 5)

(eq. 6)

V_LIMIT+ 2ꢀV @

R_LIM1) R_LIM2

@ COEpsi

A_CSSUM+ *4

R_NOR@ (R_ISO1) R_ISO2) R_T2

)

A_DRP+ *

(R_NOR) R_ISO1) R_ISO2) R_T2) @ R_SUM

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NCP5392P

Final Equations for the Current Limit Threshold

Final equations are described based on two conditions: normal mode and PSI mode.

2V@R

LIM2

R

)R

(V_in* N @ V_out) @ V_out

L @ F_SW@ V_in

LIM1

LIM2

I_LIMIT(normal) ^

* 0.5 @

R

@(R

)R )R

ISO2

)

T2

)R )@R

SUM

NOR

)R

ISO1

4 @ _(R

@ DCR_25C(1 ) 0.00393 @ (T_inductor* 25))

@ COEpsi

LIM2

(eq. 7)

)R

T2

NOR

ISO1

ISO2

2V@R

LIM2

)R

R

(V_in* V_out) @ V_out

L @ F_SW@ V_in

LIM1

)R )

ISO2

I_LIMIT(PSI) ^

* 0.5 @

(eq. 8)

R

@(R

)R

T2

@ DCR_25C(1 ) 0.00393 @ (T_inductor* 25))

)R )@R

SUM

NOR

)R

ISO1

)R

4 @ _(R

T2

NOR

ISO1

ISO2

Inductor Current Sensing Compensation

N is the number of phases involved in the circuit.

The inductors on the demo board have a DCR at 25°C of

0.6ꢁmW. Selecting the closest available values of 21.3 kW

The NCP5392P uses the inductor current sensing

method. An RC filter is selected to cancel out the

impedance from inductor and recover the current

information through the inductor's DCR. This is done by

matching the RC time constant of the sensing filter to the

L/DCR time constant. The first cut approach is to use a 0.1

mF capacitor for C and then solve for R.

for R

and 9.28 kW for R

yields a nominal

operating frequency of 330 kHz. Select R 1 = 1ꢁk, R

LIM1

LIM2

ISO

ISO2

= 1 k, R = 10 K (25°C), R

/R

= 2, (refer to

T2

NOR SUM

application diagram). That results to an approximate

current limit of 133ꢁA at 100°C for a four phase operation

and 131ꢁA at 25°C. The total sensed current can be

observed as a scaled voltage at the VDRP with a positive

no-load offset of approximately 1.3 V.

(eq. 9)

L

R_sense(T) +

0.1 @ mF @ DCR_25C@ (1 ) 0.00393(T * 25))

Because the inductor value is a function of load and

inductor temperature final selection of R is best done

Inductor Selection

When using inductor current sensing it is recommended

that the inductor does not saturate by more than 10% at

maximum load. The inductor also must not go into hard

saturation before current limit trips. The demo board

includes a four phase output filter using the T44-8 core

from Micrometals with 3 turns and a DCR target of 0.6ꢁmW

@ 25°C. Smaller DCR values can be used, however,

current sharing accuracy and droop accuracy decrease as

DCR decreases. Use the NCP5392P design aide for

regulation accuracy calculations for specific value of DCR.

experimentally on the bench by monitoring the V

droop

and performing a step load test on the actual solution.

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NCP5392P

Simple Average SPICE Model

A simple state average model shown in Figure 13 can be used to determine a stable solution and provide insight into the

control system.

GAIN = 1

{-2/3*4}

E1

+

-

Voff

E

GAIN = {6}

V3

12V

0

L

LBRD

100p

RBRD

0.75m

DCR

{0.6E-3/4}

2

1

{185e-9/4}

1

2

0

12

CCer

{22e-6*18}

CBulk

{560e-6*6}

VRamp_min

I1 = 50

I2 = 110

TD = 100u

RSUM

1k

1.3V

ESRCer

{1.5e-3/18}

I1

ESRBulk

{7e-3/6}

TR = 50n

0Aac

0Adc

2

22p

CDFB

Vdrp

RDFB

2k

TF = 50n

PW = 100u

PER = 200u

ESLCer

{1.5e-9/18}

Vout

ESLBulk

{3.5e-9/6}

1E3

R8

1k

Voff

1

C5

10.6p

RDAC CDAC

0

VDAC

50

12n

DC = 1.2V

AC = 0

R12

5.11k

CFB1

680P

CH

RFB1

69.8

TRAN = PULSE

(0 0.05 400u 5u 5u 500u 1000u)

