NE5500134-T1-AZ [RENESAS]
NE5500134-T1-AZ;型号: | NE5500134-T1-AZ |
厂家: | RENESAS TECHNOLOGY CORP |
描述: | NE5500134-T1-AZ 放大器 ISM频段 晶体管 |
文件: | 总8页 (文件大小:279K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
To our customers,
Old Company Name in Catalogs and Other Documents
On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology
Corporation, and Renesas Electronics Corporation took over all the business of both
companies. Therefore, although the old company name remains in this document, it is a valid
Renesas Electronics document. We appreciate your understanding.
Renesas Electronics website: http://www.renesas.com
April 1010
Rectronics Corporation
Issued by: Renesas Electronics Corporation (m)
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DATA SHEET
SILICON POWER MOS FET
NE5500134
N-CHANNEL SILICON POWER MOS FET
POWER AMPLIFIER FOR 0.8 TO 2.0 GHz CELLULAR HANDSETS
DESCRIPTION
The NE5500134 is an N-channel silicon power MOS FET specially designed as the transmission power amplifier
for 0.8 to 2.0 GHz cellular handsets. Dies are manufactured using our NEWMOS technology (our 0.6 μm WSi gate
lateral MOS FET), housed in a surface mount 3-pin power minimold (34 PKG) (SOT-89 type) package. The device
can deliver 29.5 dBm output power with 55% power added efficiency at 1.9 GHz der the 4.8 V supply voltage.
FEATURES
•
•
•
•
•
High output power
: Pout = 29.5 dBm TYP. (VDS = 4.8 V, GHz, Pin = 20 dBm)
High power added efficiency : ηadd = 55% TYP. (VDS = 4.8 V, Iin = 20 dBm)
High linear gain
: GL = 13 dB TYP. (VDS = 4.8 z, Pin = 10 dBm)
: 3-pin power minimold (34
: VDS = 3.0 to 6.0 V
Surface mount package
Single supply
APPLICATIONS
•
•
Digital cellular phones
Others
: Driver amplifiers dsets
: General purpGHz TDMA applications
ORDERING INFORMATION
<R>
Part Number
NE5500134
Order Numb
NE55001
Marking
V1
Supplying Form
old
de: 34)
External
r plating)
• Magazine case
• Qty 25 pcs/case
NE5500134-T1 NE5500134-T1-
n power minimold
OT-89, Our code: 34)
(Pb-Free : External
solder plating)
• 12 mm wide embossed taping
• Source pin face the perforation side of the tape
• Qty 1 kpcs/reel
Remarks 1. To order evaluation samples, contact your nearby sales office.
Part number for sample order: NE5500134
2. This product is containing Pb-material inside.
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Document No. PU10404EJ02V0DS (2nd edition)
Date Published August 2007 NS
Printed in Japan
2004, 2007
The mark <R> shows major revised points.
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.
NE5500134
ABSOLUTE MAXIMUM RATINGS (TA = +25°C)
Operation in excess of any one of these parameters may result in permanent damage.
Parameter
Drain to Source Voltage
Gate to Source Voltage
Drain Current
Symbol
VDS
VGS
ID
Ratings
Unit
V
20
6.0
V
0.5
A
Total Power Dissipation
Channel Temperature
Storage Temperature
Ptot
10
W
°C
°C
Tch
125
Tstg
−65 to +125
RECOMMENDED OPERATING CONDITIONS
Parameter
Drain to Source Voltage
Gate to Source Voltage
Drain Current
Symbol
VDS
VGS
ID
Test Conditions
IN.
TYP.
4.8
2.0
3
−
MAX.
Unit
V
6.0
3.5
0.5
20
V
Duty Cycle ≤ 50%, Ton
A
Input Power
Pin
f = 1.9 GHz, VDS =
dBm
ELECTRICAL CHARACTERISTICS
(TA = +25°C, unless otherwise specified, uxture.)
Parameter
Symbol
I
MIN.
TYP.
MAX.
100
Unit
nA
Gate to Source Leakage Current
−
−
−
−
Drain to Source Leakage Current
(Zero Gate Voltage Drain Current)
100
nA
Gate Threshold Voltage
Thermal Resistance
Transconductance
Drain to Source Breakdown Volt
Output Power
S = 1 mA
to Case
1.0
−
1.45
10
2.0
−
V
°C/W
mS
V
= 4.8 V, IDS = 250 mA
IDSS = 10 μA
−
410
24
−
t
ID
20
28.5
−
−
f = 1.9 GHz, VDS = 4.8 V,
Pin = 20 dBm,
29.5
0.3
−
dBm
A
Drain Current
−
IDset = 200 mA (RF OFF)
Power Added Efficiency
Linear GainNote
ηadd
GL
48
−
55
−
%
13.0
−
dB
Note Pin = 10 dBm
DC performance is 100% testing. RF performance is testing several samples per wafer.
