SL3S1203FUD/BG,005_技术文档

SL3S1203_1213

UCODE G2iL and G2iL+

Rev. 4.3 — 27 November 2013

178843

Product data sheet

COMPANY PUBLIC

1. General description

NXP’s UCODE G2iL series transponder ICs offer leading-edge read range and support

industry-first features such as a Tag Tamper Alarm, Data Transfer, Digital Switch, and

advanced privacy-protection modes.

Very high chip sensitivity (18 dBm) enables longer read ranges with simple, single-port

antenna designs. When connected to a power supply, the READ as well as the WRITE

range can be boosted to a sensitivity of 27 dBm. In fashion and retail the UCODE G2iL

series improve read rates and provide for theft deterrence. For consumer electronics the

UCODE G2iL series is suited for device configuration, activation, production control, and

PCB tagging. In authentication applications the transponders can be used to protect

brands and guard against counterfeiting. They can also be used to tag containers,

electronic vehicles, airline baggage, and more.

In addition to the EPC specifications the G2iL offers an integrated Product Status Flag

(PSF) feature and read protection of the memory content.

On top of the G2iL features the G2iL+ offers an integrated tag tamper alarm, RF field

detection, digital switch, external supply mode, read range reduction and data transfer

mode.

2. Features and benefits

2.1 Key features

 UHF RFID Gen2 tag chip according EPCglobal v1.2.0 with 128 bit EPC memory

 Memory read protection

 Integrated Product Status Flag (PSF)

 Tag tamper alarm

 RF field detection

 Digital switch

 Data transfer mode

 Real Read Range Reduction (Privacy Mode)

 External supply mode where both the READ & WRITE range are boosted to -27dBm

2.1.1 Memory

 128-bit of EPC memory

 64-bit Tag IDentifier (TID) including 32-bit factory locked unique serial number

 32-bit kill password to permanently disable the tag

 32-bit access password to allow a transition into the secured state

SL3S1203_1213

NXP Semiconductors

UCODE G2iL and G2iL+

 Data retention: 20 years

 Broad international operating frequency: from 840 MHz to 960 MHz

 Long read/write ranges due to extremely low power design

 Reliable operation of multiple tags due to advanced anti-collision

 READ protection

 WRITE Lock

 Wide specified temperature range: 40 C up to +85 C

2.2 Key benefits

2.2.1 End user benefit

 Prevention of unauthorized memory access through read protection

 Indication of tag tampering attempt by use of the tag tamper alarm feature

 Electronic device configuration and / or activation by the use of the digital switch / data

transfer mode

 Theft deterrence supported by the PSF feature (PSF alarm or EPC code)

 Small label sizes, long read ranges due to high chip sensitivity

 Product identification through unalterable extended TID range, including a 32-bit serial

number

 Reliable operation in dense reader and noisy environments through high interference

suppression

2.2.2 Antenna design benefits

 High sensitivity enables small and cost efficient antenna designs

 Low Q-Value eases broad band antenna design for global usage

2.2.3 Label manufacturer benefit

 Consistent performance on different materials due to low Q-factor

 Ease of assembly and high assembly yields through large chip input capacitance

 Fast first WRITE of the EPC memory for fast label initialization

2.3 Custom commands

 PSF Alarm

Built-in PSF (Product Status Flag), enables the UHF RFID tag to be used as EAS tag

(Electronic Article Surveillance) tag without the need for a back-end data base.

 Read Protect

Protects all memory content including CRC16 from unauthorized reading.

 ChangeConfig

Configures the additional features of the chip like external supply mode, tamper alarm,

digital switch, read range reduction or data transfer.

The UCODE G2iL is equipped with a number of additional features and custom

commands. Nevertheless, the chip is designed in a way standard EPCglobal

READ/WRITE/ACCESS commands can be used to operate the features. No custom

commands are needed to take advantage of all the features in case of unlocked EPC

memory.

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3. Applications

3.1 Markets

 Fashion (Apparel and footwear)

 Retail

 Electronics

 Fast Moving Consumer Goods

 Asset management

 Electronic Vehicle Identification

3.2 Applications

 Supply chain management

 Item level tagging

 Pallet and case tracking

 Container identification

 Product authentication

 PCB tagging

 Cost efficient, low level seals

 Wireless firmware download

 Wireless product activation

Outside above mentioned applications, please contact NXP Semiconductors for support.

4. Ordering information

Table 1.

Ordering information

Type number

Package

Name

Wafer

IC type

G2iL

Description

Version

SL3S1203FUF

SL3S1213FUF

SL3S1203FUD/BG

bumped die on sawn 8” 75 m wafer

not applicable

Wafer

G2iL+

G2iL

Wafer

bumped die on sawn 8” 120 m wafer,

7 m Polyimide spacer

SL3S1213FUD/BG

SL3S1203FTB0

Wafer

G2iL+

G2iL

bumped die on sawn 8” 120 m wafer,

7 m Polyimide spacer

not applicable

SOT886F1

XSON6

plastic extremely thin small outline package;

no leads; 6 terminals; body 1  1.45  0.5 mm

5. Marking

Table 2.

Marking codes

Type number

Marking code

Comment

Version

SL3S1203FTB0

UN

UCODE G2iL

SOT886

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6. Block diagram

The SL3S12x3 IC consists of three major blocks:

- Analog Interface

- Digital Control

- EEPROM

The analog part provides stable supply voltage and demodulates data received from the

reader for being processed by the digital part. Further, the modulation transistor of the

analog part transmits data back to the reader.

The digital section includes the state machines, processes the protocol and handles

communication with the EEPROM, which contains the EPC and the user data.

ANALOG

RF INTERFACE

DIGITAL CONTROL

ANTICOLLISION

EEPROM

VREG

PAD

VDD

RECT

DEMOD

READ/WRITE

CONTROL

data

in

ANTENNA

ACCESS CONTROL

MEMORY

MOD

PAD

data

out

R/W

EEPROM INTERFACE

CONTROL

PAD

VDD

OUT

I/O

CONTROL

RF INTERFACE

CONTROL

I/O CONTROL

SEQUENCER

CHARGE PUMP

001aam226

Fig 1. Block diagram of G2iL IC

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7. Pinning information

OUT

RFN

SL3S12x3FTB0

RFP

n.c.

1

2

3

6

5

4

VDD

n.c.

VDD NXP trademark

RFP

RFN

OUT

001aan103

001aam529

Transparent top view

Fig 2. Pinning bare die

Fig 3. Pin configuration for SOT886

7.1 Pin description

Table 3.

Symbol

OUT

Pin description bare die

Description

output pin

RFN

grounded antenna connector

external supply

VDD

RFP

ungrounded antenna connector

Table 4.

Pin description SOT886

1

Symbol

RFP

n.c.

Description

ungrounded antenna connector

not connected

2

3

RFN

OUT

n.c.

grounded antenna connector

output pin

4

5

not connected

6

VDD

external supply

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8. Wafer layout

8.1 Wafer layout

(1)

OUT

RFN

(5)

Y

(4)

(6)

X

(7)

VDD

RFP

(8)

(2)

(3)

not to scale!

001aak871

(1) Die to Die distance (metal sealring - metal sealring) 21,4 m, (X-scribe line width: 15 m)

(2) Die to Die distance (metal sealring - metal sealring) 21,4 m, (Y-scribe line width: 15 m)

(3) Chip step, x-length: 485 m

(4) Chip step, y-length: 435 m

(5) Bump to bump distance X (OUT - RFN): 383 m

(6) Bump to bump distance Y (RFN - RFP): 333 m

(7) Distance bump to metal sealring X: 40,3 m (outer edge - top metal)

(8) Distance bump to metal sealring Y: 40,3 m

Bump size X x Y: 60 m x 60 m

Remark: OUT and VDD are used with G2iL+ only

Fig 4. G2iL wafer layout

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9. Mechanical specification

The UCODE G2iL/G2iL+ wafers are available in 75 m and 120 m thickness. The 75m

thick wafer allows ultra thin label design but require a proper tuning of the glue dispenser

during production. Because of the more robust structure of the 120m wafer, the wafer is

ideal for harsh applications. The 120 m thick wafer is also enhanced with 7m Polyimide

spacer allowing additional protection of the active circuit.

