NTMT064N65S3H [ONSEMI]
Power MOSFET, N-Channel, SUPERFET® III, FAST, 650 V, 40 A, 64 mΩ, Power88;
| 型号： | NTMT064N65S3H |
| 厂家： | 
ONSEMI |
| 描述： | Power MOSFET, N-Channel, SUPERFET® III, FAST, 650 V, 40 A, 64 mΩ, Power88 |
| 文件： | 总11页 (文件大小：344K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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Is Now
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www.onsemi.com
onsemi andꢀꢀꢀꢀꢀꢀꢀand other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or
subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi
product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without
notice. The information herein is provided “as-is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality,
or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all
liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws,
regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/
or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application
by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized
for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for
implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and holdonsemi and its officers, employees,
subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative
Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others.
MOSFET - Power,
N‐Channel, SUPERFET) III,
FAST
650 V, 64 mW, 40 A
NTMT064N65S3H
www.onsemi.com
Description
SUPERFET III MOSFET is ON Semiconductor’s brand−new high
voltage super−junction (SJ) MOSFET family that is utilizing charge
balance technology for outstanding low on−resistance and lower gate
charge performance. This advanced technology is tailored to minimize
conduction loss, provide superior switching performance, and
withstand extreme dv/dt rate. Consequently, SUPERFET III FAST
MOSFET is suitable for various AC/DC power conversion for system
miniaturization and higher efficiency.
V
R
MAX
I MAX
D
DSS
DS(ON)
650 V
64 mW @ 10 V
40 A
D
The Power88 package is an ultra−slim surface−mount package
2
(1 mm high) with a low profile and small footprint (8 x 8 mm ).
G
SUPERFET III MOSFET in a Power88 package offers excellent
switching performance due to lower parasitic source inductance and
separated power and drive sources. Power88 offers Moisture
Sensitivity Level 1 (MSL 1).
S1: Driver Source
S2: Power Source
S1 S2
POWER MOSFET
Features
• 700 V @ T = 150°C
J
G
S1
• Typ. R
= 52 mW
S2
DS(on)
S2
• Ultra Low Gate Charge (Typ. Q = 82 nC)
g
• Low Effective Output Capacitance (Typ. C
• 100% Avalanche Tested
= 750 pF)
oss(eff.)
• These Devices are Pb−Free and are RoHS Compliant
TDFN4 8X8 2P
CASE 520AB
Applications
• Telecom / Server Power Supplies
• Industrial Power Supplies
• UPS / Solar
MARKING DIAGRAM
NTMT064
N65S3H
AWLYWW
NTMT064N65S3H = Specific Device Code
A
WL
Y
= Assembly Location
= Wafer Lot
= Year
WW
= Work Week
ORDERING INFORMATION
See detailed ordering and shipping information on page 2 of
this data sheet.
© Semiconductor Components Industries, LLC, 2018
1
Publication Order Number:
March, 2021 − Rev. 1
NTMT064N65S3H/D
NTMT064N65S3H
ABSOLUTE MAXIMUM RATINGS (T = 25°C, Unless otherwise noted)
C
Symbol
Parameter
Value
650
Unit
V
V
DSS
V
GSS
Drain to Source Voltage
Gate to Source Voltage
− DC
30
V
− AC (f > 1 Hz)
30
I
D
Drain Current
− Continuous (T = 25°C)
40
A
C
− Continuous (T = 100°C)
25
C
I
Drain Current
− Pulsed (Note 1)
112
A
mJ
A
DM
E
Single Pulsed Avalanche Energy (Note 2)
Avalanche Current (Note 2)
Repetitive Avalanche Energy (Note 1)
MOSFET dv/dt
422
AS
AS
I
6.5
E
2.60
120
mJ
V/ns
AR
dv/dt
Peak Diode Recovery dv/dt (Note 3)
Power Dissipation
20
P
(T = 25°C)
260
W
W/°C
°C
D
C
− Derate Above 25°C
2.08
−55 to +150
260
T , T
Operating and Storage Temperature Range
J
STG
T
Maximum Lead Temperature for Soldering, 1/8″ from Case for 5 seconds
°C
L
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Repetitive rating: pulse−width limited by maximum junction temperature.
2. I = 6.5 A, R = 25 W, starting T = 25°C.
AS
G
J
3. I ≤ 20 A, di/dt ≤ 200 A/ms, V ≤ 400 V, starting T = 25°C.
SD
DD
J
THERMAL CHARACTERISTICS
Symbol
Parameter
Value
0.48
45
Unit
R
R
Thermal Resistance, Junction to Case, Max.
