BYV29B-500 [NXP]
Rectifier diodes ultrafast; 整流二极管超快
| 型号： | BYV29B-500 |
| 厂家： | 
NXP |
| 描述： | Rectifier diodes ultrafast |
| 文件： | 总5页 (文件大小：45K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Philips Semiconductors
Product specification
Rectifier diodes
ultrafast
BYV29B-500
FEATURES
SYMBOL
QUICK REFERENCE DATA
• Low forward volt drop
• Fast switching
VR = 500 V
• Soft recovery characteristic
• High thermal cycling performance
• Low thermal resistance
k
1
a
2
VF ≤ 1.03 V
IF(AV) = 9 A
trr ≤ 60 ns
GENERAL DESCRIPTION
PINNING
SOT404 (D2-PAK)
Ultra-fast, epitaxial rectifier diodes
intended for use as output rectifiers
in high frequency switched mode
power supplies.
PIN
DESCRIPTION
no connection
cathode1
tab
1
2
The BYV29B-500 is supplied in the
SOT404
package.
surface
mounting
3
anode
2
tab
cathode
1
3
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134).
SYMBOL PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VRRM
VRWM
VR
IF(AV)
IFRM
IFSM
Peak repetitive reverse voltage
-
-
-
-
-
-
-
500
500
500
9
V
V
V
A
A
A
A
Crest working reverse voltage
Continuous reverse voltage
Average forward current2
square wave; δ = 0.5; Tmb ≤ 123 ˚C
Repetitive peak forward current t = 25 µs; δ = 0.5; Tmb ≤ 123 ˚C
Non-repetitive peak forward
current.
18
t = 10 ms
t = 8.3 ms
sinusoidal; with reapplied VRRM(max)
100
110
Tstg
Tj
Storage temperature
Operating junction temperature
-40
-
150
150
˚C
˚C
THERMAL RESISTANCES
SYMBOL PARAMETER
CONDITIONS
MIN. TYP. MAX. UNIT
Rth j-mb
Thermal resistance junction to
mounting base
Thermal resistance junction to minimum footprint, FR4 board.
ambient
-
-
2.5
K/W
Rth j-a
-
50
-
K/W
1 it is not possible to make a connection to pin 2 of the SOT404 package
2 Neglecting switching and reverse current losses.
September 2001
1
Rev 1.000
Philips Semiconductors
Product specification
Rectifier diodes
ultrafast
BYV29B-500
ELECTRICAL CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated
SYMBOL PARAMETER
CONDITIONS
MIN. TYP. MAX. UNIT
VF
Forward voltage
IF = 8 A; Tj = 150˚C
IF = 8 A
-
-
-
-
-
-
0.90
1.05
1.20
2.0
1.03
1.25
1.40
50
V
V
IF = 20 A
V
IR
Reverse current
VR = VRRM
µA
mA
nC
VR = VRRM; Tj = 100 ˚C
IF = 2 A to VR ≥ 30 V;
dIF/dt = 20 A/µs
IF = 1 A to VR ≥ 30 V;
dIF/dt = 100 A/µs
0.1
0.35
60
Qs
trr
Reverse recovery charge
Reverse recovery time
40
-
-
-
50
4.0
2.5
60
5.5
-
ns
A
Irrm
Vfr
Peak reverse recovery current IF = 10 A to VR ≥ 30 V;
dIF/dt = 50 A/µs; Tj = 100˚C
Forward recovery voltage
IF = 10 A; dIF/dt = 10 A/µs
V
Tmb(max) / C
D = 1.0
PF / W
15
dI
F
112.5
125
I
Vo = 0.8900 V
F
Rs = 0.0190 Ohms
dt
0.5
t
rr
10
0.2
time
0.1
5
137.5
150
t
T
p
tp
I
D =
Q
s
100%
10%
I
t
I
R
T
rrm
0
0
5
10
15
IF(AV) / A
Fig.1. Definition of trr, Qs and Irrm
Fig.3. Maximum forward dissipation PF = f(IF(AV));
square wave where IF(AV) =IF(RMS) x √D.
