QPA2609DEVB1 [QORVO]
7 â 14 GHz Low Noise Amplifier;
| 型号： | QPA2609DEVB1 |
| 厂家： | 
Qorvo |
| 描述： | 7 â 14 GHz Low Noise Amplifier |
| 文件： | 总16页 (文件大小：1070K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
QPA2609D
®
7 – 14 GHz Low Noise Amplifier
Product Overview
Qorvo’s QPA2609D is a high-performance, low noise
MMIC amplifier fabricated on Qorvo’s production 90 nm
pHEMT process (QPHT09). Covering 7 – 14 GHz, the
QPA2609D provides 27 dB small signal gain and 1.1 dB
noise figure. With a compact size of 2.37 x 0.97 mm, the
amplifier can deliver 20dBm of saturated power with P1dB
of 18 dBm. In addition, the device can provide low IMD3
level of −50 dBc at Pout = 0 dBm/tone.
The QPA2609D is matched to 50 ohms with integrated DC
blocking caps on both I/O ports for easy handling and
simple system integration.
The high performance of the QPA2609D makes it ideal for
satellite and point to point communication systems.
Key Features
• Frequency Range: 7 – 14 GHz
• Noise Figure: 1.1 dB (typical)
• Small Signal Gain: 27 dB (typical)
• P1dB: 18 dBm (typical)
• IMD3: −50 dBc (typical) (Pout=0 dBm/tone)
• Bias: VD = 3.5 V, IDQ = 120 mA, VG = −0.46 V (typical)
• Die Dimensions: 2.37 x 0.97 x 0.10 mm
Ordering Information
Part No.
QPA2609D
QPA2609S
Description
Applications
7 – 14 GHz Low Noise Amplifier
Space Inspected Version, Contact Sales
• Satellite Communications
• Point-to-Point Communications
• Radar
QPA2609DEVB1 QPA2609D Evaluation Board
Data Sheet Rev. C, Feb 2021
|
Subject to change without notice
1 of 16
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QPA2609D
®
7 – 14 GHz Low Noise Amplifier
Absolute Maximum Ratings
Parameter
Drain Voltage (VD)
Rating
4.5
Units
V
Drain Current (ID1/ID2/ID3)
Gate Voltage Range (VG)
Gate Current (IG1/IG2/IG3 at 125 °C)
RF Input Power (50 Ω, 85 °C)
Channel Temperature, TCH
Mounting Temperature (30 seconds)
Storage Temperature
96/115/192
−1.3 to 0
5.0/5.0/6.6
20
mA
V
mA
dBm
°C
175
260
°C
−55 to 150
°C
Exceeding any one or a combination of the Absolute Maximum Rating conditions may cause permanent damage to the device. Extended application of
Absolute Maximum Rating conditions to the device may reduce device reliability.
Recommended Operating Conditions
Parameter
Drain Voltage
Value
3.5
Units
V
Drain Current (quiescent, IDQ
)
120
mA
mA
V
Drain Current (ID, Low noise / PSAT
Gate Voltage (typical)
)
120 / 175
−0.46
Operating Temperature Range
−40 to 85ꢁ
°C
Electrical specifications are measured at specified test conditions. Specifications are not guaranteed over all recommended operating conditions.
Electrical Specifications
Test conditions unless otherwise noted: VD = +3.5V, IDQ = 120 mA, Temp. = +25ꢀ°C. Data de-embedded to MMIC bond wires.
Parameter
Min
Typ
Max
Units
GHz
dB
Operating Frequency
7
14
Small Signal Gain
27
1.1
Noise Figure
dB
1-dB Compression Point
Input Return Loss
18
dBm
dB
14.0
13.0
−50
Output Return Loss
dB
3RD Order Intermodulation Level (POUT = 0 dBm / Tone)
Output TOI (Pout = 0 dBm / tone)
Gain (S21) Temperature Coefficient
dBc
dBm
dB/°C
25.0
−0.013
Data Sheet Rev. C, Feb 2021
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Subject to change without notice
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QPA2609D
®
7 – 14 GHz Low Noise Amplifier
Performance Plots – Small Signal
Test conditions unless otherwise noted: VD = +3.5V, IDQ = 120 mA, Temp. = +25ꢀ°C. Data de-embedded to MMIC bond wires.