9.1 Wafer specification

See Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on

UV-tape with electronic fail die marking, BU-ID document number: 1093**”.

9.1.1 Wafer

Table 5. Specifications

Wafer

Designation

each wafer is scribed with batch number

and wafer number

Diameter

200 mm (8”)

Thickness

SL3S12x3FUF

75 m  15 m

SL3S12x3FUD

Number of pads

Pad location

120 m  15 m

4

non diagonal/ placed in chip corners

Distance pad to pad RFN-RFP

Distance pad to pad OUT-RFN

Process

333.0 m

383.0 m

CMOS 0.14 m

25 wafers

139.351

Batch size

Potential good dies per wafer

Wafer backside

Material

Si

Treatment

ground and stress release

R_amax. 0.5 m, R_tmax. 5 m

Roughness

Chip dimensions

Die size including scribe

Scribe line width:

0.485 mm  0.435 mm = 0.211 mm²

x-dimension = 15 m

y-dimension = 15 m

Passivation on front

Type

Sandwich structure

Material

PE-Nitride (on top)

Thickness

1.75 m total thickness of passivation

7 m  1 m (SL3S12x3FUD only)

Polyimide spacer

Au bump

Bump material

> 99.9 % pure Au

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Table 5. Specifications

Bump hardness

Bump shear strength

Bump height

35 – 80 HV 0.005

> 70 MPa

SL3S12x3FUF

SL3S12x3FUD

Bump height uniformity

within a die

18 m

25 m^[1]

 2 m

 3 m

 4 m

 1.5 m

– within a wafer

– wafer to wafer

Bump flatness

Bump size

60  60 m

 5 m

– RFP, RFN

– OUT, VDD

Bump size variation

[1] Because of the 7 m spacer, the bump will measure 18 m relative height protruding the spacer.

9.1.2 Fail die identification

No inkdots are applied to the wafer.

Electronic wafer mapping (SECS II format) covers the electrical test results and

additionally the results of mechanical/visual inspection.

See Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on

UV-tape with electronic fail die marking, BU-ID document number: 1093**”

9.1.3 Map file distribution

See Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on

UV-tape with electronic fail die marking, BU-ID document number: 1093**”

10. Functional description

10.1 Air interface standards

The UCODE G2iL fully supports all parts of the "Specification for RFID Air Interface

EPCglobal, EPC Radio-Frequency Identity Protocols, Class-1 Generation-2 UHF RFID,

Protocol for Communications at 860 MHz to 960 MHz, Version 1.2.0".

10.2 Power transfer

The interrogator provides an RF field that powers the tag, equipped with a UCODE G2iL.

The antenna transforms the impedance of free space to the chip input impedance in order

to get the maximum possible power for the G2iL on the tag. The G2iL+ can also be

supplied externally.

The RF field, which is oscillating on the operating frequency provided by the interrogator,

is rectified to provide a smoothed DC voltage to the analog and digital modules of the IC.

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The antenna that is attached to the chip may use a DC connection between the two

antenna pads. Therefore the G2iL also enables loop antenna design. Possible examples

of supported antenna structures can be found in the reference antenna design guide.

10.3 Data transfer

10.3.1 Reader to tag Link

An interrogator transmits information to the UCODE G2iL by modulating an UHF RF

signal. The G2iL receives both information and operating energy from this RF signal. Tags

are passive, meaning that they receive all of their operating energy from the interrogator's

RF waveform. In order to further improve the read range the UCODE G2iL+ can be

externally supplied as well so the energy to operate the chip does not need to be

transmitted by the reader.

An interrogator is using a fixed modulation and data rate for the duration of at least one

inventory round. It communicates to the G2iL by modulating an RF carrier using DSB-ASK

with PIE encoding.

For further details refer to Section 16, Ref. 1. Interrogator-to-tag (R=>T) communications.

10.3.2 Tag to reader Link

An interrogator receives information from a G2iL by transmitting an unmodulated RF

carrier and listening for a backscattered reply. The G2iL backscatters by switching the

reflection coefficient of its antenna between two states in accordance with the data being

sent. For further details refer to Section 16, Ref. 1, chapter 6.3.1.3.

The UCODE G2iL communicates information by backscatter-modulating the amplitude

and/or phase of the RF carrier. Interrogators shall be capable of demodulating either

demodulation type.

The encoding format, selected in response to interrogator commands, is either FM0

baseband or Miller-modulated subcarrier.

10.4 G2iL and G2iL+ differences

The UCODE G2iL is tailored for application where mainly EPC or TID number space is

needed. The G2iL+ in addition provides functionality such as tag tamper alarm, external

supply operation to further boost read/write range (external supply mode), a Privacy mode

reducing the read range or I/O functionality (data transfer to externally connected devices)

required.

The following table provides an overview of G2iL, G2iL+ special features.

Table 6.

Overview of G2iL and G2iL+ features

Features

G2iL

yes

-

G2iL+

yes

Read protection (bankwise)

PSF (Built-in Product Status Flag)

Backscatter strength reduction

Real read range reduction

Digital switch / Digital input

External supply mode

yes

-

yes

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Table 6.

Features

Overview of G2iL and G2iL+ features …continued

G2iL

G2iL+

yes

RF field detection

Data transfer

-

yes

Tag tamper alarm

yes

10.5 Supported commands

The G2iL supports all mandatory EPCglobal V1.2.0 commands.

In addition the G2iL supports the following optional commands:

• ACCESS

• Block Write (32 bit)

The G2iL features the following custom commands described more in detail later:

• ResetReadProtect

• ReadProtect

• ChangeEAS

• EAS_Alarm

(backward compatible to G2X)

(new with G2iL)

• ChangeConfig

10.6 G2iL, G2iL+ memory

The G2iL, G2iL+ memory is implemented according EPCglobal Class1Gen2 and

organized in three sections:

Table 7.

Name

G2iL memory sections

Size

Bank

00b

01b

10b

Reserved memory (32 bit ACCESS and 32 bit KILL password)

EPC (excluding 16 bit CRC-16 and 16 bit PC)

G2iL Configuration Word

64 bit

128 bit

16 bit

64 bit

TID (including permalocked unique 32 bit serial number)

The logical address of all memory banks begin at zero (00h).

In addition to the three memory banks one configuration word to handle the G2iL specific

features is available at EPC bank 01 address 200h. The configuration word is described in

detail in Section 10.7.1 “ChangeConfig”.

Memory pages (16 bit words) pre-programmed to zero will not execute an erase cycle

before writing data to it. This approach accelerates initialization of the chip and enables

faster programming of the memory.

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10.6.1 G2iL, G2iL+ overall memory map

Table 8.

G2iL, G2iL+ overall memory map

Bank

address

Memory

address

Type

Content

Initial

Remark

Bank 00

00h to 1Fh

20h to 3Fh

00h to 0Fh

reserved

EPC

kill password

all 00h

unlocked memory

access password

CRC-16: refer to Ref. 16

Bank 01

EPC

memory mapped

calculated CRC

10h to 14h

15h

EPC

backscatter length

UMI

00110b

0b

unlocked memory

hardwired to 0

unlocked memory

indicator bit

16h

XPC indicator

0b

17h to 1Fh

20h to 9Fh

200h

numbering system indicator 00h

[1]

EPC

Bank 01

Config Word

tamper alarm flag

external supply flag or input 0b^[4]

signal

0b^[4]

201h

indicator bit

202h

EPC

TID

RFU

0b^[4]

1b^[4]

0b^[4]

locked memory

temporary bit

203h

RFU

204h

invert digital output:

transparent mode on/off

transparent mode data/raw

RFU

205h

temporary bit

206h

temporary bit

207h

locked memory

unlocked memory

locked memory

unlocked memory

locked memory

208h

RFU

209h

max. backscatter strength

digital output

20Ah

20Bh

read range reduction on/off

RFU

20Ch

20Dh

read protect EPC Bank

read protect TID

PSF alarm flag

allocation class identifier

20Eh

20Fh

Bank 10

TID

00h to 07h

08h to 13h

14h

1110 0010b

TID

tag mask designer identifier 0000 0000 0110b

locked memory

TID

config word indicator

tag model number

serial number

1b^[2]

TMNR^[3]

14h to 1Fh

20h to 3Fh

TID

SNR

[1] G2iL: HEX E200 6806 0000 0000 0000 0000 (0000 0000)

G2iL+: HEX E200 6807 0000 0000 0000 0000 (0000 0000)

[2] Indicates the existence of a Configuration Word at the end of the EPC number

[3] See Figure 5

[4] See also Table 12 for further details.

