Z0103MAG [ONSEMI]
Sensitive Gate Triacs Series Silicon Bidirectional Thyristors; 敏感的门双向可控硅系列硅双向晶闸管
| 型号： | Z0103MAG |
| 厂家： | 
ONSEMI |
| 描述： | Sensitive Gate Triacs Series Silicon Bidirectional Thyristors |
| 文件： | 总10页 (文件大小：190K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Z0103MA, Z0107MA,
Z0109MA
Sensitive Gate Triacs
Series
Silicon Bidirectional Thyristors
Designed for use in solid state relays, MPU interface, TTL logic and
any other light industrial or consumer application. Supplied in an
inexpensive TO−92 package which is readily adaptable for use in
automatic insertion equipment.
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TRIACS
1.0 AMPERE RMS
600 VOLTS
Features
• One−Piece, Injection−Molded Package
• Blocking Voltage to 600 V
• Sensitive Gate Triggering in Four Trigger Modes (Quadrants) for all
possible Combinations of Trigger Sources, and especially for Circuits
that Source Gate Drives
MT2
MT1
G
• All Diffused and Glassivated Junctions for Maximum Uniformity of
Parameters and Reliability
• Improved Noise Immunity (dv/dt Minimum of 10 V/msec at 110°C)
• Commutating di/dt of 1.6 A/msec at 110°C
• High Surge Current of 8 A
1
1
2
2
3
3
BENT LEAD
• These are Pb−Free Devices
STRAIGHT LEAD
BULK PACK
TAPE & REEL
AMMO PACK
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
TO−92 (TO−226AA)
Rating
Symbol Value
Unit
CASE 029
STYLE 12
Peak Repetitive Off-State Voltage
V
DRM,
600
1.0
8.0
V
(1)
(T = −40 to +125°C)
V
RRM
J
MARKING DIAGRAM
Sine Wave 50 to 60 Hz, Gate Open
On-State RMS Current
Full Cycle Sine Wave 50 to 60 Hz
I
A
A
T(RMS)
Z01
10xMA
YWW G
G
(T = +50°C)
C
Peak Non−Repetitive Surge Current
One Full Cycle, Sine Wave 60 Hz
I
TSM
(T = 110°C)
C
2
2
1
2 3
Circuit Fusing Considerations (t = 8.3 ms)
I t
0.35
1.0
A s
x
Y
WW
G
= 3,7,9
= Year
= Work Week
Average Gate Power (T = 80°C, t v 8.3 ms)
P
W
A
C
G(AV)
Peak Gate Current (t v 20 ms, T = +125°C)
I
1.0
J
GM
= Pb−Free Package
Operating Junction Temperature Range
T
J
−40 to
+125
°C
(Note: Microdot may be in either location)
Storage Temperature Range
T
stg
−40 to
+150
°C
PIN ASSIGNMENT
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1
2
3
Main Terminal 1
Gate
Main Terminal 2
1. V
and V
for all types can be applied on a continuous basis. Blocking
DRM
RRM
voltages shall not be tested with a constant current source such that the
voltage ratings of the devices are exceeded.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 9 of this data sheet.
© Semiconductor Components Industries, LLC, 2009
1
Publication Order Number:
June, 2009− Rev. 2
Z0103MA/D
Z0103MA, Z0107MA, Z0109MA
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
50
Unit
°C/W
°C/W
°C
Thermal Resistance, Junction−to−Case
Thermal Resistance, Junction−to−Ambient
R
q
JC
R
160
260
q
JA
Maximum Lead Temperature for Soldering Purposes for 10 Seconds
T
L
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted; Electricals apply in both directions)
C
Characteristic
Symbol
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Peak Repetitive Blocking Current
T = 25°C
I
, I
−
−
−
−
5.0
500
mA
J
DRM RRM
(V = Rated V
, V
; Gate Open)
T = +125°C
D
DRM
RRM
J
ON CHARACTERISTICS
Peak On−State Voltage
TM
V
TM
−
−
1.56
V
(I = "1.4 A Peak; Pulse Width v 2.0 ms, Duty Cycle v 2.0%)
