BD18327EFV-M [ROHM]

BD18327EFV-M是一款适用于两轮机动车转向指示灯的50V耐压 1.5A 单通道LED驱动器。该产品采用内置CR定时器来控制LED闪烁，内置LED开路检测、短路保护、过电压保护等功能，因此具有高可靠性。当检测到LED开路时，其输出闪烁频率会加倍。在高输入电压条件下，为了控制IC的发热量并保护LED负载，IC的输出PWM占空比会降低。;


型号：	BD18327EFV-M
厂家：	ROHM
描述：	BD18327EFV-M是一款适用于两轮机动车转向指示灯的50V耐压 1.5A 单通道LED驱动器。该产品采用内置CR定时器来控制LED闪烁，内置LED开路检测、短路保护、过电压保护等功能，因此具有高可靠性。当检测到LED开路时，其输出闪烁频率会加倍。在高输入电压条件下，为了控制IC的发热量并保护LED负载，IC的输出PWM占空比会降低。驱动驱动器
文件：	总31页 (文件大小：1277K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Datasheet

Automotive LED Driver Series

50 V 1.5 A 1ch LED Driver for 2 Wheeler Turn

Indicator

BD18327EFV-M

General Description

Key Specifications

BD18327EFV-M is 50 V-withstanding 1.5 A 1ch LED Driver

for 2 Wheeler Turn Indicator. It has built-in CR Timer for LED

blinking control. The IC provides high reliability because it

has LED open detection, short circuit protection, over

voltage protection. In case of LED open detection, output

blinking rate is doubled. Under high input voltage condition,

output PWM ON Duty reduces to control heat dissipation

across the IC and protect the LED load.

◼

Input Voltage Range:

OUT Pin Maximum Output Current:

OUT Pin ON Resistance for High Mode: 0.8 Ω (Max)

Circuit Current at Power Saving Mode:

100 μA (Max)

6.0 V to 18.0 V

1.5 A

◼

CR Timer Frequency Range:

Operating Temperature Range:

150 Hz to 1 kHz

-40 °C to 125 °C

Features

Package

HTSSOP-B20

W (Typ) x D (Typ) x H (Max)

6.5 mm x 6.4 mm x 1.0 mm

◼

AEC-Q100 Qualified^{(Note 1)}

Functional Safety Supportive Automotive Products

Flasher SW Resistance Detection

Power Saving Mode

Built-in CR Timer

LED Open Detection

Disable LED Open Detection Function

at Reduced-voltage

◼

Short Circuit Protection (SCP)

Over Voltage Protection (OVP)

Output PWM ON Duty Control

during High Input Voltage

(Note 1) Grade1

Applications

◼

2 Wheeler Turn Indicator

Typical Application Circuit

Flasher SW

R_SE

SOURCE

OUT

OUTS

VREG

R_SSE

V_REG

V_IN

SSE

D_IN

C_VREG

VIN

R_CRT1

Left

Front

Rear

DISC

CRT

Z_D

C_VIN

R_VDR1

R_CRT2

BD18327EFV-M

VDR

Z_{D_OP}

V_REG

R_VSCP1

R_VSCP2

C_CRT

R_VDR2

R_VOP1

VSCP

TEST

VOP

R_VOP2

Right

Front

Right

Rear

PSSW

GND

〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays.

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BD18327EFV-M

Pin Configuration

HTSSOP-B20

(TOP VIEW)

SOURCE

OUT

OUTS

N.C.

SSE

VREG

N.C.

EXP-PAD

VIN

DISC

N.C.

CRT

VDR

VOP

PSSW

VSCP

TEST

GND

Pin Description

Pin No.

Pin Name

Function

Power PMOS source pin

SOURCE

Output current sense input pin

No internal connection^{(Note 1)}

N.C.

SSE

Output current sense input in Low Mode

No internal connection^{(Note 1)}

Power supply input

N.C.

VIN

N.C.

No internal connection^{(Note 1)}

PWM ON Duty setting

VDR

Open detection threshold setting pin

Programmable ground pin

GND

VOP

PSSW

GND

TEST

VSCP

CRT

The test pin connects to GND

Short detection threshold setting pin

CR timer setting1

CR timer setting2

DISC

N.C.

No internal connection^{(Note 1)}

Regulated voltage pin

VREG

N.C.

No internal connection^{(Note 1)}

Output sense pin

OUTS

OUT

Output pin

EXP-PAD

The EXP-PAD connect to GND.

(Note 1) Leave this pin unconnected.

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Block Diagram

SOURCE

SSE

VIN

OUT

LED Open Det.

/ SCP

High Mode

DRV

VIN

Low Mode

DRV

VBG

Bandgap

Ref (BG)

PSM

VBG

Flasher SW

Monitor

VREG

VDR

VREG

OUTS

PSSW

VREG

0.95 V

/ 1.0 V

PWM ONDuty

Control

VREG

PSSW

CRT

LOGIC

CR TIMER

DIVIDER

DISC

VIN

40 mV

VOP

VREG

VBG

VIN

VSE

UVLO

TSD

VSCP

TEST

VBG

LED OPEN Det. / SCP

GND

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Description of Blocks

(Unless otherwise specified, Ta = 25 °C, V_IN= 13 V, and numbers are “Typical” values.)

Operation mode description

1.1 Power Saving Mode (PS Mode)

After power on, the IC starts up in power saving mode. The current consumption of the IC is limited to 100 μA or less,

and it is possible to reduce the power consumption when the Flasher SW is off. In the PS mode, the MOSFET built into

the PSSW pin can be turned off to shut off the current flowing to the external resistor. When the Power Saving Mode is

released, the IC monitors the VIN pin voltage, and when the UVLO VIN Release Voltage (5.0 V (Typ)) is exceeded, the

IC shifts to Flasher SW Monitor Mode. The release condition for the power saving mode is expressed by the following

equation.