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10.7 Custom commands

The UCODE G2iL, G2iL+ is equipped with a number of additional features and custom

commands.

Nevertheless, the chip is designed in a way standard EPCglobal READ/WRITE/ACCESS

commands can be used to operate the features.

The memory map stated in the previous section describes the Configuration Word used to

control the additional features located at address 200h of the EPC memory. For this

reason the standard READ/WRITE commands of an UHF EPCglobal compliant reader

can be used to select the flags or activate/deactivate features.

The features can only be activated/deactivated (written) using standard EPC WRITE

command as long the EPC is not locked. In case the EPC is locked either the bank needs

to be unlocked to apply changes or the ChangeConfig custom command is used to

change the settings.

The UCODE G2iL is also equipped with the complete UCODE G2X command set for

backward compatibility reasons. Nevertheless, the one ChangeConfig command of the

G2iL can be used instead of the entire G2X command set.

Bit 14h of the TID indicates the existence of a Configuration Word. This flag will enable

selecting Config-Word enhanced transponders in mixed tag populations.

10.7.1 ChangeConfig

Although G2iL is tailored for supply chain management, item level tagging and product

authentication the G2iL+ version enables active interaction with products. Among the

password protected features are the capability of download firmware to electronics,

activate/deactivate electronics which can also be used as theft deterrence, a dedicated

privacy mode by reducing the read range, integrated PSF (Product Status Flag) or Tag

Tamper Alarm.

The G2iL ChangeConfig custom command allows handling the special NXP

Semiconductors features described in the following paragraph. Please also see the

memory map in Section 10.6 “G2iL, G2iL+ memory” and “Section 10.7.2 “G2iL, G2iL+

special features control mechanism”. If the EPC memory is not write locked the standard

EPC READ/WRITE command can be used to change the settings.

G2iL, G2iL+ special features¹

UCODE G2iL and G2iL+ common special features are:

• Bank wise read protection (separate for EPC and TID)

EPC bank and the serial number part of the TID can be read protected independently.

When protected reading of the particular memory will return '0'. The flags of the

configuration word can be selected using the standard SELECT²command. Only

read protected parts will then participate an inventory round. The G2X ReadProtect

command will set both EPC and TID read protect flags.

1. The features can only be manipulated (enabled/disabled) with unlocked EPC bank, otherwise the ChangeConfig command can be

used.

2. SELECT has to be applied onto the Configuration Word with pointer address 200h. Selecting bits within the Configuration Word

using a pointer address not equal to 200h is not possible.

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• Integrated PSF (Product Status Flag)

The PSF is a general purpose flag that can be used as an EAS (Electronic Article

Surveillance) flag, quality checked flag or similar.

The G2iL offers two ways of detecting an activated PSF. In cases extremely fast

detection is needed the EAS_Alarm command can be used. The UCODE G2iL will

reply a 64-bit alarm code like described in section EAS_Alarm upon sending the

command. As a second option the EPC SELECT²command selecting the PSF flag of

the configuration word can be used. In the following inventory round only PSF

enabled chips will reply their EPC number.

• Backscatter strength reduction

The UCODE G2iL features two levels of backscatter strengths. Per default maximum

backscatter is enabled in order to enable maximum read rates. When clearing the flag

the strength can be reduced if needed.

• Real Read Range Reduction 4R

Some applications require the reduction of the read range to close proximity for

privacy reasons. Setting the 4R flag will significantly reduce the chip sensitivity to

+12 dBm. The +12 dBm have to be available at chip start up (slow increase of field

strength is not applicable). For additional privacy, the read protection can be activated

in the same configuration step. The related flag of the configuration word can be

selected using the standard SELECT²command so only chips with reduced read

range will be part of an inventory.

Remark: The attenuation will result in only a few centimeter of read range at 36 dBm

EIRP!

UCODE G2iL+ specific special features are:¹

• Tag Tamper Alarm (G2iL+ only)

The UCODE G2iL+ Tamper Alarm will flag the status of the VDD to OUT pad

connection which can be designed as an predetermined breaking point (see

Figure 6).

GND

RFP

OUT

VDD

001aam228

Fig 6. Schematic of connecting VDD and OUT pad with a predetermined breaking point

to turn a standard RFID label into a wireless safety seal

The status of the pad connection (open/closed) can be read in the configuration register

and/or selected using the EPC SELECT². This feature will enable designing a wireless

RFID safety seal. When breaking the connection by peeling off the label or manipulating a

lock an alarm can be triggered.

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• RF field detection (G2iL+ only)

The UCODE G2iL+ VDD pin can be also used as a RF field detector. Upon bringing

the tag within an RF field, a pulse signal will be immediately sent from the VDD test

pad. (for details see Ref. 21).

• Digital Switch (G2iL+ only)

The UCODE G2iL+ OUT pin can be used as digital switch. The state of the output pad

can be switched to VDD or GND depending on the Digital OUT bit of the Configuration

Word register. The state of the output is persistent in the memory even after KILL or

switching off the supply. This feature will allow activating/deactivating externally

connected peripherals or can be used as theft deterrence of electronics.

The state of the OUT pin can also be changed temporary by toggling the 'Invert Digital

Output' bit.

• Data transfer Mode (G2iL+ only)

In applications where not switching the output like described in "Digital Switch" but

external device communication is needed the G2iL+ Data Transfer Mode can be used

by setting the according bit of the Configuration Word register. When activated the air

interface communication will be directly transferred to the OUT pad of the chip.

Two modes of data transfer are available and can be switched using the Transparent

Mode DATA/RAW bit.

The default Transparent Mode DATA will remove the Frame Sync of the

communication and toggle the output with every raising edge in the RF field. This will

allow implementing a Manchester type of data transmission.

The Transparent Mode RAW will switch the demodulated air interface communication

to the OUT pad.

• External Supply Indicator - Digital Input (G2iL+ only)

The VDD pad of the UCODE G2iL+ can be used as a single bit digital input pin. The

state of the pad is directly associated with the External Supply Indicator bit of the

configuration register. Simple one bit return signaling (chip to reader) can be

implemented by polling this Configuration Word register flag. RF reset is necessary

for proper polling.

• External Supply Mode (G2iL+ only)

The UCODE G2iL+ can be supplied externally by connecting 1.85 V (Iout = 0µA)

supply. When externally supplied less energy from the RF field is needed to operate

the chip. This will not just enable further improved sensitivity and read ranges (up to

27 dBm) but also enable a write range that is equal to the read range.

The figure schematically shows the supply connected to the UCODE G2iL+.

Remark: When permanently externally supplied there will not be a power-on-reset. This

will result in the following limitations:

• When externally supplied session flag S0 will keep it’s state during RF-OFF phase.

• When externally supplied session flag S2, S3, SL will have infinite persistence time

and will behave similar to S0.

• Session flag S1 will behave regular like in pure passive operation.

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GND

RFP

OUT

VDD

Vsupply

001aam229

Fig 7. Schematic of external power supply

Table 9.