Gate Trigger Current (Continuous dc) (Z0103MA)
I
I
I
mA
GT
(V = 12 Vdc, R = 30 W)
D
L
MT2(+), G(+)
0.15
0.15
0.15
0.25
−
−
−
−
3.0
3.0
3.0
5.0
MT2(+), G(−)
MT2(−), G(−)
MT2(−), G(+)
Gate Trigger Current (Continuous dc) (Z0107MA)
mA
mA
mA
GT
GT
(V = 12 Vdc, R = 30 W)
D
L
MT2(+), G(+)
0.15
0.15
0.15
0.25
−
−
−
−
5.0
5.0
5.0
7.0
MT2(+), G(−)
MT2(−), G(−)
MT2(−), G(+)
Gate Trigger Current (Continuous dc) (Z0109MA)
(V = 12 Vdc, R = 30 W)
D
L
MT2(+), G(+)
0.15
0.15
0.15
0.25
−
−
−
−
10
10
10
10
MT2(+), G(−)
MT2(−), G(−)
MT2(−), G(+)
Latching Current (V = 12 V, I = 1.2 x I ) (Z0103MA)
I
I
I
D
G
GT
L
MT2(+), G(+) All Types
−
−
−
−
−
−
−
−
7.0
15
7.0
7.0
MT2(+), G(−) All Types
MT2(−), G(−) All Types
MT2(−), G(+) All Types
Latching Current (V = 12 V, I = 1.2 x I ) (Z0107MA)
mA
mA
V
D
G
GT
L
MT2(+), G(+) All Types
−
−
−
−
−
−
−
−
10
20
10
10
MT2(+), G(−) All Types
MT2(−), G(−) All Types
MT2(−), G(+) All Types
Latching Current (V = 12 V, I = 1.2 x I ) (Z0109MA)
D
G
GT
L
MT2(+), G(+) All Types
−
−
−
−
−
−
−
−
15
25
15
15
MT2(+), G(−) All Types
MT2(−), G(−) All Types
MT2(−), G(+) All Types
Gate Trigger Voltage (Continuous dc) (Z0103MA, Z0107MA, Z0109MA)
(V = 12 Vdc, R = 30 W)
V
GT
D
L
MT2(+), G(+) All Types
MT2(+), G(−) All Types
MT2(−), G(−) All Types
MT2(−), G(+) All Types
−
−
−
−
−
−
−
−
1.3
1.3
1.3
1.3
Gate Non−Trigger Voltage (Z0103MA, Z0107MA, Z0109MA)
V
GD
0.2
−
1.3
V
(V = 12 V, R = 30 W, T = 125°C)
D
L
J
All Four Quadrants
Holding Current
D
(Z0103MA)
(Z0107MA, Z0109MA)
I
H
−
−
−
−
7.0
10
mA
(V = 12 Vdc, Initiating Current = 50 mA, Gate Open)
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2
Z0103MA, Z0107MA, Z0109MA
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted; Electricals apply in both directions)
C
Characteristic
Symbol
Min
Typ
Max
Unit
DYNAMIC CHARACTERISTICS
Rate of Change of Commutating Current
di/dt(c)
1.6
−
−
A/ms
(V = 400 V, I = 0.84 A, Commutating dv/dt = 1.5 V/ms, Gate Open,
D
TM
T = 110°C, f = 250 Hz, with Snubber)
J
Critical Rate of Rise of Off−State Voltage (V = 67% Rated V
,
dv/dt
di/dt
V/ms
A/ms
D
DRM
Exponential Waveform, Gate Open, T = 110°C)
Z0103MA
Z0107MA
Z0109MA
10
20
50
30
60
75
−
−
−
J
Repetitive Critical Rate of Rise of On−State Current, T = 125°C
−
−
20
J
Pulse Width = 20 ms, IPK
= 15 A, diG/dt = 1 A/ms, f = 60 Hz
max
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3
Z0103MA, Z0107MA, Z0109MA
Voltage Current Characteristic of Triacs
(Bidirectional Device)
+ Current
Quadrant 1
MainTerminal 2 +
V
TM
Symbol
Parameter
V
I
Peak Repetitive Forward Off State Voltage
Peak Forward Blocking Current
DRM
DRM
on state
I
H
I
at V
RRM
RRM
V
Peak Repetitive Reverse Off State Voltage
Peak Reverse Blocking Current
Maximum On State Voltage
Holding Current
RRM
I
RRM
V
TM
+ Voltage
DRM
off state
I
H
I
at V
DRM
I
H
Quadrant 3
MainTerminal 2 −
V
TM
Quadrant Definitions for a Triac
MT2 POSITIVE
(Positive Half Cycle)
+
(+) MT2
(+) MT2
Quadrant II
Quadrant I
(−) I
(+) I
GT
GT
GATE
GATE
MT1
MT1
REF
REF
I
−
+ I
GT
GT
(−) MT2
(−) MT2
Quadrant III
Quadrant IV
(+) I
(−) I
GT
GT
GATE
GATE
MT1
REF
MT1
REF
−
MT2 NEGATIVE
(Negative Half Cycle)
All polarities are referenced to MT1.
With in−phase signals (using standard AC lines) quadrants I and III are used.
