NTMFS034N15MC [ONSEMI]

Power MOSFET, 150V Single N channel 31A, 31m Ohm in Power56 package;
NTMFS034N15MC
型号: NTMFS034N15MC
厂家: ONSEMI    ONSEMI
描述:

Power MOSFET, 150V Single N channel 31A, 31m Ohm in Power56 package

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MOSFET - N-Channel  
Shielded Gate PowerTrench[  
150 V, 31 mW, 31 A  
NTMFS034N15MC  
Features  
www.onsemi.com  
Small Footprint (5 x 6 mm) for Compact Design  
Low R  
to Minimize Conduction Losses  
DS(on)  
Low QG and Capacitance to Minimize Driver Losses  
100% UIL Tested  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
150 V  
31 mW @ 10 V  
31 A  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant  
D
Typical Applications  
Synchronous Rectification  
ACDC and DCDC Power Supplies  
ACDC Adapters (USB PD) SR  
Load Switch  
G
S
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
NCHANNEL MOSFET  
Parameter  
DraintoSource Voltage  
Symbol  
Value  
150  
20  
Unit  
V
V
DSS  
GatetoSource Voltage  
V
GS  
V
Continuous Drain  
I
31  
A
D
Current R  
(Note 2)  
q
JC  
Pin 1  
Steady  
State  
T
= 25°C  
C
Power Dissipation  
(Note 2)  
P
62.5  
6.1  
W
A
Top  
Bottom  
D
Power 56  
(PQFN8)  
R
q
JC  
Continuous Drain  
Current R  
I
D
CASE 483AE  
q
JA  
Steady  
State  
(Notes 1, 2)  
T = 25°C  
A
MARKING DIAGRAM  
Power Dissipation  
P
2.5  
W
D
R
(Notes 1, 2)  
q
JA  
S
D
D
Pulsed Drain Current  
T
= 25°C, t = 100 ms  
I
DM  
131  
A
C
p
S
S
G
3415MC  
AYWZZ  
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
+150  
°C  
J
stg  
D
D
Single Pulse DraintoSource Avalanche  
E
AS  
54  
mJ  
Energy (I = 6 A , L = 3 mH)  
L
pk  
3415MC = Specific Device Code  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
L
260  
°C  
A
Y
= Assembly Location  
= Year  
W
ZZ  
= Work Week  
= Lot Traceability  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
2
1. Surfacemounted on FR4 board using a 1 in , 2 oz. Cu pad.  
ORDERING INFORMATION  
2. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
Device  
Package  
Power 56 3000 / Tape  
(PQFN8) & Reel  
Shipping  
NTMFS034N15MC  
(PbFree/Halogen Free)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2020  
1
Publication Order Number:  
May, 2020 Rev. 0  
NTMFS034N15MC/D  
 
NTMFS034N15MC  
THERMAL RESISTANCE MAXIMUM RATINGS  
Parameter  
Symbol  
Value  
2.0  
Unit  
JunctiontoCase Steady State (Note 2)  
JunctiontoAmbient Steady State (Notes 1, 2)  
R
°C/W  
q
JC  
R
50  
q
JA  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise specified)  
J
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
DraintoSource Breakdown Voltage  
V
V
GS  
= 0 V, I = 250 mA  
150  
V
(BR)DSS  
D
DraintoSource Breakdown Voltage  
Temperature Coefficient  
V
/
I
D
= 250 mA, ref to 25°C  
86  
(BR)DSS  
mV/°C  
T
J
Zero Gate Voltage Drain Current  
I
V
DS  
= 0 V,  
T = 25°C  
1.0  
DSS  
GSS  
GS  
J
mA  
V
= 120 V  
GatetoSource Leakage Current  
