NCV4295CSN50T1G [ONSEMI]
Low Dropout Voltage Regulator;
| 型号： | NCV4295CSN50T1G |
| 厂家： | 
ONSEMI |
| 描述： | Low Dropout Voltage Regulator 光电二极管 输出元件 调节器 |
| 文件： | 总11页 (文件大小：159K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NCV4295C
30 mA Low Dropout Voltage
Regulator with Power Fail
The NCV4295C is a monolithic integrated low dropout voltage
regulator with an output current capability of 30 mA available in the
TSOP–5 package.
The output voltage is accurate within 4.0% with a maximum
dropout voltage of 250 mV with an input up to 45 V. Low quiescent
current is a feature typically drawing only 160 mA with a 1 mA load.
The Power Fail output is driven to low level in case of the output
undervoltage. This part is ideal for automotive and all battery
operated microprocessor equipment.
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MARKING
DIAGRAM
5
TSOP−5
CASE 483
XXXAYWG
5
G
The regulator is protected against reverse battery, short circuit and
thermal overload conditions.
1
1
XXX = Specific Device Code
Features
A
Y
W
G
= Assembly Location
= Year
= Work Week
• Output Voltage Options: 3.3 V, 5.0 V
• Output Voltage Accuracy: 4.0%
• Output Current: up to 30 mA
= Pb−Free Package
(Note: Microdot may be in either location)
• Low Quiescent Current (typ. 160 mA @ 1 mA)
• Low Dropout Voltage (typ. 65 mV @ 20 mA)
• Wide Input Voltage Operating Range: up to 45 V
• Power Fail Output
PIN CONNECTIONS
GND
PF
1
2
3
5
• Protection Features:
GND
♦ Current Limitation
♦ Thermal Shutdown
V
in
V
out
4
♦ Reverse Polarity Protection and Reverse Bias Protection
(Top View)
• AEC−Q100 Grade 1 Qualified and PPAP Capable
• This is a Pb−Free Device
ORDERING INFORMATION
See detailed ordering, marking and shipping information on
page 10 of this data sheet.
Typical Applications
• Microprocessor Systems Power Supply
Input
Output
V
out
V
in
C
C
out
2.2 mF
in
NCV4295C
GND
100 nF
PF
Power Fail
Figure 1. Applications Circuit
©
Semiconductor Components Industries, LLC, 2017
1
Publication Order Number:
November, 2017 − Rev. 2
NCV4295C/D
NCV4295C
V
out
V
in
VOLTAGE
REFERENCE
V
REF
SATURATION
PROTECTION
SP
POWER
FAIL
PF
SP
THERMAL
SHUTDOWN
TSD
V
REF
GND
TSD
Figure 2. Simplified Block Diagram
PIN FUNCTION DESCRIPTION
Pin No.
TSOP−5
Pin Name
Description
Power Fail Output. Low state for output undervoltage.
Power Supply Ground.
1
2
3
4
5
PF
GND
V
in
Unregulated Positive Power Supply Input. Connect 0.1 mF capacitor to ground.
V
out
Regulated Positive Output Voltage. Connect 2.2 mF capacitor with ESR < 7 W to ground.
GND
Power Supply Ground.
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Min
Max
Unit
Input Voltage DC (Note 1)
DC
V
in
V
−42
45
Input Voltage (Note 2)
U
V
s
Load Dump − Suppressed
−
60
30
Output Voltage
V
out
−6
V
V
Power Fail Output Voltage
DC
V
PF
−0.3
45
Power Fail Output Current Range
DC
I
mA
PF
−0.5
−40
−50
−
Maximum Junction Temperature
Storage Temperature
T
150
150
°C
°C
J(max)
T
STG
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
2. Load Dump Test B (with centralized load dump suppression) according to ISO16750−2 standard. Guaranteed by design. Not tested in
production. Passed Class A according to ISO16750−1.
ESD CAPABILITY (Note 3)
Rating
Symbol
ESD
Min
Max
Unit
ESD Capability, Human Body Model
−2
2
kV
HBM
3. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (JS−001−2010)
2
Field Induced Charge Device Model ESD characterization is not performed on plastic molded packages with body sizes <50mm due to the
inability of a small package body to acquire and retain enough charge to meet the minimum CDM discharge current waveform characteristic
defined in JEDEC JS−002−2014.
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2
NCV4295C
LEAD SOLDERING TEMPERATURE AND MSL (Note 4)
Rating
Symbol
Min
Max
Unit
Moisture Sensitivity Level
MSL
1
−
4. For more information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D
THERMAL CHARACTERISTICS
Rating
Symbol
Value
Unit
Thermal Characteristics, TSOP−5
Thermal Resistance, Junction−to−Air (Note 5)
°C/W
R
θJA
136.2
2
2
5. Values based on copper area of 645 mm (or 1 in ) of 1 oz copper thickness and FR4 PCB substrate.
RECOMMENDED OPERATING RANGES
Rating
Symbol
Min
Max
45
Unit
V
Input Voltage (Note 6)
Junction Temperature
V
in
V
+ 0.5 or 3.5
−40
out, nom
T
J
150
°C
Functionaloperation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the
RecommendedOperating Ranges limits may affect device reliability.