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4
Z0103MA, Z0107MA, Z0109MA
110
100
90
110
100
T = 30°
T = 30°
60°
90
60°
90°
DC
DC
90°
80
70
60
50
80
180°
180°
70
120°
120°
60
a
a
50
40
30
20
a
a
40
a = CONDUCTION ANGLE
a = CONDUCTION ANGLE
30
0
0.05
0.1
0.15
0.2
0.25
0.3
0.35
0.4
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
I
, RMS ON-STATE CURRENT (AMPS)
I
, RMS ON-STATE CURRENT (AMPS)
T(RMS)
T(RMS)
Figure 2. RMS Current Derating
Figure 1. RMS Current Derating
1.2
1.0
0.8
0.6
0.4
0.2
0
6.0
4.0
a
DC
T = 110°C
J
a
180°
2.0
a = CONDUCTION ANGLE
25°C
120°
1.0
90°
0.6
0.4
60°
T = 30°
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
I
, RMS ON-STATE CURRENT (AMPS)
T(RMS)
0.2
0.1
Figure 3. Power Dissipation
0.06
0.04
0.02
0.01
0.006
0.4
1.2
2.0
2.8
3.6
4.4
5.2
6.0
V
TM
, INSTANTANEOUS ON‐STATE VOLTAGE (VOLTS)
Figure 4. On−State Characteristics
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5
Z0103MA, Z0107MA, Z0109MA
10
1.
0
5.0
Z
= R
@ r(t)
Q
Q
JC(t)
JC(t)
0.1
3.0
2.0
T = 110°C
J
f = 60 Hz
CYCLE
Surge is preceded and followed by rated current.
0.01
1.0
1.0
3
4
2.0 3.0
5.0
10
30
50
100
0.1
1.0
10
100
1•10
1•10
NUMBER OF CYCLES
t, TIME (ms)
Figure 5. Transient Thermal Response
Figure 6. Maximum Allowable Surge Current
100
10
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
Q4
Q3
Q2
Q4
Q3
Q1
Q2
Q1
1
0
0.4
0.3
-40 -25 -10
5
20
35
50
65
80
95 110
-40 -25 -10
5
20
35
50
65
80
95 110
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 7. Typical Gate Trigger Current versus
Junction Temperature
Figure 8. Typical Gate Trigger Voltage versus
Junction Temperature
100
10
10
Q2
MT2 Negative
MT2 Positive
1
Q3
Q4
Q1
1
0
0.1
-40 -25 -10
5
20
35
50
65
80
95 110
-40 -25 -10
5
20
35
50
65
80
95 110
T , JUNCTION TEMPERATURE (°C)
J
T , JUNCTION TEMPERATURE (°C)
J
Figure 9. Typical Latching Current versus
Junction Temperature
Figure 10. Typical Holding Current versus
Junction Temperature
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6
Z0103MA, Z0107MA, Z0109MA
L
L
1N4007
200 V
RMS
ADJUST FOR
, 60 Hz V
MEASURE
I
R
S
I
TM
AC
CHARGE
CONTROL
-
+
TRIGGER
200 V
CHARGE
C
S
ADJUST FOR
di/dt
MT2
G
(c)
1N914
51 W
MT1
NON‐POLAR
C
L
Note: Component values are for verification of rated (di/dt) . See AN1048 for additional information.
c
Figure 11. Simplified Test Circuit to Measure the Critical Rate of Rise of Commutating Current (di/dt)c
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7
Z0103MA, Z0107MA, Z0109MA
TO−92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL
H2A
H2A
H2B
H2B
H
W2
H4
H5
T1
L1
H1
W1
W
L
T
T2
F1
F2
D
P2
P1
P2
P
Figure 12. Device Positioning on Tape
Specification
Millimeter
Inches
Min
Max
0.1653
0.020
0.110
0.156
0.3741
0.039
0.051
0.768
0.649
0.433
−
Min
3.8
0.38
2.4
1.5
8.5
0
Max
4.2
Symbol
D
Item
Tape Feedhole Diameter
0.1496
0.015
0.0945
0.059
0.3346
0
D2
F1, F2
H
Component Lead Thickness Dimension
Component Lead Pitch
0.51
2.8
Bottom of Component to Seating Plane
Feedhole Location
4.0
H1
H2A
H2B
H4
H5
L
9.5
Deflection Left or Right
1.0
Deflection Front or Rear
0
0
1.0
Feedhole to Bottom of Component
Feedhole to Seating Plane
Defective Unit Clipped Dimension
Lead Wire Enclosure
0.7086
0.610
0.3346
0.09842
0.4921
0.2342
0.1397
0.06
18
19.5
16.5
11
15.5
8.5
2.5
12.5
5.95
3.55
0.15
−
L1
−
P
Feedhole Pitch
0.5079
0.2658
0.1556
0.08
12.9
6.75
3.95
0.20
1.44
0.65
19
P1
Feedhole Center to Center Lead
First Lead Spacing Dimension
Adhesive Tape Thickness
Overall Taped Package Thickness
Carrier Strip Thickness
P2
T
T1
−
0.0567
0.027
0.7481
0.2841
0.01968
T2
0.014
0.6889
0.2165
.0059
0.35
17.5
5.5
0.15
W
Carrier Strip Width
W1
W2
Adhesive Tape Width
6.3
Adhesive Tape Position
0.5
2. Maximum alignment deviation between leads not to be greater than 0.2 mm.
3. Defective components shall be clipped from the carrier tape such that the remaining protrusion (L) does not exceed a maximum of 11 mm.
