PMEG2010AEK,115 [NXP]
PMEG2010AEK;
| 型号： | PMEG2010AEK,115 |
| 厂家： | 
NXP |
| 描述： | PMEG2010AEK |
| 文件： | 总9页 (文件大小：61K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PMEG2010AEK
1 A very low VF MEGA Schottky barrier rectifier
Rev. 01 — 30 March 2007
Product data sheet
1. Product profile
1.1 General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an
integrated guard ring for stress protection, encapsulated in a SOT346 (SC-59A/TO-236)
small Surface-Mounted Device (SMD) plastic package.
1.2 Features
I Forward current: IF ≤ 1 A
I Reverse voltage: VR ≤ 20 V
I Very low forward voltage
I Small SMD plastic package
1.3 Applications
I Low voltage rectification
I High efficiency DC-to-DC conversion
I Switch mode power supply
I Reverse polarity protection
I Low power consumption applications
1.4 Quick reference data
Table 1.
Symbol
IF
Quick reference data
Parameter
Conditions
sp ≤ 55 °C
Min
Typ
Max
1
Unit
A
forward current
reverse voltage
forward voltage
T
-
-
-
-
VR
-
20
V
[1]
VF
IF = 1 A
400
450
mV
[1] Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
PMEG2010AEK
NXP Semiconductors
1 A very low VF MEGA Schottky barrier rectifier
2. Pinning information
Table 2.
Pinning
Pin
1
Description
anode
Simplified outline
Symbol
3
3
2
not connected
cathode
2
n.c.
3
1
006aaa436
1
2
3. Ordering information
Table 3.
Ordering information
Type number
Package
Name
Description
Version
PMEG2010AEK
SC-59A
plastic surface-mounted package; 3 leads
SOT346
4. Marking
Table 4.
Marking codes
Type number
PMEG2010AEK
Marking code
H1
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VR
Parameter
Conditions
Min
Max
20
1
Unit
V
reverse voltage
forward current
-
-
-
IF
Tsp ≤ 55 °C
A
IFRM
repetitive peak forward current tp ≤ 1 ms;
δ ≤ 0.25
3
A
IFSM
Ptot
non-repetitive peak forward
current
square wave;
tp = 8 ms
-
4.5
A
[1]
[2]
total power dissipation
T
amb ≤ 25 °C
-
250
mW
mW
°C
-
350
Tj
junction temperature
ambient temperature
storage temperature
-
150
Tamb
Tstg
−65
−65
+150
+150
°C
°C
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
PMEG2010AEK_1
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 — 30 March 2007
2 of 9
PMEG2010AEK
NXP Semiconductors
1 A very low VF MEGA Schottky barrier rectifier
6. Thermal characteristics
Table 6.
Symbol
Rth(j-a)
Thermal characteristics
Parameter
Conditions
Min
Typ
Max Unit
[1]
[2]
[3]
[4]
thermal resistance from
junction to ambient
in free air
-
-
-
-
-
-
500
360
150
K/W
K/W
K/W
Rth(j-sp)
thermal resistance from
junction to solder point
[1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse
power losses PR are a significant part of the total power losses.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[4] Soldering point of cathode tab.
