NVHL050N65S3HF [ONSEMI]

Power Mosfet - N‐Channel, SUPERFET III, FRFET 650 V, 58 A, 50 mΩ;
NVHL050N65S3HF
型号: NVHL050N65S3HF
厂家: ONSEMI    ONSEMI
描述:

Power Mosfet - N‐Channel, SUPERFET III, FRFET 650 V, 58 A, 50 mΩ

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MOSFET – Power,  
N‐Channel, SUPERFET III,  
FRFET  
650 V, 58 A, 50 mW  
NVHL050N65S3HF  
Description  
www.onsemi.com  
SUPERFET III MOSFET is ON Semiconductor’s brandnew high  
voltage superjunction (SJ) MOSFET family that is utilizing charge  
balance technology for outstanding low on-resistance and lower gate  
charge performance. This advanced technology is tailored to minimize  
conduction loss, provide superior switching performance, and  
withstand extreme dv/dt rate.  
V
R
MAX  
I MAX  
D
DSS  
DS(ON)  
650 V  
50 mW  
58 A  
D
Consequently, SUPERFET III MOSFET is very suitable for the  
various power system for miniaturization and higher efficiency.  
SUPERFET III FRFET MOSFET’s optimized reverse recovery  
performance of body diode can remove additional component and  
improve system reliability.  
G
Features  
700 V @ T = 150°C  
S
J
Typ. R  
= 41 mW  
DS(on)  
Ultra Low Gate Charge (Typ. Q = 119 nC)  
g
Low Effective Output Capacitance (Typ. C  
100% Avalanche Tested  
= 1051 pF)  
oss(eff.)  
AECQ101 Qualified and PPAP Capable  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
G
D
Compliant  
S
TO247 long leads  
Applications  
CASE 340CX  
Automotive On Board Charger HEVEV  
Automotive DC/DC Converter HEVEV  
MARKING DIAGRAM  
$Y&Z&3&K  
NVHL050  
N65S3HF  
$Y  
&Z  
&3  
&K  
= ON Semiconductor Logo  
= Assembly Plant Code  
= Data Code (Year & Week)  
= Lot  
NVHL050N65S3HF = Specific Device Code  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 2 of  
this data sheet.  
© Semiconductor Components Industries, LLC, 2019  
1
Publication Order Number:  
October, 2020 Rev. 2  
NVHL050N65S3HF/D  
NVHL050N65S3HF  
ABSOLUTE MAXIMUM RATINGS (T = 25°C, Unless otherwise noted)  
C
Symbol  
Parameter  
Value  
650  
Unit  
V
V
DSS  
V
GSS  
Drain to Source Voltage  
Gate to Source Voltage  
DC  
30  
V
AC (f > 1 Hz)  
30  
I
D
Drain Current  
Continuous (T = 25°C)  
58  
A
C
Continuous (T = 100°C)  
36  
C
I
Drain Current  
Pulsed (Note 1)  
145  
A
mJ  
A
DM  
E
Single Pulsed Avalanche Energy (Note 2)  
Avalanche Current (Note 2)  
Repetitive Avalanche Energy (Note 1)  
MOSFET dv/dt  
830  
AS  
AS  
I
7.5  
E
4.03  
100  
mJ  
V/ns  
AR  
dv/dt  
Peak Diode Recovery dv/dt (Note 3)  
Power Dissipation  
50  
P
(T = 25°C)  
403  
W
W/°C  
°C  
D
C
Derate Above 25°C  
3.23  
55 to +150  
300  
T , T  
Operating and Storage Temperature Range  
J
STG  
T
Maximum Lead Temperature for Soldering, 1/8from Case for 5 seconds  
°C  
L
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
1. Repetitive rating: pulsewidth limited by maximum junction temperature.  
2. I = 7.5 A, R = 25 W, starting T = 25°C.  
AS  
G
J
3. I 29 A, di/dt 200 A/ms, V 400 V, starting T = 25°C.  
SD  
DD  
J
THERMAL CHARACTERISTICS  
Symbol  
Parameter  
Value  
0.31  
40  
Unit  
R
Thermal Resistance, Junction to Case, Max.  