ON CHARACTERISTICS  
I
V
= 0 V, V  
=
20 V  
100  
nA  
DS  
GS  
Gate Threshold Voltage  
V
V
= V , I = 70 mA  
2.5  
4.5  
V
mV/°C  
mW  
mW  
S
GS(TH)  
GS  
DS  
D
Negative Threshold Temperature Coefficient  
DraintoSource On Resistance  
DraintoSource On Resistance  
Forward Transconductance  
V
/T  
I = 70 mA, ref to 25°C  
D
7.7  
25  
GS(TH)  
J
R
R
V
= 10 V, I = 13 A  
31  
DS(on)  
DS(on)  
GS  
D
V
= 8 V, I = 6 A  
27  
36.5  
GS  
D
g
FS  
V
= 10 V, I = 13 A  
27  
DS  
D
CHARGES, CAPACITANCES & GATE RESISTANCE  
Input Capacitance  
C
905  
270  
5
ISS  
Output Capacitance  
C
V
GS  
= 0 V, f = 1 MHz, V = 75 V  
pF  
OSS  
RSS  
DS  
Reverse Transfer Capacitance  
GateResistance  
C
R
0.6  
12  
1.2  
W
G
Total Gate Charge  
Q
G(TOT)  
Threshold Gate Charge  
GatetoSource Charge  
GatetoDrain Charge  
Plateau Voltage  
Q
3.1  
4.8  
1.8  
5.4  
32  
G(TH)  
nC  
Q
V
GS  
= 10 V, V = 75 V; I = 13 A  
GS  
GD  
GP  
DS  
D
Q
V
V
Output Charge  
Q
V
DD  
= 75 V, V = 0 V  
nC  
OSS  
GS  
SWITCHING CHARACTERISTICS (Note 3)  
TurnOn Delay Time  
t
12  
2.2  
14  
d(ON)  
Rise Time  
t
r
V
= 10 V, V = 75 V,  
DD  
GS  
D
ns  
I
= 13 A, R = 6 W  
G
TurnOff Delay Time  
t
d(OFF)  
Fall Time  
t
f
2.5  
DRAINSOURCE DIODE CHARACTERISTICS  
Forward Diode Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Time  
Reverse Recovery Charge  
V
V
GS  
= 0 V, I = 13 A  
T = 25°C  
0.87  
41  
1.2  
V
SD  
S
J
t
ns  
nC  
ns  
nC  
RR  
V
S
= 0 V, V = 75 V  
DD  
GS  
dI /dt = 300 A/ms, I = 13 A  
S
Q
126  
22  
RR  
RR  
t
RR  
V
S
= 0 V, V = 75 V  
DD  
GS  
dI /dt = 1000 A/ms, I = 13 A  
S
Q
164  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
www.onsemi.com  
2
NTMFS034N15MC  
NOTES:  
3. Switching characteristics are independent of operating junction temperatures.  
2
4. R  
is determined with the device mounted on a 1 in pad 2 oz copper pad on a 1.5 × 1.5 in. board of FR4 material. R  
is determined  
CA  
q
q
JA  
by the user’s board design.  
a) 50°C/W when mounted on  
b) 125°C/W when mounted on  
a minimum pad of 2 oz copper.  
2
a 1 in pad of 2 oz copper.  
www.onsemi.com  
3
NTMFS034N15MC  
TYPICAL CHARACTERISTICS  
6
50  
40  
30  
20  
8.0 V  
V
GS  
= 6.0 V  
10 V  
5.5 V  
7.0 V  
5
6.0 V  
4
3
2
V
GS  
= 5.5 V  
7 V  
10  
0
1
0
10 V  
Pulse Duration = 250 ms  
Duty Cycle = 0.5% Max  
8 V  
0
2
4
6
8
10  
0
4
0
10  
20  
30  
40  
50  
V
, DRAINTOSOURCE VOLTAGE (V)  
I , DRAIN CURRENT (A)  
D
DS  
Figure 1. OnRegion Characteristics  
Figure 2. Normalized OnResistance vs. Drain  
Current and Gate Voltage  
150  
120  
90  
2.2  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
I
= 13 A  
D
I
V
= 13 A  
= 10 V  
D
GS  
60  
T = 125°C  
J
T = 25°C  
J
30  
0
0.8  
0.6  
75 50 25  
0
25  
50  
75  
100 125 150  
5
6
7
8
9
10  
T , JUNCTION TEMPERATURE (°C)  
J
V
GS  
, GATETOSOURCE VOLTAGE (V)  
Figure 3. Normalized OnResistance vs.  