4. Component lead to tape adhesion must meet the pull test requirements.
5. Maximum non−cumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches.
6. Holddown tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive.
7. No more than 1 consecutive missing component is permitted.
8. A tape trailer and leader, having at least three feed holes is required before the first and after the last component.
9. Splices will not interfere with the sprocket feed holes.
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8
Z0103MA, Z0107MA, Z0109MA
ORDERING & SHIPPING INFORMATION: Packaging Options, Device Suffix
Europe
Equivalent
U.S.
Shipping
Description of TO−92 Tape Orientation
Flat side of TO−92 and adhesive tape visible
N/A, Bulk
Z0103MARL1G
Radial Tape and Reel (2K/Reel)
Bulk in Box (5K/Box)
Z0103MAG
Z0103MARLRPG
Z0103MARLRFG
Radial Tape and Fan Fold Box (2K/Box)
Radial Tape and Fan Fold Box (2K/Box)
Round side of TO−92 and adhesive tape visible
Round side of TO−92 and adhesive tape on re-
verse side
Z0107MARL1G
Z0109MARL1G
Radial Tape and Reel (2K/Reel)
Bulk in Box (5K/Box)
Flat side of TO−92 and adhesive tape visible
N/A, Bulk
Z0107MAG
Z0107MARLRPG
Z0107MARLRFG
Radial Tape and Fan Fold Box (2K/Box)
Radial Tape and Fan Fold Box (2K/Box)
Round side of TO−92 and adhesive tape visible
Round side of TO−92 and adhesive tape on re-
verse side
Radial Tape and Reel (2K/Reel)
Bulk in Box (5K/Box)
Flat side of TO−92 and adhesive tape visible
N/A, Bulk
Z0109MAG
Z0109MARLRPG
Z0109MARLRFG
Radial Tape and Fan Fold Box (2K/Box)
Radial Tape and Fan Fold Box (2K/Box)
Round side of TO−92 and adhesive tape visible
Round side of TO−92 and adhesive tape on re-
verse side
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9
Z0103MA, Z0107MA, Z0109MA
PACKAGE DIMENSIONS
TO−92 (TO−226AA)
CASE 029−11
ISSUE AM
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
A
STRAIGHT LEAD
BULK PACK
B
R
4. LEAD DIMENSION IS UNCONTROLLED IN P AND
BEYOND DIMENSION K MINIMUM.
P
L
INCHES
DIM MIN MAX
MILLIMETERS
SEATING
PLANE
K
MIN
4.45
4.32
3.18
0.407
1.15
2.42
0.39
12.70
6.35
2.04
---
MAX
5.20
5.33
4.19
0.533
1.39
2.66
0.50
---
A
B
C
D
G
H
J
0.175
0.170
0.125
0.016
0.045
0.095
0.015
0.500
0.250
0.080
---
0.205
0.210
0.165
0.021
0.055
0.105
0.020
---
D
X X
G
J
H
V
K
L
---
---
N
P
R
V
0.105
0.100
---
2.66
2.54
---
C
SECTION X−X
0.115
0.135
2.93
3.43
1
N
---
---
N
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. CONTOUR OF PACKAGE BEYOND
DIMENSION R IS UNCONTROLLED.
A
BENT LEAD
TAPE & REEL
AMMO PACK
B
R
4. LEAD DIMENSION IS UNCONTROLLED IN P
AND BEYOND DIMENSION K MINIMUM.
P
T
MILLIMETERS
SEATING
PLANE
DIM MIN
MAX
5.20
5.33
4.19
0.54
2.80
0.50
---
K
A
B
C
D
G
J
4.45
4.32
3.18
0.40
2.40
0.39
12.70
2.04
1.50
2.93
3.43
D
X X
G
K
N
P
R
V
J
2.66
4.00
---
V
C
---
SECTION X−X
1
N
STYLE 12:
PIN 1. MAIN TERMINAL 1
2. GATE
3. MAIN TERMINAL 2
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
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PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
For additional information, please contact your local
Sales Representative
Z0103MA/D
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Z0103MAT/R
Logic level four-quadrant triacWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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NXP
Z0103MA_11
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NXP
Z0103MN
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Z0103MN
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STMICROELECTR
Z0103MN
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ONSEMI
Z0103MN,135
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NXP
Z0103MN/1AA2
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ETC
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