BD61245EFV_技术文档

Datasheet

DC Brushless Fan Motor Drivers

Multifunction Single-phase Full-wave

Fan Motor Driver

BD61245EFV

General Description

Key Specifications

BD61245EFV is a 1chip driver that is composed of

H-bridge power DMOS FET. Moreover, the circuit

configuration is restructured, and convenience has been

improved by reducing the external parts and simplifying

the setting compared with the conventional driver.



Operating Voltage Range:

Operating Temperature Range:

Output Voltage(total):

4V to 16V

–40°C to +105°C

0.2V(Typ) at 0.4A

Features

Package

W (Typ) x D (Typ) x H (Max)

5.00mm x 6.40mm x 1.00mm

 High Heat Radiation Package

 Driver Including Power DMOS FET

 Speed Controllable by DC / PWM Input

 I/O Duty Slope Adjust

 PWM Soft Switching

 Current Limit

 Start Duty Assist

 Lock Protection and Automatic Restart

 Quick Start

 Rotation Speed Pulse Signal (FG) Output

HTSSOP-B16

Applications

 Fan motors for general consumer equipment of desktop PC, Projector, etc.

Typical Application Circuits

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

9

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

9

SIG

FG

GND

ADJ

SIG

FG

GND

ADJ

H–

H

H+

SSW

ZPER

MIN

H+

SSW

ZPER

MIN

SST

SLP

PWM

OUT2

RNF

SST

SLP

PWM

OUT2

RNF

DC

REF

PWM

REF

VCC

OUT1

VCC

OUT1

＋

－

＋

－

M

Figure 2. Application of DC Voltage Input

Figure 1. Application of Direct PWM Input

〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays

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Pin Configuration

Block Diagram

(TOP VIEW)

FG

H–

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

9

GND

ADJ

FG

GND

ADJ

SIGNAL

OUTPUT

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

9

OSC

TSD

H–

A/D

-

H+

SSW

ZPER

MIN

COMP

+

H+

SSW

ZPER

MIN

A/D

SST

SLP

PWM

OUT2

RNF

SST

SLP

A/D

CONTROL

LOGIC

REF

INSIDE

REG

VCC

OUT1

REF

REFE-

RENCE

FILTER

PWM

V_CL

PRE-

DRIVER

+

VCC

OUT2

COMP

-

OUT1

Pin Description

Pin No. Pin Name

RNF

Function

1

2

3

4

5

6

7

FG

H–

Speed pulse signal output terminal

Hall – input terminal

H+

Hall + input terminal

SST

SLP

PWM

OUT2

Soft start setting terminal

I/O duty slope setting terminal

PWM input duty terminal

Motor output terminal 2

Output current detecting resistor

connecting terminal (motor ground)

Motor output terminal 1

8

RNF

9

OUT1

VCC

REF

MIN

10

11

12

13

14

Power supply terminal

Reference voltage output terminal

Minimum output duty setting terminal

ZPER Re-circulate period setting terminal

SSW

Soft switching setting terminal

Output duty correction setting

terminal

15

16

ADJ

GND

Ground terminal (signal ground)

I/O Truth Table

Hall Input

Driver Output

H+

H–

L

OUT1

OUT2

FG

Hi-Z

L

H

L

H

L

H

H; High, L; Low, Hi-Z; High impedance

FG output is open-drain type.

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Absolute Maximum Ratings

Parameter

Symbol

V_CC

Rating

18

Unit

V

Supply Voltage

Power Dissipation

Pd

0.95 ^{(Note 1)}

–40 to +105

–55 to +150

18

W

Operating Temperature Range

Storage Temperature Range

Output Voltage

Topr

Tstg

V_OMAX

I_OMAX

V_FG

°C

V

Output Current

1.8 ^{(Note 2)}

A

Rotation Speed Pulse Signal (FG) Output Voltage

Rotation Speed Pulse Signal (FG) Output Current

Reference Voltage (REF) Output Current

Input Voltage1

18

V

I_FG

10

mA

I_REF

10

V_IN1

2.6

V

(H+,H–,MIN,SSW,SST,ZPER,SLP,ADJ)

Input Voltage2 (PWM)

V_IN2

Tj

6.5

V

Junction Temperature

150

°C

(Note 1) Derate by 7.6mW/°C when operating over Ta=25°C.

(Note 2) Do not exceed Pd and Tj=150°C.

Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated

over the absolute maximum ratings.

Thermal Resistance ^{(Note 1)}

Thermal Resistance (Typ)

Parameter

Symbol

Unit

1s^{(Note 3)}

2s2p^{(Note 4)}

HTSSOP-B16

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 2)}

θ_JA

131.5

9

30.8

3

°C/W

Ψ_JT

(Note 1)Based on JESD51-2A(Still-Air)

(Note 2)The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside

surface of the component package.