ChangeConfig custom command

Command

RFU

Data

RN

CRC-16

No. of bits

16

8

16

-

Description

11100000

00000111

00000000

Toggle bits

XOR RN 16

handle

The bits to be toggled in the configuration register need to be set to '1'.

E.g. sending 0000 0000 0001 0001 XOR RN16 will activate the 4R and PSF. Sending the

very same command a second time will disable the features again.

The reply of the ChangeConfig will return the current register setting.

Table 10. ChangeConfig custom command reply

Header

Status bits

16

RN

CRC-16

No. of bits

1

0

16

-

Description

Config-Word

Handle

Table 11. ChangeConfig command-response table

Starting state

Condition

Response

Next state

ready

all

-

ready

arbitrate, reply,

acknowledged

arbitrate

open

valid handle Status word

needs to change

Backscatter unchanged

Config-WordConfig-Word

immediately

open

valid handle Status word does Backscatter Config-Word

open

not need to change

immediately

secured

killed

valid handle Status word

needs to change

Backscatter modified

Config-Word, when done

secured

killed

valid handle Status word does Backscatter Config-Word

not need to change

immediately

all

-

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The features can only be activated/deactivated using standard EPC WRITE if the EPC

bank is unlocked. The permanent and temporary bits of the Configuration Word can be

toggled without the need for an ACCESS password in case the ACCESS password is set

to zero. In case the EPC bank is locked the lock needs to be removed before applying

changes or the ChangeConfig command has to be used.

10.7.2 G2iL, G2iL+ special features control mechanism

Special features of the G2iL are managed using a configuration word (Config-Word)

located at address 200h in the EPC memory bank.

The entire Config-Word is selectable (using the standard EPC SELECT²command) and

can be read using standard EPC READ command and modified using the standard EPC

WRITE or ChangeConfig custom command in case the EPC memory is locked for writing.

ChangeConfig can be executed from the OPEN and SECURED state.

The chip will take all “Toggle Bits” for ’0’ if the chip is in the OPEN state or the ACCESS

password is zero; therefore it will not alter any status bits, but report the current status

only. The command will be ignored with an invalid CRC-16 or an invalid handle. The chip

will then remain in the current state. The CRC-16 is calculated from the first

command-code bit to the last handle bit.

A ChangeConfig command without frame-sync and proceeding Req_RN will be ignored.

The command will also be ignored if any of the RFU bits are toggled.

In order to change the configuration, to activate/deactivate a feature a ’1’ has to be written

to the corresponding register flag to toggle the status. E.g. sending 0x0002 to the register

will activate the read protection of the TID. Sending the same command a second time will

again clear the read protection of the TID. Invalid toggling on indicator or RFU bits are

ignored.

Executing the command with zero as payload or in the OPEN state will return the current

register settings. The chip will reply to a successful ChangeConfig with an extended

preamble regardless of the TRext value of the Query command.

After sending a ChangeConfig an interrogator shall transmit CW for less than T_Replyor

20 ms, where T_Replyis the time between the interrogator's ChangeConfig command and

the chip’s backscattered reply. An interrogator may observe three possible responses

after sending a ChangeConfig, depending on the success or failure of the operation

• ChangeConfigChangeConfig succeeded: The chip will backscatter the reply shown

above comprising a header (a 0-bit), the current Status Word setting, the handle, and

a CRC-16 calculated over the 0-bit, the status word and the handle. If the interrogator

observes this reply within 20 ms then the ChangeConfig completed successfully.

• The chip encounters an error: The chip will backscatter an error code during the CW

period rather than the reply shown below (see EPCglobal Spec for error-code

definitions and for the reply format).

• ChangeConfig does not succeed: If the interrogator does not observe a reply within

20 ms then the ChangeStatus did not complete successfully. The interrogator may

issue a Req_RN command (containing the handle) to verify that the chip is still in the

interrogator's field, and may reissue the ChangeConfig command.

The G2iL configuration word is located at address 200h of the EPC memory and is

structured as following:

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Table 12. Address 200h to 207h

Indicator bits

Temporary bits

Tamper

indicator

External supply

indicator

RFU

Invert Output Transparent

mode on/off

Data mode

data/raw

RFU

0

1

2

3

4

5

6

7

Table 13. Address 208h to 20Fh

Permanent bits

RFU

max. backscatter Digital

Privacy

mode

RFU

Protect EPC Protect TID

13 14

PSF Alarm

bit

strength

output

8

9

10

11

12

15

The configuration word contains three different type of bits:

• Indicator bits cannot be changed by command:

Tag Tamper Alarm Indicator

External Supply Indicator (digital input)

• Temporary bits are reset at power up:

Invert Output

Transparent Mode on/off

Data Mode data/raw

• Permanent bits: permanently stored bits in the memory

Max. Backscatter Strength

Digital Output

Read Range Reduction

Read Protect EPC

Read Protect TID

PSF Alarm

10.7.3 ReadProtect³

The G2iL ReadProtect custom command enables reliable read protection of the entire

G2iL memory. Executing ReadProtect from the Secured state will set the ProtectEPC and

ProtectTID bits of the Configuration Word to '1'. With the ReadProtect-Bit set the G2iL will

continue to work unaffected but veil its protected content.

The read protection can be removed by executing Reset ReadProtect. The

ReadProtect-Bits will than be cleared.

Devices whose access password is zero will ignore the command. A frame-sync must be

pre-pended the command.

After sending the ReadProtect command an interrogator shall transmit CW for the lesser

of T_Replyor 20 ms, where T_Replyis the time between the interrogator's ReadProtect

command and the backscattered reply. An interrogator may observe three possible

responses after sending a ReadProtect, depending on the success or failure of the

operation:

3. Note: The ChangeConfig command can be used instead of “ReadProtect”, “ResetReadProtect”, “ChangeEAS”.

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• ReadProtect succeeds: After completing the ReadProtect the G2iL shall backscatter

the reply shown in Table 15 comprising a header (a 0-bit), the tag's handle, and a

CRC-16 calculated over the 0-bit and handle. Immediately after this reply the G2iL will

render itself to this ReadProtect mode. If the interrogator observes this reply within

20 ms then the ReadProtect completed successfully.

• The G2iL encounters an error: The G2iL will backscatter an error code during the CW

period rather than the reply shown in the EPCglobal Spec (see Annex I for error-code

definitions and for the reply format).

• ReadProtect does not succeed: If the interrogator does not observe a reply within

20 ms then the ReadProtect did not complete successfully. The interrogator may

issue a Req_RN command (containing the handle) to verify that the G2iL is still in the

interrogation zone, and may re-initiate the ReadProtect command.

The G2iL reply to the ReadProtect command will use the extended preamble shown in

EPCglobal Spec (Figure 6.11 or Figure 6.15), as appropriate (i.e. a Tag shall reply as if

TRext=1) regardless of the TRext value in the Query that initiated the round.

Table 14. ReadProtect command

Command

16

RN

CRC-16

# of bits

16

-

description

11100000 00000001

handle

Table 15. G2iL reply to a successful ReadProtect procedure

Header

RN

CRC-16

# of bits

1

0

16

-

description

handle

Table 16. ReadProtect command-response table

Starting State

Condition

Response

Next State

ready

all

–

arbitrate, reply,

acknowledged

arbitrate

open

all

-

open

secured

valid handle & invalid

access password

–

arbitrate

valid handle & valid

non zero access

password

Backscatter handle,

when done

secured

invalid handle

all

–

secured

killed

10.7.4 Reset ReadProtect³

Reset ReadProtect allows an interrogator to clear the ProtectEPC and ProtectTID bits of

the Configuration Word. This will re-enable reading of the related G2iL memory content.

For details on the command response please refer to Table 17 “Reset ReadProtect

command”.

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After sending a Reset ReadProtect an interrogator shall transmit CW for the lesser of

_Replyor 20 ms, where T_Replyis the time between the interrogator's Reset ReadProtect

T

command and the G2iL backscattered reply. A Req_RN command prior to the Reset

ReadProtect is necessary to successfully execute the command. A frame-sync must be

pre-pended the command.

