STK5MFU3C1A-E [ONSEMI]

2 合 1 PFC 和逆变器,智能功率模块 (IPM),600 V,30 A;
STK5MFU3C1A-E
型号: STK5MFU3C1A-E
厂家: ONSEMI    ONSEMI
描述:

2 合 1 PFC 和逆变器,智能功率模块 (IPM),600 V,30 A

功率因数校正
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中文:  中文翻译
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STK5MFU3C1A-E  
2-in-1 PFC and Inverter Intelligent  
Power Module (IPM), 600 V, 30 A  
The STK5MFU3C1A-E is a fully-integrated PFC and inverter power  
stage consisting of a high-voltage driver, six motor drive IGBT’s, one  
PFC IGBT, one PFC rectifier and a thermistor, suitable for driving  
permanent magnet synchronous (PMSM) motors, brushless-DC (BLDC)  
motors and AC asynchronous motors.  
www.onsemi.com  
PACKAGE PICTURE  
The IGBT’s are configured in a 3-phase bridge with common emitter  
connections for the lower legs.  
An internal comparator and reference connected to the over-current  
protection circuit allows the designer to set individual over-current  
protection levels for the PFC and the inverter stages. Additionally, the  
power stage has a full range of protection functions including cross-  
conduction protection, external shutdown and under-voltage lockout  
functions.  
Features  
Simple thermal design with PFC and inverter stage in one package.  
PFC operating frequency up to 40 kHz  
Cross-conduction protection  
Adjustable over-current protection level  
Integrated bootstrap diodes and resistors  
SIP28 78x31.1  
MARKING DIAGRAM  
Certification  
UL1557 (File Number : E339285)  
STK5MFU3C1A  
Typical Applications  
Heat Pumps  
ABCDD  
Home Appliances  
Industrial Fans  
Industrial Pumps  
3
6
9
12  
16 18 20 22 24 26 28  
1
4
7
10  
13 15 17 19 21 23 25 27  
STK5MFU3C1A = Specific Device Code  
A = Year  
B = Month  
C = Production Site  
DD = Factory Lot Code  
Device marking is on package top side  
HINU  
LINU  
HS1  
LS1  
HS2  
LS2  
HS3  
LS3  
Three channel  
half-bridge  
driver  
HS1  
LS1  
HS2  
LS2  
HS3  
LS3  
HINV  
LINV  
+
single-ended  
PFC driver  
ORDERING INFORMATION  
HINW  
LINW  
PFCIN  
with  
protection  
circuits  
Shipping  
Device  
Package  
(Qty / Packing)  
SIP28 78x31.1  
(Pb-Free)  
STK5MFU3C1A-E  
280 / Box  
GND  
Figure 1. Functional Diagram  
© Semiconductor Components Industries, LLC, 2016  
December 2016 - Rev. 1  
1
Publication Order Number :  
STK5MFU3C1A-E/D  
STK5MFU3C1A-E  
STK5MFU3C1A  
PFCL (1)  
RC filtering for  
HINx, LINx and  
PFCIN not  
VP1 (12)  
VP2 (13)  
From Op-amp  
circuit  
+
C1  
CS  
shown.  
Recommended  
in noisy  
environments.  