(Note 3)Using a PCB board based on JESD51-3.

Layer Number of

Measurement Board

Material

FR-4

Board Size

Single

114.3mm x 76.2mm x 1.57mmt

Top

Copper Pattern

Thickness

Footprints and Traces

70μm

(Note 4)Using a PCB board based on JESD51-5, 7.

Thermal Via^{(Note 5)}

Layer Number of

Material

Board Size

114.3mm x 76.2mm x 1.6mmt

2 Internal Layers

Measurement Board

Pitch

Diameter

4 Layers

FR-4

1.20mm

Φ0.30mm

Top

Bottom

Copper Pattern

Thickness

Copper Pattern

Thickness

Copper Pattern

Thickness

70μm

Footprints and Traces

70μm

74.2mm x 74.2mm

35μm

74.2mm x 74.2mm

(Note 5) This thermal via connects with the copper pattern of all layers..

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Recommended Operating Conditions

Parameter

Symbol

V_CC

Min

4

Typ

12

-

Max

16

2

Unit

V

Operating Supply Voltage

Hall Input Voltage

V_H

0

V

PWM Input Frequency

f_PWM

15

-

50

kHz

Electrical Characteristics (Unless otherwise specified Ta=25°C, V_CC=12V)

Limit

Characteristic

Data

Parameter

Circuit Current

Symbol

I_CC

Unit

mA

V

Conditions

Min

1.8

Typ Max

3.3

4.8

Figure 3

Figure 4 to

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12 to

Figure 13

Figure 14

-

I_O=±400mA,

Output Voltage

V_O

-

0.2

0.44

High and low side total

Lock Detection ON Time

t_ON

t_OFF

0.3

3.0

8

0.5

5.0

10

0.7

7.0

12

s

Lock Detection OFF Time

Lock Detection OFF/ON Ratio

Hall Input Hysteresis Voltage

r_LCK

-

r_LCK=t_OFF/ t_ON

V_HYS+

±7 ±12 ±17

mV

FG Output Low Voltage

V_FGL

-

0.3

V

I_FG=5mA

V_FG=16V

FG Output Leak Current

I_FGL

-

10

5.0

1.0

10

μA

V

PWM Input High Level Voltage

PWM Input Low Level Voltage

V_PWMH

V_PWML

I_PWMH

I_PWML

2.5

-0.3

-10

-50

-

V

-

0

μA

V_PWM=5V

V_PWM=0V

Figure 15 to

Figure 16

Figure 17 to

Figure 18

Figure 19

PWM Input Current

-25

-12

Reference Voltage

V_REF

2.2

2.4

2.6

V

I_REF=-1mA

Current Limit Setting Voltage

V_CL

120

150

180

mV

For parameters involving current, positive notation means inflow of current to IC while negative notation means outflow of current from IC.

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Typical Performance Curves (Reference Data)

0.00

-0.15

-0.30

-0.45

-0.60

8

6

105°C

25°C

–40°C

4

2

0

–40°C

25°C

Operating Voltage Range

105°C

0

5

10

15

20

0.0

0.6

1.2

1.8

Supply Voltage: VCC[V]

Output Source Current: IO[A]

Figure 3. Circuit Current vs Supply Voltage

Figure 4. Output High Voltage vs Output Source Current

(V_CC=12V)

0.00

-0.15

-0.30

-0.45

-0.60

0.60

0.45

105°C 25°C

–40°C

0.30

16V

12V

0.15

0.00

4V

0.0

0.6

1.2

1.8

0.0

0.6

1.2

1.8

Output Source Current: IO[A]

Output Sink Current: IO[A]

Figure 5. Output High Voltage vs Output Source Current

(Ta=25°C)

Figure 6. Output Low Voltage vs Output Sink Current

(V_CC=12V)

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Typical Performance Curves (Reference Data) – continued

0.60

0.45

0.30

0.15

0.00

0.7

0.6

0.5

0.4

0.3

4V

12V

16V

-40℃

25℃

105℃

Operating Voltage Range

0

5

10

15

20

0.0

0.6

1.2

1.8

Output Sink Current: Io[A]

Supply Voltage: Vcc[V]

Figure 7. Output Low Voltage vs Output Sink Current

(Ta=25°C)

Figure 8. Lock Detection ON Time vs Supply Voltage

12.0

11.0

10.0

9.0

7.0

6.0

5.0

4.0

3.0

–40°C

25°C

105°C

–40°C

25°C

105°C

Operating Voltage Range

8.0

0

5

10

15

20

0

5

10

15

20

Supply Voltage: Vcc[V]

