NHPAF220 [ONSEMI]
Surface Mount Schottky Power Rectifier;
| 型号： | NHPAF220 |
| 厂家： | 
ONSEMI |
| 描述： | Surface Mount Schottky Power Rectifier |
| 文件： | 总5页 (文件大小：68K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NHPAF220, NRVHPAF220
Surface Mount
Ultrafast Power Rectifier
This SMA flat lead ultrafast rectifier provides fast switching
performance with soft recovery in a compact thermally efficient
package. Its compact footprint makes it ideally suited to portable and
automotive applications where board space is at a premium. Its low
profile makes it a good option for flat panel display and other
applications with limited vertical clearance. The device offers low
leakage over temperature making it a good match for applications
requiring low quiescent current.
www.onsemi.com
ULTRAFAST RECTIFIER
2.0 AMPERE
200 VOLTS
Features
• Fast Soft Switching for Reduced EMI and Higher Efficiency
• Low Profile − Maximum Height of 1.1 mm
2
• Small Footprint − Footprint Area of 13.5 mm
• NRV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
SMA−FL
CASE 403AA
STYLE 6
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MARKING DIAGRAM
Mechanical Characteristics:
AYWW
P22G
G
• Case: Molded Epoxy
• Epoxy Meets UL 94 V−0 @ 0.125 in
• Weight: 95 mg (Approximately)
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Maximum for 10 Seconds
• MSL 1
P22
A
Y
WW
G
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
Applications
(Note: Microdot may be in either location)
• Switching Power Supplies including Mini−adapters and Displays
• Instrumentation
• Engine Control Recirculation Diodes
• Freewheeling Diode Where Space is at a Premium
ORDERING INFORMATION
†
Device
Package
Shipping
NHPAF220T3G
SMA−FL
(Pb−Free)
5000 / Tape &
Reel
NRVHPAF220T3G
SMA−FL
(Pb−Free)
5000 / Tape &
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2015
1
Publication Order Number:
March, 2015 − Rev. 0
NHPAF220/D
NHPAF220, NRVHPAF220
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
200
V
RRM
V
RWM
V
R
Average Rectified Forward Current
(T = 130°C)
L
I
A
A
A
O
2.0
4.0
Peak Repetitive Forward Current
I
FRM
(Rated V , Square Wave, 20 kHz) T = 125°C
R
L
Non−Repetitive Peak Surge Current
I
FSM
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
60
Storage Temperature Range
T
−65 to +175
−65 to +175
°C
°C
stg
Operating Junction Temperature
T
J
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Lead (Note 1)
Symbol
Value
29
Unit
°C/W
°C/W
Y
JCL
Thermal Resistance, Junction−to−Ambient (Note 1)
1. 1 inch square pad size (1 × 0.5 inch) for each lead on FR4 board.
R
80
q
JA
ELECTRICAL CHARACTERISTICS
Value
T = 25°C
J
T = 125°C
J
Characteristic
Symbol
Unit
v
V
Maximum Instantaneous Forward Voltage (Note 2)
(i = 2.0 A)
F
F
1.00
0.5
0.85
35
Maximum Instantaneous Reverse Current (Note 2)
(V = 200 V)
R
I
R
mA
ns
ns
Reverse Recovery Time
t
rr
t
rr
30
50
I = 2.0 A, V = 30 V, dl/dt = 50 A/ms, T = 25°C
F
R
J
Reverse Recovery Time
I = 2.0 A, V = 30 V, dl/dt = 50 A/ms, T = 125°C
F
R
J
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
2. Pulse Test: Pulse Width ≤ 380 ms, Duty Cycle ≤ 2.0%.
www.onsemi.com
2
NHPAF220, NRVHPAF220
TYPICAL CHARACTERISTICS
100
10
1
100
T = 175°C
A
T = 175°C
A
10
1
T = 150°C
A
T = 150°C
A
T = 125°C
A
T = 125°C
A
0.1
0.1
T = 25°C
A
T = 25°C
A
0.01
0.01
T = −40°C
T = −40°C
A
A
0.001
0.001
0.1
0.3
0.5
0.7
0.9
1.1
1.3
1.5
0
0
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
V , INSTANTANEOUS FORWARD VOLTAGE (V)
V , INSTANTANEOUS FORWARD VOLTAGE (V)
F
F
Figure 1. Typical Instantaneous Forward
Characteristics
Figure 2. Maximum Instantaneous Forward
Characteristics
1.E−03
1.E−04
1.E−05
1.E−06
1.E−07
1.E−03
1.E−04
1.E−05
1.E−06
1.E−07
1.E−08
1.E−09
1.E−10
T = 175°C
A
T = 175°C
A
T = 125°C
A
T = 125°C
A
T = 150°C
A
T = 150°C
A
T = 25°C
A
T = 25°C
A
T = −40°C
A
1.E−08
1.E−09
T = −40°C
A
1.E−11
1.E−12
0
20 40 60
80 100 120 140 160 180 200
20 40 60 80 100 120 140 160 180 200
V , INSTANTANEOUS REVERSE VOLTAGE (V)
R
V , INSTANTANEOUS REVERSE VOLTAGE (V)
R
Figure 3. Typical Reverse Characteristics
Figure 4. Maximum Reverse Characteristics
1000
4.0
3.5
3.0
2.5
2.0
1.5
1.0
T = 25°C
J
DC
Square Wave
100
R
= 29°C/W
0.5
0
q
JC
10
0
20 40 60 80 100 120 140 160 180 200
20
40
60
80
100 120 140 160 180
V , REVERSE VOLTAGE (V)
R
T , CASE TEMPERATURE (°C)
C
Figure 5. Typical Junction Capacitance
Figure 6. Current Derating
www.onsemi.com
3
NHPAF220, NRVHPAF220
TYPICAL CHARACTERISTICS
3.0
2.5
2.0
1.5
1.0
T = 175°C
I /I = 20
PK AV
I
/I = 10
J
PK AV
I
/I = 5
PK AV
Square Wave
DC
0.5
0
0
0.5
1.0
1.5
2.0
I , AVERAGE FORWARD CURRENT (A)
F(AV)
Figure 7. Forward Power Dissipation
100
10
50% Duty Cycle
20%
10%
5%
2%
1
1%
0.1
0.01
0.001
Single Pulse
0.0000001 0.000001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
t, PULSE TIME (S)
Figure 8. Typical Transient Thermal Response, Junction−to−Ambient
www.onsemi.com
4
NHPAF220, NRVHPAF220
PACKAGE DIMENSIONS
SMA−FL
CASE 403AA
ISSUE O
E
E1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
MILLIMETERS
DIM MIN
MAX
1.10
1.65
0.30
2.80
5.40
4.60
1.10
D
A
b
c
D
E
0.90
1.25
0.15
2.40
4.80
TOP VIEW
SIDE VIEW
E1 4.00
0.70
L
A
RECOMMENDED
SOLDER FOOTPRINT*
c
SEATING
PLANE
C
5.56
1.76
2X b
1.30
2X
L
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
BOTTOM VIEW
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or
unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable
copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
For additional information, please contact your local
Sales Representative
NHPAF220/D
相关型号：
©2020 ICPDF网 联系我们和版权申明