PTRIP (25)  
RSPFC  
HVGND (15)  
N (16)  
ITRIP (26)  
RSINV  
From HV  
Power  
Source  
HINU (17)  
HINV (18)  
HINW (19)  
LINU (20)  
LINV (21)  
LINW (22)  
PFCIN (23)  
To Op-amp  
circuit  
ToOp-amp  
circuit  
VBU (9)  
U (10)  
VBV (6)  
V (7)  
+
+
RP  
Controller  
FAULT/ TH (24)  
Motor  
VDD Supply  
From 15V  
VBW (3)  
W (4)  
VDD (27)  
GND (28)  
+
+
Power  
Source  
LV Ground  
Star connection to HVGND  
Figure 2. Application Schematic  
www.onsemi.com  
2
STK5MFU3C1A-E  
VDD (27)  
PFCL (1)  
VBU (9)  
VBV (6)  
RBC  
DB  
DB  
DB  
RBS  
RBS  
RBS  
VBW (3)  
VP2 (13)  
VP1 (12)  
W (4)  
V (7)  
PFC  
Driver  
PFCIN(23)  
U (10)  
HVGND (15)  
N (16)  
Level  
Level  
Level  
Shifter  
Shifter  
Shifter  
HINU (17)  
HINV (18)  
HINW (19)  
LINU (20)  
LINV (21)  
LINW (22)  
Logic  
Logic  
Logic  
VDD  
undervoltage  
shutdown  
VDD  
FAULT/ TH (24)  
ITRIP (26)  
PTRIP (25)  
VITRIP  
Reset after  
delay  
GND (28)  
VPFCTRIP  
Figure 3. Simplified Block Diagram  
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3
STK5MFU3C1A-E  
PIN FUNCTION DESCRIPTION  
Pin  
Name  
PFCL  
Description  
1
3
4
6
7
9
PFC Inductor Connection to IGBT and Rectifier node  
High Side Floating Supply voltage for W phase  
V phase output. Internally connected to W phase high side driver ground  
High Side Floating Supply voltage for V phase  
V phase output. Internally connected to V phase high side driver ground  
High Side Floating Supply voltage for U phase  
U phase output. Internally connected to U phase high side driver ground  
Positive PFC Output Voltage  
VBW  
W
VBV  
V
VBU  
U
10  
12  
13  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
VP1  
VP2  
Positive Inverter Output Voltage  
HVGND  
N
Negative PFC Output Voltage  
Low Side Emitter Connection  
HINU  
HINV  
HINW  
LINU  
LINV  
LINW  
PFCIN  
FAULT / TH  
PTRIP  
ITRIP  
VDD  
GND  
Logic Input High Side Gate Driver - Phase U  
Logic Input High Side Gate Driver - Phase V  
Logic Input High Side Gate Driver - Phase W  
Logic Input Low Side Gate Driver - Phase U  
Logic Input Low Side Gate Driver - Phase V  
Logic Input Low Side Gate Driver – Phase W  
Logic Input PFC Gate Driver  
FAULT output and thermistor output  
Current protection pin for PFC  
Current protection pin for inverter  
+15 V Main Supply  
Negative Main Supply  
Note : Pins 2, 5, 8, 11 and 14 are not present  
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4
STK5MFU3C1A-E  
ABSOLUTE MAXIMUM RATINGS at Tc = 25°C (Notes 1, 2)  
Rating  
Symbol  
Conditions  
Value  
Unit  
PFC Section  
V
Collector-emitter voltage  
PFCL to HVGND  
600  
150  
53  
26  
96  
600  
90  
30  
18  
65  
11  
3
V
A
CE  
Repetitive peak collector current  
ICP  
Duty cycle 10%, pulse width 1ms  
PFC  
IGBT  
A
Collector current  
IC  
A
Tc = 100C  
Maximum power dissipation  
Diode reverse voltage  
PC  
W
V
VRM  
IFP1  
VP1 to PFCL  
Repetitive peak forward current  
Duty cycle 10%, pulse width 1ms  
A
PFC  
Diode  
A
Diode forward current  
IF1  
A
Tc = 100C  
Maximum power dissipation  
PD1  
IFP2  
IF2  
W
A
Repetitive peak forward current  
