MN102H74G [PANASONIC]
MN102H74D;型号: | MN102H74G |
厂家: | PANASONIC |
描述: | MN102H74D |
文件: | 总5页 (文件大小:367K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MN102H74D, MN102H74G
Type
MN102H74D
MN102H74G
MN102HF74G
Internal ROM type
ROM (byte)
Mask ROM
FLASH
64K
128K
RAM (byte)
4K
Package (Lead-free)
LQFP100-P-1414
[With main clock operated]
83.3 ns (at 3.0 V to 3.6 V, 12 MHz)
Minimum Instruction
Execution Time
Interrupts
/RST pin, Watchdog, /NMI pin, Timer counter 0 to 9 underflow, Timer counter 10 to 13 under/o Verflow, Timer counter 10 to 13
compare capture A, Timer counter 10 to 13 compare capture B, ATC ch.0 to ch.3 tra nsfer finish, External 0 to 5, Serial ch.0 to ch.3
tra nsmission, Serial ch.0 to ch.3 reception, A/D conversion finish, USB general-purpose, USBSOF, USB end points 1 to 8
Timer Counter
Timer counter 0 : 8-bit × 1 (timer output, event count, timer interrupt)
Clock source................ SYSCLK; XI; prescaler 0; TM0IO pin
Interrupt source ........... Timer counter 0 underflow
Timer counter 1 : 8-bit × 1 (timer output, event count, timer interrupt)
Clock source................ SYSCLK; prescaler 0; TM1IO pin
Interrupt source ........... Timer counter 1 underflow
Connectable Timer counters 0 to 1
Timer counter 2 : 8-bit × 1
(timer output, event count, timer interrupt, A/D conversion start)
Clock source................ SYSCLK; 1/8 of SYSCLK; 1/32 of SYSCLK; timer counter 3 underflow; timer counter 4 underflow;
TM2IO pin
Interrupt source ........... Timer counter 2 underflow
Timer counter 3 : 8-bit × 1 (timer output, event count, timer interrupt)
Clock source................ SYSCLK; 1/8 of SYSCLK; 1/32 of SYSCLK; timer counter 2 underflow; timer counter 4 underflow;
TM3IO pin
Interrupt source ........... Timer counter 3 underflow
Timer counter 4 : 8-bit × 1 (timer output, event count, timer interrupt)
Clock source................ SYSCLK; 1/8 of SYSCLK; 1/32 of SYSCLK; timer counter 2 underflow; timer counter 3 underflow;
TM4IO pin
Interrupt source ........... Timer counter 4 underflow
Timer counter 5 : 8-bit × 1 (timer output, event count, timer interrupt)
Clock source................ SYSCLK; 1/8 of SYSCLK; 1/32 of SYSCLK; timer counter 2 underflow; timer counter 3 underflow;
timer counter 4 underflow; TM5IO pin
Interrupt source ........... Timer counter 5 underflow
Connectable Timer counters 2 to 5
Timer counter 6 : 8-bit × 1
(timer output, event count, timer interrupt, serial clock generation)
Clock source................ SYSCLK; 1/8 of SYSCLK; 1/32 of SYSCLK; timer counter 7 underflow; timer counter 8 underflow;
TM6IO pin
Interrupt source ........... Timer counter 6 underflow
Timer counter 7 : 8-bit × 1
(timer output, event count, timer interrupt, serial clock generation)
Clock source................ SYSCLK; 1/8 of SYSCLK; 1/32 of SYSCLK; timer counter 6 underflow; timer counter 8 underflow;
TM7IO pin
Interrupt source ........... Timer counter 7 underflow
MAE00011GEM
MN102H74D, MN102H74G
Timer counter 8 : 8-bit × 1
(timer output, event count, timer interrupt, serial clock generation)
Clock source................ SYSCLK; 1/8 of SYSCLK; 1/32 of SYSCLK; timer counter 6 underflow; timer counter 7 underflow;
TM8IO pin
Interrupt source ........... Timer counter 8 underflow
Timer counter 9 : 8-bit × 1 (timer output, event count, timer interrupt)
Clock source................ SYSCLK; 1/8 of SYSCLK; 1/32 of SYSCLK; timer counter 6 underflow; timer counter 7 underflow;
timer counter 8 underflow; TM9IO pin
Interrupt source ........... Timer counter 9 underflow
Connectable Timer counters 6 to 9
Timer counter 10 : 16-bit × 1
(timer output, event count, input capture, PWM output, 2-phase encoder input)
Clock source................ SYSCLK; 1/8 of SYSCLK; timer counter 2 or 3 underflow; 2-phase encoding of TM10IOA/TM10IOB
pin (1×, 4×); TM10IOB pin
Interrupt source ........... Timer counter 10 under/overflow; timer counter 10 compare capture A; timer counter 10 compare capture
B
Timer counter 11 : 16-bit × 1
(timer output, event count, input capture, PWM output, 2-phase encoder input)
Clock source................ SYSCLK; 1/8 of SYSCLK; timer counter 8 or 9 underflow; 2-phase encoding of TM11IOA/TM11IOB
pin (1×, 4×); TM11IOB pin
Interrupt source ........... Timer counter 11 under/overflow; timer counter 11 compare capture A; timer counter 11 compare capture
B
