NCP706AMX300TAG [ONSEMI]
Precision Very Low Dropout Voltage Regulator;
| 型号： | NCP706AMX300TAG |
| 厂家： | 
ONSEMI |
| 描述： | Precision Very Low Dropout Voltage Regulator |
| 文件： | 总9页 (文件大小：331K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NCP706A
1 A, 1% Precision Very Low
Dropout Voltage Regulator
with Enable and Active
Discharge
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The NCP706A is a Very Low Dropout Regulator which provides up
to 1 A of load current and maintains excellent output voltage accuracy
of 1% including line, load and temperature variations. The operating
input voltage range from 2.4 V up to 5.5 V makes this device suitable
for Li−ion battery powered products as well as post−regulation
applications. The product is available in 3.0 V fixed output voltage
option. NCP706A is fully protected against overheating and output
short circuit.
Very small 8−pin XDFN8 1.6 x 1.2, 04P package makes the device
especially suitable for space constrained portable applications such as
tablets and smartphones. Parts feature active output discharge
function.
MARKING
DIAGRAM
AEMG
XDFN8
CASE 711AS
G
AE = Specific Device Code
M
G
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
Features
PIN CONNECTION
• Operating Input Voltage Range: 2.4 V to 5.5 V
• Fixed Output Voltage Option: 3.0 V
OUT
OUT
N/C
IN
1
2
3
4
8
7
6
5
Other Output Voltage Options Available on Request.
• Low Quiescent Current of Typ. 200 mA
IN
• Very Low Dropout: 155 mV Max. at I
= 1 A
OUT
EN
GND
•
1% Accuracy Over Load/Line/Temperature
SNS
• High PSRR: 60 dB at 1 kHz
(Top View)
• Internal Soft−Start to Limit the Inrush Current
• Thermal Shutdown and Current Limit Protections
• Stable with a 1.0 mF Ceramic Output Capacitor
• Available in XDFN8 1.6 x 1.2, 04P 8−pin Package
• Active Output Discharge
IN
IN
OUT
OUT
N/C
8
7
6
5
1
2
3
4
EN
• These are Pb−Free Devices
Typical Applications
GND
SNS
(Bottom View)
• Tablets, Smartphones,
• Wireless Handsets, Portable Media Players
• Portable Medical Equipment
• Other Battery Powered Applications
ORDERING INFORMATION
See detailed ordering, marking and shipping information on
page 8 of this data sheet.
V
= 2.4 (3.3) − 5.5 V
V
= 3.0 V @ 1 A
IN
OUT
IN
OUT
SNS
NCP706A
GND
C
C
OUT
IN
EN
1.0 mF
Ceramic
ON
OFF
Figure 1. Typical Application Schematic
© Semiconductor Components Industries, LLC, 2016
1
Publication Order Number:
May, 2016 − Rev. 1
NCP706A/D
NCP706A
Figure 2. Simplified Internal Schematic Block Diagram
PIN FUNCTION DESCRIPTION
Pin No.
XDFN8
Pin Name
OUT
OUT
N/C
Description
1
2
3
4
5
6
Regulated output voltage. A minimum 1.0 mF ceramic capacitor is needed from this pin to ground to
assure stability.
Not connected. This pin can be tied to ground to improve thermal dissipation.
Remote sense connection. This pin should be connected to the output voltage rail.
Power supply ground.
SNS
GND
EN
Enable pin. Driving EN over 0.9 V turns on the regulator. Driving EN below 0.4 V puts the regulator
into shutdown mode.
7
8
−
IN
IN
Input pin. A small capacitor is needed from this pin to ground to assure stability.
Exposed
Pad
This pad enhances thermal performance and is electrically connected to GND. It is recommended
that the exposed pad is connected to the ground plane on the board or otherwise left open.