Duty cycle 10%, pulse width 1ms  
Anti-  
parallel Diode forward current  
A
Diode  
Maximum power dissipation  
PD2  
VAC  
Vo  
5
W
V
Maximum AC input voltage  
Maximum output voltage  
Input AC current (steady state)  
Inverter Section  
Single-phase Full-rectified  
264  
450  
33  
V
In the Application Circuit  
(VAC = 200 V)  
Iin  
Arms  
VP2 to N surge < 500 V  
(Note 3)  
V
Supply voltage  
450  
V
CC  
V
max  
Collector-emitter voltage  
VP2 to U, V, W or U, V, W to N  
VP2, U, V, W, N terminal current  
600  
±30  
V
A
CE  
Output current  
Io  
VP2, U, V, W, N terminal current  
at Tc = 100C  
±15  
A
VP, U, V, W, N terminal current, pulse  
width 1 ms  
Output peak current  
Iop  
Pd  
±60  
65  
A
Maximum power dissipation  
IGBT per 1 channel  
W
Gate driver section  
VBU to U, VBV to V, VBW to W, VDD  
to GND (Note 4)  
HINU, HINV, HINW, LINU, LINV,  
LINW, PFCIN  
V
Gate driver supply voltage  
Input signal voltage  
V
V
0.3 to +20.0  
BS  
0.3 to V  
VIN  
DD  
0.3 to V  
FAULT terminal voltage  
ITRIP terminal voltage  
PFCTRIP terminal voltage  
Intelligent Power Module  
Junction temperature  
VFAULT  
VITRIP  
FAULT terminal  
ITRIP terminal  
PTRIP terminal  
V
V
V
DD  
0.3 to +10.0  
1.5 to 2.0  
VPTRIP  
Tj  
IGBT, FRD, Gate driver IC  
150  
C  
C  
Storage temperature  
Tstg  
Tc  
40 to +125  
20 to +100  
1.17  
Operating case temperature  
Tightening torque  
IPM case temperature  
Case mounting screws  
C  
MT  
Nm  
50 Hz sine wave AC 1 minute  
(Note 5)  
Isolation voltage  
Vis  
2000  
Vrms  
1. Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device  
functionality should not be assumed, damage may occur and reliability may be affected.  
2. Refer to ELECTRICAL CHARACTERISTICS, RECOMMENDED OPERATING RANGES and/or APPLICATION INFORMATION for  
Safe Operating parameters.  
3. This surge voltage developed by the switching operation due to the wiring inductance between VP2 and N terminal.  
4.  
V
= VBU to U, VBV to V, VBW to W  
BS  
5. Test conditions : AC 2500 V, 1 second  
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5
STK5MFU3C1A-E  
RECOMMENDED OPERATING RANGES (Note 6)  
Rating  
Symbol  
Conditions  
VP1 to HVGND, VP2 to N  
VBU to U, VBV to V, VBW to W  
Min  
0
Typ  
Max  
400  
17.5  
16.5  
5.0  
0.3  
40  
Unit  
V
V
Supply voltage  
280  
CC  
VBS  
12.5  
13.5  
2.5  
0
15  
15  
-
V
Gate driver supply voltage  
V
V
to GND  
DD  
V
DD  
ON-state input voltage  
OFF-state input voltage  
PWM frequency(PFC)  
PWM frequency(Inverter)  
Dead time  
VIN(ON)  
VIN(OFF)  
fPWMp  
fPWMi  
DT  
V
HINU, HINV, HINW, LINU, LINV, LINW,  
PFCIN  
-
V
1
-
kHz  
kHz  
μs  
μs  
Nm  
1
-
20  
Turn-off to Turn-on (external)  
ON and OFF  
1.5  
1
-
-
Allowable input pulse width  
Tightening torque  
PWIN  
-
-
‘M4’ type screw  
0.79  
-
1.17  
6. Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to  
stresses beyond the Recommended Operating Ranges limits may affect device reliability.  
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6
STK5MFU3C1A-E  
ELECTRICAL CHARACTERISTICS (Note 7)  
at Tc = 25C, V (V , V ) = 15 V unless otherwise noted.  