Figure 9. Lock Detection OFF Time vs Supply Voltage

Figure 10. Lock Detection OFF/ON Ratio vs Supply Voltage

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Typical Performance Curves (Reference Data) – continued

40

20

0

0.4

0.3

0.2

0.1

0.0

105°C

25°C

–40°C

105°C

25°C

–40°C

25°C

105°C

–40°C

-20

-40

Operating Voltage Range

0

2

4

6

8

10

0

5

10

15

20

FG Sink Current: IFG[mA]

Supply Voltage: Vcc[V]

Figure 11. Hall Input Hysteresis Voltage vs Supply Voltage

Figure 12. FG Output Low Voltage vs FG Sink Current

(VCC=12V)

0.4

8

6

4

0.3

4V

0.2

12V

16V

2

105°C

25°C

–40°C

0.1

0.0

0

Operating Voltage Range

-2

0

2

4

6

8

10

0

5

10

15

20

FG Sink Current: IFG[mA]

FG Voltage: VFG[V]

Figure 13. FG Output Voltage vs FG Sink Current

(Ta=25°C)

Figure 14. FG Output Leak Current vs FG Voltage

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Typical Performance Curves (Reference Data) – continued

12

0

105°C

Operating Voltage Range

25°C

-10

-20

-30

-40

-50

–40°C

9

6

3

0

–40°C

25°C

105°C

Operating Voltage Range

0

5

10

15

20

0

5

10

15

20

Supply Voltage: VCC[V]

Figure 15. PWM Input High Current vs Supply Voltage

(V_PWM=5V)

Figure 16. PWM Input Low Current vs Supply Voltage

(V_PWM=0V)

3.0

2.5

2.0

1.5

1.0

–40°C

25°C

105°C

2.5

2.0

1.5

1.0

16V 12V

4V

Operating Voltage Range

0.0

2.5

5.0

7.5

10.0

0

5

10

15

20

Supply Voltage: VCC[V]

REF Source Current: IREF[mA]

Figure 17. Reference Voltage vs Supply Voltage

(VCC=12V)

Figure 18. Reference Voltage vs REF Source Current

(Ta=25°C)

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Typical Performance Curves (Reference Data) – continued

200

175

105°C

25°C

–40°C

150

125

Operating Voltage Range

100

0

5

10

15

20

Supply Voltage: VCC[V]

Figure 19. Current Limit Setting Voltage vs Supply Voltage

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Application Circuit Examples (Constant Values are for Reference)

1. PWM Input Application

This is the application example of direct PWM input into PWM terminal. Minimum rotational speed is set in MIN

terminal voltage.

Protection of FG open-drain

Hall bias is set according

to the amplitude of hall

element output and hall

input voltage range.

I/O duty correction setting

Soft switching setting

Re-circulate setting

FG

GND

ADJ

SIGNAL

OUTPUT

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

OSC

TSD

SIG

500Ω

to 2kΩ

H–

A/D

-

Noise measures of substrate

COMP

H

+

1kΩ

to 100kΩ

H+

SSW

ZPER

MIN

A/D

Soft start time setting

I/O duty slope setting

SST

SLP

A/D

CONTROL

LOGIC

Minimum duty setting

1kΩ

to 100kΩ

INSIDE

REG

REF

REFE-

RENCE

PWM

FILTER

Stabilization of REF voltage

PWM

V_CL

PRE-

DRIVER

+

VCC

OUT2

COMP

＋

To limit motor current, the current

is detected.

Note the power consumption of

sense resistance.

-

1μF

to 10μF

Reverse Polarity

Protection

OUT1

9

RNF

0Ω to 0.5Ω

Measure against back EMF

M

－

Connect bypass capacitor near

VCC terminal as much as possible.

Maximum output voltage and current

are 18V and 1.8A respectively

Figure 20. PWM Input Application

When a function is not used, do not let the A/D converter input terminal open.

Resistor Divider

OK

Resistor Pull-down

(GND Short)

Terminal Open

(Prohibited input)

Resistor Pull-up

(REF Short)

OK

NG

OK

REF

A/D

REF

A/D

REF

A/D

REF

A/D

Application Design Note

(1) Please connect the bypass capacitor with reference to the value mentioned above. Because there is a possibility

of the motor start-up failure etc. due to IC malfunction.

Substrate Design Note

(1) IC power(Vcc), and motor outputs(OUT1, 2) lines are made as wide as possible.

(2) IC ground (GND) line is common with the application ground except motor ground (i.e. hall ground etc.), and

arranged near to (–) land.

(3) The bypass capacitor and/or Zener diode are placed near to VCC pin.

(4) H+ and H– lines are arranged side by side and made from the hall element to IC as short as possible, because it

is easy for the noise to influence the hall lines.