22p

RFB

RF

2.2k

CF

1.8n

R6

0

1k

Voff

1E3

R11

1k

Vdrp

Voffset

1.3V

1k

C4

10.6p

R10

2k

Unity Gain BW=15MHz

1E3

0

R9

C6

0

Voff

IMON

1k 10.6p

Figure 13. NCP5392P Average SPICE Model

Compensation and Output Filter Design

If the required output filter and switching frequency are

significantly different, it's best to use the available PSPICE

models to design the compensation and output filter from

scratch.

plus the board impedance is 1.15 mW + 0.75 mW or

1.9 mW. The actual output filter impedance does not drop

to 1.0 mW until the ceramic breaks in at over 375 kHz. The

controller must provide some loop gain slightly less than

one out to a frequency in excess 300 kHz. At frequencies

below where the bulk capacitance ESR breaks with the

bulk capacitance, the DC-DC converter must have

sufficiently high gain to control the output impedance

completely. Standard Type-3 compensation works well

with the NCP5392P.

The design target for this demo board was 1.0 mW up to

2.0 MHz. The phase switching frequency is currently set to

330 kHz. It can easily be seen that the board impedance of

0.75 mW between the load and the bulk capacitance has a

large effect on the output filter. In this case the six 560 mF

bulk capacitors have an ESR of 7.0 mW. Thus the bulk ESR

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NCP5392P

Zout Open Loop

Zout Closed Loop

Open Loop Gain with Current Loop Closed

Voltage Loop Compensation Gain

80

60

40

20

0

-20

-40

-60

1mOhm

-80

-100

100

1000

10000

100000

1000000

10000000

Frequency

Figure 14. NCP5392P Circuit Frequency Response

CH

CF

The goal is to compensate the system such that the

resulting gain generates constant output impedance from

DC up to the frequency where the ceramic takes over

holding the impedance below 1.0 mW. See the example of

the locations of the poles and zeros that were set to optimize

the model above.

CFB1

RFB1

RF

I Bias

RFB

-

+

-

+

Error

Amp

1.3 V

Droop

Amp

RDRP

RISO2

PWM

Comparator

By matching the following equations a good set of

starting compensation values can be found for a typical

mixed bulk and ceramic capacitor type output filter.

+

-

RNOR

RT

1.3 V

RISO1

RSUM

Gain = 4

-

1

+

(eq. 10)

(eq. 11)

2p @ CF @ RF

2p @ (RBRD ) ESR_Bulk) @ C_Bulk

+

CSSUM

Amp

1.3 V

1

RSx

+

2p @ CFB1 @ (RFB1 ) RFB)

2p @ C

@ (RBRD ) ESR

)

Bulk

Cer

+

-

RL

+

R

should be set to provide optimal thermal

compensation in conjunction with thermistor R , R

FB

CSx

Gain = 1

T2

ISO1

and R

. With R set to 1.0 kW, R

FB

is usually set to

ISO2

FB1

100 W for maximum phase boost, and the value of RF is

typically set to 3.0 kW.

Figure 15. Droop Injection and Thermal

Compensation

RDRP determines the target output impedance by the

basic equation:

Droop Injection and Thermal Compensation

The VDRP signal is generated by summing the sensed

output currents for each phase. A droop amplifier is added

to adjust the total gain to approximately eight. VDRP is

externally summed into the feedback network by the

resistor RDRP. This introduces an offset which is

proportional to the output current thereby forcing a

controlled, resistive output impedance.

R_FB@ DCR @ A_CSSUM@ A_DRP

V

^out+ Z_out

I_out

+

(eq. 12)

R_DRP

R_FB@ DCR @ A_CSSUM@ A_DRP

R_DRP

+

(eq. 13)

Z_out

The value of the inductor's DCR is a function of

temperature according to the Equation 14:

DCRꢀ(T) + DCR_25C@ (1 ) 0.00393 @ (T * 25))

(eq. 14)

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NCP5392P

Actual DCR increases by temperature, the system can be

thermally compensated to cancel this effect to a great

degree by adding an NTC in parallel with R to reduce

temperature. The series resistor is split and inserted on both

sides of the NTC to reduce noise injection into the feedback

loop. The recommended total value for R

approximately 1.0 kW.

plus R

is

NOR

ISO1

ISO2

the droop gain as the temperature increases. The NTC

device is nonlinear. Putting a resistor in series with the NTC

helps make the device appear more linear with

The output impedance varies with inductor temperature

by the equation:

R_FB@ DCR_25C@ (1 ) 0.00393 @ (T * 25)) @ A_CSSUM@ A_DRP

(eq. 15)

(eq. 16)