퐼_{푂푈푇_푃푆푀}× 푅_푃푆푀×> 푉_{푃푆푀_ꢀ퐸퐿}

푎푛푑

> 푉_{푈ꢂ퐿푂ꢀ}

푉

ꢁ푁

ꢂ

ꢃꢄ

퐼_{푂푈푇_푃푆푀}

ꢀ

ꢅꢆꢇ

+ꢀ +ꢀ

ꢆ푊 ꢈꢉ퐷

where:

퐼_{푂푈푇_푃푆푀}

푅_푃푆푀

is the OUT pin current in Power Saving Mode.

is the Power Saving Mode Internal Resistance.

is the Power Saving Mode Release Threshold.

is the VIN pin voltage.

푉_{푃푆푀_ꢀ퐸퐿}

푉

ꢁ푁

푉_{푈ꢂ퐿푂ꢀ}

푅_퐿퐸ꢊ

푅_푆ꢋ

is the UVLO VIN Release Voltage.

is the LED board resistance.

is the Flasher SW resistance.

Solving above equation for R_SW

ꢂ

ꢃꢄ

푅_푆ꢋ< 푅_푃푆푀

− 푅_푃푆푀− 푅_퐿퐸ꢊ

ꢂ

ꢅꢆꢇ_ꢌꢉꢈ

V_IN

VIN

VDR

Flasher

Left Side

V_IN

R_A

R_B

OUT

to Logic

VOP

RSW

PSSW

RF Lamp

RR Lamp

R_LED

R_PSM= R_A+R_B

PSSW

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Operation mode description – continued

1.2 Flasher SW Monitor Mode

When PS Mode is released, the IC shifts to Flasher SW Monitor Mode. When the IC shifts to Flasher SW monitor mode,

the constant current source for SW resistance monitoring turns on and monitoring of the OUTS pin voltage starts.

The constant current source turns ON only in the ON Duty section set by CR timer, and the judgment of the SW monitor

also becomes only in this section. After switching from PS mode, if the OUTS pin voltage is V_{OUTS_ON}(0.95 V (Typ)) or

more within 8 CLK cycle, the IC returns to PS mode again.

Condition for IC to go from Flasher SW Monitor Mode to Blinking High Mode:

After switching from PS mode, if the OUTS pin voltage falls below V_{OUTS_ON}(0.95 V (Typ)) within 8 CLK cycles, the IC

shifts to the blinking High mode. The Blinking High Mode transition conditions are as follows.

(

)

푉_푂푈푇푆= 퐼_{푂푈푇_푆ꢋ푀푂푁ꢁ}× 푅_푆ꢋꢍ 푅_퐿퐸ꢊ< 푉_{푂푈푇푆_푂푁}

ꢂ

ꢆꢆꢉ_퐹퐵

퐼_{푂푈푇_푆ꢋ푀푂푁ꢁ}

ꢀ

ꢆꢆꢉ

(

)

ꢀ

+ꢀ

ꢈꢉ퐷

ꢆ푊

< 퐾_ꢎ퐿푂푁

ꢀ

ꢆꢆꢉ

where:

푉_푂푈푇푆

is the OUTS pin voltage.

퐼_{푂푈푇_푆ꢋ푀푂푁ꢁ}

is the OUT pin current in Flasher SW Monitor Mode.

푉

푆푆퐸_ꢏꢎ

is the SSE pin Feedback Voltage.

푅_푆푆퐸

푅_푆ꢋ

is the Constant Current Setting Resistor.

is the Flasher SW resistance.

푅_퐿퐸ꢊ

is the LED board resistance.

푉_{푂푈푇푆_푂푁}

퐾_ꢎ퐿푂푁

is the Blinking ON Threshold Voltage.

is the Blinking ON Threshold Constant. ( K_BLON= V_{OUTS_ON}/ V_{SSE_FB}

)

R_SSE

R_SE

VIN

SSE

Internal MOSFET

for Blinking High Mode

V_{SSE_FB}

: 0.95 V

OFF

Flasher

Left Side

Constant Current Source

for Flasher SW Monitor

OUT

I_{OUT_SWMONI}

OUTS

From Logic

R_SW

RF Lamp

RR Lamp

R_LED

to Logic

CR TIMER

V_{OUTS_ON}: 0.95 V

/ V_{OUTS_OFF}: 1.0 V

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Operation mode description – continued

1.3 Blinking High Mode

The Blinking High mode continues for 256 CLK cycles. During Blinking High Mode, the constant current source for

Flasher SW monitoring and the comparator built into the OUTS Pin turn off. During this period, the IC performs LED

Open Detection, SW Open Detection and Short Circuit Protection. After 256 CLK cycles, the IC shifts to Blinking Low

Mode.

R_SSE

R_SE

VIN

SSE

Internal MOSFET

for Blinking High Mode

V_{SSE_FB}

: 0.95 V

Flasher

Left Side

OUT

OFF

From Logic

R_SW

RF Lamp

OUTS

RR Lamp

R_LED

to Logic

_{OUTS_ON}: 0.95 V

/ V_{OUTS_OFF}: 1.0 V

OFF

1.4 Blinking Low Mode

When the IC enters Blinking Low Mode, the internal counter starts counting. After 256 CLK cycles, the IC shifts to

Blinking High Mode. If the OUTS pin voltage reaches V_{OUTS_OFF}(1.0 V (Typ)) or more before 256 CLK cycles elapse,

the IC returns to Flasher SW Resistance Monitor Mode again. The Flasher Switch Monitor Mode transition conditions

are as follows.