Tmb(max) / C
a = 1.57
PF / W
I
12
10
8
120
125
130
135
140
F
F
Vo = 0.89V
Rs = 0.019 Ohms
1.9
2.2
2.8
4
time
time
6
V
4
V
2
145
150
fr
V
F
0
0
2
4
6
8
10
IF(AV) / A
Fig.2. Definition of Vfr
Fig.4. Maximum forward dissipation PF = f(IF(AV));
sinusoidal current waveform where a = form
factor = IF(RMS) / IF(AV)
.
September 2001
2
Rev 1.000
Philips Semiconductors
Product specification
Rectifier diodes
ultrafast
BYV29B-500
trr / ns
1000
IF / A
30
20
10
0
Tj=150 C
Tj=25 C
IF=10 A
1A
100
10
typ
max
Tj = 25 C
Tj = 100C
1
1
100
10
dIF/dt (A/us)
0.5
1.5
0
1
2
VF / V
Fig.5. Maximum trr at Tj = 25˚C and 100˚C
Fig.7. Typical and maximum forward characteristic
IF = f(VF); parameter Tj
Qs / nC
1000
Irrm / A
10
IF=10A
IF = 10 A
100
1
IF=1A
2 A
0.1
10
Tj = 25 C
Tj = 100C
0.01
1
10
100
1
1.0
10
100
-dIF/dt (A/us)
-dIF/dt (A/us)
Fig.6. Maximum Irrm at Tj = 25˚C and 100˚C.
Fig.8. Maximum Qs at Tj = 25˚C
Transient thermal impedance, Zth j-mb (K/W)
10
1
0.1
p
t
p
t
P
0.01
D
D =
T
t
T
0.001
1us
10us 100us 1ms
10ms 100ms
1s
10s
pulse width, tp (s)
Fig.9. Transient thermal impedance Zth j-mb= f(tp)
September 2001
3
Rev 1.000
Philips Semiconductors
Product specification
Rectifier diodes
ultrafast
BYV29B-500
MECHANICAL DATA
Dimensions in mm
Net Mass: 1.4 g
4.5 max
1.4 max
10.3 max
11 max
15.4
2.5
0.85 max
(x2)
0.5
2.54 (x2)
Fig.10. SOT404 : centre pin connected to mounting base.
MOUNTING INSTRUCTIONS
Dimensions in mm
11.5
9.0
17.5
2.0
3.8
5.08
Fig.11. SOT404 : soldering pattern for surface mounting.
Notes
1. Epoxy meets UL94 V0 at 1/8".
September 2001
4
Rev 1.000
Philips Semiconductors
Product specification
Rectifier diodes
ultrafast
BYV29B-500
DEFINITIONS
DATA SHEET STATUS
DATA SHEET
STATUS3
PRODUCT
DEFINITIONS
STATUS4
Objective data
Development
This data sheet contains data from the objective specification for
product development. Philips Semiconductors reserves the right to
change the specification in any manner without notice
Preliminary data
Qualification
Production
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in ordere to improve the design and supply the best possible
product
Product data
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in
order to improve the design, manufacturing and supply. Changes will
be communicated according to the Customer Product/Process
Change Notification (CPCN) procedure SNW-SQ-650A
Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or at any other conditions above those given in the Characteristics sections of
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Philips Electronics N.V. 2001
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the
copyright owner.
The information presented in this document does not form part of any quotation or contract, it is believed to be
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under patent or other
industrial or intellectual property rights.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these
products can be reasonably expected to result in personal injury. Philips customers using or selling these products
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting
from such improper use or sale.
3 Please consult the most recently issued datasheet before initiating or completing a design.
4 The product status of the device(s) described in this datasheet may have changed since this datasheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
September 2001
5
Rev 1.000
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