Thermal Resistance, Junction to Ambient, Max.  
_C/W  
q
JC  
JA  
R
q
PACKAGE MARKING AND ORDERING INFORMATION  
Part Number  
Top Marking  
Package  
Packing Method  
Reel Size  
Tape Width  
Quantity  
30 Units  
NVHL050N65S3HF  
NVHL050N65S3HF  
TO247  
Tube  
N/A  
N/A  
www.onsemi.com  
2
 
NVHL050N65S3HF  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
C
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
OFF CHARACTERISTICS  
BV  
Drain to Source Breakdown Voltage  
650  
700  
V
V
V
= 0 V, I = 1 mA, T = 25_C  
DSS  
GS  
D
J
V
GS  
= 0 V, I = 1 mA, T = 150_C  
D
J
DBV  
/DT  
Breakdown Voltage Temperature  
Coefficient  
I
D
= 10 mA, Referenced to 25_C  
0.64  
V/_C  
DSS  
J
I
Zero Gate Voltage Drain Current  
V
= 650 V, V = 0 V  
22  
10  
mA  
DSS  
DS  
GS  
V
DS  
= 520 V, T = 125_C  
C
I
Gate to Body Leakage Current  
V
GS  
=
30 V, V = 0 V  
100  
nA  
GSS  
DS  
ON CHARACTERISTICS  
V
Gate Threshold Voltage  
V
= V , I = 1.7 mA  
3.0  
5.0  
50  
V
mW  
S
GS(th)  
DS(on)  
GS  
DS  
D
R
Static Drain to Source On Resistance  
Forward Transconductance  
V
= 10 V, I = 29 A  
41  
27  
GS  
DS  
D
g
FS  
V
= 20 V, I = 29 A  
D
DYNAMIC CHARACTERISTICS  
C
Input Capacitance  
4880  
113  
1051  
200  
119  
36  
pF  
pF  
pF  
pF  
nC  
nC  
nC  
W
iss  
V
= 400 V, V = 0 V, f = 1 MHz  
GS  
DS  
C
Output Capacitance  
oss  
C
Effective Output Capacitance  
Energy Related Output Capacitance  
Total Gate Charge at 10V  
Gate to Source Gate Charge  
Gate to Drain “Miller” Charge  
Equivalent Series Resistance  
V
V
= 0 V to 400 V, V = 0 V  
GS  
oss(eff.)  
DS  
C
= 0 V to 400 V, V = 0 V  
GS  
oss(er.)  
DS  
Q
g(tot)  
V
DS  
= 400 V, I = 29 A, V = 10 V  
D
GS  
Q
gs  
(Note 4)  
Q
45  
gd  
ESR  
f = 1 MHz  
1.8  
SWITCHING CHARACTERISTICS  
t
Turn-On Delay Time  
Turn-On Rise Time  
Turn-Off Delay Time  
Turn-Off Fall Time  
32  
30  
89  
25  
ns  
ns  
ns  
ns  
d(on)  
V
= 400 V, I = 29 A,  
D
t
r
DD  
GS  
V
= 10 V, R = 2.2 W  
g
t
d(off)  
(Note 4)  