푉_푂푈푇푆> 푉_{푂푈푇푆_푂ꢏꢏ}

(

)

ꢀ

+ꢀ

ꢈꢉ퐷

ꢆ푊

> 퐾_{ꢎ퐿푂ꢏꢏ}

ꢀ

ꢆꢆꢉ

where:

푉_{푂푈푇푆_푂ꢏꢏ}

퐾_{ꢎ퐿푂ꢏꢏ}

is the Blinking OFF Threshold Voltage.

is the Blinking OFF Threshold Constant. ( K_BLOFF= V_{OUTS_OFF}/ V_{SSE_FB}

)

R_SSE

R_SE

VIN

SSE

Internal MOSFET

for Blinking High Mode

V_{SSE_FB}

: 0.95 V

OFF

Flasher

Left Side

Constant Current Source

for Flasher SW Monitor

OUT

I_{OUT_SWMONI}

OUTS

From Logic

R_SW

RF Lamp

RR Lamp

R_LED

to Logic

CR TIMER

V_{OUTS_ON}: 0.95 V

/ V_{OUTS_OFF}: 1.0 V

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Operation mode description – continued

1.5 Flasher SW Open Detection (SWOP)

If voltage drop across external resistance R_SEdrops below a certain value, Flasher SW open is detected.

When the Flasher SW open is detected, the IC shifts from Blinking High mode to Power Saving Mode.

Flasher SW Open detection can only be detected in Blinking High Mode.

The Flasher SW Open Detection condition can be calculated by the following formula.

푉

ꢁ푁_푆퐸

> 푉

푆ꢋ푂푃

where:

푉

is the VIN to SE voltage.

is the Flasher SW Open Detection Threshold.

ꢁ푁_푆퐸

푉

푆ꢋ푂푃

VIN

R_SE

VIN

SOURCE

LOGIC

V_SWOP

40 mV

DRV

OUT

Hi-Z

RSW < RPSM × VIN / VPSM_REL - RPSM - RLED

R_SW> R_PSM× V_IN/ V_{PSM_DET}- R_PSM- R_LED

R_SW

RSW < KBL_ON×RSSE - RLE D

R_SW> K_{BL_OFF}×R_SSE- R_LED

V_{IN_SE}

ON : 256 CLK

cycles

OFF : 256 CLK

cycles

ON : 256 CLK

cycles

OFF

V_OUT< V_IN- V_{PSM_REL}(1.0 V)

V_IN

V_OUT

VOUT < VIN - VPSM_DET (0.9 V)

V_OUTS

V_OUTS< V_{OUTS_ON}(0.95 V)

V_OUTS> V_{OUTS_OFF}(1.0 V)

8 CLK

Cycles

Flasher

Monitor

Mode

Power

Saving

Mode

Flasher SW

Monitor

Mode

Power

Saving

Mode

Blinking Mode

(High / Low)

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1.5 Flasher SW Open Detection (SWOP) – continued

Hi-Z

RSW > RPSM × VIN / VPSM_DET - RPSM - RLE D

RSW < RPSM × VIN / VPSM_REL - RPSM - RLED

R_SW

R_SW< K_{BL_ON}×R_SSE- R_{LE D}

V_{IN_SE}

V_{IN_SE}< 50 mV

ON : 256 CLK

cycles

OFF : 256 CLK

cycles

ON : 256 CLK

cycles

OFF : 256 CLK

cycles

V_OUT< V_IN- V_{PSM_REL}(1.0 V)

V_OUT< V_IN- V_{PSM_DET}(0.9 V)

V_IN

V_OUT

V_OUTS

V_OUTS< V_{OUTS_ON}(0.95 V)

8 CLK

Cycles

Flasher

Monitor

Mode

Power

Saving

Mode

Flasher SW

Monitor

Mode

Power

Saving

Mode

Blinking Mode

(High / Low)

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Operation mode description – continued

1.6 LED Open Detection Mode (LEDOP)

This LSI can detect LED open. In case of LED open inform the fault condition to user by double blinking. On detection

of fault IC starts operating the outputs on almost 1/2 blinking period (double blink operation). If voltage drop across

external resistance R_SEdrops below a certain value, LED open is detected. The LED open detection condition can be

calculated by the following formula.

푉

ꢁ푁_푆퐸

< 푉_푂푃퐸푁& 푉 > 푉

ꢁ푁_푂푃푀

ꢁ푁

푉_푂푃

푉_푂푃퐸푁

ꢀ

ꢐꢑꢅ2

푉_푂푃= (푉 − 푉_{푍ꢊ_푂푃}) ×

ꢁ푁

ꢀ

+ꢀ

ꢐꢑꢅ2

ꢐꢑꢅꢒ

where:

푉

ꢁ푁_푆퐸

is the VIN to SE voltage.

푉_푂푃퐸푁

푉

ꢁ푁

is the LED Open Detection Threshold Voltage.

is the VIN pin voltage.

푉

is the Disable LED Open Detection Function at Reduced-voltage.

ꢁ푁_푂푃푀

푉_푂푃

is the VOP pin voltage.

푉_{푍ꢊ_푂푃}

푅_ꢂ푂푃ꢓ

푅_ꢂ푂푃ꢔ

is the characteristic Zener voltage of diode Z_{D_OP}(chosen based on output voltage).

is the LED Open Detection Threshold Setting Resistor 1.

is the LED Open Detection Threshold Setting Resistor 2.