Input Return Loss vs Temperature
Gain vs Temperature
0
-5
30
29
28
27
26
25
24
23
22
21
20
-10
-15
-20
-25
-30
- 40 C
+ 25 C
+ 85 C
12
- 40 C
+ 25 C
+ 85 C
12
7
8
9
10
11
13
14
7
8
9
10
11
13
14
Freq (GHz)
Freq (GHz)
Reverse Isolation vs Temperature
Output Return Loss vs Temperature
-50
-60
0
-5
-10
-15
-20
-25
-30
-70
-80
-90
- 40 C
+ 25 C
+ 85 C
12
- 40 C
+ 25 C
+ 85 C
12
-100
7
8
9
10
11
13
14
7
8
9
10
11
13
14
Freq (GHz)
Freq (GHz)
Data Sheet Rev. C, Feb 2021
|
Subject to change without notice
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QPA2609D
®
7 – 14 GHz Low Noise Amplifier
Performance Plots – Small Signal
Test conditions unless otherwise noted: VD = +3.5V, IDQ = 120 mA, Temp. = +25ꢀ°C. Data de-embedded to MMIC bond wires.
Gain vs Current
Gain vs Voltage
29
27
25
23
21
19
17
15
30
29
28
27
26
25
24
23
22
21
20
1.5 V
8
2 V
9
2.5 V
10
3.0 V
11
3.5 V
12
4.0 V
13
40 mA
8
60 mA
90 mA
120 mA
12
150 mA
13
7
7
7
14
14
14
7
9
10
11
14
14
14
Freq (GHz)
Freq (GHz)
Input Return Loss vs Voltage
Input Return Loss vs Current
0
-5
0
40 mA
60 mA
90 mA
120 mA
150 mA
-5
-10
-15
-20
-25
-30
-10
-15
-20
-25
-30
1.5 V
8
2 V
9
2.5 V
10
3.0 V
11
3.5 V
12
4.0 V
13
7
8
9
10
11
12
13
Freq (GHz)
Freq (GHz)
Output Return Loss vs Voltage
Output Return Loss vs Current
0
-5
0
-5
40 mA
60 mA
90 mA
120 mA
150 mA
-10
-15
-20
-25
-30
-10
-15
-20
-25
-30
1.5 V
3.0 V
2.0 V
3.5 V
2.5 V
4.0 V
8
9
10
11
12
13
7
8
9
10
11
12
13
Freq (GHz)
Freq (GHz)
Data Sheet Rev. C, Feb 2021
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Subject to change without notice
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QPA2609D
®
7 – 14 GHz Low Noise Amplifier
Performance Plots – Noise Figure
Test conditions unless otherwise noted: VD = +3.5V, IDQ = 120 mA, Temp. = +25ꢀ°C. Data de-embedded to MMIC bond wires.
NF vs Temperature
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
- 40 C
+ 25 C
+ 85 C
12
0.0
7
8
9
10
11
13
14
Freq (GHz)
NF vs Voltage
NF vs Current
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
1.5 V
3.0 V
2.0 V
3.5 V
2.5 V
4.0 V
40 mA
8
60 mA
90 mA
120 mA
12
150 mA
13
7
9
10
11
14
7
8
9
10
11
12
13
14
Freq (GHz)
Freq (GHz)
Data Sheet Rev. C, Feb 2021
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Subject to change without notice
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QPA2609D
®
7 – 14 GHz Low Noise Amplifier
Performance Plots – Large Signal
Test conditions unless otherwise noted: VD = +3.5V, IDQ = 120 mA, Temp. = +25ꢀ°C. Data de-embedded to MMIC bond wires.
Psat vs Temperature
P1dB vs Temperature
24
22
20
18
16
14
12
10
24
22
20
18
16
14
12
10
- 40 C
9
+ 25 C
+ 85 C
12
- 40 C
9
+ 25 C
+ 85 C
12
7
8
10
11
13
14
7
8
10
11
13
14
Freq (GHz)
Freq (GHz)
Psat vs Voltage
P1dB vs Voltage
24
24
22
20
18
16
14
12
10
8
22
20
18
16
14
12
10
8
1.5 V
8
2.0 V
9
2.5 V
10
3.0 V
11
3.5 V
12
4.0 V
13
1.5 V
8
2.0 V
9
2.5 V
10
3.0 V
11
3.5 V
12
4.0 V
13
6
6
7
14
7
14
Freq (GHz)
Freq (GHz)
Psat vs Current
P1dB vs Current
24
22
20
18
16
14
12
10
24
22
20
18
16
14
12
10
8
40 mA
60 mA
90mA
120 mA
150 mA
40 mA
8
60 mA
9
90 mA
120 mA
12
150 mA
13
7
10
11
14
7
8
9
10
11
12
13
14
Freq (GHz)
Freq (GHz)
Data Sheet Rev. C, Feb 2021
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Subject to change without notice
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QPA2609D
®
7 – 14 GHz Low Noise Amplifier
Performance Plots – Large Signal
Test conditions unless otherwise noted: VD = +3.5V, IDQ = 120 mA, Temp. = +25ꢀ°C. Data de-embedded to MMIC bond wires.