_C/W
q
JC
JA
Thermal Resistance, Junction to Ambient, Max. (Note 4)
q
2
4. Device on 1 in pad 2 oz copper pad on 1.5 x 1.5 in. board of FR−4 material.
PACKAGE MARKING AND ORDERING INFORMATION
†
Part Number
Top Marking
Package
Reel Size
Tape Width
Shipping Quantity
NTMT064N65S3H
NTMT064N65S3H
TDFN4
13″
13.3 mm
3000 Units / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
www.onsemi.com
2
NTMT064N65S3H
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)
C
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
OFF CHARACTERISTICS
BV
Drain to Source Breakdown Voltage
650
700
V
V
V
= 0 V, I = 1 mA, T = 25_C
DSS
GS
D
J
V
I
= 0 V, I = 1 mA, T = 150_C
GS
D
J
DBV
/DT
Breakdown Voltage Temperature
Coefficient
0.63
3.2
V/_C
DSS
J
= 10 mA, Referenced to 25_C
D
I
Zero Gate Voltage Drain Current
V
DS
= 650 V, V = 0 V
10
mA
DSS
GS
V
= 520 V, T = 125_C
DS
C
I
Gate to Body Leakage Current
V
=
30 V, V = 0 V
100
nA
GSS
GS
DS
ON CHARACTERISTICS
V
Gate Threshold Voltage
V
= V , I = 3.9 mA
2.4
4.0
64
V
mW
S
GS(th)
DS(on)
GS
DS
D
R
Static Drain to Source On Resistance
Forward Transconductance
V
= 10 V, I = 20 A
52
44
GS
DS
D
g
FS
V
= 20 V, I = 20 A
D
DYNAMIC CHARACTERISTICS
C
Input Capacitance
3745
58
pF
pF
pF
pF
nC
nC
nC
W
iss
V
= 400 V, V = 0 V, f = 250 kHz
GS
DS
C
Output Capacitance
oss
C
Effective Output Capacitance
Energy Related Output Capacitance
Total Gate Charge at 10 V
Gate to Source Gate Charge
Gate to Drain “Miller” Charge
Equivalent Series Resistance
V
= 0 V to 400 V, V = 0 V
750
100
82
oss(eff.)
DS
GS
C
V
= 0 V to 400 V, V = 0 V
GS
oss(er.)
DS
Q
g(tot)
V
= 400 V, I = 20 A, V = 10 V
DS
D
GS
Q
20
gs
(Note 5)
Q
23
gd
ESR
f = 1 MHz
0.7
SWITCHING CHARACTERISTICS
t
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
29
16
85
3.1
ns
ns
ns
ns
d(on)
V
= 400 V, I = 20 A,
D
t
r
DD
GS
V
= 10 V, R = 4.7 W
g
t
d(off)
(Note 5)