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Application Circuit Examples (Constant Values are for Reference) – continued

2. DC Voltage Input Application

This is the application example of DC voltage into MIN terminal. Minimum rotational speed setting is disable.

FG

GND

ADJ

SSW

ZPER

MIN

SIGNAL

OUTPUT

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

OSC

TSD

SIG

500Ω

to 2kΩ

H–

A/D

-

COMP

H

+

1kΩ

to 100kΩ

H+

A/D

SST

SLP

A/D

1kΩ

to 100kΩ

CONTROL

LOGIC

DC

INSIDE

REG

REF

V_CC

REFE-

RENCE

FILTER

PWM

V_CL

PRE-

DRIVER

0Ω

+

OUT2

COMP

＋

Short the PWM terminal to

GND.

-

1μF

to 10μF

OUT1

9

RNF

0Ω to 0.5Ω

M

－

Figure 21. DC Voltage Input Application

When a function is not used, do not let the A/D converter input terminal open.

Resistor Divider

OK

Resistor Pull-down

(GND Short)

Terminal Open

(Prohibited input)

Resistor Pull-up

(REF Short)

OK

NG

OK

REF

A/D

REF

A/D

REF

A/D

REF

A/D

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Functional Descriptions

1. Variable Speed Operation

There are 2 ways to control the speed of motor.

(1) PWM Control (Input PWM pulse into PWM terminal)

(2) Voltage Control (Input DC voltage into MIN terminal)

Both (1) and (2), output PWM frequency is 50kHz. When computed duty is less than 5%, a driving signal is not

output.

(1) PWM Operation by Pulse Input in PWM Terminal

The PWM signal from the controller can be input directly to IC in Figure 22. The output duty is controlled by the

input PWM duty (Figure 23). Refer to recommended operating conditions and electrical characteristics (P.4) for the

input condition.

Internal power-supply voltage (INTERNAL REG; typ 5.0V) is impressed when the PWM terminal is open, it

becomes 100% input of the duty and equivalent, and a full torque is driven. There must be a pull- down resistance

outside of IC to make it to torque 0 when the PWM terminal opens (However, only at the controller of the

complimentary output type.). Insert the protective resistance if necessary.

H–

High

Controller

Motor Unit

H+

Inside

REG

Low

Driver

5.0V

INTERNAL

REG

2.5V

Protection

Resistor

PWM

GND

1.0V

0.0V

PWM

FILTER

PWM

High

Low

OUT1

Motor output ON

: High impedance

Complimen

-tary Output

High

OUT2

Low

Full

Motor

Torque

Figure 22. PWM Input Application

Zero

Figure 23. PWM Input Operation Timing Chart

○Setting of Minimum Output Duty (MIN)

The voltage which divided REF terminal voltage by resistance is input into MIN terminal, and minimum output

duty is set like Figure 24. When input duty from a PWM terminal is lower than minimum output duty which is set

by MIN terminal, the output duty does not fall to lower than minimum output duty.

The MIN terminal is the input terminal of the analog-digital converter to have an input voltage range of the REF

voltage, and the resolution is 128 steps (0.78% per step). When minimum output duty is not set, please perform

resistance pull-down of MIN terminal.

Minimum output duty

(128 steps)

100

Minimum duty

25

0

100

0.6

REF

Input PWM duty [%]

MIN input voltage [V]

Figure 25. Setting of Minimum Output Duty

Figure 24. Relation of MIN terminal Voltage and Output

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Functional Descriptions – continued

(2) PWM Operation by DC Input in MIN Terminal

Output duty is controlled by input voltage from MIN terminal. Output duty is 100% when MIN terminal voltage is

2.4V (Typ), output duty is 0% when MIN terminal voltage is 0V. (If using SLP function, it is not like this.)

In voltage control mode, short the PWM terminal to GND.

Please refer to input voltage 1(P.3) for the input condition of the MIN terminal. Because terminal voltage becomes

unsettled when MIN terminal is in an open state, like application of Figure 26, please be applied some voltage to

MIN terminal.

Minimum output duty cannot be set in voltage control.

H–

High

H+

Low

INSIDE

REG

200kΩ(Typ)

REF

2.4V

MIN

GND

FILTER

PWM

MIN

0.0V

High

DC

A/D

OUT1

Low

Motor Output ON

: High Impedance

100%

OUT2

Duty

0%

Full

Motor

Torque

Zero

Figure 26. DC Input Application

Figure 27. DC Input Operation Timing Chart

2. Input-output Duty Slope Setting (SLP)

Slope properties of input duty and output duty can be set with SLP terminal like Figure 28. SLP setting work in

both mode, PWM control and voltage control. The resolution is 7bit (128 steps).

