BD6091GU [ROHM]
Silicon Monolithic Integrated Circuit; 硅单片集成电路型号: | BD6091GU |
厂家: | ROHM |
描述: | Silicon Monolithic Integrated Circuit |
文件: | 总5页 (文件大小:170K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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Structure
Silicon Monolithic Integrated Circuit
Product Name
Compound LED Driver for cellular phone
Type
BD6091GU
Features
Boost DC/DC for LED back lighting
Constant current driver for LED back lighting
Auto Luminous Control (ALC)
●Absolute Maximum Ratings(Ta=25℃)
Parameter
Symbol
VMAX1
VMAX2
VMAX3
Pd
Limits
7
Unit
V
Pins
except for VLED, VOUT, SW
VLED
Maximum voltage 1
Maximum voltage 2
15
V
Maximum voltage 3
32.6
V
VOUT, SW
1250
mW
oC
oC
Power Dissipation
Topr
-40 ~ +85
-55 ~ +150
Operating Temperature Range
Storage Temperature Range
Tstg
note)Power dissipation deleting is 10mW/ oC, when it’s used in over 25 oC.
(It’s deleting is on the board that is ROHM’s standard)
Dissipation by LSI should not exceed tolerance level.of Pd.
●Operating conditions(VBAT≧VIO, Ta=-30~85℃)
Parameter
VBAT input voltage
VIO pin voltage
Symbol
VBAT
VIO
Limits
Unit
V
2.7~5.5
1.65~3.3
V
* Radiation-proof is not designed.
REV. A
2/4
● Electrical Characteristics (Unless otherwise specified, Ta=25°C, VBAT=3.6V, VIO=1.8V)
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
【Circuit Current】
VBAT Circuit current 1
VBAT Circuit current 2
IBAT1
IBAT2
0.1
0.5
1.0
3.0
μA
μA
RESETB=0V, VIO=0V
RESETB=0V, VIO=1.8V
LED=ON, ILED=15mA setting
Vo=24V
VBAT Circuit current 3
IBAT3
-
-
2.5
5.0
mA
Only ALC block ON
ADCYC=0.52s setting
Except sensor current
VBAT Circuit current 4
IBAT4
0.4
1.0
mA
【LED Driver】
LED current Step (Setup)
LED current Step (At slope)
LED Maximum current
LED current accuracy
【DC/DC】
ILEDSTP1
ILEDSTP2
IMAXWLED
IWLED
128
256
25.6
15
Step
Step
mA
-
-
-7%
+7%
mA
ILED=15mA setting
VLED pin feedback voltage
Over current protection
Vfb
-
-
0.3
-
-
V
OCP
650
mA
Oscillator frequency
Over Voltage Protection
detect voltage
fosc
0.8
1.0
31
27
24
21
18
-
1.2
MHz
V
OVP1
OVP2
OVP3
OVP4
OVP5
Mduty
30
32
-
-
V
-
-
V
-
-
-
V
-
V
Maximum Duty
92.5
-
%
VOUT open protection
【I2C input (SDA, SCL)】
OVO
-
0.7
1.4
V
0.25 ×
VIO
LOW level input voltage
HIGH level input voltage
VIL
VIH
-0.3
-
-
-
V
V
V
0.75 ×
VIO
VBAT
+0.3
Hysteresis of
0.05 ×
VIO
Vhys
-
Schmitt trigger input
LOW level output voltage
(SDA) at 3mA sink current
Input current
VOL
lin
0
-
-
0.3
3
V
-3
μA
Input voltage = 0.1×VIO~0.9×VIO
Input voltage = 0.1×VIO~0.9×VIO
【RESETB】
0.25 ×
VIO
LOW level input voltage
HIGH level input voltage
VIL
-0.3
-
V
0.75 ×
VIO
-3
VBAT
+0.3
3
VIH
Iin
-
-
V
Input current
μA
【ALC】
2.850
2.470
-
3.0
2.6
-
3.150
2.730
30
V
V
Io=200μA < Initial value >
Io=200μA
SBIAS Output voltage
SBIAS Output current
SSENS Input range
VoS
IoS
mA
Vo=3.0V
VoS x
255/256
VISS
0
-
-
V
SBIAS Discharge resister at
OFF
ROFFS
1.0
1.5
kΩ
ADC resolution
ADRES
ADINL
8
-
bit
ADC non-linearity error
ADC differential
-3
-1
1
+3
+1
-
LSB
ADDNL
-
-
LSB
non-linearity error
SSENS Input impedance
RSSENS
MΩ
REV. A
3/4
● Electrical Characteristics (Unless otherwise specified, Ta=25°C, VBAT=3.6V, VIO=1.8V)
【WPWMIN】
L level input voltage
VILA
-0.3
1.4
-
-
0.3
VBAT
+0.3
10
V
H level input voltage
VIHA
-
V
Input current
IinA
3.6
-
μA
μs
Vin=1.8V
PWM input
PWpwm
50
-
minimum High pulse width
【GC1, GC2】
L level output voltage
VOLS
VOHS
-
-
-
0.2
-
V
V
IOL=1mA
IOH=1mA
VoS
-0.2
H level output voltage
●Outside size figure
BD6091
LOT No.
