2SD2266Q [PANASONIC]

Power Bipolar Transistor, 4A I(C), 60V V(BR)CEO, 1-Element, NPN, Silicon, Plastic/Epoxy, 3 Pin, MT4, 3 PIN;
2SD2266Q
型号: 2SD2266Q
厂家: PANASONIC    PANASONIC
描述:

Power Bipolar Transistor, 4A I(C), 60V V(BR)CEO, 1-Element, NPN, Silicon, Plastic/Epoxy, 3 Pin, MT4, 3 PIN

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Power Transistors  
2SD2266  
Silicon NPN triple diffusion planar type  
Unit: mm  
For power switching  
10.0 0.ꢀ  
5.0 0.1  
1.0 0.ꢀ  
I Features  
High-speed switching  
Satisfactory linearity of forward current transfer ratio hFE  
Allowing supply with the radial taping  
1.ꢀ 0.1  
C 1.0  
18 0.ꢀ  
ꢀ.ꢀ5 0.ꢀ  
0.60.1  
35 0.1  
0.6
I Absolute Maximum Ratings TC = 25°C  
1.05
5 0.1  
Parameter  
Collector to base voltage  
Collector to emitter voltage  
Emitter to base voltage  
Peak collector current  
Collector current  
Symbol  
VCBO  
VCEO  
VEBO  
ICP  
Rating  
Unit  
V
0.55 0.1  
80  
ꢀ.5 0.ꢀ  
ꢀ.5 0.ꢀ  
60  
V
1
ꢀ 3  
7
1: Base  
2: Collector  
3: Emitter  
A
IC  
4
A
MT4 (MT4 Type Package)  
Base current  
IB  
1
A
TC = 25°C  
Ta = 25°C  
PC  
1
W
Collector power  
dissipation  
2
Junction temperature  
Storage temperature  
Tj  
150  
°C  
°C  
Tstg  
55 to +150  
I Electrical Charteristics TC = 25°C  
aram
Collector utoff urrent  
mitter cutof current  
Symbol  
ICBO  
Coditions  
Min  
Typ  
Max  
100  
Unit  
µA  
µA  
V
VCB = 80 V, IE = 0  
VEB = 6 V, IC = 0  
IC = 25 mA, IB = 0  
VCE = 4 V, IC = 1 A  
V= 4 V, IC = 4 A  
VCE = 4 V, IC = 4 A  
IC = 4 A, IB = 0.4 A  
IEO  
100  
Colctor to emittee  
Forward curre
VCEO  
60  
70  
20  
*
hFE1  
320  
hFE2  
VBE  
VCE(sat)  
fT  
Base to emitter volta
Collector to emitter saturation voltage  
Transition frequency  
Turn-on time  
2.0  
1.5  
V
V
VCE = 12 V, IC = 0.2 A, f = 10 MHz  
IC = 4 A, IB1 = 0.4 A, IB2 = 0.4 A,  
VCC = 50 V  
80  
0.3  
1.0  
0.2  
MHz  
µs  
ton  
Storage time  
tstg  
µs  
Fall time  
tf  
µs  
Note) : Rank classification  
*
Rank  
Q
P
O
hFE1  
70 to 150  
120 to 250 160 to 320  
1
2SD2266  
Power Transistors  
PC Ta  
IC VCE  
IC VBE  
20  
15  
10  
5
4
3
2
1
0
6
5
4
3
1
0
VCE=4V  
TC=25˚C  
IB=40mA  
(1) TC=Ta  
(2) Without heat sink  
(PC=2.0W)  
25˚C  
35mA  
100˚C  
TC=25˚C  
30mA  
25mA  
(1)  
20mA  
15mA  
10mA  
5mA  
(2)  
0
0
20 40 60 80 100 120 140 160  
0
1
2
3
4
5
7
0
1
3
4
)
(
)
(
)
(
Base to emie VBE V  
Ambient temperature Ta ˚C  
Collector to emitter voltge VC
V
VCE(sat) IC  
hFE
fT IC  
100  
104  
1000  
100  
10  
IC/IB=10  
VCE=4V  
VCE=12V  
f=10MHz  
TC=25˚C  
30  
10  
103  
102  
10  
1
TC=100˚C  
3
1
TC=100˚C  
25˚
25˚C  
0.3  
0.1  
2˚C  
25˚C  
1
0.03  
0.01  
0.1  
0.01 0.03  
0.0.03  
.1  
3
10  
0.01 0.03  
0.1  
0.3  
1
3
0  
0.1  
0.3  
1
3
10  
(
)
(
)
( )  
Collector current IC A  
Clector IC  
A
Collector curreIC  
A
Cob VCB  
ton, tstg, tf IC  
Area of safe operation (ASO)  
1000
1000  
100  
10  
100  
10  
100  
Pulsed tw=1ms  
Duty cycle=1%  
IC/IB=10 (IB1=IB2  
VCC=50V  
=0  
1MHz  
=25˚C  
Non repetitive pulse  
TC=25˚C  
)
30  
10  
TC=25˚C  
ICP  
IC  
t=1ms  
3
1
tstg  
DC  
1
ton  
tf  
0.3  
0.1  
0.1  
0.01  
0.03  
0.01  
1
1
3
10  
30  
100 300 1000  
0
1
2
3
4
5
6
7
)
8
1
3
10  
30  
100 300 1000  
(
)
(
( )  
Collector to emitter voltage VCE V  
Collector to base voltage VCB  
V
Collector current IC  
A
Power Transistors  
2SD2266  
Rth(t) t  
1000  
Note: Rth was measured at Ta=25˚C and under natural convection.  
(1) Without heat sink  
(2) With a 50 × 50 × 2mm Al heat sink  
100  
10  
1
(1)  
(2)  
0.1  
103  
102  
101  
1
10  
102  
103  
04  
( )  
s
Time  
t
3
Request for your special attention and precautions in using the technical information and  
semiconductors described in this book  
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and  
regulations of the exporting country, especially, those with regard to security export control, must be observed.  
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples  
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other  
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other  
company which may arise as a result of the use of technical information described in this book.  
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office  
equipment, communications equipment, measuring instruments and household appliances).  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support  
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-  
ucts may directly jeopardize life or harm the human body.  
Any applications other than the standard applications intended.  
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-  
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product  
Standards in advance to make sure that the latest specifications satisfy your requirements.  
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions  
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute  
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any  
defect which may arise later in your equipment.  
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure  
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire  
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.  
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,  
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which  
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.  
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita  
Electric Industrial Co., Ltd.  

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