BIAS BS DD  
Parameter  
Test Conditions  
Symbol  
Min  
Typ  
Max  
Unit  
PFC Section  
V
= 600 V  
I
Collector-emitter cut-off current  
Reverse leakage current (PFC Diode)  
-
-
-
-
-
-
-
-
-
-
0.2  
0.1  
2.2  
-
mA  
mA  
V
CE  
CE  
VR = 600 V  
IR  
-
IC = 40 A, Tj = 25°C  
IC = 20 A, Tj = 100°C  
IF = 40 A, Tj = 25°C  
IF = 20 A, Tj = 100°C  
1.6  
1.3  
2.4  
1.5  
1.5  
-
V
(sat)  
Collector-emitter saturation voltage  
Diode forward voltage (PFC Diode)  
CE  
V
3.4  
-
V
VF1  
Diode forward voltage (Anti-parallel Diode) IF = 5 A, Tj = 25°C  
VF2  
2.4  
1.3  
1.9  
V
IGBT  
Junction to case thermal resistance  
PFC Diode  
θj-c(T)  
θj-c(D)  
°C/W  
°C/W  
-
Switching characteristics  
tON  
tOFF  
trr  
0.2  
0.2  
-
0.4  
0.5  
30  
0.6  
0.7  
-
μs  
μs  
ns  
Switching time  
IC = 40 A, VP = 300 V, Tj = 25C  
Diode reverse recovery time  
Inverter section  
V
= 600 V  
I
Collector-emitter leakage current  
Bootstrap diode reverse current  
-
-
0.1  
0.1  
2.5  
-
mA  
mA  
V
CE  
CE  
VR(DB) = 600 V  
IC = 30 A, Tj = 25C  
IC = 15 A, Tj = 100C  
IF = 30 A, Tj = 25C  
IF = 15 A, Tj = 100C  
IGBT  
IR(BD)  
-
-
-
1.8  
V
(SAT)  
Collector to emitter saturation voltage  
Diode forward voltage  
CE  
-
1.5  
V
-
-
2.0  
2.7  
-
V
VF  
1.6  
V
θj-c(T)  
θj-c(D)  
tON  
-
-
1.9  
2.9  
1.0  
1.5  
C/W  
C/W  
μs  
Junction to case thermal resistance  
Switching time  
FRD  
-
-
0.3  
0.5  
0.6  
IC = 30 A, V  
IC = 60 A, V  
= 300 V, Tj = 25C  
CC  
CE  
tOFF  
1.1  
μs  
= 450 V  
Reverse bias safe operating area  
Short circuit safe operating area  
Allowable offset voltage slew rate  
RBSOA  
SCSOA  
dv/dt  
Full Square  
V
= 400 V, Tj = 100C  
4
-
-
-
μs  
CE  
U, V, W to N  
50  
V/ns  
50  
7. Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted.  
Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
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7
STK5MFU3C1A-E  
ELECTRICAL CHARACTERISTICS (Note 8)  
at Tc = 25C  
Parameter  
Test Conditions  
Symbol  
Min  
Typ  
Max  
Unit  
Driver Section  
V
V
= 15 V (Note 4), per driver  
= 15V, total  
ID  
ID  
-
0.08  
0.85  
-
0.4  
2.4  
-
mA  
mA  
V
BS  
DD  
Gate driver consumption current  
-
High level Input voltage  
Low level Input voltage  
Logic 1 input current  
VIN H  
VIN L  
IIN+  
2.5  
HINU, HINV, HINW, LINU, LINV,  
LINW, PFCIN to GND  
-
-
-
-
-
0.8  
143  
2
V
VIN = +3.3 V  
VIN = 0 V  
100  
-
μA  
μA  
V
Logic 0 input current  
IIN-  
Bootstrap diode forward voltage  
IF = 0.1 A  
VF(DB)  
0.8  
-
Resistor value for common boot  
charge line  
Resister values for separate boot  
charge lines  
RBC  
RBS  
-
-
22  
33  
-
-
Bootstrap circuit resistance  
FAULT terminal sink current  
FAULT clearance delay time  
ITRIP threshold voltage  
FAULT : ON / VFAULT = 0.1 V  
IoSD  
-
2
-
mA  
ms  
V
FLTCLR  
VITRIP  
VPTRIP  
1.0  
1.85  
0.49  
0.31  
2.7  
ITRIP to GND  
PTRIP to GND  
0.44  
0.37  
0.54  
0.25  
PTRIP threshold voltage  
V
V
and V  
supply undervoltage  
BS  
VCCUV+  
VBSUV+  
DD  
positive going input threshold  
and V supply undervoltage  
10.5  
10.3  
0.14  
11.1  
10.9  
0.2  
11.7  
11.5  
-
V
V
V
V
VCCUV-  
VBSUV-  
DD  
negative going input threshold  
and V supply undervoltage Iockout  
BS  
V
VCCUVH  
VBSUVH  
DD  
hysteresis  
BS  
8. Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted.  
Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
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8
STK5MFU3C1A-E  
TYPICAL CHARACTERISTICS PFC SECTION  
60  
50  
40  
30  
20  
10  
0
60  
50  
40  
Tj = 25˚C  
Tj = 100˚C  
Tj = 100˚C  
30  
20  
10  
0
Tj = 25˚C  
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
VCE, COLLECTOR-EMITTER VOLTAGE (V)  
VF, FORWARD VOLTAGE (V)  
Figure 4. VCE versus IC for different temperatures  
(V = 15 V)  
Figure 5. VF versus IF for different temperatures  
DD  
1.2  
2.0  
1.5  
1.0  
0.5  
0.0  
VCE = 300V  
VCE = 300V  
VDD = 15V  
VDD = 15V  
0.9  
Tj = 100˚C  
Tj = 100˚C  
0.6  
Tj = 25˚C  
Tj = 25˚C  
0.3  
0.0  
0
10  
20  
30  
40  
50  
60  
70  
0
10  
20  
30  
40  
50  
60  
70  
IC, COLLECTOR CURRENT (A)  
IC, COLLECTOR CURRENT (A)  
Figure 7. EOFF versus IC for different temperatures  
Figure 6. EON versus IC for different temperatures  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
0.000001  
0.0001  
0.01  
1
100  
ON-PULSE WIDTH (s)  
Figure 8. Thermal Impedance Plot  
500  
400  
300  
200  
100  
0
50  
40  
30  
20  
10  
0
500  
400  
300  
200  
100  
0
50  
40  
30  
20  
10  
0
VCE  
IC  
VCE  
IC  
-100  
-10  
-100  
0.0  
-10  
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
1.6  
1.8  
2.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
1.6  
1.8  
2.0  
Time (μs)  
Time (μs)  
Figure 10. Turn-off waveform Tj = 100°C, V  
= 300 V  
Figure 9. Turn-on waveform Tj = 100°C, V = 300 V  
CC  
CC  
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9
STK5MFU3C1A-E  
TYPICAL CHARACTERISTICS INV SECTION  
60  
50  
40  
30  
20  
10  
0
60  
50  
40  
Tj = 25˚C  
Tj = 25˚C  
30  
Tj = 100˚C  
Tj = 100˚C  
20  
10  
0
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
VCE, COLLECTOR-EMITTER VOLTAGE (V)  
VCE, COLLECTOR-EMITTER VOLTAGE (V)  
Figure 11. VCE versus IC for different temperatures  
(V = 15 V)  
Figure 12. VF versus IF for different temperatures  
DD  
2.0  
2.0  
1.5  
1.0  
0.5  
0.0  
VCE = 300V  
VCE = 300V  
VDD = 15V  
VDD = 15V  
1.5  
Tj = 100˚C  
Tj = 100˚C  
1.0  
Tj = 25˚C  
Tj = 25˚C  
0.5  
0.0  
0
10  
20  
30  
40  
50  
0
10  
20  
30  
40  
50  
IC, COLLECTOR CURRENT (A)  
IC, COLLECTOR CURRENT (A)  
Figure 14. EOFF versus IC for different temperatures  
Figure 13. EON versus IC for different temperatures  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
0.000001  
0.0001  
0.01  
1
100  
ON-PULSE WIDTH (s)  
Figure 15. Thermal Impedance Plot  
500  
400  
300  
200  
100  
0
25  
20  
15  
10  
5
500  
400  
300  
200  
100  
0
25  
20  
15  
10  
5
VCE  
IC  
VCE  
IC  
0
0
-100  
-5  
-100  
0.0  
-5  
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
1.6  
1.8  