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2
NCP706A
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
−0.3 V to 6 V
−0.3 V to VIN + 0.3 V
−0.3 V to VIN + 0.3 V
Indefinite
Unit
V
Input Voltage (Note 1)
V
IN
Output Voltage
V
OUT
V
Enable Input
V
EN
V
Output Short Circuit Duration
Maximum Junction Temperature
Storage Temperature
t
s
SC
T
150
°C
°C
V
J(MAX)
T
−55 to 150
2000
STG
ESD Capability, Human Body Model (Note 2)
ESD Capability, Machine Model (Note 2)
ESD
HBM
ESD
200
V
MM
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per EIA/JESD22−A114
ESD Machine Model tested per EIA/JESD22−A115
Latch−up Current Maximum Rating tested per JEDEC standard: JESD78
THERMAL CHARACTERISTICS
Rating
Symbol
Value
Unit
Thermal Characteristics, XDFN8 1.6x1.2, 04P
Thermal Resistance, Junction−to−Air
R
160
°C/W
q
JA
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3
NCP706A
ELECTRICAL CHARACTERISTICS − VOLTAGE VERSION 3.0 V
−40°C ≤ T ≤ 125°C; V = V
+ 0.3 V or 3.3 V, whichever is greater; I
= 10 mA, C = C
= 1.0 mF, V = 0.9 V, unless
OUT EN
J
IN
OUT(NOM)
OUT
IN
otherwise noted. Typical values are at T = +25°C. (Note 3)
J
Parameter
Operating Input Voltage
Undervoltage lock−out
Output Voltage Accuracy
Line Regulation
Test Conditions
Symbol
Min
Typ
Max
5.5
Unit
V
V
IN
2.4
1.2
V
V
V
rising, I
= 0
UVLO
1.6
3.0
2
1.9
V
IN
OUT
+ 0.3 V ≤ V ≤ 4.5 V, I
= 0 – 1 A
V
OUT
2.97
3.03
V
OUT
OUT
IN
OUT
+ 0.3 V ≤ V ≤ 4.5 V, I
= 10 mA
Reg
mV
mV
mV
IN
OUT
LINE
LOAD
LOAD
Load Regulation
I
= 0 mA to 1 A, V = 3.3 V
Reg
2
OUT
IN
Load Transient
I
= 10 mA to 1 A in 10 ms, V = 3.5 V
Tran
120
OUT
IN
C
= 10 mF
OUT
Dropout voltage (Note 4)
Output Current Limit
Quiescent current
Ground current
I
= 1 A, V
= 3.0 V
V
155
230
230
1
mV
A
OUT
OUT(nom)
DO
V
= 90% V
I
CL
1.1
0.9
OUT
OUT(nom)
I
= 0 mA
= 1 A
I
170
200
0.1
mA
mA
mA
V
OUT
OUT
Q
I
I
GND
Shutdown current
V
≤ 0 V, V = 2.0 to 5.5 V
EN
IN
EN Pin High Threshold
EN Pin Low Threshold
V
V
Voltage increasing
Voltage decreasing
V
EN_HI
EN_LO
EN
EN
V
0.4
EN Pin Input Current
Turn−on Time
V
= 5.5 V
I
100
150
500
nA
EN
EN
C
= 4.7 mF, from assertion EN pin to 98%
t
ms
OUT
ON
V
out(nom)
Power Supply Rejection Ratio
Output Noise Voltage
V
= 3.5 V + 200 mVpp
f = 100 Hz
f = 1 kHz
f = 10 kHz
PSRR
65
58
52
dB
IN
modulation, V
= 3.0 V
OUT
I
= 0.5 A, C
= 4.7 mF
OUT
OUT
V
OUT
= 3.0 V, V = 4.0 V, I
= 0.5 A
V
NOISE
300
mV
rms
IN
OUT
f = 100 Hz to 100 kHz
Thermal Shutdown Temperature
Thermal Shutdown Hysteresis
Active Output Discharge
Temperature increasing from T = +25°C
T
160
20
°C
J
SD
Temperature falling from T
T
SDH
°C
SD
V
EN
≤ 0.4 V, V = 4.5 V
R
DIS
60
W
IN
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
3. Performance guaranteed over the indicated operating temperature range by design and/or characterization production tested at T = T =
J
A
25_C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
4. Characterized when V
falls 90 mV below the regulated voltage at V = 3.3 V, I
= 10 mA.