VIN

R_SE

V^IN

VIN

SOURCE

LOGIC

V_OPEN

ZD_OP

R_VOP1

R_VOP2

VOP

DRV

PSSW

OUT

Transition when

< V_OP/10

Transition when

VIN_SE > VOP/10

IN_SE

Normal Blinking

LED Open

Normal Blinking

OFF:

256 CLK cycles

ON:

256 CLK cycles

OFF: 112

ON: 112

OFF: 112

ON:

256 CLK cycles

OFF: 256

CLK cycles

ON:

256 CLK cycles

CLK cycles CLK cycles CLK cycles

V_{IN_SE}

increases

LED Open

Detection Masked

Masked

V_{IN_SE}

V_OP/10

LED Open Detection

Threshold

V_{IN_SE}decreases

CLK

PWM

V_OUT

Completes previous pattern of 256

cycles, before double blinking

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Operation mode description – continued

1.7 Short Circuit Protection Mode (SCP)

When voltage drop across R_SErises above a certain value, short circuit is detected.

When short circuit is detected, the MOSFET connected to the OUT pin is turned off to prevent overcurrent from flowing

into the IC. The Short Circuit Protection condition can be calculated by the following formula.

푉

ꢁ푁_푆퐸

> 푉

푆퐻푂ꢀ푇

ꢂ

ꢆ퐶ꢅ

푉

푆퐻푂ꢀ푇

ꢔ

ꢀ

ꢐꢆ퐶ꢅ2

푉

푆ꢕ푃

= 푉_ꢀ퐸퐺

ꢀ

+ꢀ

ꢐꢆ퐶ꢅ2

ꢐꢆ퐶ꢅꢒ

where:

푉

ꢁ푁_푆퐸

is the VIN to SE voltage.

푉

푆ꢕ푃

is the Short Circuit Protection Threshold Voltage .

is the VSCP pin voltage.

푆퐻푂ꢀ푇

푅_{ꢂ푆ꢕ푃ꢓ}

푅_{ꢂ푆ꢕ푃ꢔ}

is the SCP Threshold Setting Resistor 1.

is the SCP Threshold Setting Resistor 2.

VIN

R_SE

VIN

SOURCE

V_SHORT

LOGIC

DRV

VREG

R_VSCP1

VSCP

R_VSCP2

OUT

Transition when

VIN_SE > VSCP/2

VIN_SE < VSCP/2

Normal Blinking

Short Circuit

Normal Blinking

ON:

256 CLK cycles

OFF:

256 CLK cycles

ON:

256 CLK cycles

OFF:

256 CLK cycles

ON:

256 CLK cycles

VIN_SE increases

Short Circuit

Protection Masked

Short Circuit

Protection Masked

V_SCP/ 2

Short Circuit

V_{IN_SE}

Protection Threshold

CLK

PWM

V_OUT

Short Circuit detected

on rising edge of

Blinking ON cycle

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Description of Blocks – continued

State Transition Diagram

Power Saving Mode

(I_{VIN_PS}< 100 μA)

V_OUTS< V_IN- V_{PSM_REL}(1.0 V)

Under Voltage

Lock out (UVLO)

VIN > VUVLOR (5.0 V)

VIN < VUVLOD (4.5 V)

Yes

Flasher

SW Monitor

Mode

check if

VOUTS > VIN - VPSM_DET (0.9 V)

8 Counts starts

check if

V_OUTS< V_{OUTS_ON}(0.95 V)

in every CLK ON cycle

Monitor RSW

1 Count starts

Yes

LED Open

Detection Mode

Flasher SW

Open Detection

V_{IN_SE}> V_OP/ 10

Double Blink High Mode:

112 ON cycles

V_{IN_SE}< V_SWOP(40 mV)

112 cycles

over

112 cycles

over

112 OFF cycles

112 cycles

over

Double Blink Low Mode:

112 OFF cycles

each

"ON"

cycles

Blinking High Mode

: 256 ON cycles

VIN_SE < VOP / 10 and 256 cycles over

VIN_SE > VSCP / 2

V_OUTS> V_{OUTS_OFF}(1.0 V)

256

cycles

over

256

cycles

over

Blinking High Mode:SCP

(Internal MOSFET OFF)

each

"OFF"

cycles

Blinking Low Mode

: 256 OFF cycles

256 OFF cycles

256 cycles

over

Short Circuit

Protection Mode

OVP/TSD

Release

OVP/TSD

Detect

OVP/TSD: Driver Shutdown

(Internal MOSFET OFF)

State transitions uninterrupted

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Description of Blocks – continued

CR Timer

This IC determines the flasher cycle from the internal clock generated by CR timer. The CR timer period, ON Duty, can be

set by the external resistor R_CRT1, R_CRT2and the capacitance C_CRT

(1) CRT ramp up Time t₁and CRT ramp down Time t₂

CRT ramp up Time t₁and CRT ramp down Time t₂can be defined from the following equations.

Make sure that t₂is set PWM Minimum Pulse Width t_MIN(100 μs) or more.

(

)

×ꢕ

ꢀ

+ꢀ

푁

퐶ꢌꢖꢒ

퐶ꢌꢖ2

퐶ꢌꢖ

푡_ꢓ=

푡_ꢔ=

[s]

퐶ꢗ퐴

(

)

ꢀ

+ꢀ ×ꢕ

퐶ꢌꢖ2

퐷

퐶ꢌꢖ

[s]

푁

퐷ꢃꢆ

When R_CRT2>> R_D

ꢀ

×ꢕ

퐶ꢌꢖ2

퐶ꢌꢖ

푡_ꢔ=

[s]

푁

퐷ꢃꢆ

where:

푅_ꢕꢀ푇ꢓ

푅_ꢕꢀ푇ꢔ

푅_ꢊ

is the CR Timer Time Setting Resistor 1.

is the DISC Pin ON Resistance.