Pout vs Pin
Gain vs Pin
24
22
20
18
16
14
12
10
8
30
28
26
24
22
20
18
16
14
12
10
6
4
7 GHz
8 GHz
10.5 GHz
13 GHz
-6
14 GHz
-2
7 GHz
8 GHz
10.5 GHz
13 GHz
-6
14 GHz
-4 -2
2
0
-20 -18 -16 -14 -12 -10
Pin (dBm)
-8
0
-20 -18 -16 -14 -12 -10
Pin (dBm)
-8
-4
0
PAE vs Pin
Ids vs Pin
30
28
26
24
22
20
18
16
14
12
10
8
200
190
180
170
160
150
140
130
120
110
100
7 GHz
7 GHz
8 GHz
8 GHz
10.5 GHz
13 GHz
14 GHz
10.5 GHz
13 GHz
14 GHz
6
4
2
0
-20 -18 -16 -14 -12 -10
Pin (dBm)
-8
-6
-4
-2
0
-20 -18 -16 -14 -12 -10
Pin (dBm)
-8
-6
-4
-2
0
Data Sheet Rev. C, Feb 2021
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QPA2609D
®
7 – 14 GHz Low Noise Amplifier
Performance Plots – Linearity
Test conditions unless otherwise noted: VD = +3.5V, IDQ = 120 mA, f = 11 MHz, 25ꢀ°C. Data de-embedded to MMIC bond wires.
TOI vs Temperature
TOI vs Temperature
34
32
30
28
26
24
22
20
18
16
14
34
32
30
28
26
24
22
20
18
16
14
Pout = 10 dBm / tone
Pout = 0 dBm / tone
- 40 C
+ 25 C
+ 85 C
12
- 40 C
+ 25 C
+ 85 C
12
7
8
9
10
11
13
14
7
8
9
10
11
13
14
Freq (GHz)
Freq (GHz)
TOI vs Current
TOI vs Voltage
34
32
30
28
26
24
22
20
18
16
14
34
32
30
28
26
24
22
20
18
16
14
Pout = 0 dBm / tone
Pout = 0 dBm / tone
60 mA
10
90 mA
11
120 mA
12
150 mA
13 14
2.5 V
3.0 V
10
3.5 V
11
4.0 V
12
7
8
9
13
14
7
8
9
Freq (GHz)
Freq (GHz)
Data Sheet Rev. C, Feb 2021
|
Subject to change without notice
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QPA2609D
®
7 – 14 GHz Low Noise Amplifier
Performance Plots – Linearity
Test conditions unless otherwise noted: VD = +3.5V, IDQ = 120 mA, f = 11 MHz, 25ꢀ°C. Data de-embedded to MMIC bond wires.
IMD3 vs Temperature
0
Pout = 0 dBm / tone
-10
-20
-30
-40
-50
-60
-70
- 40 C
9
+ 25 C
+ 85 C
12
-80
7
8
10
11
13
14
Freq (GHz)
TOI vs Pout
IMD3 vs Pout
40
35
30
25
20
15
10
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
-100
7 GHz
8 GHz
-6 -4
10.5 GHz
13 GHz
14 GHz
10 12
7 GHz
8 GHz
10.5 GHz
13 GHz
14 GHz
-12 -10 -8
-2
0
2
4
6
8
-12 -10 -8 -6 -4 -2
0
2
4
6
8
10 12
Pout (dBm) / tone
Pout (dBm) / tone
IMD3 vs Voltage
IMD3 vs Current
0
-10
-20
-30
-40
-50
-60
-70
-80
0
-10
-20
-30
-40
-50
-60
-70
-80
2.5 V
3.0 V
3.5 V
4.0 V
60 mA
90 mA
120 mA
150 mA
Pout = 0 dBm / tone
Pout = 0 dBm / tone
7
8
9
10
11
12
13
14
7
8
9
10
11
12
13
14
Freq (GHz)
Freq (GHz)
Data Sheet Rev. C, Feb 2021
|
Subject to change without notice
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QPA2609D
®
7 – 14 GHz Low Noise Amplifier
Performance Plots – Linearity
Test conditions unless otherwise noted: VD = +3.5V, IDQ = 120 mA, f = 11 MHz, 25ꢀ°C. Data de-embedded to MMIC bond wires.
