NUP4103FCT1G [ONSEMI]
Four Channel ESD Array; 四通道ESD阵列
| 型号： | NUP4103FCT1G |
| 厂家： | 
ONSEMI |
| 描述： | Four Channel ESD Array |
| 文件： | 总5页 (文件大小：138K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NUP4103FC
Four Channel ESD Array
This integrated transient voltage suppressor device (TVS) is
designed for applications requiring transient overvoltage protection. It
is intended for use in sensitive portable equipment and other
applications. Its integrated design provides very effective and reliable
protection for four (4) separate lines using only one package. These
devices are ideal for situations where board space is a premium.
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Features
CIRCUIT DESCRIPTION
• Unidirectional, Quad ESD Protection
A1
A3
C1
C3
• Ultra−small Flip−Chip Packaging (0.95 mm x 1.33 mm)
• Compliance with IEC61000−4−2 (Level 4) Requirements
• Maximum Leakage Current of 100 nA at 3.3 V
• Pb−Free Package is Available*
B2
Benefits
• Protects Four Data Lines from ESD while Reducing Component
Count
• Small Package Saves on PCB Real Estate
• Provides Protection for ESD Industry Standards, IEC 61000,
HBM and MM
MARKING
DIAGRAM
1
• Low Leakage Capability Minimizes Power Loss in the System
E M G
5−PIN FLIP−CHIP CSP
PLASTIC
G
Applications
CASE 766AB
• ESD Protection for Portable Equipment
• Cell Phones
• MP3 Players
• PDAs
E
M
G
= Specific Device Code
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
TOP VIEW
(Bumps Down)
BOTTOM VIEW
(Bumps Up)
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
1
2
3
3
2 1
ESD Discharge IEC61000−4−2,
− Air Discharge
V
kV
A
B
C
A
B
C
PP
30
30
16
1.6
− Contact Discharge
Human Body Model
Machine Model
Junction Temperature
T
150
°C
°C
°C
J
Operating Ambient Temperature Range
Storage Temperature Range
T
−40 to +85
−55 to +150
A
ORDERING INFORMATION
T
STG
†
Device
Package
Shipping
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
NUP4103FCT1
Flip−Chip 3000/Tape & Reel
NUP4103FCT1G
Flip−Chip 3000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
March, 2006 − Rev. 1
NUP4103FC/D
NUP4103FC
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise specified)
J
Parameter
Reverse Stand−Off Voltage
Breakdown Voltage
Symbol
Conditions
Min
Typ
7.0
30
Max
5.5
Unit
V
V
I
= 10 mA (Note 1)
RWM
RWM
V
I
= 1.0 mA (Note 2)
T
6.0
8.0
V
BR
Leakage Current
I
V
= 3.3 V per line
RM
100
nA
pF
R
Junction Capacitance
C
J
V = 2.5 V, f = 1 MHz
R
1. TVS devices are normally selected according to the working peak reverse voltage (V
or continuous peak operating voltage level.
) which should be equal or greater than the DC
RWM
2. V is measured at pulse test current I .
BR
T
TYPICAL PERFORMANCE CURVES
(T = 25°C unless otherwise specified)
J
50
45
40
35
100.0E−9
10.0E−9
1.0E−9
30
25
20
100.0E−12
10.0E−12
−40
−15
10
35
60
85
0
1
2
3
4
5
V , Reverse Voltage (V)
R
T, Temperature (°C)
Figure 1. Reverse Voltage vs Junction Capacitance
Figure 2. Reverse Leakage Current
vs Junction Temperature
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2
NUP4103FC
200 ns
Figure 3. ESD Response for Human Body Model (+8 kV)
2.0 V/div
500 mV/div
200 ns
Figure 4. ESD Response for Human Body Model (−8 kV)
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3
NUP4103FC
Printed Circuit Board Recommendations
500 mm Pitch
300 mm Solder Ball
Parameter
PCB Pad Size
Pad Shape
Pad Type
250 mm +25 / −0
Round
NSMD
Solder Mask Opening
Solder Stencil Thickness
Stencil Aperture
Solder Flux Ratio
Solder Paste Type
Trace Finish
350 mm 25
125 mm
250 x 250 mm sq.
50/50
No Clean Type 3 or Finer
OSP Cu
Trace Width
150 mm Max
Copper
Solder Mask
NSMD
SMD
Figure 5. Solder Mask versus Non−Solder Mask Definition
Controlled Atmosphere
250
225°C Min
235°C Max
200
183 °C
2 to 5 °C/s
150
140 to 160 °C
100
50
1 to 5 °C/s
0
0
1
2
3
4
5
1 to 2 min
30−100 sec
TIME (minutes)
Figure 6. Solder Reflow Profile
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4
NUP4103FC
PACKAGE DIMENSIONS
5−PIN FLIP−CHIP CSP
CASE 766AB−01
ISSUE O
NOTES:
4 X
D
A
B
E
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
0.10
C
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
MILLIMETERS
DIM
A
A1
A2
D
E
b
e
f
D1
MIN
−−−
0.210
0.380
1.330 BSC
0.960 BSC
0.290 0.340
0.500 BSC
0.433 BSC
0.866 BSC
MAX
0.680
0.270
0.430
TERMINAL A1
LOCATOR
A1
0.10
C
C
A2
A
0.05
C
SEATING
PLANE
D1
f
1
2
3
5 X
b
e
0.05
0.03
C A B
C
A
B
C
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer
purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
Literature Distribution Center for ON Semiconductor
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
For additional information, please contact your
local Sales Representative.
NUP4013FC/D
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