ꢘ_ꢕꢀ푇

ꢙ_ꢕ퐻ꢚ

ꢙ_ꢊꢁ푆

is the CR Timer Time Setting Capacitor.

is the CR Timer Charge Constant.

is the CR Timer Discharge Constant.

(2) Internal clock frequency f_CLKand ON Duty D_ON

Internal clock frequency and internal clock ON Duty is defined by t₁and t₂.

ꢓ

푓

[Hz]

[%]

ꢕ퐿ꢛ

ꢜ +ꢜ

ꢒ

ꢜ

ꢝ_푂푁

ꢜ +ꢜ

ꢒ

CRT voltage ramp down

CRT voltage ramp up

V_{CRT_DIS}= 1.75 V (Typ)

V_REG

R_CRT1

CRT pin

waveform

⊿V_CRT

DISC

CRT

to Logic

R_CRT2

VCRT_CHA = 0.95 V (Typ)

t₂

t₁

C_CRT

Internal

Clock

0.95 V /

1.75 V

Waveform

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Description of Blocks – continued

Output PWM ON Duty Control during high input voltage

This IC has built in Output PWM ON Duty Control during high input voltage which protects the output LEDs.

VDR pin voltage which is generated externally by dividing VIN pin voltage is compared with CRT pin voltage to generate

PWM signal. When VDR > VCRT, the internal MOSFET for Blinking High Mode is turned off and the increase in average

current flowing to the LED can be reduced.

Output PWM ON Duty D_{ON_PWM}is represented by following expression.

ꢂ

ꢞꢂ

퐷ꢌ

퐶ꢌꢖ_퐷ꢃꢆ

ꢝ_푂푁

[%]

ꢂ

ꢞꢂ

퐶ꢌꢖ_퐷ꢃꢆ

퐶ꢌꢖ_퐶ꢗ퐴

ꢀ

ꢐ퐷ꢌ2

푉_ꢊꢀ= 푉

[%]

ꢁ푁

ꢀ

+ꢀ

ꢐ퐷ꢌꢒ

ꢐ퐷ꢌ2

where:

푉

is the CRT Pin Discharge Voltage.

is the CRT Pin Charge Voltage.

is the VDR pin voltage.

ꢕꢀ푇_ꢊꢁ푆

푉

ꢕꢀ푇_ꢕ퐻ꢚ

푉_ꢊꢀ

푉

ꢁ푁

is the VIN pin voltage.

푅_ꢂꢊꢀꢓ

푅_ꢂꢊꢀꢔ

is the Output ON Duty Setting Resistor 1.

is the Output ON Duty Setting Resistor 2.

However,

V_DR≤ V_{CRT_CHA}: ON Duty = 100 %

V_DR≥ V_{CRT_DIS}: ON Duty = 0 %

Make sure to connect resistors for voltage division of VIN to fix the voltage on the VDR pin as shown in figure.

Example-

For R_VDR1= 47 kΩ and R_VDR2= 3.4 kΩ

When V_IN= 14 V,

When V_IN= 18 V,

V_DR= 0.944 V & ON Duty = 100 %

V_DR= 1.214 V & ON Duty = 66 %

So as VIN increases the PWM duty cycle decreases.

V_IN

V_DR

VCRT

V_CRT& V_DR

V_IN

R_VDR1

VDR

PWM

Signal

to Logic

R_VDR2

Internal Clock

(CLK) Signal

V_REG

R_CRT1

R_CRT2

C_CRT

1 CLK Cycle

DISC

CRT

to Logic

Blinking Cycle

256 CLK Cycles

One Blinking Cycle = 512 CLK cycles

LED

Current

0.95 V /

1.75 V

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Description of Blocks – continued

Reference Voltage (VREG)

Reference voltage VREG 5.0 V (Typ) is generated from VIN input voltage. This voltage is used as power source for the

internal circuit, and also used to fix the voltage of pins outside LSI to HIGH side. The VREG pin must be connected with C_VREG

= 1.0 μF to 10 μF to ensure capacity for the phase compensation. If C_VREGis not connected, the circuit behavior would become

extraordinarily unstable, for example with the oscillation of the reference voltage.

The VREG pin voltage must not be used as power source for other devices than this LSI.

VREG circuit has a built-in UVLO function. The IC is activated when the VREG pin voltage rises to 3.5 V (Typ) or higher, and

shuts down when the VREG pin voltage drops to 2.0 V (Typ) or lower.

Under Voltage Lock-Out (UVLO)

This IC has built-in under voltage lock-out function (UVLO).

For VIN ramp-up UVLO is active till VIN = 5.0 V (Typ). For VIN ramp down UVLO gets active when VIN = 4.5 V (Typ).

UVLO shuts down all circuit blocks other than regulator (VREG) block.

UVLO is also dependent on VREG voltage. At ramp-up UVLO is released when VREG > 3.5 V and at ramp down UVLO is

enabled when VREG = 2.0 V.

Over Voltage protection (OVP)

This LSI has a function to turn off output and prevent deterioration of load when VIN Pin voltage exceeds 25.5 V (Typ).

When OVP is detected, after the supply voltage drops more than hysteresis width of 500 mV (Typ) below OVP, it returns to

normal state.