Timer counter 12 : 16-bit × 1
(timer output, event count, input capture, PWM output, 2-phase encoder input)
Clock source................ SYSCLK; 1/8 of SYSCLK; timer counter 4 or 5 underflow; 2-phase encoding of TM12IOA/TM12IOB
pin (1×, 4×); TM12IOB pin
Interrupt source ........... Timer counter 12 under/overflow; timer counter 12 compare capture A; timer counter 12 compare capture
B
Timer counter 13 : 16-bit × 1
(timer output, event count, input capture, PWM output, 2-phase encoder input)
Clock source................ SYSCLK; 1/8 of SYSCLK; timer counter 6 or 7 underflow; 2-phase encoding of TM13IOA/TM13IOB
pin (1×, 4×); TM13IOB pin
Interrupt source ........... Timer counter 13 under/overflow; timer counter 13 compare capture A; timer counter 13 compare capture
B
Serial interface
Serial 0 : 8-bit × 1 (transfer direction of MSB/LSB selectable; transmission / reception of 7, 8-bit length)
Clock source................ 1/2 or 1/16 of timer counter 6 underflow; external pin
Serial 1 : 8-bit × 1 (transfer direction of MSB/LSB selectable; transmission / reception of 7, 8-bit length)
Clock source................ 1/2 or 1/16 of timer counter 7 underflow; external pin
Serial 2 : 8-bit × 1 (transfer direction of MSB/LSB selectable; transmission / reception of 7, 8-bit length)
Clock source................ 1/2 or 1/16 of timer counter 8 underflow; external pin
Serial 3 : 8-bit × 1 (transfer direction of MSB/LSB selectable; transmission / reception of 7, 8-bit length)
Clock source................ 1/2 or 1/16 of timer counter 9 underflow; external pin
UART × 4 (common use with serial 0 to 3)
I²C × 2 (common use with serial 0, 1; single master)
MAE00011GEM
DMA controller
4-ch.
DMA transfer enabled between memory and memory or memory and peripheral register by set interrupt factor and software
activation setting
Transfer unit : bytes/word
Transfer mode : 1 word/burst (max. 128 K bytes)
Transfer addressing : source/destination pointer fix/increment
High-speed transfer enabled between USB-FIFO and internal RAM in single address mode
USB Functions
Conforms to USB1.1.
USB transceiver built-in
Full-speed (12 Mbps) supported.
9 end points (FIFO built-in independently)
FIFO size
(EP0, 1, 2, 3, 4, 5, 6, 7, 8) : 64, 128, 128, 128, 128, 128, 128, 128, 128 bytes
・EP0
Control transfer
IN/OUT (two ways)
・EP1 to EP8
Interrupt/Bulk/Isochronous transfer supported.
Settable to IN or OUT.
Double Buffering function supported.
When the MAXP size is set to a half or less of the MAXFIFO size for each EP, the Double Buffering function is made valid
automatically.
I/O Pins
I/O
77
Common use : 77 (pull-up resistance specifiable)
A/D converter
10-bit × 8-ch. (with S/H)
Special Ports
USB ports (D+, D-)
Notes
4 multiply PLL built-in, generation of internal 48 MHz at external oscillation 12 MHz
Electrical Charactreistics (Supply current)
Limit
typ
Parameter
Symbol
Condition
VI = VDD or VSS, output open
Unit
min
max
65+10α* mA
70 µA
Operating supply current
Supply current at STOP
IDDopr
IDDS
f = 12 MHz , VDD = 3.3 V
Pin with pull-up resistor is open all other input pins and
Hi-Z state input/output pins are simultaneously applied
VDD or VSS level
Supply current at HALT0
IDDH
30+10α* mA
f = 12 MHz , VDD = 3.3 V, output open
(Ta = –20°C to +70°C , VDD = 3.3 V, VSS = 0 V)
Note) * "α" depends on products.
MN102H74D, MN102H74G α= 0
MN102HF74G α = 1
Development tools
In-circuit Emulator
PX-ICE102H74-LQFP100-P-1414
MAE00011GEM
MN102H74D, MN102H74G
Pin Assignment
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
PB0, /IRQ0
PB1, /IRQ1
PB2, /IRQ2
PB3, /IRQ3
PB4, /IRQ4
/CS3S, (TM9IO), SBT3, P72
/CS2S, (TM8IO), SBO3, P71
/CS1S, (TM7IO), SBI3, P70
/CS0S, (TM6IO), A23, P47
(TM5IO), A22, P46
(TM4IO), A21, P45
(TM3IO), A20, P44
VSS
(TM2IO), A19, P43
A18, P42
A17, P41
A16, P40
A15, P37
A14, P36
A13, P35
A12, P34
VDD
A11, P33
A10, P32
A09, P31
A08, P30
A07, P27
A06, P26
A05, P25
PB5, /IRQ5
/RST
VDD
P00, D00
P01, D01
P02, D02
P03, D03
P04, D04
P05, D05
MN102H74D
MN102H74G
P06, D06
P07, D07
VSS
P10, D08, (TM2IO)
P11, D09, (TM3IO)
P12, D10, (TM4IO)
P13, D11, (TM5IO)
P14, D12, (TM6IO)
P15, D13, (TM7IO)
P16, D14, (TM8IO)
P17, D15, (TM9IO)
26
A04, P24
LQFP100-P-1414
Note : Use 4.7 kΩ to 10 kΩ
*
MAE00011GEM
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd. Industrial Co., Ltd.
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