An interrogator may observe three possible responses after sending a Reset

ReadProtect, depending on the success or failure of the operation:

• Reset ReadProtect succeeds: After completing the Reset ReadProtect a G2iL will

backscatter the reply shown in Table 18 comprising a header (a 0-bit), the handle, and

a CRC-16 calculated over the 0-bit and handle. If the interrogator observes this reply

within 20 ms then the Reset ReadProtect completed successfully.

• The G2iL encounters an error: The G2iL will backscatter an error code during the CW

period rather than the reply shown in Table 18 (see EPCglobal Spec for error-code

definitions and for the reply format).

• Reset ReadProtect does not succeed: If the interrogator does not observe a reply

within 20 ms then the Reset ReadProtect did not complete successfully. The

interrogator may issue a Req_RN command (containing the handle) to verify that the

G2iL is still in the interrogation zone, and may reissue the Reset ReadProtect

command.

The G2iL reply to the Reset ReadProtect command will use the extended preamble

shown in EPCglobal Spec (Figure 6.11 or Figure 6.15), as appropriate (i.e. a G2iL will

reply as if TRext=1 regardless of the TRext value in the Query that initiated the round.

The Reset ReadProtect command is structured as following:

• 16 bit command

• Password: 32 bit Access-Password XOR with 2 times current RN16

Remark: To generate the 32 bit password the 16 bit RN16 is duplicated and used two

times to generate the 32 bit (e.g. a RN16 of 1234 will result in 1234 1234).

• 16 bit handle

• CRC-16 calculate over the first command-code bit to the last handle bit

Table 17. Reset ReadProtect command

Command

Password

RN

CRC-16

# of bits

16

32

16

-

description

11100000

00000010

(access

password) 

2*RN16

handle

Table 18. G2iL reply to a successful Reset ReadProtect command

Header

RN

CRC-16

# of bits

1

0

16

-

description

handle

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Table 19. Reset ReadProtect command-response table

Starting State

Condition

Response

Next State

ready

all

–

arbitrate, reply,

acknowledged

arbitrate

open

valid handle & valid access password

Backscatter handle,

when done

open

valid handle & invalid access password

invalid handle

–

arbitrate

open

secured

valid handle & valid access password

Backscatter handle,

when done

secured

valid handle & invalid access password

–

arbitrate

secured

killed

invalid handle

all

killed

10.7.5 ChangeEAS³

UCODE G2iL equipped RFID tags will also feature a stand-alone operating EAS alarm

mechanism for fast and offline electronic article surveillance. The PSF bit of the

Configuration Word directly relates to the EAS Alarm feature. With an PSF bit set to '1' the

tag will reply to an EAS_Alarm command by backscattering a 64 bit alarm code without

the need of a Select or Query. The EAS is a built-in solution so no connection to a

backend database is required. In case the EAS_Alarm command is not implemented in

the reader a standard EPC SELCET to the Configuration Word and Query can be used.

When using standard SELECT/QUERY the EPC will be returned during inventory.

ChangeEAS can be executed from the Secured state only. The command will be ignored

if the Access Password is zero, the command will also be ignored with an invalid CRC-16

or an invalid handle, the G2iL will than remain in the current state. The CRC-16 is

calculated from the first command-code bit to the last handle bit. A frame-sync must be

pre-pended the command.

The G2iL reply to a successful ChangeEAS will use the extended preamble, as

appropriate (i.e. a Tag shall reply as if TRext=1) regardless of the TRext value in the

Query that initiated the round.

After sending a ChangeEAS an interrogator shall transmit CW for less than T_Replyor

20 ms, where T_Replyis the time between the interrogator's ChangeEAS command and the

G2iL backscattered reply. An interrogator may observe three possible responses after

sending a ChangeEAS, depending on the success or failure of the operation

• ChangeEAS succeeds: After completing the ChangeEAS a G2iL will backscatter the

reply shown in Table 21 comprising a header (a 0-bit), the handle, and a CRC-16

calculated over the 0-bit and handle. If the interrogator observes this reply within

20 ms then the ChangeEAS completed successfully.

• The G2iL encounters an error: The G2iL will backscatter an error code during the CW

period rather than the reply shown in Table 21 (see EPCglobal Spec for error-code

definitions and for the reply format).

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• ChangeEAS does not succeed: If the interrogator does not observe a reply within

20 ms then the ChangeEAS did not complete successfully. The interrogator may

issue a Req_RN command (containing the handle) to verify that the G2iL is still in the

interrogator's field, and may reissue the ChangeEAS command.

Upon receiving a valid ChangeEAS command a G2iL will perform the commanded

set/reset operation of the PSF bit of the Configuration Word.

If PSF bit is set, the EAS_Alarm command will be available after the next power up and

reply the 64 bit EAS code upon execution. Otherwise the EAS_Alarm command will be

ignored.

Table 20. ChangeEAS command

Command

ChangeEAS

RN

CRC-16

# of bits

16

1

16

description

11100000

00000011

1 ... set PSF bit

0 ... reset PSF bit

handle

Table 21. G2iL reply to a successful ChangeEAS command

Header

RN

CRC-16

# of bits

1

0

16

-

description

handle

Table 22. ChangeEAS command-response table

Starting State

Condition

Response

Next state

ready

all

–

arbitrate, reply,

acknowledged

arbitrate

open

all

–

open

secured

valid handle

backscatter handle,

when done

secured

invalid handle

all

–

secured

killed

10.7.6 EAS_Alarm

Upon receiving an EAS_Alarm custom command the UCODE G2iL will immediately

backscatter an EAS-Alarmcode in case the PSF bit of the Configuration Word is set. The

alarm code is returned without any delay caused by Select, Query and without the need

for a backend database.

The EAS feature of the G2iL is available after enabling it by sending a ChangeEAS

command described in Section 10.7.5 “ChangeEAS³” or after setting the PSF bit of the

Configuration Word to ’1’. With the EAS-Alarm enabled the G2iL will reply to an

EAS_Alarm command by backscattering a fixed 64 bit alarm code. A G2iL will reply to an

EAS_Alarm command from the ready state only. As an alternative to the fast EAS_Alarm

command a standard SELECT²(upon the Configuration Word) and QUERY can be used.

If the PSF bit is reset to '0' by sending a ChangeEAS command in the password protected

Secure state or clearing the PSF bit the G2iL will not reply to an EAS_Alarm command.

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The EAS_Alarm command is structured as following:

• 16 bit command

• 16 bit inverted command

• DR (TRcal divide ratio) sets the T=>R link frequency as described in EPCglobal Spec.

6.3.1.2.8 and Table 6.9.

• M (cycles per symbol) sets the T=>R data rate and modulation format as shown in

EPCglobal Spec. Table 6.10.

• TRext chooses whether the T=>R preamble is pre-pended with a pilot tone as

described in EPCglobal Spec. 6.3.1.3.

A preamble must be pre-pended the EAS_Alarm command according EPCglobal Spec,

6.3.1.2.8.

Upon receiving an EAS_Alarm command the tag loads the CRC5 register with 01001b

and backscatters the 64 bit alarm code accordingly. The reader is now able to calculate

the CRC5 over the backscattered 64 bits received to verify the received code.

Table 23. EAS_Alarm command

Command Inv_Command DR

M

TRext

CRC-16

# of bits

16

1

2

1

16

-

description 11100000

00011111

11111011

0: DR = 8

00: M = 1

0: no pilot

tone

00000100

1: DR = 64/3 01: M = 2

10: M = 4

1: use pilot

tone

11: M = 8

Table 24. G2iL reply to a successful EAS_Alarm command

Header

EAS Code

# of bits

1

0

64

description

CRC5 (MSB)

Table 25. EAS_Alarm command-response table

Starting State

Condition

PSF bit is set

PSF bit is cleard

all

Response

Next state

ready

backscatter alarm code ready

--

arbitrate, reply,

acknowledged

–

arbitrate

open

all

–

open

secured

killed

secured

killed

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11. Limiting values

Table 26. Limiting values^[1][2]

In accordance with the Absolute Maximum Rating System (IEC 60134).

