2SK3539 [PANASONIC]

Silicon N-channel MOSFET; 硅N沟道MOSFET
2SK3539
型号: 2SK3539
厂家: PANASONIC    PANASONIC
描述:

Silicon N-channel MOSFET
硅N沟道MOSFET

晶体 小信号场效应晶体管 开关 光电二极管
文件: 总3页 (文件大小:84K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Silicon MOSFETs (Small Signal)  
2SK3539  
Silicon N-channel MOSFET  
Unit: mm  
+0.10  
+0.1  
–0.0  
For switching  
0.15  
0.3  
–0.05  
3
Features  
High-speed switching  
Wide frequency band  
Gate protection diode built-in  
1
2
(0.65) (0.65)  
1.3 0.1  
2.0 0.2  
Absolute Maximum Ratings Ta = 25°C  
10˚  
Parameter  
Drain-source voltage  
Symbol  
VDS  
VGSO  
ID  
Rating  
Unit  
V
50  
1: Gate  
2: Source  
3: Drain  
Gate-source voltage (Drain open)  
Drain current  
7
100  
V
mA  
mA  
mW  
°C  
EIAJ: SC-70  
SMini3-G1 Package  
Peak drain current  
IDP  
200  
Power dissipation  
PD  
150  
Marking Symbol: 5F  
Channel temperature  
Storage temperature  
Tch  
150  
Tstg  
55 to +150  
°C  
Electrical Characteristics Ta = 25°C 3°C  
Parameter  
Symbol  
VDSS  
IDSS  
Conditions  
Min  
Typ  
Max  
Unit  
V
Drain-source surrender voltage  
Drain-source cutoff current  
Gate-Source cutoff current  
Gate threshold voltage  
ID = 10 µA, VGS = 0  
VDS = 50 V, VGS = 0  
VGS 7 V, VDS = 0  
50  
1.0  
5.0  
1.5  
15  
µA  
µA  
V
IGSS  
=
Vth  
ID = 1.0 µA, VDS = 3 V  
0.9  
20  
1.2  
8
Drain-source ON resistance  
RDS(on)  
ID = 10 mA, VGS = 2.5 V  
ID = 10 mA, VGS = 4.0 V  
6
12  
Forward trancfer admitance  
Yfs  
ID = 10 mA, VDS = 3 V, f = 1 kHz  
VDS = 3 V, VGS = 0, f = 1 MHz  
60  
12  
mS  
pF  
Short-circuit forward transfer  
capacitance (Common source)  
Ciss  
Short-circuit output capacitance (Common source)  
Reverse transfer capacitance (Common source)  
Turn-on time *  
Coss  
Crss  
ton  
7
pF  
pF  
ns  
ns  
3
VDD = 3 V, VGS = 0 V to 3 V, RL = 470 Ω  
VDD = 3 V, VGS = 3 V to 0 V, RL = 470 Ω  
200  
200  
Turn-off time *  
toff  
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.  
2. : ton , toff test circuit  
*
VOUT  
470 Ω  
90%  
10%  
VIN  
VGS = 3.0 V  
50 Ω  
VDD = 3 V  
VOUT  
10%  
90%  
ton  
toff  
Publication date: January 2004  
SJF00035BED  
1
2SK3539  
PD Ta  
ID VDS  
ID VGS  
160  
120  
80  
40  
0
250  
200  
150  
100  
50  
Ta = 25°C  
VDS = 3 V  
VGS = 2.0 V  
60  
40  
20  
0
Ta = −25°C  
25°C  
75°C  
1.9 V  
1.8 V  
1.7 V  
1.6 V  
1.5 V  
0
0
0
40  
80  
120  
160  
4
8
0
1
2
3
Ambient temperature Ta (°C)  
Drain-source voltage VDS (V)  
Gate-source voltage VGS (V)  
Yfs  VGS  
RDS(on) VGS  
VIN IO  
10  
60  
50  
40  
30  
20  
10  
0
VO = 5 V  
ID = 10 mA  
VDS = 3 V  
f = 1 MHz  
Ta = 25°C  
TC = 25°C  
0.16  
0.12  
0.08  
0.04  
0
1
25°C  
Ta = 75°C  
25°C  
101  
1
10  
102  
103  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
0
2
4
6
(
)
Output current IO mA  
Gate-source voltage VGS (V)  
Gate-source voltage VGS (V)  
SJF00035BED  
2
Request for your special attention and precautions in using the technical information  
and semiconductors described in this material  
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of  
the products or technical information described in this material and controlled under the "Foreign Exchange  
and Foreign Trade Law" is to be exported or taken out of Japan.  
(2) The technical information described in this material is limited to showing representative characteristics and  
applied circuits examples of the products. It neither warrants non-infringement of intellectual property right  
or any other rights owned by our company or a third party, nor grants any license.  
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical  
information as described in this material.  
(4) The products described in this material are intended to be used for standard applications or general elec-  
tronic equipment (such as office equipment, communications equipment, measuring instruments and house-  
hold appliances).  
Consult our sales staff in advance for information on the following applications:  
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combus-  
tion equipment, life support systems and safety devices) in which exceptional quality and reliability are  
required, or if the failure or malfunction of the products may directly jeopardize life or harm the human  
body.  
Any applications other than the standard applications intended.  
(5) The products and product specifications described in this material are subject to change without notice for  
modification and/or improvement. At the final stage of your design, purchasing, or use of the products,  
therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifica-  
tions satisfy your requirements.  
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rat-  
ing, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not  
be liable for any defect which may arise later in your equipment.  
Even when the products are used within the guaranteed values, take into the consideration of incidence of  
break down and failure mode, possible to occur to semiconductor products. Measures on the systems such  
as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent  
physical injury, fire, social damages, for example, by using the products.  
(7) When using products for which damp-proof packing is required, observe the conditions (including shelf life  
and amount of time let standing of unsealed items) agreed upon when specification sheets are individually  
exchanged.  
(8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written  
permission of Matsushita Electric Industrial Co., Ltd.  
2003 SEP  

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