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BD18327EFV-M

Timing Chart

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Absolute Maximum Ratings (Ta = 25 °C)

Parameter

Symbol

V_IN

Rating

Unit

VIN Voltage

-0.3 to +50.0

SOURCE, SE, SSE, OUT, OUTS,

PSSW, VDR, VOP Voltage

V_SOURCE, V_SE, V_SSE, V_OUT, V_OUTS

-0.3 to +V_IN+0.3 V

V_PSSW, V_DR, V_OP

V_{IN_SOURCE}

V_{IN_SE}

V_{IN_SSE}

VIN to SOURCE, VIN to SE,

VIN to SSE Voltage

-0.3 to +5.0

VREG Voltage

V_REG

-0.3 to +7.0

-0.3 to V_REG+0.3 V

-55 to +150

150

DISC, CRT, VSCP, TEST

Voltage

V_DISC, V_CRT, V_SCP, V_TEST

Storage Temperature Range

Tstg

°C

Maximum Junction Temperature

Tjmax

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing

board size and copper area so as not to exceed the maximum junction temperature rating.

Thermal Resistance ^{(Note 1)}

Thermal Resistance (Typ)

Parameter

Symbol

Unit

1s^{(Note 3)}

2s2p^{(Note 4)}

HTSSOP-B20

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 2)}

θ_JA

103.50

10.00

31.40

4.00

°C/W

Ψ_JT

(Note 1) Based on JESD51-2A (Still-Air), using a BD18327 Chip.

(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top centre of the outside surface

of the component package.

(Note 3) Using a PCB board based on JESD51-3.

(Note 4) Using a PCB board based on JESD51-5, 7.

Layer Number of

Measurement Board

Material

FR-4

Board Size

Single

114.3 mm x 76.2 mm x 1.57 mmt

Top

Copper Pattern

Thickness

70 μm

Footprints and Traces

Layer Number of

Measurement Board

Thermal Via^{(Note 5)}

Material

FR-4

Board Size

114.3 mm x 76.2 mm x 1.6 mmt

2 Internal Layers

Pitch

Diameter

4 Layers

1.20 mm

Φ0.30 mm

Top

Copper Pattern

Bottom

Thickness

70 μm

Copper Pattern

Thickness

35 μm

Copper Pattern

Thickness

70 μm

Footprints and Traces

74.2 mm x 74.2 mm

(Note 5) This thermal via connects with the copper pattern of all layers.

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Recommended Operating Conditions

Parameter

Symbol

V_IN

Min

6.0

Typ

Max

18.0

Unit

Supply Voltage^{(Note 1)}

13.0

OUT Pin Maximum Output Current

PWM Minimum Pulse Width

PWM Frequency

I_{OUT_MAX}

t_MIN

1.5

100

150

-40

µs

°C

f_PWM

1000

+125

Operating Temperature

Topr

(Note 1) ASO should not be exceeded.

Recommended Setting Parts Range

Parameter

Symbol

C_VIN

Min

1.0

Max

10.0

Unit

μF

kΩ

Power Supply Input Capacitor

Reference Voltage Output Pin Capacitor

Constant Current Setting Resistor

Output Current Sense Resistor

CR Timer Time Setting Resistor 1

CR Timer Time Setting Resistor 2

CR Timer Time Setting Capacitor

SCP Threshold Setting Resistor 1

SCP Threshold Setting Resistor 2

C_VREG

R_SSE

1.0

0.04

0.065

1.0

R_SE

R_CRT1

R_CRT2

C_CRT

100

1.00

100

kΩ

μF

kΩ

1.0

0.01

R_VSCP1

R_VSCP2

R_VOP1

R_VOP2

R_VDR1

R_VDR2

4.7

LED Open Detection Threshold Setting

Resistor 1

LED Open Detection Threshold Setting

Resistor 2

4.7

Output PWM ON Duty Setting Resistor 1

Output PWM ON Duty Setting Resistor 2

4.7

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Electrical Characteristics

(Unless otherwise specified V_IN= 13 V Ta = -40 °C to + 125 °C, C_VREG= 4.7 µF)

Parameter

Symbol

I_{VIN_NOM}

I_{VIN_PS}

Min

Typ

Max

Unit

μA

Condition

Circuit Current

at Normal Mode

Circuit Current

at Power Saving Mode

100

OUT: OPEN

I_L= 2 mA

[VREG]

Reference Voltage

V_REG

4.750

5.000

0.95

5.250

[Current Driver for Low Mode]

SSE Pin Feedback Voltage

V_{SSE_FB}

[Flasher SW Resistance Monitor Mode]

Blinking ON Threshold

Voltage

V_{OUTS_ON}

V_{OUTS_OFF}

K_BLON

0.95

1.00

1.05

V_OUTS= Sweep down

V_OUTS= Sweep up

Blinking OFF Threshold

Voltage

Blinking ON Threshold

Constant

0.95

1.00

1.05

1.11

K_BLON= V_{OUTS_ON}/ V_{SSE_FB}

K_BLOFF= V_{OUTS_OFF}/ V_{SSE_FB}

Blinking OFF Threshold

Constant

K_BLOFF

[Power Saving Mode]

Power Saving Mode

Release Threshold

V_{PSM_REL}

V_{PSM_DET}

R_PSM

0.5

0.4

1.0

0.9

1.5

1.4

V_OUT= Sweep down

V_OUT= Sweep up

Power Saving Mode

Detect Threshold

Power Saving Mode

Internal Resistance

kΩ

[Output Section]

OUT Pin ON Resistance

for High Mode

R_{ON_OUT}

R_{LON_OUT}

I_{LEAK_OUT}

0.4

0.8

I_OUT= 0.5 A

I_OUT= 20 mA

V_OUT= 13 V

OUT Pin ON Resistance

for Low Mode

OUT Pin Leakage Current

[CR Timer Section]