Voltages are referenced to RFN

Symbol

Parameter

Conditions

Min

Max

Unit

Bare die and SOT886 limitations

T_stg

storage temperature

ambient temperature

55

40

-

+125

+85

2

C

kV

T_amb

V_ESD

[3]

electrostatic discharge

voltage

Human body

model

Pad limitations

V_i

input voltage

absolute limits,

VDD-OUT pad

0.5

+2.5

+0.5

V

I_o

output current

input power

absolute limits

input/output

current,VDD-OUT

pad

mA

P_i

maximum power

dissipation, RFP

pad

-

100

mW

[1] Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at these or any conditions other

than those described in the Operating Conditions and Electrical Characteristics section of this specification

is not implied.

[2] This product includes circuitry specifically designed for the protection of its internal devices from the

damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be

taken to avoid applying greater than the rated maxima.

[3] For ESD measurement, the die chip has been mounted into a CDIP20 package.

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12. Characteristics

12.1 UCODE G2iL, G2iL+ bare die characteristics

Table 27. G2iL, G2iL+ RF interface characteristics (RFN, RFP)

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

f_i

input frequency

840

-

960

MHz

Normal mode - no external supply, read range reduction OFF

[1][2][7]

P_i(min)

minimum input power

READ sensitivity

-

18

-

dBm

%

WRITE sensitivity,

(write range/read

range - ratio)

30

[3]

C_i

Q

Z

input capacitance

quality factor

impedance

parallel

-

0.77

-

pF

-

915 MHz

866 MHz

915 MHz

953 MHz

9.7

25 -j237

23 -j224

21 -j216



External supply mode - VDD pad supplied, read range reduction OFF

[1][2]

[2]

P_i(min)

minimum input power

Ext. supplied READ

Ext. supplied WRITE

-

27

-

dBm



27

[3]

Z

impedance

externally supplied,

915 MHz

7 -j230

Read range reduction ON - no external supply

[1][2][4]

[2][4]

[3]

P_i(min)

minimum input power

4R on READ

-

+12

-

dBm



4R on WRITE

4R on, 915 MHz

+12

Z

impedance

18 -j2

Modulation resistance

[5]

[6]

R

resistance

modulation

resistance, max.

backscatter = off

-

170

55

-



modulation

resistance, max.

backscatter = on

[1] Power to process a Query command.

[2] Measured with a 50  source impedance.

[3] At minimum operating power.

[4] It has to be assured the reader (system) is capable of providing enough field strength to give +12 dBm at the chip otherwise

communication with the chip will not be possible.

[5] Enables tag designs to be within ETSI limits for return link data rates of e.g. 320 kHz/M4.

[6] Will result in up to 10 dB higher tag backscatter power at high field strength.

[7] Results in approx. 18.5 dBm tag sensitivity on a 2 dBi gain antenna.

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Table 28. VDD pin characteristics

Symbol Parameter

Conditions

Min

Typ

Max

Unit

[1][3][4]

Minimum supply voltage/current - without assisted EEPROM WRITE

V_DD

I_DD

supply voltage

supply current

minimum voltage

-

1.8

7

V

minimum current,

I_out-^-= 0 A

A

I

_out= 100 A

-

110

A

[2][3][4]

Minimum supply voltage/current - assisted EEPROM READ and WRITE

V_DD

supply voltage

supply current

minimum voltage,

I_out= 0 A

1.8

1.85

V

I_out= 100 A

-

1.95

125

V

I_DD

minimum current,

I_out= 0 A

A

I_out= 100 A

-

265

A

[3][5]

Maximum supply voltage/current

V_DD

supply voltage

absolute maximum

voltage

2.2

-

V

I_i(max)

maximum input current

absolute maximum

current

280

A

[1] Activates Digital Output (OUT pin), increases read range (external supplied).

[2] Activates Digital Output (OUT pin), increases read and write range (external supplied).

[3] Operating the chip outside the specified voltage range may lead to undefined behaviour.

[4] Either the voltage or the current needs to be above given values to guarantee specified functionality.

[5] No proper operation is guaranteed if both, voltage and current, limits are exceeded.

Table 29. G2iL, G2iL+ VDD and OUT pin characteristics

Symbol Parameter

Conditions

Min

Typ

Max

Unit

OUT pin characteristics

V_OL

V_OH

Low-level output voltage

HIGH-level output voltage

Isink = 1 mA

-

100

-

mV

V

VDD = 1.8 V; Isource

1.5

= 100 µA

VDD/OUT pin characteristics

[1]

[2]

C_L

V_o

load capacitance

output voltage

VDD - OUT pin max.

-

5

pF

maximum RF peak

voltage on VDD-OUT

pins

500

mV

[3]

[4]

[5]

VDD/OUT pin tamper alarm characteristics

R_L(max)

R_L(min)

maximum load resistance

minimum load resistance

resistance range high

resistance range low

-

<2

-

M

>20

[1] Is the sum of the allowed capacitance of the VDD and OUT pin referenced to RFN.

[2] Is the maximum allowed RF input voltage coupling to the VDD/OUT pin to guarantee undisturbed chip functionality.

[3] Resistance between VDD and OUT pin in checked during power up only.

[4] Resistance range to achieve tamper alarm flag = 1.

[5] Resistance range to achieve tamper alarm flag = 0:

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For further reading we recommend application note “FAQ UCODE G2iL+“ (Ref. 21)

describing the output characteristics more in detail. An example schematic is available in

application note “UCODE G2iL+ Demo board Manual“ (Ref. 22). The documents are

available at NXP Document Control or at the website www.nxp.com.

Table 30. G2iL, G2iL+ memory characteristics

Symbol

Parameter

Conditions

Min

Typ

Max Unit

EEPROM characteristics

t_ret

retention time

T_amb55 C

20

-

year

N_endu(W)

write endurance

1000 10000^[1]

cycle

[1] T_amb25 C

12.2 UCODE G2iL SOT886 characteristics

Table 31. G2iL RF interface characteristics (RFN, RFP)

Symbol

Parameter

Conditions

Min

Typ

Max Unit

Normal mode - no external supply, read range reduction OFF

[1][2]

P_i(min)

minimum input power

READ

sensitivity

-

17.6

-

dB

m

[3]

Z

impedance

915 MHz

21 j199



Normal mode - externally supplied, read range reduction OFF

[1][2]

P_i(min)

minimum input power

READ

sensitivity

-

27

-

dB

m

[3]

Z

impedance

915 MHz

-

5.6 j204



[1] Power to process a Query command.

[2] Measured with a 50  source impedance.

[3] At minimum operating power.

Remark: For DC and memory characteristics refer to Table 28, Table 29 and Table 30.