The voltage of SLP terminal is less than 0.3V (Typ), slope of input-output duty characteristic is fixed to 1. And

fixed to 0.5 in 0.3V to 0.6V (Typ) (refer to Figure 29). When slope setting is not set, pull-down SLP terminal.

Input-output duty slope

(128 steps)

100

2

1.5

1

Slope=0.5

Slope Setting

0.5

Slope=2

0

100

0

0.6

0.3

1.2

1.8

REF

PWM input duty [%]

SLP input voltage [V]

Figure 29. Relations of SLP terminal voltage and the

input-output duty slope characteristics

Figure 28. Adjust of Slope of I/O Duty

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Functional Descriptions – continued

3. Input and Output Duty Properties Adjustment Function (ADJ)

When input duty vs output duty shows the characteristic of the straight line, rotational speed may become the

characteristics that middle duty area swells by the characteristic of fan motor. (Figure 30)

Rotational

speed

Output

duty

Figure 30. Properties curve of input PWM duty vs rotational speed

This IC reduces duty in the middle duty area and can adjust rotational speed characteristics of the motor with a straight

line.

Rotational

speed

Output

duty

Figure 31. Properties curve of input PWM duty vs rotational speed after adjusting

The adjustment to reduce duty is performed by ADJ terminal input voltage. The ADJ terminal is input terminal of A/D

converter and the resolution is 7bit. By input 0 (ADJ=GND) of the ADJ terminal, the characteristic of input duty vs.

output duty becomes straight line (no adjustment). The adjustment become maximum by input 127(ADJ=REF), and

output duty in input duty 50% decreases to about 25%.

Figure 32. Input duty vs output duty characteristics

Please set the voltage of ADJ terminal so that motor rotation speed in input duty 50% is on the diagonal which links the

rotation speed of 0% to 100%. IC corrects output duty so that overall rotation speed properties match a straight line.

When it is used together with SLP function, at first ADJ adjustment is performed in slope=1, and please adjust SLP

after adjusting input duty vs. rotation speed property.

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Functional Descriptions – continued

4. About Setting of Phase Switching of Output

The period of Soft switching and re-circulate can be adjusted by SSW and ZPER setting.

(1) Soft Switching Period Setting (SSW)

Angle of the soft switching can be set by the input voltage of SSW terminal. When one period of the hall signal

is assumed 360°, the angle of the soft switching can be set from 22.5° to 90° by the input voltage of SSW

terminal (refer to Figure 33). Resolution of SSW terminal is 128 steps. Operational image is shown in Figure 34.

*Soft switching angle means the section where output duty changes between 0% and setting duty at the timing

of output phase change. To smooth off the current waveform, the coefficient table that duty gradually

changes is set inside IC, and the step is 16.

Angle range of soft switching：Min22.5° to Max90°

H+

Set of Soft Switching Period

Angle[°]

(128 Steps)

H–

90

One period of hall signal 360°

67.5

45

High

OUT1

OUT2

Low

22.5

High

Motor

Low

0A

0

0.6

1.2

1.8

REF

Current

SSW input voltage [V]

Soft Switching Angle (Max 90°)

Figure 33. Relation of SSW terminal Voltage

and Soft Switching Period

Figure 34. Soft switching angle

(2) Re-circulate Period Setting (ZPER)

Re-circulate angle at the timing of output phase changes can be set by the input voltage of ZPER terminal.

When one period of the hall signal is assumed 360°, the angle of the re-circulate can be set from 0° to 90° by

the input voltage of ZPER terminal (refer to Figure 35). Resolution of ZPER terminal is 128steps. Operational

image is shown in Figure 36.

When angular degree to regenerate is bigger than soft switching angular degree, a soft switching section for 5.6

degrees enters.

*Re-circulate angle means the section where the coil current re-circulate before the timing of output phase

change. If it is set appropriately, it is effective to suppress leaping up of voltage by BEMF, and reduce invalid

electricity consumption. The logic of the output transistor in the section is decided depending on the hall input

logic. As for the output of the H logic, the logic of the motor output in high impedance (Hi-Z). The output of the

L logic remains L.

Angle range of re-circulate：Min0° to Max90°

H+

ZPER re-circulate angle

Angle[°]

(128 Steps)

90

67.5

45

H–

One period of hall signal 360°

High

OUT1

OUT2

22.5

Low

High

Motor

0

0.6

1.2

1.8

REF

Low

0A

Current

ZPER input voltage [V]

Soft Switching Period

Re-circulate Period(Max 90°)

Figure 35. Relation of ZPER terminal Voltage

and Re-circulate Period

Figure 36. Re-circulate angle

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Functional Descriptions – continued

(3) Kickback Restraint Function

When there is induced current to the motor coil , regenerative current flows to the power supply.