µA

V_REG

0.18

V_REG

0.19

V_REG

0.20

CRT Pin Charge Voltage

V_{CRT_CHA}

V_{CRT_DIS}

R_D

V_CRT= Sweep down

V_CRT= Sweep up

I_L= 10 mA

V_REG

0.33

V_REG

0.35

V_REG

0.37

CRT Pin Discharge Voltage

DISC Pin ON Resistance

CR Timer Charge Constant

N_CHA

4.31

1.55

4.54

1.64

4.77

1.73

CR Timer Discharge Constant

[COUNTER Section]

N_DIS

Flasher SW Resistance

Detection Circuit Count Number

N_COUNT

T_{BL_NOM}

T_{BL_LEDOP}

D_ON

Blinking Cycle Time

at Normal Mode

1 / f_CLK

x 511

1 / f_CLK

x 512

1 / f_CLK

x 513

Blinking Cycle Time

at LED Open Detection

1 / f_CLK

x 223

1 / f_CLK

x 224

1 / f_CLK

x 225

Blinking ON Duty

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Electrical Characteristics - continued

(Unless otherwise specified V_IN= 13 V Ta = -40 °C to + 125 °C, C_VREG= 4.7 µF)

Parameter

[PSSW Section]

PSSW ON Resistance

Symbol

Min

Typ

Max

Unit

Condition

R_PSSW

I_PSSW= 30 mA

[LED Open Detection/ Short Circuit Protection]

V_IN= Sweep down

Detect

7.85

8.00

8.25

8.45

0.20

8.65

8.90

Disable LED Open Detection

V_{IN_OPM}

V_IN= Sweep up

Release

Function at Reduced-voltage

V_IN

Hysteresis

1.0

V_IN– 4.0

10.0

2.5

V_IN< 14 V

V_IN> 14 V

VOP Pin

V_OP

Input Voltage Range

_RANGE

VSCP Pin

V_SCP

Input Voltage Range

_RANGE

LED Open Detection

Threshold Voltage 1

(V_OP/10)

- 5

(V_OP/10)

+ 5

V_{IN_SE}= Sweep down

V_OP≤ 2.5 V

V_OPEN1

V_OPEN2

V_SWOP

V_SHORT

V_OP/10

LED Open Detection

Threshold Voltage 2

(V_OP/10)

- 6.5

(V_OP/10)

+ 6.5

V_{IN_SE}= Sweep down

V_OP> 2.5 V

Flasher SW Open Detection

Threshold Voltage

mV V_{IN_SE}= Sweep down

Short Circuit Protection

Threshold Voltage

V_SCP/2

-0.065

V_SCP/2

+0.065

V_SCP/2

V_{IN_SE}= Sweep up

[VIN UVLO]

UVLO VIN

Detect Voltage

V_UVLOD

V_UVLOR

4.0

4.5

5.0

5.5

V_IN= Sweep down

UVLO VIN

Release Voltage

V_IN= Sweep up,

V_REG> 3.5 V

[Overvoltage Protection]

Over Voltage Protection

Threshold Voltage

V_OVP

22.95

250

25.50

500

28.05

750

V_IN= Sweep up

Over Voltage Protection

Hysteresis Voltage

V_OVPHYS

V_IN= Sweep down

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Typical Performance Curve

(Unless otherwise specified V_IN= 13 V Ta = -40 °C to + 125 °C, C_VREG= 4.7 µF)

1.10

1.00

0.90

0.80

5.3

5.2

5.1

5.0

4.9

4.8

4.7

4.6

4.5

V_IN= 6 V

V_IN= 12 V

V_IN= 24 V

V_IN= 12 V

V_IN= 24 V

-50 -25

25 50 75 100 125

-50 -25

25 50 75 100 125

Temperature [°C]

Figure 1. Reference Voltage vs Temperature

Figure 2. CRT Pin Charge Voltage vs Temperature

0.8

0.6

0.4

1.90

1.80

1.70

1.60

1.50

V_IN= 4 V

V_IN= 12 V

V_IN= 24 V

V_IN= 12 V

V_IN= 24 V

0.2

0.0

-50 -25

25 50 75 100 125

-50 -25

25 50 75 100 125 150

Temepature [°C]

Temperature [°C]

Figure 3. CRT Pin Discharge Voltage vs Temperature

Figure 4. Out Pin ON Resistance for High Mode

vs Temperature

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Typical Performance Curve - continued

(Unless otherwise specified V_IN= 13 V Ta = -40 °C to + 125 °C, C_VREG= 4.7 µF)

155.0

153.0

151.0

149.0

147.0

145.0

105.0

103.0

101.0

99.0

V_IN= 9 V

V_IN= 12 V

V_IN= 24 V

V_IN= 9 V

V_IN= 12 V

V_IN= 24 V

97.0

95.0

-50 -25

25 50 75 100 125 150

-50 -25

25 50 75 100 125 150

Temperature [°C]

Figure 5. LED Open Detection Threshold Voltage

at V_OP= 1.5 V, V_OPEN= 150 mV

vs Temperature

Figure 6. LED Open Detection Threshold Voltage

at V_OP= 1.0 V, V_OPEN= 100 mV

vs Temperature

0.600

0.550

0.500

1.350

1.300

1.250

V_IN= 6 V

V_IN= 12 V

V_IN= 24 V

V_IN= 6 V

V_IN= 12 V

V_IN= 24 V

1.200

1.150

0.450

0.400

-50 -25

25 50 75 100 125 150

-50 -25

25 50 75 100 125 150

Temperature [°C]

Figure 7. Short Circuit Protection Threshold Voltage

at V_SCP= 1.0 V, V_SHORT= 0.500 V

vs Temperature

Figure 8. Short Circuit Protection Threshold Voltage

at V_SCP= 2.5 V, V_SHORT= 1.250 V

vs Temperature

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Application Example

VIN = 13 V, CLK frequency 763 Hz (duty = 100 %), Blinking frequency: 1.49 Hz, I_OUT= 687 mA