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13. Package outline

XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm

SOT886

b

1

2

3

4x

(2)

L

1

e

6

5

4

e

1

e

1

6x

(2)

A

1

D

E

terminal 1

index area

0

1

2 mm

scale

Dimensions (mm are the original dimensions)

(1)

Unit

A

1

b

D

E

e

L

1

max 0.5 0.04 0.25 1.50 1.05

0.35 0.40

0.20 1.45 1.00 0.6 0.5 0.30 0.35

0.17 1.40 0.95 0.27 0.32

mm nom

min

Notes

1. Including plating thickness.

2. Can be visible in some manufacturing processes.

sot886_po

References

Outline

version

European

projection

Issue date

IEC

JEDEC

MO-252

JEITA

04-07-22

12-01-05

SOT886

Fig 8. Package outline SOT886

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14. Packing information

14.1 Wafer

See Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on

UV-tape with electronic fail die marking, BU-ID document number: 1093**”

14.2 SOT886

Part orientation T1. For details please refer to

http://www.standardics.nxp.com/packaging/packing/pdf/sot886.t1.t4.pdf

15. Abbreviations

Table 32. Abbreviations

Acronym

CRC

Description

Cyclic Redundancy Check

CW

Continuous Wave

DSB-ASK

DC

Double Side Band-Amplitude Shift Keying

Direct Current

EAS

Electronic Article Surveillance

Electrically Erasable Programmable Read Only Memory

EEPROM

EPC

Electronic Product Code (containing Header, Domain Manager, Object Class

and Serial Number)

FM0

G2

Bi phase space modulation

Generation 2

IC

Integrated Circuit

PIE

Pulse Interval Encoding

Real Read Range Reduction

Product Status Flag

RRRR

PSF

RF

Radio Frequency

UHF

SECS

TID

Ultra High Frequency

Semi Equipment Communication Standard

Tag IDentifier

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16. References

[1] EPCglobal: EPC Radio-Frequency Identity Protocols Class-1 Generation-2 UHF

RFID Protocol for Communications at 860 MHz – 960 MHz, Version 1.1.0

(December 17, 2005)

[2] EPCglobal: EPC Tag Data Standards

[3] EPCglobal (2004): FMCG RFID Physical Requirements Document (draft)

[4] EPCglobal (2004): Class-1 Generation-2 UHF RFID Implementation Reference

(draft)

[5] European Telecommunications Standards Institute (ETSI), EN 302 208:

Electromagnetic compatibility and radio spectrum matters (ERM) – Radio-frequency

identification equipment operating in the band 865 MHz to 868 MHz with power

levels up to 2 W, Part 1 – Technical characteristics and test methods

[6] European Telecommunications Standards Institute (ETSI), EN 302 208:

Electromagnetic compatibility and radio spectrum matters (ERM) – Radio-frequency

identification equipment operating in the band 865 MHz to 868 MHz with power

levels up to 2 W, Part 2 – Harmonized EN under article 3.2 of the R&TTE directive

[7] [CEPT1]: CEPT REC 70-03 Annex 1

[8] [ETSI1]: ETSI EN 330 220-1, 2

[9] [ETSI3]: ETSI EN 302 208-1, 2 V<1.1.1> (2004-09-Electromagnetic compatibility

And Radio spectrum Matters (ERM) Radio Frequency Identification Equipment

operating in the band 865 - MHz to 868 MHz with power levels up to 2 W Part 1:

Technical characteristics and test methods.

[10] [FCC1]: FCC 47 Part 15 Section 247

[11] ISO/IEC Directives, Part 2: Rules for the structure and drafting of International

Standards

[12] ISO/IEC 3309: Information technology – Telecommunications and information

exchange between systems – High-level data link control (HDLC) procedures –

Frame structure

[13] ISO/IEC 15961: Information technology, Automatic identification and data capture –

Radio frequency identification (RFID) for item management – Data protocol:

application interface

[14] ISO/IEC 15962: Information technology, Automatic identification and data capture

techniques – Radio frequency identification (RFID) for item management – Data

protocol: data encoding rules and logical memory functions

[15] ISO/IEC 15963: Information technology — Radio frequency identification for item

management — Unique identification for RF tags

[16] ISO/IEC 18000-1: Information technology — Radio frequency identification for item

management — Part 1: Reference architecture and definition of parameters to be

standardized

[17] ISO/IEC 18000-6: Information technology automatic identification and data capture

techniques — Radio frequency identification for item management air interface —

Part 6: Parameters for air interface communications at 860–960 MHz

[18] ISO/IEC 19762: Information technology AIDC techniques – Harmonized vocabulary

– Part 3: radio-frequency identification (RFID)

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[19] U.S. Code of Federal Regulations (CFR), Title 47, Chapter I, Part 15:

Radio-frequency devices, U.S. Federal Communications Commission.

[20] Data sheet - Delivery type description – General specification for 8” wafer on

UV-tape with electronic fail die marking, BU-ID document number: 1093**⁴

[21] Application note - FAQ UCODE G2i, BU-ID document number: AN10940

[22] Application note - UCODE G2iM+ demo board documentation, BU-ID document

number: AN11237

4. ** ... document version number

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17. Revision history

Table 33. Revision history

Document ID

Release date

20131127

Data sheet status

Change notice Supersedes

SL3S1203_1213 v.4.3

Modifications:

Product data sheet

-

SL3S1203_1213 v.4.2

• Figure 5 “G2iL TID memory structure”: updated

SL3S1203_1213 v.4.2

Modifications:

20130701

Product data sheet

-

SL3S1203_1213 v.4.1

• Update of delivery form

• Update RF field detection

SL3S1203_1213 v.4.1

Modifications:

20120917

Product data sheet

-

SL3S1203_1213 v.4.0

SL3S1203_1213 v.3.9

SL3S1203_1213 v.3.8

• Update of delivery form

20120227

SL3S1203_1213 v.4.0

Modifications:

Product data sheet

• Figure 4 “G2iL wafer layout”: Figure notes (1) and (2) updated

20120130 Product data sheet

SL3S1203_1213 v.3.9

Modifications:

-

• Table 6 “Specifications”: “Passivation on front” updated

• Section 15.2.1 “General assembly recommendations”: updated

SL3S1203_1213 v.3.8

Modifications:

20120111

• Section 8.1 “Wafer layout”: Figure notes (1) and (2) updated

20111124 Product data sheet

• Table 11 “G2iL, G2iL+ overall memory map”: updated

• Table 34 “G2iL, G2iL+ RF interface characteristics (RFN, RFP)”: updated

20110803 Product data sheet

• Real Read Range Reduction feature added to G2iL

Product data sheet

-

SL3S1203_1213 v.3.7

Modifications:

-

SL3S1203_1213 v.3.6

Modifications:

-

SL3S1203_1213 v.3.5

SL3S1203_1213 v.3.4

SL3S1203_1213 v.3.3

SL3S1203_1213 v.3.5

Modifications:

20110531

• Superfluous text removed from Table 6

20110511 Product data sheet

Product data sheet

-

SL3S1203_1213 v.3.4

Modifications:

-

• Security status changed into COMPANY PUBLIC

• Delivery form of FCS2 strap added

• Section 13 “Package information”, Section 15 “Handling information” and Section 16

“Packing information” added

SL3S1203_1213 v.3.3

Modifications:

20110131

Product data sheet

-

SL3S1203_1213 v.3.2

• Section 4 “Ordering information”: new types SL3S1203FUD and SL3S1213FUD added

• Section 9 “Mechanical specification”: updated according to the new types

• Replaced wording of “ChangeStatus” with “ChangeConfig”

SL3S1203_1213 v.3.2

Modifications:

20101109

Product data sheet

-

SL3S1203_1213 v.3.1

• Version SOT886F1 added

• Section 5 “Marking”, Section 13 “Package outline” and Section 14 “Packing information”

added

SL3S1203_1213 v.3.1

Modifications:

20100922

Product data sheet

Objective data sheet

-

SL3S1203_1213 v.3.0

• General Modifications

20100621

SL3S1203_1213 v.3.0

Modifications:

178810

-

• General update

20100304

178810

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18. Legal information

18.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Definition

Objective [short] data sheet

This document contains data from the objective specification for product development.

This document contains data from the preliminary specification.

This document contains the product specification.

Preliminary [short] data sheet Qualification

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Definitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

Suitability for use — NXP Semiconductors products are not designed,

18.2 Definitions

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at the customer’s own

risk.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall prevail.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and operation of their applications

and products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications and

products planned, as well as for the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to offer functions and qualities beyond those described in the

Product data sheet.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

18.3 Disclaimers

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Semiconductors takes no

responsibility for the content in this document if provided by an information

source outside of NXP Semiconductors.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

No offer to sell or license — Nothing in this document may be interpreted or

construed as an offer to sell products that is open for acceptance or the grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

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Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Bare die — All die are tested on compliance with their related technical

specifications as stated in this data sheet up to the point of wafer sawing and

are handled in accordance with the NXP Semiconductors storage and

transportation conditions. If there are data sheet limits not guaranteed, these

will be separately indicated in the data sheet. There are no post-packing tests

performed on individual die or wafers.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It is neither qualified nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

NXP Semiconductors has no control of third party procedures in the sawing,

handling, packing or assembly of the die. Accordingly, NXP Semiconductors

assumes no liability for device functionality or performance of the die or

systems after third party sawing, handling, packing or assembly of the die. It

is the responsibility of the customer to test and qualify their application in

which the die is used.

