NGTB20N60L2TF1G [ONSEMI]
IGBT,N 沟道 600V,20A,VCE(sat); 1.45V TO-3PF-3L,带低 VF 开关二极管;型号: | NGTB20N60L2TF1G |
厂家: | ONSEMI |
描述: | IGBT,N 沟道 600V,20A,VCE(sat); 1.45V TO-3PF-3L,带低 VF 开关二极管 开关 双极性晶体管 二极管 |
文件: | 总7页 (文件大小:513K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
NGTB20N60L2TF1G
N-Channel IGBT
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600V, 20A, V (sat);1.45V TO-3PF-3L
CE
V 开关二极管内置
F
低
主要特长
IGBT V (sat)=1.45V typ. (I =20A, V =15V)
适应全绝缘型封装
增强型 (Enhancement type)
最高结温 Tj=175C
CE GE
C
IGBT t =67ns typ.
f
Diode V =1.5V typ. (I =20A)
F
F
Diode t =70ns typ.
rr
应用
白物家电的功率因数校正
通用变频器 (General purpose inverter)
规格
绝对最大额定值 / Ta = 25C (除非特殊指定)
参数
记号
CES
GES
条件
额定值
单位
V
集电极-发射极电压(Collector to Emitter Voltage)
栅极-发射极电压(Gate to Emitter Voltage)
V
V
600
20
V
@ Tc=25C *2
@ Tc=100C *2
40
A
集电极电流(Collector Current) (DC)
I *1
C
Limited by Tjmax
20
A
集电极电流(Collector Current) (脉冲)
二极管平均输出电流(Diode Average Output Current
允许功耗(Allowable Power Dissipation)
结温(Junction Temperature)
I
I
Pulse width Limited by Tjmax
80
A
CP
20
64
A
O
P
Tc=25C (我司的理想散热条件) *2
W
C
C
D
Tj
175
储存温度(Storage Temperature)
Tstg
55 to +175
注 : *1 集电极电流由下式计算:
Tjmax - Tc
I (Tc)=
C
R (j-c)×
th
V
(sat)(Tjmax, I (Tc))
C
CE
*2 我司的条件为背面散热。 方法为:器件的背面涂上硅脂, 然后将该器件贴在 铝制的水冷散热器上。
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed,
damage may occur and reliability may be affected.
订单及封装情况
器件名称
出货包装
封装
注解
无铅
TO-3PF-3L
SC-94
30
NGTB20N60L2TF1G
pcs. / tube
印刷图
电气连接
2
GTB20N
LOT No.
60L2
1
3
© Semiconductor Components Industries, LLC, 2015
September 2015 - Rev. 0
1
Publication Order Number :
NGTB20N60L2TF1GCN/D
NGTB20N60L2TF1G
电气特性 / Ta = 25C (除非特殊指定)
额定值
参数
记号
条件
单位
min
600
typ
max
集电极-发射极击穿电压
V(
)
I
=500A, V =0V
C GE
V
BR CES
(Collector to Emitter Breakdown Voltage)
10
A
集电极-发射极截止电流
V
=600V, V =0V
GE
Tc=25C
CE
I
I
CES
(Collector to Emitter Cutoff Current)
Tc=150C
1
mA
栅极-发射极漏电流
V
GE
=20V, V
=0V
100
nA
V
GES
CE
(Gate to Emitter Leakage Current)
栅极-发射极阈值电压
V
(th)
GE
V
V
=20V, I =250A
4.5
6.5
CE
C
(Gate to Emitter threshold voltage)
1.45
1.8
1.65
V
V
集电极-发射极饱和电压
=15V, I =20A
Tc=25C
GE
C
V
V
(
)
CE sat
(Collector to Emitter Saturated Voltage)
Tc=150C
正向二极管电压(Forward Diode Voltage)
输入电容(Input Capacitance)
I =20A
F
1.5
V
F
Cies
2000
60
pF
pF
输出电容(Output Capacitance)
Coes
V
CE
=20V,f=1MHz
反向传输电容
Cres
50
pF
(Reverse Transfer Capacitance)
开启迟延时间(Turn-on delay time)
t (on)
60
37
ns
ns
ns
ns
ns
ns
nC
nC
d
上升时间(Rise Time)
t
r
V
CC
=300V,I =20A
C
=30,L=200H
开启时间(Turn-ON Time)
ton
400
193
67
R
V
G
=0V/15V, Vclamp=400V
关断迟延时间(Turn-OFF Delay Time)
下降时间(Fall Time)
t (off)
d
GE
See Fig.1, Fig.2
t
f
关断时间(Turn-OFF Time)
总栅极电荷(Total Gate Charge)
栅极-发射极电荷(Gate to Emitter charge)
toff
281
84
Qg
Qge
16
V
CE
=300V, V =15V, I =20A
GE
C
栅极-集电极米勒电荷
Qgc
37
70
nC
ns
(Gate to Collector “Miller” Charge)
二极管反向恢复时间
t
I =10A , di/dt=100A/s, V =50V See Fig.3
F CC
rr
(Diode Reverse Recovery Time)
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be
indicated by the Electrical Characteristics if operated under different conditions.