Wafer rejection criteria for standard devices is 1 reject for several samples.
2
Data Sheet PU10404EJ02V0DS
NE5500134
TYPICAL CHARACTERISTICS (TA = +25°C, f = 1.9 GHz, IDset = 200 mA, unless otherwise specified)
<R>
DRAIN CURRENT vs.
DRAIN TO SOURCE VOLTAGE
SET DRAIN CURRENT vs.
GATE TO SOURCE VOLTAGE
3.5
3.0
2.5
2.0
1.5
1.0
0.5
1 000
100
10
V
GS = 10 V MAX.
V
DS = 4.8 V
Step = 1.0 V
1
0.1
0
2
4
6
8
10 12
14 16
1.0
5
2.0
2.5
3.0
Drain to Source Voltage VDS (V)
ource Voltage VGS (V)
OUTPUT POWER vs. INPUT POWER
. INPUT POWER
35
30
25
20
15
10
0
100
0
V
DS = 5.8 V
V
DS = 4.8 V
V
DS = 5.8 V
V
DS = 4.8 V
0
5
0
5
10
15
20
25
In
Input Power Pin (dBm)
POWER ADDED EFFICIENINPUT POWER
100
80
η
60
V
DS = 4.8 V
V
40
20
0
DS = 5.8 V
0
5
10
15
20
25
Input Power Pin (dBm)
Remark The graphs indicate nominal characteristics.
3
Data Sheet PU10404EJ02V0DS
NE5500134
PACKAGE DIMENSIONS
3-PIN POWER MINIMOLD (34 PKG) (UNIT: mm)
(Bottom View)
(Side View)
(Top View)
4.5 0.1
1.5 0.1
1.6 0.2
V1
2
2
3
1
3
2
+0.03
–0.06
0.41
0.42 0.06
0.42 0.06
1
0.47 0.06
1.5
3.0
PIN CONNE
1.
4
Data Sheet PU10404EJ02V0DS
NE5500134
RECOMMENDED SOLDERING CONDITIONS
<R>
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Infrared Reflow
Soldering Conditions
Condition Symbol
IR260
Peak temperature (package surface temperature)
Time at peak temperature
: 260°C or below
: 10 seconds or less
: 60 seconds or less
: 120 30 seconds
: 3 times
Time at temperature of 220°C or higher
Preheating time at 120 to 180°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Wave Soldering
Partial Heating
Peak temperature (molten solder temperature)
Time at peak temperature
: 260°C or below
: 10 seconds or less
WS260
HS350
Preheating temperature (package surface temperature) : 120°C or below
Maximum number of flow processes
: 1 time
Maximum chlorine content of rosin flux (% mass)
: 0.t.) or below
Peak temperature (terminal temperature)
Soldering time (per side of device)
low
ss
Maximum chlorine content of rosin flux (% mass
Caution Do not use different soldering methods togeing).
5
Data Sheet PU10404EJ02V0DS
NE5500134
•
The information in this document is current as of August, 2007. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC Electronics data
sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not
all products and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without the prior
written consent of NEC Electronics. NEC Electronics assumes no reslity for any errors that may
appear in this document.
•
NEC Electronics does not assume any liability for infringement of ts or other intellectual
property rights of third parties by or arising from the use of NEC ed in this document
or any other liability arising from the use of such products. d or otherwise, is
granted under any patents, copyrights or other intellectual procs or others.
Descriptions of circuits, software and other related inforprovided for illustrative
purposes in semiconductor product operation and e incorporation of these
circuits, software and information in the design ohall be done under the full
responsibility of the customer. NEC Electronicty for any losses incurred by
customers or third parties arising from the use nd information.
•
• While NEC Electronics endeavors to enhasafety of NEC Electronics products,
customers agree and acknowledge that treof cannot be eliminated entirely. To
minimize risks of damage to proper) to persons arising from defects in NEC
Electronics products, customers safety measures in their design, such as
redundancy, fire-containment a
• NEC Electronics products ang three quality grades: "Standard", "Special" and
"Specific".
The "Specific" quality Electronics products developed based on a customer-
designated "quality cific application. The recommended applications of an NEC
Electronics produc, as indicated below. Customers must check the quality grade of
each NEC Electronics t in a particular application.
"Standard": Computerst, communications equipment, test and measurement equipment, audio
and visual eqme electronic appliances, machine tools, personal electronic equipment
and industrial rob
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support).
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications
not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to
determine NEC Electronics' willingness to support a given application.
(Note)
(1)
"NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
majority-owned subsidiaries.
(2)
"NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
M8E 02. 11-1
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