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automotive specifications and standards, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

All die sales are conditioned upon and subject to the customer entering into a

written die sale agreement with NXP Semiconductors through its legal

department.

18.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

UCODE — is a trademark of NXP B.V.

19. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

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20. Tables

Table 1. Ordering information. . . . . . . . . . . . . . . . . . . . . .3

Table 2. Marking codes . . . . . . . . . . . . . . . . . . . . . . . . . .3

Table 3. Pin description bare die . . . . . . . . . . . . . . . . . . .5

Table 4. Pin description SOT886 . . . . . . . . . . . . . . . . . . .5

Table 5. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . .7

Table 6. Overview of G2iL and G2iL+ features . . . . . . . .9

Table 7. G2iL memory sections . . . . . . . . . . . . . . . . . . .10

Table 8. G2iL, G2iL+ overall memory map. . . . . . . . . . .11

Table 9. ChangeConfig custom command . . . . . . . . . . .16

Table 10. ChangeConfig custom command reply. . . . . . .16

Table 11. ChangeConfig command-response table . . . . .16

Table 12. Address 200h to 207h . . . . . . . . . . . . . . . . . . .18

Table 13. Address 208h to 20Fh . . . . . . . . . . . . . . . . . . .18

Table 14. ReadProtect command. . . . . . . . . . . . . . . . . . .19

Table 15. G2iL reply to a successful ReadProtect

command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Table 19. Reset ReadProtect command-response table 21

Table 20. ChangeEAS command . . . . . . . . . . . . . . . . . . 22

Table 21. G2iL reply to a successful ChangeEAS

command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Table 22. ChangeEAS command-response table . . . . . . 22

Table 23. EAS_Alarm command . . . . . . . . . . . . . . . . . . . 23

Table 24. G2iL reply to a successful EAS_Alarm

command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Table 25. EAS_Alarm command-response table . . . . . . 23

Table 26. Limiting values^[1][2]. . . . . . . . . . . . . . . . . . . . . . 24

Table 27. G2iL, G2iL+ RF interface characteristics

(RFN, RFP) . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Table 28. VDD pin characteristics . . . . . . . . . . . . . . . . . . 26

Table 29. G2iL, G2iL+ VDD and OUT pin characteristics 26

Table 30. G2iL, G2iL+ memory characteristics . . . . . . . . 27

Table 31. G2iL RF interface characteristics (RFN, RFP). 27

Table 32. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 29

Table 33. Revision history . . . . . . . . . . . . . . . . . . . . . . . . 32

procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19

Table 16. ReadProtect command-response table . . . . . .19

Table 17. Reset ReadProtect command . . . . . . . . . . . . .20

Table 18. G2iL reply to a successful Reset ReadProtect

21. Figures

Fig 1. Block diagram of G2iL IC . . . . . . . . . . . . . . . . . . .4

Fig 2. Pinning bare die. . . . . . . . . . . . . . . . . . . . . . . . . . .5

Fig 3. Pin configuration for SOT886 . . . . . . . . . . . . . . . .5

Fig 4. G2iL wafer layout. . . . . . . . . . . . . . . . . . . . . . . . . .6

Fig 5. G2iL TID memory structure . . . . . . . . . . . . . . . . .12

Fig 6. Schematic of connecting VDD and OUT pad

with a predetermined breaking point to turn a

standard RFID label into a wireless safety seal. .14

Fig 7. Schematic of external power supply . . . . . . . . . .16

Fig 8. Package outline SOT886. . . . . . . . . . . . . . . . . . .28

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22. Contents

1

General description. . . . . . . . . . . . . . . . . . . . . . 1

12

12.1

12.2

Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 25

UCODE G2iL, G2iL+ bare die characteristics 25

UCODE G2iL SOT886 characteristics. . . . . . 27

2

2.1

Features and benefits . . . . . . . . . . . . . . . . . . . . 1

Key features . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Key benefits . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

End user benefit . . . . . . . . . . . . . . . . . . . . . . . . 2

Antenna design benefits . . . . . . . . . . . . . . . . . . 2

Label manufacturer benefit. . . . . . . . . . . . . . . . 2

Custom commands. . . . . . . . . . . . . . . . . . . . . . 2

2.1.1

2.2

2.2.1

2.2.2

2.2.3

2.3

13

Package outline. . . . . . . . . . . . . . . . . . . . . . . . 28

14

14.1

14.2

Packing information . . . . . . . . . . . . . . . . . . . . 29

Wafer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

SOT886 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

15

16

17

Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 29

References. . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Revision history . . . . . . . . . . . . . . . . . . . . . . . 32

3

3.1

3.2

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Markets. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

18

Legal information . . . . . . . . . . . . . . . . . . . . . . 33

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 33

Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 34

18.1

18.2

18.3

18.4

4

Ordering information. . . . . . . . . . . . . . . . . . . . . 3

Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Pinning information. . . . . . . . . . . . . . . . . . . . . . 5

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5

Wafer layout . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

5

6

7

7.1

8

19

20

21

22

Contact information . . . . . . . . . . . . . . . . . . . . 34

Tables. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

8.1

9

9.1

9.1.1

9.1.2

9.1.3

Mechanical specification . . . . . . . . . . . . . . . . . 7

Wafer specification . . . . . . . . . . . . . . . . . . . . . . 7

Wafer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Fail die identification . . . . . . . . . . . . . . . . . . . . 8

Map file distribution. . . . . . . . . . . . . . . . . . . . . . 8

10

10.1

10.2

10.3

10.3.1

10.3.2

10.4

10.5

10.6

Functional description . . . . . . . . . . . . . . . . . . . 8

Air interface standards . . . . . . . . . . . . . . . . . . . 8

Power transfer . . . . . . . . . . . . . . . . . . . . . . . . . 8

Data transfer. . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Reader to tag Link . . . . . . . . . . . . . . . . . . . . . . 9

Tag to reader Link. . . . . . . . . . . . . . . . . . . . . . . 9

G2iL and G2iL+ differences . . . . . . . . . . . . . . . 9

Supported commands . . . . . . . . . . . . . . . . . . 10

G2iL, G2iL+ memory . . . . . . . . . . . . . . . . . . . 10

G2iL, G2iL+ overall memory map. . . . . . . . . . 11

G2iL TID memory details . . . . . . . . . . . . . . . . 12

Custom commands. . . . . . . . . . . . . . . . . . . . . 13

ChangeConfig. . . . . . . . . . . . . . . . . . . . . . . . . 13

G2iL, G2iL+ special features . . . . . . . . . . . . . .13

G2iL, G2iL+ special features control

10.6.1

10.6.2

10.7

10.7.1

10.7.2

mechanism . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

ReadProtect . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Reset ReadProtect³. . . . . . . . . . . . . . . . . . . . 19

ChangeEAS³. . . . . . . . . . . . . . . . . . . . . . . . . 21

EAS_Alarm . . . . . . . . . . . . . . . . . . . . . . . . . . 22

10.7.3

10.7.4

10.7.5

10.7.6

11

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 24

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 27 November 2013

178843


型号：	SL3S1203FUD/BG,005
厂家：	NXP
描述：	SL3S1203_1213 - UCODE G2iL and G2iL+
文件：	总36页 (文件大小：330K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SL3S1203FUD/BG,005 [NXP]

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SL3S1203FUD/G/BG,0

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SL3S1203FUDBG

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SL3S1203_1213

SL3S1204

SL3S1204FTB0

SL3S1204FTB01

SL3S1204FTB0X

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SL3S1204FUD/BG