6. Minimum V = V
+ 0.5 or 3.5, whichever is higher.
in
out, nom
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3
NCV4295C
ELECTRICAL CHARACTERISTICS
V
in
= 13.5 V, C = 0.1 mF, C = 2.2 mF, for typical values T = 25°C, for min/max values T = −40°C to 150°C; unless otherwise noted.
in
out
J
J
(Note 7)
Parameter
Test Conditions
Symbol
Min
Typ
Max
Unit
REGULATOR OUTPUT
Output Voltage
5.0 V V = 13.5 V, I = 1 mA to 30 mA
V
out
4.80
4.80
3.17
3.17
5.00
5.00
3.30
3.30
5.20
5.20
3.43
3.43
V
in
in
out
V
= 6 V to 40 V, I = 10 mA
out
3.3 V V = 13.5 V, I = 1 mA to 30 mA
in
in
out
V
= 4.3 V to 40 V, I = 10 mA
out
Line Regulation
Load Regulation
V
V
= V
= V
to 36 V, I = 5 mA, T = 25°C
Reg
−
−
5
20
30
mV
mV
mV
in
in
in, min
in, min
out
J
line
to 36 V, I = 5 mA
10
out
I
I
= 1 mA to 25 mA, T = 25°C
= 1 mA to 25 mA
Reg
−
−
3
10
20
30
out
out
J
load
Dropout Voltage (Note 8)
I
= 20 mA
V
DO
−
65
250
out
QUIESCENT CURRENT
Quiescent Current, I = I − I
I
q
q
in
out
I
I
I
< 0.1 mA, T < 85°C
−
−
−
150
160
0.8
170
200
4
μA
μA
mA
out
out
out
J
< 1 mA
< 30 mA
CURRENT LIMIT PROTECTION
Current Limit
V
= V
– 100 mV
I
30
−
−
−
mA
dB
V
out
out, nom
LIM
PSRR
Power Supply Ripple Rejection
POWER FAIL
f = 100 Hz, 0.5 V
PSRR
−
60
pp
Power Fail Switching Threshold
V
out, PF
5.0 V
3.3 V
−
−
4.86
3.20
−
−
Power Fail Headroom
V
mV
out, nom
out, PF
5.0 V
3.3 V
− V
50
33
140
100
300
200
Power Fail Low Voltage
Power Fail Pull−up
I
= 0.1 mA
V
−
10
50
mV
PF
PF, low
Internally connected to V
R
PF
70
100
130
kW
out
THERMAL SHUTDOWN
Thermal Shutdown Temperature
(Note 9)
T
SD
151
175
195
°C
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performancemay not be indicated by the Electrical Characteristics if operated under different conditions.
7. Performanceguaranteed over the indicated operating temperature range by design and/or characterization tested at T [T . Low duty cycle
A
J
pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
8. Measuredwhen output voltage falls 100 mV below the regulated voltage at V = 13.5 V. If V
< 5 V, then V = V − V . Maximum dropout
in
out
DO in out
voltage value is limited by minimum input voltage V = V
+ 0.5 V recommended for guaranteed operation at maximum output current.