2.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
1.6  
1.8  
2.0  
Time (μs)  
Time (μs)  
Figure 18. Turn-off waveform Tj = 100°C, V  
= 300 V  
Figure 17. Turn-on waveform Tj = 100°C, V  
= 300 V  
CC  
CC  
www.onsemi.com  
10  
STK5MFU3C1A-E  
APPLICATIONS INFORMATION  
Input / Output Timing Chart  
Figure 18. Input / Output Timing Chart  
Notes  
9. This section of the timing diagram shows the effect of cross-conduction prevention.  
10. This section of the timing diagram shows that when the voltage on V decreases sufficiently all gate output signals will go low,  
DD  
rises sufficiently, normal operation will resume.  
switching off all six IGBTs. When the voltage on V  
DD  
11. This section shows that when the bootstrap voltage on VBU (VBV, VBW) drops, the corresponding high side output U (V, W) is  
switched off. When the voltage on VBU (VBV, VBW) rises sufficiently, normal operation will resume.  
12. This section shows that when the voltage on ITRIP exceeds the threshold, all IGBT’s are turned off. Normal operation resumes  
later after the over-current condition is removed. Similarly, when the voltage on PTRIP exceeds the threshold, all IGBT’s are  
turned off. Normal operation resumes later after the over-current condition is removed  
Input / Output Logic Table  
INPUT  
OUTPUT  
High side IGBT  
ON  
HIN  
H
LIN  
L
ITRIP  
PTRIP  
Low side IGBT  
U,V,W  
FAULT  
OFF  
OFF  
OFF  
OFF  
ON  
L
L
L
L
H
X
L
L
L
L
X
H
OFF  
ON  
VP  
L
H
L
OFF  
N
L
OFF  
OFF  
OFF  
OFF  
OFF  
High Impedance  
High Impedance  
High Impedance  
High Impedance  
H
H
X
OFF  
X
OFF  
X
X
OFF  
ON  
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11  
STK5MFU3C1A-E  
Thermistor characteristics  
Parameter  
Symbol  
Condition  
Min  
99  
Typ  
100  
Max  
101  
Unit  
kΩ  
kΩ  
K
R
25  
Tth = 25℃  
Resistance  
R
100  
5.18  
4208  
40  
5.38  
4250  
5.60  
4293  
+125  
Tth = 100℃  
B
B-Constant (25 to 50)  
Temperature Range  
Figure 19. Thermistor Resistance versus Thermistor Temperature  
Figure 20. Thermistor Voltage versus Thermistor Temperature  
Conditions: RTH = 39 k, pull-up voltage 5.0 V (see Figure 2)  
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12  
STK5MFU3C1A-E  
Signal inputs  
Calculation of bootstrap capacitor value  
Each signal input has a pull-down resistor. An  
additional pull-down resistor of between 2.2 kand  
3.3 kis recommended on each input to improve noise  
immunity.  
The bootstrap capacitor value CB is calculated using  
the following approach. The following parameters  
influence the choice of bootstrap capacitor :  
VBS: Bootstrap power supply.  
15 V is recommended.  
QG: Total gate charge of IGBT at VBS = 15 V.  
266 nC  
UVLO: Falling threshold for UVLO.  
Specified as 12 V.  