热特性 / Ta = 25C (除非特殊指定)
参数
记号
条件
额定值
单位
热阻 IGBT(结到外壳
Thermal Resistance IGBT (junction- case)
热阻二极管 结到外壳
Thermal Resistance Diode (junction- case)
热阻 结到环境
Thermal Resistance (junction- atmosphere)
)
Rth(j-c)(IGBT)
Rth(j-c)(Diode)
Rth(j-a)
Tc=25
Tc=25
C (我司的理想散热条件)*2
C (我司的理想散热条件)*2
2.33
2.36
47.5
C /W
C /W
C /W
(
)
(
)
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2
NGTB20N60L2TF1G
图 1 : 开关时间测试电路
图 2 : 时间图
Clamp Di
V
GE
90%
10%
0
200H
DUT
I
C
90%
V
90%
CC
R
G
10%
10%
10%
10%
V
CE
0
NGTB20N60L2TF1G
t
t
r
f
t (off)
d
t (on)
d
t
t
on
off
IT16383
图 3 : 反向恢复时间测试电路
DUT
NGTB20N60L2TF1G
500H
V
CC
Driver IGBT
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3
NGTB20N60L2TF1G
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4
NGTB20N60L2TF1G
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5
NGTB20N60L2TF1G
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6
NGTB20N60L2TF1G
封装尺寸
单位: mm
TO-3PF-3L
CASE 340AH
ISSUE A
NOTES:
SEATING
PLANE
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 2009.
2. CONTROLLING DIMENSION: MILLIMETERS.
P
A
E
3. CONTOUR UNCONTROLLED IN THIS AREA (6 PLACES).
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR GATE
PROTRUSIONS. MOLD FLASH AND GATE PROTRUSIONS NOT TO
EXCEED 0.13 PER SIDE. THESE DIMENSIONS ARE TO BE MEA
SURED AT THE OUTERMOST EXTREME OF THE PLASTIC BODY.
5. DIMENSION b2 DOES NOT INCLUDE DAMBAR PROTRUSION.
LEAD WIDTH INCLUDING PROTRUSION SHALL NOT EXCEED 2.20.
A1
Q
H1
MILLIMETERS
DIM MIN
MAX
5.70
3.20
3.50
2.20
0.95
2.15
4.20
1.10
24.70
25.30
3.70
15.70
5.55
10.20
19.50
5.20
2.20
3.80
4.70
A
A1
A2
A3
b
b2
b3
c
5.30
2.80
3.10
1.80
0.65
1.90
3.80
0.80
24.30
D
D2
D
L2
D3
D2 24.70
L1
D3
E
e
H1
L
L1
L2
P
3.30
15.30
5.35
9.80
19.10
4.80
1.90
3.40
4.30
NOTE 3
L
Q
1
2
3
c
3X
b
3X b2
A3
A2
b3
e
1 : Gate
2 : Collector
3 : Emitter
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