Z_out(T) +

R_DRP

By including the NTC R and the series isolation resistors the new equation becomes:

T2

R

@(R

)R )R

ISO2

)R

)

T2

)R )@R

SUM

NOR

)R

ISO1

R_FB@ DCR_25C@ (1 ) 0.00393 @ (T * 25)) @ A_CSSUM

@

(R

T2

NOR

ISO1 ISO2

Z_out(T) +

R_DRP

Acssum

Adrp

RNOR

The typical equation of an NTC is based on a curve fit

Equation 17

RISO1

RISO2

1

298

I1

ƪǒ

Ǔ_*ǒ Ǔƫ

RT2

273)T

(eq. 17)

RT2(T) + RT2_25C@ e^b

I2

I3

I4

-

+

RSUM

The demo board use a 10 kW NTC with a b value of 3740.

Figure 16 shows the comparison of the compensated output

impedance and uncompensated output impedance varying

with temperature.

+

-

OCP

event

Ilim

Imon

+

-

0.0013

Zout

Zout(uncomp)

0.0012

Gain = 2

0.0011

0.001

Figure 17. IMON Circuit

0.0009

0.0008

0.0007

0.0006

Vimon vs. Iout

1.05

0.84

0.63

0.42

0.21

0

25

45

65

85

105

Celsius

Figure 16. Z_outvs. Temperature

IMON for Current Monitor

Since VDRP signal reflects the current information of all

phases. It can be fed into the IMON amplifier for current

monitoring as shown in Figure 17. IMON amplifier has a

fixed gain of 2 with an offset when VDRP is equal to 1.3ꢁV,

the internal floating reference voltage. The IMON

amplifier will be saturated at an maximum output of 1.09ꢁV

therefore the total gain of current should be carefully

considered to make the maximum load current indicated by

the IMON output. Figure 18 shows a typical of the relation

between IMON output and the load current.

0

10 20 30 40 50 60 70 80 90 100

Iout-A

Figure 18. IMON Output vs. Output Current

Power Saving Indicator (PSI) and Phase Shedding

VR11.1 requires the processor to provide an output

signal to the VR controller to indicate when the processor

is in a low power state. NCP5392P use the status of PSI pin

to decide if there is a need to change its operating state to

maximize efficiency at light loads. When PSI = 0, the PSI

function will be enabled, and VR system will be running at

a single phase power saving mode.

The PSI signal will de-assert 1 ms prior to moving to a

normal power state.

At power saving mode, NCP5392P works with the

NCP5359 driver to represent diode emulation mode at light

load for further power saving.

When system switches on PSI function, a phase shedding

will be presented. Only one or two phases (depending on

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NCP5392P

Auto-PSI Function:

PH_PSI) are active in the emulation mode while other

phases are shed. Figure 19 indicates a PSI-on transition

from a 3-phase mode to a single phase mode. While staying

stable in PSI mode, the PWM signal of phase 1 will vary

from a mid-state level (1.5 V typical) to high level while

other phases all go to mid-state level. Vice verse, when PSI

signal goes high, the system will go back to the original

phase mode such as shown in Figure 20.

In Auto-PSI mode (APSI_EN=1, PSI=1), the device will

monitor VID lines for transition into/out-of Low Power

States. Figure 21 to 24 describe the Auto-PSI function

during VID transitions, in one-phase and two-phase

operation respectively.

Figure 21. 10 A Load, VID Down, into PSI (One Phase)

Figure 19. PSI turns on, CH1: PWM1, CH2: PWM2,

CH3: PWM3, CH4: PSI

Figure 22. 10 A Load, VID Up, Out of PSI (One Phase)

Figure 20. PSI turns off, CH1: PWM1, CH2: PWM2,

CH3: PWM3, CH4: PSI

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NCP5392P

voltage even during a dynamic change in the VID setting

during operation.

Figure 23. 10 A Load, VID Down, into PSI (Two Phase)

Figure 25. VR11.1, 1.6 V OVP Event

Figure 26. AMD, 1.55 V OVP Event

Gate Driver and MOSFET Selection

Figure 24. 10 A Load, VID Up, Out of PSI

(Two Phase)

ONꢁSemiconductor provides the NCP5359 as

a

OVP Improved Performance

companion gate driver IC. The NCP5359 driver is

optimized to work with a range of MOSFETs commonly

used in CPU applications. The NCP5359 provides special

functionality including power saving mode operation and

is required for high performance dynamic VID operation.

Contact your local ONꢁSemiconductor applications

engineer for MOSFET recommendations.

The overvoltage protection threshold is not adjustable.