Flasher SW

R_SE

SOURCE

OUT

OUTS

VREG

R_SSE

V_REG

V_IN

SSE

D_IN

VIN

C_VREG

Left

Front

Left

Rear

RCRT1

DISC

CRT

Z_DIN

C_VIN

R_VDR1

R_CRT2

C_CRT

BD18327EFV-M

VDR

Z_{D_OP}

R_VDR2

V_REG

R_VSCP1

R_VSCP2

R_VOP1

VSCP

TEST

VOP

R_VOP2

Right

Front

Right

Rear

PSSW

GND

Recommended Parts List:

Parts

Parts Name

Value

UNIT Product Maker

BD18327EFV-M

RFN2LAM6STFTR

ROHM

D_IN

ROHM

Diode

Z_DIN

TND12H-220KB00AAA0

EDZVFH3.6B

3.6

0.51

360

5.1

3.3

4.7

2.2

0.1

NIPPON CHEMICON

ROHM

Z_{D_OP}

R_SE

LTR100JZPFLR510

kΩ

ROHM

R_SSE

R_VDR1

R_VDR2

R_CRT1

R_CRT2

R_VSCP1

R_VSCP2

R_VOP1

R_VOP2

C_VIN

MCR03EZPFX3600

MCR03EZPFX6802

ROHM

MCR03EZPFX5101

MCR03EZPFX4702

MCR03EZPFX3301

MCR03EZPFX3002

MCR03EZPFX1002

MCR03EZPFX2402

MCR03EZPFX1002

ROHM

Resistor

kΩ

ROHM

kΩ

ROHM

kΩ

μF

ROHM

GCM31CC71H475KA03

GCM188C71A225KE01

GCM155R11A104KA01

murata

Capacitor

C_VREG

C_CRT

murata

Precautions for board design

① Place C_VIN, C_VREGin the immediate vicinity of the IC pin. If necessary, connect a bypass capacitor (0.1 μF) close to the IC.

② Select the optimum one for D1 according to the output current.

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BD18327EFV-M

I/O Equivalence Circuit

1. SOURCE

2 . SE

VIN

4 . SSE

VIN VIN

VIN

SSE

OUT

8. VDR

9. VOP

VOP

10. PSSW

PSSW

CLP15V

VIN

VIN VREG VREG

VIN

VDR

12. TEST

TEST

13 . VSCP

VSCP

14 . CRT

VREG

CRT

15. DISC

DISC

17. VREG

VREG

19. OUTS

OUTS

VREG

VIN

20. OUT

OUT

VIN

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BD18327EFV-M

Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply

pins.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at

all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic

capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5. Recommended Operating Conditions

The function and operation of the IC are guaranteed within the range specified by the recommended operating

conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical

characteristics.

6. Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow

instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.

Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing

of connections.

7. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject

the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should

always be turned off completely before connecting or removing it from the test setup during the inspection process. To

prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and

storage.

8. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

9. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge

acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause

unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power

supply or ground line.

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Operational Notes – continued

10. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be

avoided.

Resistor

Transistor (NPN)

Pin A

Pin B

Pin A

P⁺

Parasitic

Elements

Parasitic

Elements

P Substrate

GND GND

P Substrate

GND

Parasitic

Elements

Parasitic

Elements

N Region

close-by

Figure 9. Example of Monolithic IC Structure

11. Ceramic Capacitor

When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

12. Thermal Shutdown Circuit (TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always

be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the

junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj

falls below the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from

heat damage.

13. Functional Safety

“ISO 26262 Process Compliant to Support ASIL-*”

A product that has been developed based on an ISO 26262 design process compliant to the ASIL level described in

the datasheet.

“Safety Mechanism is Implemented to Support Functional Safety (ASIL-*)”

A product that has implemented safety mechanism to meet ASIL level requirements described in the datasheet.

“Functional Safety Supportive Automotive Products”

A product that has been developed for automotive use and is capable of supporting safety analysis with regard to

the functional safety.

Note: “ASIL-*” is stands for the ratings of “ASIL-A”, “-B”, “-C” or “-D” specified by each product's datasheet.

www.rohm.com

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BD18327EFV-M

Ordering Information

B D 1

7 E F V

M E2

Part Number

Package

EFV: HTSSOP-B20

Packing and Forming Specification

M: For Automotive

E2: Embossed Tape and Reel

Marking Diagram

HTSSOP-B20 (TOP VIEW)

Part Number Marking

LOT Number

D18327

Pin 1 Mark

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26/28.

BD18327EFV-M

Physical Dimension and Packing Information

Package Name

HTSSOP-B20

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TSZ22111 • 15 • 001

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27/28.

BD18327EFV-M

Revision History

Date

Version

001

Changes

26.Apr.2021

New Release

Page.19 Short Circuit Protection Threshold Voltage

Change limit: Min = VSCP/2 - 0.100 → VSCP/2 - 0.065

Max = VSCP/2 + 0.100 → VSCP/2 + 0.065

25.Nov.2021 002

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28/28.

Notice

Precaution on using ROHM Products

(Note 1)

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment

aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,

bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales

representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any

ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.

Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the

use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our

Products under any special or extraordinary environments or conditions (as exemplified below), your independent

verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.

However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble

cleaning agents for cleaning residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PAA-E

Rev.004

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl₂, H₂S, NH₃, SO₂, and NO₂

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PAA-E

Rev.004

Daattaasshheeeett

General Precaution

1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.

ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this document is current as of the issuing date and subject to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales

representative.

3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001

BD18327EFV-M [ROHM]

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