7. Characteristics
Table 7.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter Conditions
Min
Typ
Max
Unit
[1]
VF
forward voltage
IF = 10 mA
IF = 100 mA
IF = 1 A
-
-
-
-
-
-
-
200
265
400
15
220
290
450
20
mV
mV
mV
µA
µA
µA
pF
IR
reverse current
VR = 5 V
VR = 10 V
VR = 20 V
20
80
50
200
70
Cd
diode capacitance VR = 5 V; f = 1 MHz
55
[1] Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
PMEG2010AEK_1
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 — 30 March 2007
3 of 9
PMEG2010AEK
NXP Semiconductors
1 A very low VF MEGA Schottky barrier rectifier
006aab032
006aab033
4
5
10
10
I
R
I
F
(µA)
4
3
2
(mA)
(1)
(2)
10
10
10
3
2
10
(1)
(2) (3)
(4)
(5)
10
(3)
(4)
10
10
1
−1
10
1
−2
10
10
−1
−3
10
0
0.2
0.4
0.6
0
5
10
15
20
V
(V)
V (V)
R
F
(1) Tamb = 150 °C
(2) Tamb = 125 °C
(3) Tamb = 85 °C
(4) Tamb = 25 °C
(5) Tamb = −40 °C
(1) Tamb = 125 °C
(2) Tamb = 85 °C
(3) Tamb = 25 °C
(4) Tamb = −40 °C
Fig 1. Forward current as a function of forward
voltage; typical values
Fig 2. Reverse current as a function of reverse
voltage; typical values
mdb824
200
C
d
(pF)
150
100
50
0
0
5
10
15
20
V
R
(V)
f = 1 MHz; Tamb = 25 °C
Fig 3. Diode capacitance as a function of reverse voltage; typical values
PMEG2010AEK_1
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 — 30 March 2007
4 of 9
PMEG2010AEK
NXP Semiconductors
1 A very low VF MEGA Schottky barrier rectifier
8. Test information
t
t
1
2
P
duty cycle δ =
t
2
t
1
t
006aaa812
Fig 4. Duty cycle definition
9. Package outline
3.1
2.7
1.3
1.0
3
0.6
0.2
3.0 1.7
2.5 1.3
1
2
0.50
0.35
0.26
0.10
1.9
Dimensions in mm
04-11-11
Fig 5. Package outline SOT346 (SC-59A/TO-236)
10. Packing information
Table 8.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
Package
Description
Packing quantity
3000
10000
PMEG2010AEK SOT346
4 mm pitch, 8 mm tape and reel
-115
-135
[1] For further information and the availability of packing methods, see Section 14.
PMEG2010AEK_1
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 — 30 March 2007
5 of 9
PMEG2010AEK
NXP Semiconductors
1 A very low VF MEGA Schottky barrier rectifier
11. Soldering
3.30
1.00
0.70 (3x)
0.60 (3x)
0.70
(3x)
3
0.95
3.40
3.15
1.55
0.95
1
2
1.20
2.60
2.90
sot346
solder lands
solder paste
solder resist
occupied area
Dimensions in mm
Fig 6. Reflow soldering footprint SOT346 (SC-59A/TO-236)
4.70
2.80
solder lands
solder resist
occupied area
Dimensions in mm
3
5.20 4.60 1.20
1
2
sot346
1.20 (2x)
3.40
preferred transport direction during soldering
Fig 7. Wave soldering footprint SOT346 (SC-59A/TO-236)
PMEG2010AEK_1
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 — 30 March 2007
6 of 9
PMEG2010AEK
NXP Semiconductors
1 A very low VF MEGA Schottky barrier rectifier
12. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
PMEG2010AEK_1
20070330
Product data sheet
-
-
PMEG2010AEK_1
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 — 30 March 2007
7 of 9
PMEG2010AEK
NXP Semiconductors
1 A very low VF MEGA Schottky barrier rectifier
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of a NXP Semiconductors product can reasonably be expected to
13.2 Definitions
result in personal injury, death or severe property or environmental damage.
NXP Semiconductors accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or applications and therefore
such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
13.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
14. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: salesaddresses@nxp.com
PMEG2010AEK_1
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 — 30 March 2007
8 of 9
PMEG2010AEK
NXP Semiconductors
1 A very low VF MEGA Schottky barrier rectifier
15. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
1.4
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Test information. . . . . . . . . . . . . . . . . . . . . . . . . 5
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5
Packing information. . . . . . . . . . . . . . . . . . . . . . 5
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 7
3
4
5
6
7
8
9
10
11
12
13
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 8
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
13.1
13.2
13.3
13.4
14
15
Contact information. . . . . . . . . . . . . . . . . . . . . . 8
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2007.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 30 March 2007
Document identifier: PMEG2010AEK_1
相关型号：
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