t
f
SOURCE-DRAIN DIODE CHARACTERISTICS  
I
Maximum Continuous Source to Drain Diode Forward Current  
Maximum Pulsed Source to Drain Diode Forward Current  
Source to Drain Diode Forward  
58  
145  
1.3  
A
A
V
S
I
SM  
V
SD  
V
GS  
= 0 V, I = 29 A  
SD  
Voltage  
t
Reverse Recovery Time  
Reverse Recovery Charge  
128  
606  
ns  
rr  
V
GS  
= 0 V, I = 29 A,  
SD  
F
dI /dt = 100 A/ms  
Q
nC  
rr  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
4. Essentially independent of operating temperature typical characteristics.  
www.onsemi.com  
3
NVHL050N65S3HF  
TYPICAL CHARACTERISTICS  
200  
100  
200  
V
GS  
= 10 V  
V
GS  
= 10 V  
8.0 V  
250 ms Pulse Test  
= 150°C  
8.0 V  
7.0 V  
6.5 V  
100  
T
C
7.0 V  
6.5 V  
6.0 V  
5.5 V  
6.0 V  
5.5 V  
10  
10  
1
250 ms Pulse Test  
= 25°C  
T
C
1
0.2  
2.0  
, DRAINSOURCE VOLTAGE (V)  
20  
0.2  
2.0  
20  
V
DS  
V
DS  
, DRAINSOURCE VOLTAGE (V)  
Figure 1. OnRegion Characteristics  
Figure 2. OnRegion Characteristics  
200  
100  
80  
60  
250 ms Pulse Test  
= 20 V  
T
C
= 25°C  
V
DS  
T = 150°C  
J
T = 25°C  
J
V
= 10 V  
= 20 V  
GS  
10  
1
40  
20  
V
GS  
T = 55°C  
J
3
4
5
6
7
8
0
20  
40  
60  
80 100 120 140 160 180  
V
GS  
, GATETOSOURCE VOLTAGE (V)  
I , DRAIN CURRENT (A)  
D
Figure 3. Transfer Characteristics  
Figure 4. OnResistance Variation vs. Drain  
Current and Gate Voltage  
100K  
10K  
1K  
1000  
100  
10  
250 ms Pulse Test  
= 0 V  
V
GS  
C
iss  
T = 150°C  
J
1
C
oss  
f = 1 MHz  
= 0 V  
100  
T = 25°C  
J
V
GS  
0.1  
C
C
C
= C + C (C = shorted)  
C
rss  
iss  
gs  
gd  
ds  
10  
1
0.01  
= C + C  
oss  
rss  
ds  
gd  
= C  
gd  
T = 55°C  
J
0.001  
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0  
, BODY DIODE FORWARD VOLTAGE (V)  
0.1  
1
10  
100  
1000  
V
SD  
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
Figure 5. Body Diode Forward Voltage  
Figure 6. Capacitance Characteristics  
Variation vs. Source Current and Temperature  
www.onsemi.com  
4
NVHL050N65S3HF  
TYPICAL CHARACTERISTICS  
10  
8
1.2  
I
D
= 29 A  
V
DD  
= 130 V  
V
= 0 V  
= 10 mA  
GS  
I
D
1.1  
1.0  
V
DD  
= 400 V  
6
4
0.9  
0.8  
2
0
0
24  
48  
72  
96  
120  
75 50 25  
0
25 50 75 100 125 150 175  
Q , TOTAL GATE CHARGE (nC)  
g
T , JUNCTION TEMPERATURE (°C)  
J
Figure 7. Gate Charge Characteristics  
Figure 8. Breakdown Voltage Variation vs.  
Temperature  
200  
100  
3.0  
2.5  
2.0  
1.5  
1.0  
V
= 10 V  
= 29 A  
GS  
I
D
100 ms  
10  
1 ms  
10 ms  
Operation in this Area  
1
0.1  
is Limited by R  
DS(ON)  
DC  
T
= 25°C  
C
0.5  
0
T = 150°C  
J
Single Pulse  
0.01  
75 50 25  
0
25 50  
75 100 125 150 175  
1
10  
100  
1K  
T , JUNCTION TEMPERATURE (°C)  
J
V
DS  
, DRAINSOURCE VOLTAGE (V)  
Figure 9. OnResistance Variation vs.  