However, when reverse connection protection diode is connected, V_CCvoltage rises because the diode prevents

current flow to power supply. (Figure 37)

ON

Phase

switching

ON

Figure 37. V_CCVoltage Rise by Back Electromotive Force

The kickback restraint function is a supporting function to reduce induced current in a motor coil.

To the specifications of the motor, please adjust soft switching period (SSW) and re-circulate period (ZPER) to

reduce leaping up of the output voltage.

By specifications and how to use motor, it may not reduce this induced current.

For example, it becomes the severe condition in the motor startup.

In this case leaping up of the voltage decreases when it sets soft start time for a long time.

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Functional Descriptions – continued

5. Soft Start

Soft start function gradually change drive duty to suppress sound noise and peak current when the motor start up etc.

PWM duty resolution is 7bit (128steps, 0.78% per step). SST terminal sets the step up time of duty increment.

Soft start step up time

(128 steps)

76.2

57.2

38.1

19.1

0

0.6

1.2

1.8

V_REF

SST input voltage [V]

Figure 38. Relations of SST terminal voltage and soft start step up time

Duty transition time is

(Difference of current duty and Target duty (output duty after SLP/ADJ calculation)) x (step time)

When soft start time is set for a long time, lock protection may be detected without enough motor torque when motor

start up from 0% duty. Therefore start up duty is set to approximately 20% (25/128).

PWM input

50%

PWM input

100%

20%

100%

50%

DRIVE PWM duty

Drive PWM duty

20%

Soft start section

Start with input duty 100%

Start with input duty 50%

Figure 39. Soft start operation image from motor stop condition

When SST terminal voltage = REF terminal voltage, and 100% duty is input on motor stop condition, output duty

arrives at 100% after progress the time of 76.2ms x (128-25step) = 7.84 seconds

Soft start functions always work when the change of input duty as well as motor start up. In addition, it works when

duty goes down from high duty. Duty step down time is the half of duty step up time.

6. Start duty assist

It is the function that enable the motor to start even if drive duty output is low, when the soft start function is not used.

When input duty is within 50% at motor stop condition, 50% duty is output till three times of hall signal change are

detected. Operational image is shown in Figure 40.

FG

Input duty

10%

50%

Output duty

10%

0%

Hall detect

Power ON

Figure 40. Start duty assist operation at input duty 10%

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Functional Descriptions – continued

7. Current Limit

Current limit function turns off the output when the current flow through the motor coil is detected exceeding a set

value. The working current value of the limit is determined by current limit voltage V_CLand RNF terminal voltage.

The value of the current sense resistor is included in not only the R_NFresistor but also wire resistance in the IC

(Rwire=Approximately 10mΩ) or the resistance of the substrate pattern line (Rline).

In Figure 41, current flow in motor coil is Io, resistor to detect Io is R_NF=50mΩ (@1/2W), wire resistance in the IC is

Rwire=10mΩ, the resistance of the substrate pattern line is Rline=40mΩ, power consumption of RNF is P_R, current

limit voltage V_CL=150mV (Typ), current limit value and power consumption of RNF can be calculated below expression.

About current limit value, when motor current is big, it is affected by Rwire and Rline.

Please decide the RNF resistor value in considering a real substrate.

When current limit function is not used, please short RNF terminal to GND.

OUT1

I_O[A] = V_CL[V] / (Rwire + Rline + R_NF) [Ω]

= 150[mV] / (10 + 40 + 50 )[mΩ]

= 150[mV] / 100[mΩ]

= 1.5[A]

M

OUT2

RNF

Rline

Rwire

I_O

P_RMAX[W] = V_CL[V] x I_O[A]

= 150[mV] x 1.5[A]

= 0.225[W] *

V_CL

CURRENT

LIMIT COMP

GND

*This calculation ignores Rwire and Rline.

R_NF

IC Signal GND Line

Motor GND Line

－

Figure 41. Current limit setting and GND line

8. Lock Protection and Automatic Restart

Motor rotation is detected by hall signal period. IC detects motor rotation is stop when the period becomes longer

than the time set up at the internal counter, and IC turns off the output. Lock detection ON time (t_ON) and lock

detection OFF time (t_OFF) are set by the digital counter based on internal oscillator. Therefore the ratio of ON/OFF

time is always constant. Timing chart is shown in Figure 42.

Motor Idling

H–

High

H+

Low

t_OFF(Typ 5.0s)

t_OFF

t_ON(Typ 0.5s)

t_ON

High

OUT1

OUT2

FG

Low

High

Low

High

Low

Instruction

torque

Motor

Output ON

duty

0%

: High impedance

Motor Lock Lock Detection

Motor Lock Release

Figure 42. Lock Protection Timing Chart

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Functional Descriptions – continued

9. Quick Start

When torque off logic is input by the control signal over a fixed time, the lock protection function is disabled. The motor

can restart quickly once the control signal is applied.