IDMAX: High side drive power dissipation.  
Specified as 0.4 mA  
FAULT/ TH pin  
The FAULT pin is connected to an open-drain FAULT  
output requiring a pull-up resistor. If the pull-up  
voltage is 5 V, use a pull-up resistor with a value of 6.8  
kor higher. If the pull-up voltage is 15 V, use a pull-  
up resistor with a value of 20 kor higher. The  
FAULT output is triggered if there is a V  
undervoltage or an overcurrent condition on either the  
PFC or inverter stages.  
DD  
TONMAX: Maximum ON pulse width of high  
side IGBT.  
The FAULT/ TH pin is also connected to a grounded  
thermistor. Thermal characteristics are shown in this  
datasheet for a pull up value of 39 k.  
Capacitance calculation formula:  
CB = (QG + IDMAX * TONMAX) / (VBS UVLO)  
Undervoltage protection  
CB is recommended to be approximately 3 times the  
value calculated above. The recommended value of CB  
is in the range of 1 to 47 μF, however, the value needs  
to be verified prior to production. When not using the  
bootstrap circuit, each high side driver power supply  
requires an external independent power supply. If the  
capacitors selected are 47 μF or more, a series resistor  
of 20 should be added in series with the three  
capacitors to limit the current. The resistors should be  
inserted between VBU and U, VBV and V and VBW  
and W.  
If V  
goes below the V supply undervoltage  
DD  
DD  
lockout falling threshold, the FAULT output is  
switched on. The FAULT output stays on until V  
DD  
supply undervoltage lockout  
rises above the V  
DD  
rising threshold. The hysteresis is approximately 200  
mV.  
Overcurrent protection  
An over-current condition is detected if the voltage on  
the ITRIP/PTRIP pin is larger than the reference  
voltage. There is a blanking time of typically 350 ns to  
improve noise immunity. After  
propagation delay of typically 0.6 s, the FAULT  
output is switched on.  
a
shutdown  
80  
60  
40  
20  
0
The over-current protection threshold should be set to  
be equal or lower to 2 times the module rated current  
(IO).  
An additional fuse is recommended to protect against  
system level or abnormal over-current fault conditions.  
0.1  
1
10  
100  
1000  
Capacitors on High Voltage and V  
DD  
supplies  
Tonmax [ms]  
Both the high voltage and V  
supplies require an  
DD  
Figure 21. Bootstrap capacitance versus Tonmax  
electrolytic capacitor and an additional high frequency  
capacitor. The recommended value of the high  
frequency capacitor is between 100 nF and 10 μF.  
Minimum input pulse width  
When input pulse width is less than 1μs, an output may  
not react to the pulse. (Both ON signal and OFF signal)  
www.onsemi.com  
13  
STK5MFU3C1A-E  
Mounting Instructions  
Item  
Recommended Condition  
Pitch  
70.0 ±0.1 mm (Please refer to Package Outline Diagram)  
diameter : M4  
Screw  
Bind machine screw, Truss machine screw, Pan machine screw  
Plane washer  
Washer  
The size is D : 9 mm, d : 4.3 mm and t : 0.8 mm JIS B 1256  
Material: Aluminum or Copper  
Warpage (the surface that contacts IPM ) : 50 to 100 μm  
Screw holes must be countersunk.  
Heat sink  
No contamination on the heat sink surface that contacts IPM.  
Temporary tightening : 20 to 30 % of final tightening on first screw  
Temporary tightening : 20 to 30 % of final tightening on second screw  
Final tightening : 0.79 to 1.17 Nm on first screw  
Torque  
Grease  
Final tightening : 0.79 to 1.17 Nm on second screw  
Silicone grease.  
Thickness : 100 to 200 μm  
Uniformly apply silicone grease to whole back.  
Thermal foils are only recommended after careful evaluation. Thickness, stiffness and  
compressibility parameters have a strong influence on performance.  