Figure 10. Maximum Safe Operating Area  
Temperature  
70  
60  
50  
40  
30  
20  
30  
24  
18  
12  
6
0
10  
0
25  
50  
75  
100  
125  
150  
0
100  
200  
300  
400  
500  
600  
T , CASE TEMPERATURE (°C)  
C
V
DS  
, DRAINTOSOURCE VOLTAGE (V)  
Figure 11. Maximum Drain Current vs. Case  
Temperature  
Figure 12. EOSS vs. DraintoSource Voltage  
www.onsemi.com  
5
NVHL050N65S3HF  
TYPICAL CHARACTERISTICS  
250  
200  
150  
1.2  
1.0  
0.8  
V
= V  
DS  
= 1.7 mA  
GS  
I
D
T = 150°C  
A
100  
50  
0
T = 25°C  
A
Pulse Duration = 250 ms  
Duty Cycle = 0.5% Max  
= 29 A  
I
D
0.6  
80  
5
6
7
8
9
10  
40  
0
40  
80  
120  
160  
V
GS  
, GATETOSOURCE VOLTAGE (V)  
T , JUNCTION TEMPERATURE (°C)  
J
Figure 13. RDS(ON) vs. Gate Voltage  
Figure 14. Normalized Gate Threshold Voltage  
vs. Temperature  
100  
10  
T
= 25°C  
J(initial)  
T
= 100°C  
J(initial)  
1
1E06 1E05 1E04 1E03 1E02 1E01 1E+00  
t , TIME IN AVALANCHE (sec)  
AV  
Figure 15. Unclamped Inductive Switching  
Capability  
10  
1
Duty Cycle = 0.5  
0.2  
0.1  
0.05  
0.1  
0.02  
P
DM  
Z
R
(t) = r(t) x R  
q
JC  
q
JC  
0.01  
0.01  
= 0.31°C/W  
q
JC  
t
1
Peak T = PDM x Z (t) + T  
Duty Cycle, D = t / t  
q
J
JC  
C
Single Pulse  
t
2
1
2
0.001  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
t, RECTANGULAR PULSE DURATION (s)  
Figure 16. Transient Thermal Response Curve  
www.onsemi.com  
6
NVHL050N65S3HF  
V
GS  
R
Q
g
L
V
DS  
Q
Q
gd  
gs  
V
GS  
DUT  
I
G
= Const.  
Figure 17. Gate Charge Test Circuit & Waveform  
R
L
V
V
DS  
90%  
90%  
10%  
90%  
V
DS  
V
DD  
V
GS  
R
G
10%  
GS  
DUT  
V
GS  
t
r
t
f
t
t
d(off)  
d(on)  
t
on  
t
off  
Figure 18. Resistive Switching Test Circuit & Waveforms  
L
2
1
2
EAS  
+
@ LIAS  
V
DS  
BV  
DSS  
I
D
I
AS  
R
G
V
DD  
I (t)  
D
DUT  
V
DD  
V
GS  
V
DS  
(t)  
t
p
Time  
t
p
Figure 19. Unclamped Inductive Switching Test Circuit & Waveforms  
www.onsemi.com  
7
NVHL050N65S3HF  
+
DUT  
V
SD  
I
SD  
L
Driver  
R
G
Same Type  
as DUT  
V
DD  
V
GS  
dv/dt controlled by R  
G
I controlled by pulse period  
SD  
Gate Pulse Width  
D +  
Gate Pulse Period  
V
GS  
10 V  
(Driver)  
I
, Body Diode Forward Current  
FM  
I
di/dt  
SD  
(DUT)  
I
RM  
Body Diode Reverse Current  
Body Diode Recovery dv/dt  
V
DS  
V
DD  
V
SD  
(DUT)  
Body Diode  
Forward Voltage Drop  
Figure 20. Peak Diode Recovery dv/dt Test Circuit & Waveforms  
SUPERFET and FRFET are registered trademarks of Semiconductor Components Industries, LLC.  
www.onsemi.com  
8
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
TO2473LD  
CASE 340CX  
ISSUE A  
DATE 06 JUL 2020  
GENERIC  
MARKING DIAGRAM*  
XXXXX = Specific Device Code  
A
Y
= Assembly Location  
= Year  
WW  
G
= Work Week  
= PbFree Package  
XXXXXXXXX  
AYWWG  
*This information is generic. Please refer to  
device data sheet for actual part marking.  
PbFree indicator, “G” or microdot “ G”, may  
or may not be present. Some products may  
not follow the Generic Marking.  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON93302G  
TO2473LD  
PAGE 1 OF 1  
ON Semiconductor and  
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ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically  
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