in
out, nom
9. Values based on design and/or characterization.
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4
NCV4295C
TYPICAL CHARACTERISTICS − 5.0 V VERSION
1000
Unstable Region
100
10
1
Stable Region
C
≥ 2.2 mF
out
0.1
T = 25°C
J
0.01
0
5
10
15
20
25
30
I
, OUTPUT CURRENT (mA)
out
Figure 3. Output Stability with Output
Capacitor ESR
5.10
5.05
5.00
6
V
= 13.5 V
in
R = 5 kW
5
4
3
2
L
4.95
4.90
R = 166 W
T = 25°C
J
1
0
L
−40
0
40
80
120
160
0
1
2
3
4
5
6
7
8
9
10
T , JUNCTION TEMPERATURE (°C)
J
V , INPUT VOLTAGE (V)
in
Figure 4. Output Voltage vs. Junction
Temperature
Figure 5. Output Voltage vs. Input Voltage
150
100
70
60
T = 125°C
J
50
40
30
20
T = 25°C
J
T = −40°C
J
50
0
V
out
= 0 V
10
0
T = 25°C
J
0
5
10
15
20
25
30
0
5
10
15
20
25
30
35
40 45
I
, OUTPUT CURRENT (mA)
V , INPUT VOLTAGE (V)
in
out
Figure 6. Dropout Voltage vs. Output Current
Figure 7. Maximum Output Current vs. Input
Voltage
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5
NCV4295C
TYPICAL CHARACTERISTICS − 5.0 V VERSION
0.8
0.7
0.6
0.5
0.4
0.3
0.2
300
200
V
= 13.5 V
in
T = 25°C
J
100
0
V
in
= 13.5 V
0.1
0
T = 25°C
J
0
5
10
15
20
25
30
0
1
2
3
4
5
I
, OUTPUT CURRENT (mA)
I
, OUTPUT CURRENT (mA)
out
out
Figure 8. Quiescent Current vs. Output Current
(High Load)
Figure 9. Quiescent Current vs. Output Current
(Low Load)
4.92
4.90
4.88
4.86
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
R = 166 W
T = 25°C
J
L
4.84
4.82
4.80
4.78
0.5
0
0
5
10
15
20
25
30
35
40
−40
0
40
80
120
160
V , INPUT VOLTAGE (V)
in
T , JUNCTION TEMPERATURE (°C)
J
Figure 10. Quiescent Current vs. Input Voltage
Figure 11. Power Fail Threshold Voltage vs.
Junction Temperature
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6
NCV4295C
TYPICAL CHARACTERISTICS − 3.3 V VERSION
1000
Unstable Region
100
10
1
Stable Region
C
≥ 2.2 mF
out
0.1
T = 25°C
J
0.01
0
5
10
15
20
25
30
I
, OUTPUT CURRENT (mA)
out
Figure 12. Output Stability with Output
Capacitor ESR
3.40
3.35
3.30
4.0
V
= 13.5 V
in
3.5
3.0
2.5
2.0
1.5
1.0
R = 3.3 kW
L
3.25
3.20
R = 110 W
L
0.5
0
T = 25°C
J
−40
0
40
80
120
160
0
1
2
3
4
5
6
7
8
9
10
T , JUNCTION TEMPERATURE (°C)
J
V , INPUT VOLTAGE (V)
in
Figure 13. Output Voltage vs. Junction
Temperature
Figure 14. Output Voltage vs. Input Voltage
70
60
50
40
30
20
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
R = 110 W
T = 25°C
J
L
V
= 0 V
10
0
out
0.5
0
T = 25°C
J
0
5
10
15
20
25
30
35
40
45
0
5
10
15
20
25
30
35
40
V , INPUT VOLTAGE (V)
in
V , INPUT VOLTAGE (V)
in
Figure 15. Maximum Output Current vs. Input
Voltage
Figure 16. Quiescent Current vs. Input Voltage
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7
NCV4295C
TYPICAL CHARACTERISTICS − 3.3 V VERSION
0.8
0.7
0.6
0.5
0.4
0.3
0.2
300
200
V
= 13.5 V
in
T = 25°C
J
100
0
V
in
= 13.5 V
0.1
0
T = 25°C
J
0
5
10
15
20
25
30
0
1
2
3
4
5
I
, OUTPUT CURRENT (mA)
I
, OUTPUT CURRENT (mA)
out
out
Figure 17. Quiescent Current vs. Output
Current (High Load)
Figure 18. Quiescent Current vs. Output
Current (Low Load)
3.24
200
175
150
3.22
3.20
1 oz
2 oz
3.18
3.16
125
100
0
100
200
300
400
500
600
700
−40
0
40
80
120
160
2
PCB Cu Area (mm )
T , JUNCTION TEMPERATURE (°C)
J
Figure 19. Power Fail Threshold Voltage vs.
Junction Temperature
Figure 20. RqJA vs. PCB Cu Area
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8
NCV4295C
DEFINITIONS
General
Quiescent and Disable Currents
All measurements are performed using short pulse low
Quiescent Current (I ) is the difference between the input
q
duty cycle techniques to maintain junction temperature as
close as possible to ambient temperature.
current (measured through the LDO input pin) and the
output load current.
Output Voltage
Current Limit
The output voltage parameter is defined for specific
temperature, input voltage and output current values or
specified over Line, Load and Temperature ranges.
Current Limit is value of output current by which output
voltage drops 100 mV below its nominal value. It means
that the device is capable to supply minimum 30 mA
without sending Power Fail signal to microprocessor.
Line Regulation
The change in output voltage for a change in input
voltage measured for specific output current over operating
ambient temperature range.
PSRR
Power Supply Rejection Ratio is defined as ratio of
output voltage and input voltage ripple. It is measured in
decibels (dB).
Load Regulation
The change in output voltage for a change in output
current measured for specific input voltage over operating
ambient temperature range.