IMD5 vs Temperature
IMD5 vs Pout
-30
-40
-30
-40
- 40 C
+ 25 C
+ 85 C
-50
-50
Pout = 0 dBm / tone
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-100
-110
-120
7 GHz
8 GHz
10.5 GHz
-2
13 GHz
14 GHz
7
8
9
10
11
12
13
14
-12 -10 -8
-6
-4
0
2
4
6
8
10 12
Freq (GHz)
Pout (dBm) / tone
IMD5 vs Voltage
IMD5 vs Current
-30
-40
-30
-40
2.5 V
3.0 V
3.5 V
4.0 V
60 mA
90 mA
120 mA
150 mA
-50
-50
Pout = 0 dBm / tone
Pout = 0 dBm / tone
-60
-60
-70
-70
-80
-80
-90
-90
-100
-110
-120
-100
-110
-120
7
8
9
10
11
12
13
14
7
8
9
10
11
12
13
14
Freq (GHz)
Freq (GHz)
Data Sheet Rev. C, Feb 2021
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Subject to change without notice
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QPA2609D
®
7 – 14 GHz Low Noise Amplifier
Mechanical Drawing and Bond Pad Description
Unit: millimeters
Die x, y size tolerance: +/- 0.010, die thickness: 0.10
Chip edge to bond pad dimensions are shown to center of pad. Ground is backside of die
Pad No.
Label
RF Input
VG1
Pad Size (um)
91 x 197
82 x 82
Description
1
2
3
4
5
6
7
8
Matched to 50 ohms, DC blocked
Gate Voltage; bias network is required (VG can be tied together at PCB)
Gate Voltage; bias network is required (VG can be tied together at PCB)
Gate Voltage; bias network is required (VG can be tied together at PCB)
Matched to 50 ohms, DC blocked
VG2
82 x 82
VG3
82 x 82
RF Output
VD3
91 x 197
82 x 82
Drain Voltage; bias network is required (VD can be tied together at PCB)
Drain Voltage; bias network is required (VD can be tied together at PCB)
Drain Voltage; bias network is required (VD can be tied together at PCB)
VD2
82 x 82
VD1
82 x 82
Data Sheet Rev. C, Feb 2021
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QPA2609D
®
7 – 14 GHz Low Noise Amplifier
Assembly Notes
Component placement and adhesive attachment assembly notes:
•
•
•
•
•
Vacuum pencils and/or vacuum collets are the preferred method of pick up.
Air bridges must be avoided during placement.
The force impact is critical during auto placement.
Organic attachment (i.e., conductive epoxy) can be used in low-power applications.
Curing should be done in a convection oven; proper exhaust is a safety concern.
Reflow process assembly notes:
•
•
•
•
•
•
•
Use AuSn (80/20) solder and limit exposure to temperatures above 300C to 3-4 minutes, maximum.
Conductive epoxy die attach is recommended for PCB mounting.
Bonding pads plating: Au.
An alloy station or conveyor furnace with reducing atmosphere should be used.
Do not use any kind of flux.
Coefficient of thermal expansion matching is critical for long-term reliability.
Devices must be stored in a dry nitrogen atmosphere.
Interconnect process assembly notes:
•
•
•
•
Thermosonic ball bonding is the preferred interconnect technique.
Force, time, and ultrasonics are critical parameters.
Aluminum wire should not be used.
Devices with small pad sizes should be bonded with 0.0007-inch wire.
Data Sheet Rev. C, Feb 2021
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Subject to change without notice
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QPA2609D
®
7 – 14 GHz Low Noise Amplifier
Evaluation Board and BOM
RF Layer is 0.008” thick Rogers Corp. RO4003C (εr = 3.35). Metal layers are 0.5 oz. copper. The microstrip line at the
connector interface is optimized for the Southwest Microwave end launch connector 1092-01A-5. PCB level tuning at
input side is recommended for optimal performance.