OUT
IN
OUT
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4
NCP706A
TYPICAL CHARACTERISTICS
3.004
3.5
3.0
2.5
2.0
1.5
1.0
3.002
3.000
V
IN
= V
EN
T = 25°C
A
2.998
2.996
C
= 1 mF
= 3.0 V
OUT
OUT(NOM)
V
V
= 3.3 V
= 10 mA
= 1 mF
I
I
I
I
= 10 mA
= 50 mA
= 250 mA
= 500 mA
IN
OUT
OUT
OUT
OUT
I
OUT
2.994
2.992
0.5
0.0
C
OUT
V
= 3.0 V
OUT(NOM)
−40 −20
0
20
40
60
80
100 120
0.0
1.0
2.0
3.0
4.0
5.0
TEMPERATURE (°C)
INPUT VOLTAGE (V)
Figure 3. Output Voltage vs. Temperature
Figure 4. Output Voltage vs. Input Voltage
240
220
200
180
160
140
120
260
240
220
200
I
= 0
= 1 mF
= 3.0 V
V
V
V
= 3.3 V
= 4.0 V
= 5.0 V
V
IN
V
IN
V
IN
= 3.5 V
= 4.5 V
= 5.5 V
OUT
IN
IN
IN
C
OUT
V
OUT(NOM)
T = 125°C
A
T = 25°C
A
180
160
140
T = −40°C
A
C
= 1 mF
OUT
T = 25°C
A
V
= 3.0 V
OUT(NOM)
3.0
3.5
4.0
4.5
5.0
5.5
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
OUTPUT CURRENT (A)
INPUT VOLTAGE (V)
Figure 5. Quiescent Current vs. Input Voltage
Figure 6. Ground Current vs. Output Current
1.8
1.7
1.6
1.5
1.4
1.3
200
180
160
140
120
100
V
= 0
V
= V
IN
= 1 mF
= 3.0 V
OUT
EN
V
EN
= V
125°C
C
IN
OUT
C
= 1 mF
V
OUT
OUT(NOM)
T = 25°C
A
25°C
V
= 3.0 V
OUT(NOM)
−40°C
80
60
40
20
0
1.2
3.0
3.5
4.0
4.5
5.0
5.5
0
0.2
0.4
0.6
0.8
1
INPUT VOLTAGE (V)
OUTPUT CURRENT (A)
Figure 7. Short Current Limitation vs. Input
Voltage
Figure 8. Dropout Voltage vs. Output Current
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5
NCP706A
TYPICAL CHARACTERISTICS
2.5
2.0
1.5
1.0
0.5
0.0
80
60
40
20
V
= 3.5 V + 200 mV Modulation
PP
IN
V
= 5.5 V
IN
V
I
= 500 mA
OUT
= 0
EN
T = 25°C
A
C
= C
T = 25°C
= 4.7 mF
IN
OUT
V
= 3.0 V
OUT(NOM)
A
C
C
C
= 1 mF
= 2.2 mF
= 4.7 mF
OUT
OUT
OUT
V
= 3.0 V
5.0
OUT(NOM)
0
0.1
1
10
100
1000
0.0
1.0
2.0
3.0
4.0
FREQUENCY (kHz)
FORCED OUTPUT VOLTAGE (V)
Figure 9. Reverse Leakage Current in
Shutdown
Figure 10. PSRR vs. Frequency & Output
Capacitor
80
3.5
I
= 500 mA
= 4.0 V
V
IN
= 3.5 V + 200 mV Modulation
PP
OUT
V
IN
C
= 1 mF
OUT
3.0
2.5
2.0
1.5
1.0
T = 25°C
A
A
V
= 3.0 V
V
60
40
OUT(NOM)
20
0
I
I
I
= 10 mA
= 100 mA
= 500 mA
OUT
OUT
OUT
C
C
= 1 mF
= 2.2 mF
OUT
OUT
0.5
0.0
0.1
1
1000
0.01
0.1
1
10
100
1000
FREQUENCY (kHz)
Figure 11. PSRR vs. Frequency & Output
Current
Figure 12. Output Noise Density vs. Frequency
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6
NCP706A
TYPICAL CHARACTERISTICS
Figure 13. Turn−on by Coupled Input and
Figure 14. Turn−on by Enable Signal
Enable Pins
Figure 15. Line Transient Response
Figure 16. Load Transient Response
Figure 17. Turn−off by Enable Signal
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7
NCP706A
APPLICATIONS INFORMATION
Thermal
Input Decoupling (Cin)
A 1.0 mF capacitor either ceramic or tantalum is
recommended and should be connected as close as possible
to the pins of NCP706A device. Higher values and lower
ESR will improve the overall line transient response.