Figure 4. OnResistance vs. GatetoSource  
Junction Temperature  
Voltage  
50  
40  
30  
20  
100  
10  
1
V
= 10 V  
V
= 0 V  
DS  
GS  
T = 25°C  
J
0.1  
T = 150°C  
10  
0
0.01  
J
T = 150°C  
J
T = 25°C  
J
T = 55°C  
J
T = 55°C  
J
0.001  
2
3
4
5
6
7
8
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
V
GS  
, GATETOSOURCE VOLTAGE (V)  
V
SD  
, BODY DIODE FORWARD VOLTAGE (V)  
Figure 5. Transfer Characteristics  
Figure 6. SourcetoDrain Diode Forward  
Voltage vs. Source Current  
www.onsemi.com  
4
NTMFS034N15MC  
TYPICAL CHARACTERISTICS  
10  
8
10K  
V
DD  
= 25 V  
I
D
= 13 A  
V
DD  
= 50 V  
C
ISS  
1K  
V
DD  
= 75 V  
C
OSS  
6
100  
4
10  
1
C
RSS  
2
0
f = 1 MHz  
= 0 V  
V
GS  
0
3
6
9
12  
0.1  
1
10  
100 150  
Q , GATE CHARGE (nC)  
g
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
Figure 7. Gate Charge Characteristics  
Figure 8. Capacitance vs. DraintoSource  
Voltage  
40  
30  
20  
10K  
V
= 10 V  
GS  
1K  
V
= 8 V  
GS  
100  
10  
10  
0
R
= 2.0°C/W  
q
JC  
25  
50  
75  
100  
125  
150  
0.00001 0.0001  
0.001  
0.01  
0.1  
1
T , CASE TEMPERATURE (°C)  
C
t, PULSE WIDTH (s)  
Figure 9. Drain Current vs. Case Temperature  
Figure 10. Peak Power  
10  
200  
100  
T
= 25°C  
C
Single Pulse  
= 2.0°C/W  
R
q
JC  
10 ms  
T
= 25°C  
J(initial)  
100 ms  
10  
T
= 100°C  
J(initial)  
T
= 125°C  
J(initial)  
1 ms  
10 ms  
1
R
Limit  
DS(on)  
Thermal Limit  
Package Limit  
100 ms/DC  
100 200  
1
0.1  
0.01  
0.1  
1
10  
0.1  
1
10  
t , TIME IN AVALANCHE (mS)  
AV  
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
Figure 11. Unclamped Inductive Switching  
Capability  
Figure 12. Forward Bias Safe Operating Area  
www.onsemi.com  
5
NTMFS034N15MC  
TYPICAL CHARACTERISTICS  
10  
1
Duty Cycle = 0.5  
0.2  
0.1  
0.05  
Notes:  
= 2.0°C/W  
P
DM  
0.1  
0.02  
R
q
JC  
Peak T = P  
Duty Cycle, D = t /t  
x Z  
(t) + T  
JC C  
q
J
DM  
t
1
0.01  
1
2
t
2
Single Pulse  
0.01  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
t, RECTANGULAR PULSE DURATION (sec)  
Figure 13. Transient Thermal Impedance  
www.onsemi.com  
6
NTMFS034N15MC  
PACKAGE DIMENSIONS  
PQFN8 5X6, 1.27P  
CASE 483AE  
ISSUE A  
www.onsemi.com  
7
NTMFS034N15MC  
ON Semiconductor and  
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.  
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent  
coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
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