Bill of Material ꢀ–ꢀ Evaluation Board
Ref. Des.
C3, C12
C6, C15
C9, C18
Value
0.01 uF
1.0 uF
10 uF
Description
Manuf.
Various
Various
Various
Part Number
CAP 0.01UF +/-10% 50V 0402 X7R ROHS
CAP 1.0UF +/-10% 16V 0603 X7R ROHS
CAP CER 10UF 10V X7R 10% 0805 TDK ROHS
2.92 MM END LAUNCH CONNECTOR
RF IN, RF OUT 2.92 mm
Southwest Microwave 1092-01A-5
Data Sheet Rev. C, Feb 2021
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QPA2609D
®
7 – 14 GHz Low Noise Amplifier
Application Circuit and Biasing Sequence
Notes:
1. Can use separate gate and drain for individual stage controls.
Bias-up Procedure
Bias-down Procedure
1. Set ID limit to 220 mA, IG limit to 10 mA
2. Set VG to −1.3 V
1. Turn off RF signal
2. Reduce VG to −1.3 V. Ensure IDQ 0mA
3. Set VD to 0V
3. Set VD +3.5 V
4. Adjust VG more positive until IDQ = 120mA
(VG −0.46 V Typical)
5. Apply RF signal
4. Turn off VD supply
5. Turn off VG supply
Data Sheet Rev. C, Feb 2021
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QPA2609D
®
7 – 14 GHz Low Noise Amplifier
Thermal and Reliability Information
Parameter
Test Conditions
Value
65.0
Units
ºC/W
°C
Thermal Resistance (θJC) (1)
Channel Temperature, TCH (Under RF)
Median Lifetime (TM)
Tbase = 85°C, VD = 3.5 V, IDQ = 120 mA
Quiescent/Small Signal operation, PDISS = 0.42 W
112.3
4.0E07
Hrs
Notes:
1. Die mounted to 40 mil CuMo carrier plate with AuSn eutectic. Thermal resistance measured at back of carrier plate.
Median Lifetime
Test Conditions: VDꢁ=ꢁ+4ꢁV
Failure Criteria is 10% reduction in ID_MAX
Data Sheet Rev. C, Feb 2021
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QPA2609D
®
7 – 14 GHz Low Noise Amplifier
Handling Precautions
Parameter
Rating
Standard
ESDꢁ–ꢁHuman Body Model (HBM)
1A
ESDAꢀ/ꢀJEDEC JS-001-2012
Caution!
ESD-Sensitive Device
RoHS Compliance
This part is compliant with 2011/65/EU RoHS directive (Restrictions on the Use of Certain Hazardous Substances in Electrical and
Electronic Equipment) as amended by Directive 2015/863/EU.
This product also has the following attributes:
• TBBP-A (C15H12Br402) Free
• Lead Free
• PFOS Free
• SVHC Free
• Halogen Free (Chlorine, Bromine)
• Antimony Free
Contact Information
For the latest specifications, additional product information, worldwide sales and distribution locations:
Tel: 1-844-890-8163
Web: www.qorvo.com
Email: customer.support@qorvo.com
Important Notice
The information contained herein is believed to be reliable; however, Qorvo makes no warranties regarding the information contained
herein and assumes no responsibility or liability whatsoever for the use of the information contained herein. All information contained
herein is subject to change without notice. Customers should obtain and verify the latest relevant information before placing orders for
Qorvo products. The information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any
patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by
such information. THIS INFORMATION DOES NOT CONSTITUTE A WARRANTY WITH RESPECT TO THE PRODUCTS DESCRIBED
HEREIN, AND QORVO HEREBY DISCLAIMS ANY AND ALL WARRANTIES WITH RESPECT TO SUCH PRODUCTS WHETHER
EXPRESS OR IMPLIED BY LAW, COURSE OF DEALING, COURSE OF PERFORMANCE, USAGE OF TRADE OR OTHERWISE,
INCLUDING THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE.
Without limiting the generality of the foregoing, Qorvo products are not warranted or authorized for use as critical components in medical,
life-saving, or life-sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal
injury or death.
© 2021 Qorvo US, Inc. All rights reserved. This document is subject to copyright laws in various jurisdictions worldwide and may not be
reproduced or distributed, in whole or in part, without the express written consent of Qorvo US, Inc.
Data Sheet Rev. C, Feb 2021
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