As power across the NCP706A increases, it might become
necessary to provide some thermal relief. The maximum
power dissipation supported by the device is dependent
upon board design and layout. Mounting pad configuration
on the PCB, the board material, and also the ambient
temperature affect the rate of temperature rise for the part.
This is stating that when the NCP706A has good thermal
conductivity through the PCB, the junction temperature will
be relatively low with high power dissipation.
Output Decoupling (Cout)
The
minimum
decoupling
value
for
NCP706AMX300TAG device is 1 mF. The regulator accepts
ceramic chip capacitors MLCC. If a tantalum capacitor is
used, and its ESR is large, the loop oscillation may result.
Larger values improve noise rejection and PSRR.
The power dissipation across the device can be roughly
represented by the equation:
ǒ
Ǔ
Enable Operation
(eq. 1)
PD + VIN * VOUT * IOUT [W]
The enable pin EN will turn on or off the regulator. These
limits of threshold are covered in the electrical specification
section of this data sheet. If the enable is not used then the
The maximum power dissipation depends on the thermal
resistance of the case and circuit board, the temperature
differential between the junction and ambient, PCB
orientation and the rate of air flow.
pin should be connected to V .
IN
The maximum allowable power dissipation can be
calculated using the following equation:
Hints
Please be sure the V and GND lines are sufficiently wide.
in
If their impedance is high, noise pickup or unstable
operation may result.
Set external components, especially the output capacitor,
as close as possible to the circuit.
ǒ
Ǔ
(eq. 2)
PMAX + TJ * TA ńqJA [W]
Where (T − T ) is the temperature differential between
the junction and the surrounding environment and q is the
J
A
JA
thermal resistance from the junction to the ambient.
Connecting the exposed pad and non connected pin 3 to
a large ground pad or plane helps to conduct away heat and
improves thermal relief.
The sense pin SNS trace is recommended to be kept as far
from noisy power traces as possible and as close to load as
possible.
ORDERING INFORMATION
Nominal Ooutput
†
Voltage
Device
Marking
Package
Shipping
NCP706AMX300TAG
3.0 V
AE
XDFN8
(Pb−Free)
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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8
NCP706A
PACKAGE DIMENSIONS
XDFN8 1.6x1.2, 0.4P
CASE 711AS
ISSUE D
NOTES:
L
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
D
A
B
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
8X
L1
DETAIL A
MILLIMETERS
OPTIONAL
DIM
A
A1
b
D
D2
E
E2
e
L
MIN
NOM
MAX
CONSTRUCTION
0.300 0.375 0.450
0.000 0.025 0.050
0.130 0.180 0.230
1.500 1.600 1.700
1.200 1.300 1.400
1.100 1.200 1.300
0.200 0.300 0.400
0.40 BSC
E
PIN ONE
IDENTIFIER
EXPOSED Cu
MOLD CMPD
TOP VIEW
DETAIL B
0.150 0.200 0.250
0.000 0.050 0.100
OPTIONAL
L1
A
CONSTRUCTION
DETAIL B
0.10
0.08
C
C
A1
8X
SEATING
PLANE
RECOMMENDED
MOUNTING FOOTPRINT*
NOTE 3
C
SIDE VIEW
D2
8X
0.35
1.44
PACKAGE
OUTLINE
DETAIL A
1
4
E2
1.40
8X
L1
1
0.44
0.40
PITCH
8X
0.26
8
5
8X b
8X
L
DIMENSIONS: MILLIMETERS
e
0.10
0.05
C
C
A
B
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
e/2
BOTTOM VIEW
ON Semiconductor and the
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SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
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or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
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PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
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Email: orderlit@onsemi.com
For additional information, please contact your local
Sales Representative
NCP706A/D
相关型号：
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