t
f
SOURCE-DRAIN DIODE CHARACTERISTICS
I
Maximum Continuous Source to Drain Diode Forward Current
Maximum Pulsed Source to Drain Diode Forward Current
Source to Drain Diode Forward
40
112
1.2
A
A
V
S
I
SM
V
SD
V
GS
= 0 V, I = 20 A
SD
Voltage
t
Reverse Recovery Time
Reverse Recovery Charge
367
6.3
ns
rr
V
DD
= 400 V, I = 20 A,
SD
F
dI /dt = 100 A/ms
Q
mC
rr
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
5. Essentially independent of operating temperature typical characteristics.
www.onsemi.com
3
NTMT064N65S3H
TYPICAL CHARACTERISTICS
1000
100
200
V
4.5 V
5 V
= 4 V
GS
V
= 20 V
DS
100
250 ms Pulse Test
5.5 V
6 V
6.5 V
7 V
8 V
T = 150°C
J
10
1
10
1
10 V
T = 25°C
J
250 ms Pulse Test
= 25°C
T
C
T = −55°C
J
0.2
2
20
2.0
3.0
4.0
5.0
6.0
7.0
V
DS
, DRAIN−TO−SOURCE VOLTAGE (V)
V
GS
, GATE−TO−SOURCE VOLTAGE (V)
Figure 1. On−Region Characteristics
Figure 2. Transfer Characteristics
0.10
0.09
0.08
0.07
0.06
T
C
= 25°C
100
10
1
V
= 0 V
GS
250 ms Pulse Test
V
GS
= 10 V
T = 150°C
J
V
GS
= 20 V
0.1
T = 25°C
J
0.01
0.05
0.04
T = −55°C
J
0.001
0
20
40
60
80
100
0
0.2
0.4
0.6
0.8
1.0
1.2
I , DRAIN CURRENT (A)
D
V
SD
, BODY DIODE FORWARD VOLTAGE (V)
Figure 3. On−Resistance Variation vs. Drain
Figure 4. Body Diode Forward Voltage
Variation vs. Source Current and
Temperature
Current and Gate Voltage
100K
10K
1K
10
8
I
D
= 20 A
V
DS
= 130 V
V
C
iss
= 400 V
DS
6
C
100
oss
f = 250 kHz
= 0 V
4
V
GS
C
rss
10
1
C
C
C
= C + C (C = shorted)
2
0
iss
gs
gd
ds
= C + C
oss
rss
ds gd
= C
gd
0.1
1
10
100
0
18
36
54
72
90
V
DS
, DRAIN−TO−SOURCE VOLTAGE (V)
Q , TOTAL GATE CHARGE (nC)
g
Figure 5. Capacitance Characteristics
Figure 6. Gate Charge Characteristics
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4
NTMT064N65S3H
TYPICAL CHARACTERISTICS
1.2
1.1
1.0
3.0
V
= 0 V
= 10 mA
V
= 10 V
GS
GS
I
D
I = 20 A
D
2.5
2.0
1.5
1.0
0.9
0.8
0.5
0
−75 −50 −25
0
25
50 75 100 125 150 175
−75 −50 −25
0
25
50 75 100 125 150175
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 7. Breakdown Voltage Variation
vs. Temperature
Figure 8. On−Resistance Variation
vs. Temperature
45
40
35
30
25
20
200
100
30 ms
100 ms
10
1 ms
Operation in this
Area is Limited by
10 ms
R
1
0.1
DS(on)
15
DC
T
C
= 25°C
10
5
Single Pulse
T = 150°C
J
0.01
0
1
10
100
1000
25
50
75
100
125
150
V
DS
, DRAIN−TO−SOURCE VOLTAGE (V)
T , CASE TEMPERATURE (°C)
C
Figure 9. Maximum Safe Operating Area
Figure 10. Maximum Drain Current
vs. Case Temperature
20
15
10
5
0
0
130
260
390
520
650
V
DS
, DRAIN−TO−SOURCE VOLTAGE (V)
Figure 11. EOSS vs. Drain−to−Source Voltage
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5
NTMT064N65S3H
TYPICAL CHARACTERISTICS
2
1
50% Duty Cycle
20%
10%
5%
0.1
2%
1%
0.01
Single Pulse
0.001
−5
−4
−3
−2
−1
0
1
10
10
10
10
10
10
10
t, RECTANGULAR PULSE DURATIONTIME (s)
Figure 12. Transient Thermal Response Curve
www.onsemi.com
6
NTMT064N65S3H
V
GS
R
Q
g
L
V
DS
Q
Q
gs
gd
V
GS
DUT
I
G
= Const.
Charge
Figure 13. Gate Charge Test Circuit & Waveform
R
L
V
DS
GS
90%
90%
10%
90%
V
DS
V
DD
V
GS
R
G
10%
V
DUT
V
GS
t
t
d(off)
t
r
t
f
d(on)
t
on
t
off
Figure 14. Resistive Switching Test Circuit & Waveforms
L
2
1
2
EAS
+
@ LIAS
V
DS
BV
DSS
I
D
I
AS
R
G
V
DD
I (t)
D
DUT
V
DD
V
GS
V
DS
(t)
t
p
Time
t
p
Figure 15. Unclamped Inductive Switching Test Circuit & Waveforms
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7
NTMT064N65S3H
+
DUT
V
DS
−
I
SD
L
Driver
R
G
Same Type
as DUT
V
DD
V
GS
− dv/dt controlled by R
G
− I controlled by pulse period
SD
Gate Pulse Width
D +
Gate Pulse Period
V
GS
10 V
(Driver)
I
, Body Diode Forward Current
FM
I
di/dt
SD
(DUT)
I
RM
Body Diode Reverse Current
Body Diode Recovery dv/dt
V
DS
V
DD
V
SD
(DUT)
Body Diode
Forward Voltage Drop
Figure 16. Peak Diode Recovery dv/dt Test Circuit & Waveforms
SUPERFET is a registered trademark of Semiconductor Components Industries, LLC.
www.onsemi.com
8
NTMT064N65S3H
PACKAGE DIMENSIONS
TDFN4 8x8, 2P
CASE 520AB
ISSUE O
www.onsemi.com
9
NTMT064N65S3H
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
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相关型号：
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Power MOSFET, N-Channel, SUPERFET® V, Easy Drive with Zener Diode, 600 V, 13 A, 280 mΩ, Power88
ONSEMI
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