Motor Idling

H–

High

H+

Low

High

PWM

Low

Enable

Lock

Protection

Signal

Disable

Under 5ms(Typ)

Quick start standby mode

PWM or

MIN

torque

Motor

Output

ON duty

0%

Torque OFF

Motor Stop

Torque ON

Figure 43. Quick Start Timing Chart (PWM Input Application)

10. Hall Input Setting

The input voltage of a hall signal is input in "Hall Input Voltage" in P.4 including signal amplitude. In order to detect

rotation of a motor, the amplitude of hall signal more than "Hall Input Hysteresis Voltage" is required. Input the hall

signal more than 34mVpp at least.

2V

GND

Figure 44. Hall Input Voltage Range

○Reducing the Noise of Hall Signal

Hall element may be affected by V_CCnoise or the like depending on the wiring pattern of board. In this case, place

a capacitor like C1 in Figure 45. In addition, when wiring from the hall element output to IC hall input is long, noise

may be loaded on wiring. In this case, place a capacitor like C2 in Figure 45.

H–

H+

REF

C2

R1

Bias current

＝V_REF/ (R1 + RH)

C1

RH

Hall Element

Figure 45. Application near of Hall Signal

11. High-speed detection protection

High-speed detection protection begin lock protection action when it detects that the hall input signal is in an abnormal

state (more than Typ 2.5kHz). Noise may be induced on wiring. In this case, place a capacitor like C2 in Figure 45.

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I/O Equivalence Circuit (Resistance Values are Typical)

1. Power supply terminal

2. PWM input duty terminal

3. Hall input terminal

INSIDE

REG

INSIDE

REG

VCC

200kΩ

H+

H–

PWM

GND

4. A/D converter input terminal

5. Reference voltage

output terminal

6. Motor output terminal

Output current detecting

resistor connecting terminal

V_CC

OUT1

OUT2

SLP

MIN

ZPER

SSW

REF

RNF

7. Rotation speed pulse signal

output terminal

FG

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Safety Measure

1. Reverse Connection Protection Diode

Reverse connection of power results in IC destruction as shown in Figure 46. When reverse connection is possible,

reverse connection protection diode must be added between power supply and V_CC

.

After reverse connection

destruction prevention

In normal energization

Reverse power connection

Vcc

Circuit

Block

Circuit

Block

Circuit

Block

I/O

GND

Internal circuit impedance is high

Large current flows

No destruction

 Amperage small

 Thermal destruction

Figure 46. Flow of Current When Power is Connected Reversely

2. Protection against V_CCVoltage Rise by Back Electromotive Force

Back electromotive force (Back EMF) generates regenerative current to power supply. However, when reverse

connection protection diode is connected, V_CCvoltage rises because the diode prevents current flow to power supply.

ON

Phase

Switching

ON

Figure 47. V_CCVoltage Rise by Back Electromotive Force

When the absolute maximum rated voltage may be exceeded due to voltage rise by back electromotive force, place

(A) Capacitor or (B) Zener diode between V_CCand GND. If necessary, add both (C).

(A) Capacitor

(B) Zenner diode

(C) Capacitor & Zenner diode

ON

Figure 48. Measure against V_CCand Motor Driving Outputs Voltage

3. Problem of GND line PWM Switching

Do not perform PWM switching of GND line because GND terminal potential cannot be kept to a minimum.

4. Protection of Rotation Speed Pulse (FG) Open-Drain Output

FG output is an open drain and requires pull-up resistor. Adding resistor can protect the IC. Exceeding the absolute

maximum rating, when FG terminal is directly connected to power supply, could damage the IC.

Motor Unit

VCC

Driver

Pull-up

Resistor

Protection

Resistor

Motor

Driver

Controller

M

FG

SIG

Connector

GND

PWM Input

Prohibit

Figure 49. GND Line PWM Switching Prohibited

Figure 50. Protection of FG Terminal

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Power Dissipation

1. Power Dissipation

Power dissipation (total loss) indicates the power that can be consumed by IC at Ta=25°C (normal temperature). IC is

heated when it consumes power, and the temperature of IC chip becomes higher than ambient temperature. The

temperature that can be accepted by IC chip into the package, that is junction temperature of the absolute maximum

rating, depends on circuit configuration, manufacturing process, etc. Power dissipation is determined by this maximum

joint temperature, the thermal resistance in the state of the substrate mounting, and the ambient temperature.

Therefore, when the power dissipation exceeds the absolute maximum rating, the operating temperature range is not a

guarantee. The maximum junction temperature is in general equal to the maximum value in the storage temperature

range.