OVP protection is enabled as soon as soft-start begins and

is disabled when part is disabled. When OVP is tripped, the

controller commands all four gate drivers to enable their

low side MOSFETs and VR_RDY transitions low. In order

to recover from an OVP condition, V must fall below the

CC

UVLO threshold. See the state diagram for further details.

The OVP circuit monitors the output of DIFFOUT. If the

DIFFOUT signal reaches 180 mV (typical) above the

nominal 1.3ꢁV offset the OVP will trip and VRRDY will be

pulled low, after eight consecutive OVP events are

detected, all PWMs will be latched. The DIFFOUT signal

is the difference between the output voltage and the DAC

voltage (minus 19 mV if in VR11.1 modes) plus the 1.3ꢁV

internal offset. This results in the OVP tracking on the DAC

Board Stackup and Board Layout

Close attention should be paid to the routing of the sense

traces and control lines that propagate away from the

controller IC. Routing should follow the demo board

example. For further information or layout review contact

ONꢁSemiconductor.

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NCP5392P

SYSTEM TIMING DIAGRAM

12 V (Gate Driver)

5 V (Controller)

UVLO

EN

3.5 ms

VID

Valid VID

DRVON

1 ms min

1.5 ms

500 ms

VSP-VSN

VR_RDY

500 ms

Figure 27. Normal Startup

12 V (Gate Driver)

UVLO

5 V (Controller)

UVLO

POR

EN

3.5 ms

DRVON

VID

Valid VID

1 ms min

1.5 ms

500 ms

1 ms

VSP-VSN

VR_RDY

500 ms

Figure 28. Driver UVLO Limited Startup

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NCP5392P

1

2

3

4

5

6

7

8

185 mV

Diffout ~ 1.3 V

VR_RDY

DRVON = High

1

2

3

4

5

6

7

8

185 mV

VSP = VID - 19 mV

Figure 29. OVP Shutdown

I

+ 1.3

limit

VDRP

VR_RDY

DRVON

Figure 30. Non-PSI Current Limit

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NCP5392P

PACKAGE DIMENSIONS

QFN40 6x6, 0.5P

CASE 488AR-01

ISSUE A

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

D

A B

2. CONTROLLING DIMENSIONS: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.25 AND 0.30mm FROM TERMINAL

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

PIN ONE

LOCATION

E

MILLIMETERS

DIM MIN

MAX

1.00

0.05

A

A1

A3

b

0.80

0.00

0.20 REF

2X

0.15

C

0.18

0.30

D

D2

E

E2

e

L

6.00 BSC

TOP VIEW

2X

0.15

C

4.00

4.20

6.00 BSC

4.00 4.20

0.50 BSC

(A3)

0.10

C

0.30

0.20

0.50

---

A

K

40X

0.08

SIDE VIEW

D2

A1

SOLDERING FOOTPRINT*

SEATING

PLANE

C

6.30

4.20

L

40X

K

40X

11

20

40X

21

10

0.65

EXPOSED PAD

1

E2

4.20 6.30

40X b

1

30

0.10

0.05

C

A B

40

31

36X

e

BOTTOM VIEW

40X

36X

0.50 PITCH

0.30

DIMENSIONS: MILLIMETERS

*For additional information on our Pb-Free strategy and soldering

details, please download the ON Semiconductor Soldering and

MountingTechniques Reference Manual, SOLDERRM/D.

The products described herein (NCP5392P), is covered by one or more of the following U.S. patent; US07057381. There may be other patents pending.

ON Semiconductor and

are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any

liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental

damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over

time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under

its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body,

or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death

may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees,

subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of

personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.

SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

LITERATURE FULFILLMENT:

ꢁLiterature Distribution Center for ON Semiconductor

ꢁP.O. Box 5163, Denver, Colorado 80217 USA

N. American Technical Support: 800-282-9855 Toll Free

ꢁUSA/Canada

Europe, Middle East and Africa Technical Support:

ON Semiconductor Website: www.onsemi.com

Order Literature: http://www.onsemi.com/orderlit

ꢁPhone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada ꢁPhone: 421 33 790 2910

ꢁFax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada

ꢁEmail: orderlit@onsemi.com

For additional information, please contact your loca

Sales Representative

Japan Customer Focus Center

ꢁPhone: 81-3-5773-3850

NCP5392P/D

http://onsemi.com

32


型号：	NCP5392P
厂家：	ONSEMI
描述：	2/3/4-Phase Controller for CPU Applications 2/3/ 4相位控制器的CPU应用控制器
文件：	总32页 (文件大小：314K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

NCP5392P [ONSEMI]

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