Screw  
First  
Second  
t
Washer  
Module  
Grease  
Module  
D
d
+
Heatsink  
showing  
warpage  
Mounting components  
Washer details  
Silicone grease  
Recommended  
Not recommended  
Thermal grease must be spread  
evenly (left is correct)  
Figure 22. Module Mounting details: components; washer drawing; need for even spreading of thermal grease  
www.onsemi.com  
14  
STK5MFU3C1A-E  
TEST CIRCUITS  
I , IR(DB)  
CE  
PFC  
W-  
U+  
V+  
W+  
U-  
V-  
9
ICE, IR  
VBS=15V  
VBS=15V  
VBS=15V  
VDD=15V  
IGBT  
A
A
10  
A
B
13  
10  
13  
7
13  
4
10  
16  
7
4
1
6
7
16  
16  
15  
VCE, VR  
U+,V+,W+ : High side phase  
U-,V-,W- : Low side phase  
3
4
27  
B
PFC  
Diode  
U(DB) V(DB)  
W(DB)  
28, 15, 16  
A
B
9
6
3
12  
28  
28  
28  
1
Figure 23. Test Circuit for I  
CE  
V (sat) (Test by pulse)  
CE  
PFC  
IGBT  
9
U+  
V+  
W+  
U-  
V-  
W-  
VBS=15V  
VBS=15V  
VBS=15V  
A
10  
A
B
C
13  
10  
17  
13  
7
13  
4
10  
16  
20  
7
4
1
6
7
16  
21  
16  
22  
15  
23  
V
IC  
18  
19  
3
VCE(sat)  
4
27  
VDD=15V  
5V  
C
B
28, 15, 16  
Figure 24. Test circuit for VCE(SAT)  
V (Test by pulse)  
F
U+  
V+  
13  
7
W+  
13  
4
U-  
10  
16  
V-  
7
W-  
4
A
B
13  
10  
A
V
B
16  
16  
IF  
PFC  
Diode  
Anti-parallel  
Diode  
U(DB)  
V(DB)  
W(DB)  
A
B
9
6
3
12  
1
1
28  
28  
28  
15  
Figure 25. Test circuit for VF  
ID  
V
ID  
VBS U+  
VBS V+  
VBS W+  
DD  
A
A
B
A
B
9
6
7
3
4
27  
28  
10  
VD*  
Figure 26. Test circuit for ID  
www.onsemi.com  
15  
STK5MFU3C1A-E  
VITRIP, VPTRIP  
VITRIP(U-)  
10  
VPTRIP  
A
B
C
D
1
A
B
16  
20  
26  
15  
23  
25  
27  
VDD=15V  
V
Io  
Input Signal  
VITRIP/VPFCTRIP  
C
D
28, 15, 16  
Input Signal  
(0 to 5V)  
Figure 27. Test circuit for ITRIP.PTRIP  
ITRIP  
/PFCTRIP  
lo  
Switching time (The circuit is a representative example of the lower side U phase.)  
PFC  
IGBT  
U+  
V+  
W+  
U-  
V-  
W-  
9
VBS=15V  
A
C
10  
A
B
C
D
E
13  
16  
10  
16  
17  
13  
16  
7
13  
16  
4
13  
16  
13  
10  
20  
13  
16  
13  
7
13  
16  
13  
4
12  
6
7
VBS=15V  
VBS=15V  
VDD=15V  
15  
CS VCC  
12  
3
4
16  
18  
16  
19  
1
D
B
21  
22  
23  
27  
E
Input Signal  
Io  
28, 15, 16  
Input Signal  
(0 to 5V)  
Figure 28. Test circuit for switching time  
90%  
lo  
10%  
tON  
tOFF  
www.onsemi.com  
16  
STK5MFU3C1A-E  
Package Dimensions  
unit : mm  
SIP28 78x31.1  
CASE 127DG  
ISSUE A  
1
28  
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Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or  
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17  

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