NUP4104X6T1 [ONSEMI]
150W, UNIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE, LEAD FREE, PLASTIC, CASE 463A-01, 6 PIN;
| 型号： | NUP4104X6T1 |
| 厂家： | 
ONSEMI |
| 描述： | 150W, UNIDIRECTIONAL, 4 ELEMENT, SILICON, TVS DIODE, LEAD FREE, PLASTIC, CASE 463A-01, 6 PIN 局域网 光电二极管 电视 |
| 文件： | 总4页 (文件大小：34K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NUP4104X6
4−Line Transient Voltage
Suppressor Array
This 4−line voltage transient suppressor array is designed for
application requiring transient voltage protection capability. It is
intended for use in over−transient voltage and ESD sensitive
equipment such as wireless phones, printers, automotive electronics,
networking communication and other applications. This device
features a monolithic common anode design which protects five
independent lines in a single SOT−563 package.
http://onsemi.com
1
2
3
6
5
4
Features
• Protects Up to 4−Line in a Single SOT−563 Package
• Peak Power Dissipation − 150 Watts (8x20 msec Waveform)
• ESD Rating of Class 3B (Exceeding 8.0 KV) per Human Body
Model and Class C (Exceeding 400 V) per Machine Model
• Compliance with IEC 61000−4−2 (ESD) 15 KV (Air), 8.0 KV
(Contact)
MARKING
DIAGRAM
6 5 4
• UL Flammability Rating of 94 V−0
• 100% Lead−Free, MSL1 @ 260°C Reflow Temperature
SOT−563
CASE 463A
PLASTIC
RR D
Applications
1 2 3
• Hand−Held Portable Applications
• Networking and Telecom
• Automotive Electronics
• Serial and Parallel Ports
• Notebooks, Desktops, Servers
RR = Specific Device Code
= Date Code
D
ORDERING INFORMATION
Device
NUP4104X6T1
Package
Shipping†
MAXIMUM RATINGS (T = 25°C, unless otherwise noted)
SOT−563 4000/Tape & Reel
J
Rating
Symbol Value
Unit
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Peak Power Dissipation
8x20 ms Double Exponential Waveform,
P
PK
150
W
(Note 1)
Operating Temperature Range
Storage Temperature Range
Lead Solder Temperature (10 s)
T
−40 to
125
°C
°C
J
T
−55 to
150
STG
T
L
260
°C
Electro−Static Discharge
Human Body Model (HBM)
Machine Model (MM)
IEC 61000−4−2 (Air)
IEC 61000−4−2 (Contact)
ESD
V
8000
400
30000
15000
1. Non−repetitive current pulse per Figure 1.
Semiconductor Components Industries, LLC, 2004
1
Publication Order Number:
February, 2004 − Rev. 2
NUP4104X6/D
NUP4104X6
ELECTRICAL CHARACTERISTICS (T = 25°C, unless otherwise noted)
J
Characteristic
Reverse Working Voltage
Test Condition
Symbol
Min
−
Typ
−
Max
3.0
7.2
0.5
8.0
13
Unit
V
(Note 2)
V
RWM
Breakdown Voltage
Reverse Leakage Current
Clamping Voltage
I
R
= 1.0 mA
V
BR
6.1
−
−
V
V
RWM
= 3.0 V
I
R
−
mA
V
I
= 1.0 A (8x20 ms Waveform)
= 12 A (8x20 ms Waveform)
8x20 ms Waveform
V
C
−
−
PP
I
−
−
PP
Peak Pulse Current
Capacitance
I
PP
−
−
13
A
V
R
= 0 V, f = 1.0 MHz
(Line to GND)
C
−
70
−
pF
J
2. TVS devices are normally selected according to the working peak reverse voltage (V
or continuous peak operating voltage.
), which should be equal or greater than the DC
RWM
3. V is measured at pulse test current I .
BR
T
TYPICAL PERFORMANCE CURVES
(T = 25°C unless otherwise noted)
A
110
110
WAVEFORM
PARAMETERS
100
90
80
70
60
50
40
30
20
100
90
80
70
60
50
40
30
20
t = 8 ms
r
t = 20 ms
d
c−t
t = I /2
d
PP
10
0
10
0
0
5
10
15
t, TIME (ms)
20
25
30
0
25
50
75
100
125
150
T , AMBIENT TEMPERATURE (°C)
A
Figure 2. Power Derating Curve
Figure 1. Pulse Waveform
16.00
12.00
8.00
4.00
0.00
0
12
16
4
8
I , PEAK PULSE CURRENT (A)
PP
Figure 3. Clamping Voltage versus
Peak Pulse Current
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NUP4104X6
PACKAGE DIMENSIONS
SOT−563, 6−LEAD
CASE 463A−01
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
A
C
−X−
K
6
5
2
4
3
MILLIMETERS
DIM MIN MAX
INCHES
B
−Y−
MIN
MAX
0.067
0.051
0.024
0.011
S
J
A
B
C
D
G
J
1.50
1.10
0.50
0.17
1.70 0.059
1.30 0.043
0.60 0.020
0.27 0.007
1
0.50 BSC
0.020 BSC
D 56 PL
0.08
0.10
1.50
0.18 0.003
0.30 0.004
1.70 0.059
0.007
0.012
0.067
G
M
0.08 (0.003)
X Y
K
S
SOLDERING FOOTPRINT*
0.3
0.0118
0.45
0.0177
1.0
0.0394
1.35
0.0531
0.5 0.5
0.0197 0.0197
mm
inches
ǒ
Ǔ
SCALE 20:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
3
NUP4104X6
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
For additional information, please contact your
local Sales Representative.
NUP4104X6/D
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