VCSP85H3(24pin) (unit:mm)
REV. A
4/4
● Block Diagram
●Pin List
PIN
A2
PIN NAME
PIN
B1
PIN NAME
VBAT1
WPWMIN
VIO
D5
D1
C1
E2
A3
E3
D4
C5
D3
C2
D2
VBAT2
VIO
E4
C3
A4
B4
B5
B3
C4
A1
A5
E5
E1
SW
OCP
RESETB
SCL
VOUT
VLED
SBIAS
SSENS
GC1
GC2
T1
I2C interface
DC/DC
Level
Shift
OVP
SDA
GND1
GND2
LEDGND
GNDP
Digital
Control
Feed Back
WPWMIN
VLED
External PWM
LEDGND
SBIAS
SSENS
SGND
GND1
GND2
GNDPS
TSD
Sensor
I/F
ALC
SGND
VREF
IREF
GC2
GC1
RESETB
T2
SDA
SCL
T3
T4
● Cautions on use
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can break down devices, thus
making impossible to identify breaking mode such as a short circuit or an open circuit. If any special mode exceeding the absolute maximum ratings
is assumed, consideration should be given to take physical safety measures including the use of fuses, etc.
(2) Power supply and ground line
Design PCB pattern to provide low impedance for the wiring between the power supply and the ground lines. Pay attention to the interference by
common impedance of layout pattern when there are plural power supplies and ground lines. Especially, when there are ground pattern for
small signal and ground pattern for large current included the external circuits, please separate each ground pattern. Furthermore, for all
power supply pins to ICs, mount a capacitor between the power supply and the ground pin. At the same time, in order to use a capacitor, thoroughly
check to be sure the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature,
thus determining the constant.
(3) Ground voltage
Make setting of the potential of the ground pin so that it will be maintained at the minimum in any operating state. Furthermore, check to be sure no
pins are at a potential lower than the ground voltage including an actual electric transient.
(4) Short circuit between pins and erroneous mounting
In order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting can break down the
ICs. Furthermore, if a short circuit occurs due to foreign matters entering between pins or between the pin and the power supply or the
ground pin, the ICs can break down.
(5) Operation in strong electromagnetic field
Be noted that using ICs in the strong electromagnetic field can malfunction them.
(6) Input pins
In terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of the parasitic element can cause
interference with circuit operation, thus resulting in a malfunction and then breakdown of the input pin. Therefore, pay thorough attention not to handle
the input pins, such as to apply to the input pins a voltage lower than the ground respectively, so that any parasitic element will operate. Furthermore,
do not apply a voltage to the input pins when no power supply voltage is applied to the IC. In addition, even if the power supply voltage is applied,
apply to the input pins a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics.
(7) External capacitor
In order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to a degradation in the nominal
capacitance due to DC bias and changes in the capacitance due to temperature, etc.
(8) Thermal shutdown circuit (TSD)
This LSI builds in a thermal shutdown (TSD) circuit. When junction temperatures become detection temperature or higher, the thermal
shutdown circuit operates and turns a switch OFF. The thermal shutdown circuit, which is aimed at isolating the LSI from thermal runaway as
much as possible, is not aimed at the protection or guarantee of the LSI. Therefore, do not continuously use the LSI with this circuit
operating or use the LSI assuming its operation.
(9) Thermal design
Perform thermal design in which there are adequate margins by taking into account the permissible dissipation (Pd) in actual states of use.
(10) About the pin for the test, the un-use pin
Prevent a problem from being in the pin for the test and the un-use pin under the state of actual use. Please refer to a function manual and
an application notebook. And, as for the pin that doesn't specially have an explanation, ask our company person in charge.
(11) Rush Current
Rush current may flow in instant in the internal logic unfixed state by the power supply injection order and delay. Therefore, be careful of
power supply coupling capacity, a power supply and the width of grand pattern wiring, and leading about.
(12) DC/DC converter
Please select the low DCR inductors to decrease power loss for DC/DC converter.
REV. A
Appendix
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM
CO.,LTD.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you
wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM
upon request.
Examples of application circuits, circuit constants and any other information contained herein illustrate the
standard usage and operations of the Products. The peripheral conditions must be taken into account
when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document. However, should
you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no re-
sponsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and examples
of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to
use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no re-
sponsibility whatsoever for any dispute arising from the use of such technical information.
The Products specified in this document are intended to be used with general-use electronic equipment
or devices (such as audio visual equipment, office-automation equipment, communication devices, elec-
tronic appliances and amusement devices).
The Products are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or
malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard against the
possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as
derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your
use of any Product outside of the prescribed scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or system
which requires an extremely high level of reliability the failure or malfunction of which may result in a direct
threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment,
aerospace machinery, nuclear-reactor controller, fuel-controller or other safety device). ROHM shall bear
no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intend-
ed to be used for any such special purpose, please contact a ROHM sales representative before purchasing.
If you intend to export or ship overseas any Product or technology specified herein that may be controlled under
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Appendix-Rev4.0
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