Thermal Protection
Internal thermal shutdown circuitry is provided to
protect the integrated circuit in the event that the maximum
junction temperature is exceeded. When activated at
typically 175°C, the regulator turns off. This feature is
provided to prevent failures from accidental overheating.
Dropout Voltage
The input to output differential at which the regulator
output no longer maintains regulation against further
reductions in input voltage. It is measured when the output
drops 100 mV below its nominal value. The junction
temperature, load current, and minimum input supply
requirements affect the dropout level.
Maximum Package Power Dissipation
The power dissipation level is maximum allowed power
dissipation for particular package or power dissipation at
which the junction temperature reaches its maximum
operating value, whichever is lower.
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9
NCV4295C
APPLICATIONS INFORMATION
The NCV4295C low dropout regulator is self−protected
with internal thermal shutdown and internal current limit.
Typical characteristics are shown in Figure 3 to Figure 20.
upon board design and layout. Mounting pad configuration
on the PCB, the board material, and the ambient
temperature affect the rate of junction temperature rise for
the part. When the NCV4295C has good thermal
conductivity through the PCB, the junction temperature
will be relatively low with high power applications. The
maximum dissipation the NCV4295C can handle is given
by:
Input Decoupling (Cin)
A ceramic or tantalum 0.1 mF capacitor is recommended
and should be connected close to the NCV4295C package.
Higher capacitance and lower ESR will improve the
overall line and load transient response.
ƪT
ƫ
J(MAX) * TA
(eq. 1)
Output Decoupling (Cout
)
PD(MAX)
+
RqJA
The NCV4295C is a stable component and does not
require a minimum Equivalent Series Resistance (ESR) for
the output capacitor. Stability region of ESR vs. Output
Current is shown in Figures 3 and 12. The minimum output
decoupling value is 2.2 mF and can be augmented to fulfill
stringent load transient requirements. The regulator works
with ceramic chip capacitors as well as tantalum devices.
Larger values improve noise rejection and load transient
response.
Since T is not recommended to exceed 150°C, then the
J
2
NCV4295C soldered on 645 mm , 1 oz copper area, FR4
can dissipate up to 0.92 W when the ambient temperature
(T ) is 25°C. See Figure 20 for R
versus PCB area. The
A
thJA
power dissipated by the NCV4295C can be calculated from
the following equations:
ǒ
Ǔ
ǒ
Ǔ
in * Vout
(eq. 2)
(eq. 3)
P
D [ Vin Iq@Iout ) Iout
V
or
Power Fail Operation
ǒ
Ǔ
PD(MAX) ) Vout Iout
Iout ) Iq
A Power Fail signal is provided on the Power Fail Output
(PF) pin to provide feedback to the microprocessor of an
out of regulation condition. The power fail threshold vs.
Junction Temperature diagrams for each voltage option are
shown in Figures 11 and 19. This is in the form of a logic
signal on PF. Output voltage conditions below the Power
Fail threshold cause PF to go low. The Power Fail Output
(PF) circuitry includes internal pull−up connected to the
output (Vout) No external pull−up is necessary.
Vin(MAX)
[
Hints
V and GND printed circuit board traces should be as wide
in
as possible. When the impedance of these traces is high,
there is a chance to pick up noise or cause the regulator to
malfunction. Place external components, especially the
output capacitor, as close as possible to the NCV4295C and
make traces as short as possible. For better EMC
performance on PF pin it is recommended to use additional
decoupling 10 nF ceramic capacitor connected between PF
and GND.
Thermal Considerations
As power in the NCV4295C increases, it might become
necessary to provide some thermal relief. The maximum
power dissipation supported by the device is dependent
ORDERING INFORMATION
†
Device
NCV4295CSN50T1G
NCV4295CSN33T1G
Marking
55V
Package
Shipping
TSOP−5
(Pb−Free)
3000 / Tape & Reel
53V
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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10
NCV4295C
PACKAGE DIMENSIONS
TSOP−5
CASE 483
ISSUE M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
NOTE 5
5X
D
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
0.20 C A B
2X
0.10
T
M
5
4
3
2X
0.20
T
B
S
1
2
K
B
A
DETAIL Z
G
A
MILLIMETERS
TOP VIEW
DIM
A
B
C
D
MIN
2.85
1.35
0.90
0.25
MAX
3.15
1.65
1.10
0.50
DETAIL Z
J
G
H
J
K
M
S
0.95 BSC
C
0.01
0.10
0.20
0
0.10
0.26
0.60
10
3.00
0.05
H
SEATING
PLANE
END VIEW
C
_
_
SIDE VIEW
2.50
SOLDERING FOOTPRINT*
1.9
0.074
0.95
0.037
2.4
0.094
1.0
0.039
0.7
0.028
mm
inches
ǒ
Ǔ
SCALE 10:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
MountingTechniques Reference Manual, SOLDERRM/D.
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