2. Thermal Resistance

Heat generated by consumed power of IC is radiated from the mold resin or lead frame of package. The parameter

which indicates this heat dissipation capability (hardness of heat release) is called thermal resistance. In the state of

the substrate mounting, thermal resistance from the chip junction to the ambience is shown in θ_JA[°C/W], and thermal

characterization parameter from junction to the top center of the outside surface of the component package is shown

in Ψ_JT[°C/W]. Thermal resistance is classified into the package part and the substrate part, and thermal resistance in

the package part depends on the composition materials such as the mold resins and the lead frames. On the other

hand, thermal resistance in the substrate part depends on the substrate heat dissipation capability of the material, the

size, and the copper foil area etc. Therefore, thermal resistance can be decreased by the heat radiation measures like

installing a heat sink etc. in the mounting substrate.

The thermal resistance model is shown in Figure 51, and Equation is shown below.

Ambient temperature: Ta[°C]

θ_JA= (Tj – Ta) / P [ºC/W]

Package outside surface (top center)

temperature: Tt[°C]

Ψ_JT= (Tj – Tt) / P [ºC/W]

θ_JA[°C/W]

where:

θ_JAis the thermal resistance from junction

to ambient [ºC/W]

Junction temperature: Tj[°C]

Ψ_JT[°C/W]

Ψ_JTis the thermal characterization parameter from

junction to the top center of the outside surface of the

component package [ºC/W]

Tj is the junction temperature [ºC]

Ta is the ambient temperature [ºC]

Tt is the package outside surface (top center)

temperature [ºC]

Mounting Substrate

Figure 51. Thermal Resistance Model of Surface Mount

P is the power consumption [W]

Even if it uses the same package, θ_JAand Ψ_JTare changed depending on the chip size, power consumption, and the

measurement environments of the ambient temperature, the mounting condition, and the wind velocity, etc.

3. Thermal De-rating Curve

Thermal de-rating curve indicates power that can be consumed by IC with reference to ambient temperature. Power

that can be consumed by IC begins to attenuate at certain ambient temperature (25°C), and becomes 0W at the

maximum joint temperature (150°C). The inclination is reduced by the reciprocal of thermal resistance θja. The thermal

de-rating curve under a condition of thermal resistance (P.3) is shown in Figure 52.

1.0

0.8

-1/θ_JA= -7.6mW/°C

0.6

0.4

Operating temperature range

0.2

0.0

-50 -25

0

25

Ambient Temperature: Ta[°C]

Figure 52. Power Dissipation vs Ambient Temperature

50

75 100 125 150

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Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power

supply pins.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at

all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic

capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

However, pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go

below ground due to back EMF or electromotive force. In such cases, the user should make sure that such voltages

going below ground will not cause the IC and the system to malfunction by examining carefully all relevant factors

and conditions such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5. Thermal Consideration

Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in

deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size

and copper area to prevent exceeding the Pd rating.

6. Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately

obtained. The electrical characteristics are guaranteed under the conditions of each parameter.

7. Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may

flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power

supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,

and routing of connections.

8. Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

9. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may

subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply

should always be turned off completely before connecting or removing it from the test setup during the inspection

process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

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Operational Notes – continued

10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)

and unintentional solder bridge deposited in between pins during assembly to name a few.

11. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small

charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and

cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the

power supply or ground line.

12. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them

isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a

parasitic diode or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should

be avoided.

Resistor

Transistor (NPN)

Pin A

Pin B

B

E

C

Pin A

B

C

E

P

P⁺

N

P⁺

P

P⁺

N

Parasitic

Elements

Parasitic

Elements

P Substrate

GND GND

P Substrate

GND

Parasitic

Elements

Parasitic

Elements

N Region

close-by

Figure 53. Example of monolithic IC structure

13. Ceramic Capacitor

When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

14. Area of Safe Operation (ASO)

Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe

Operation (ASO).

15. Thermal Shutdown (TSD) Circuit

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always

be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction

temperature will rise which will activate the TSD circuit that will turn OFF all output pins. When the junction

temperature falls below the TSD threshold, the circuits are automatically restored to normal operation.

Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no

circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from

heat damage.

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Ordering Information

B

D

6

1

2

4

5

E

F

V

-

E 2

Part Number

Packaging and forming specification

Package

･EFV; HTSSOP-B16

･E2: Embossed tape and reel

Marking Diagram

HTSSOP-B16

(TOP VIEW)

6 1 2 4 5

Part Number

LOT Number

1PIN Mark

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Physical Dimension, Tape and Reel Information

Package Name

HTSSOP-B16

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Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PGA-E

Rev.003

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PGA-E

Rev.003


型号：	BD61245EFV
厂家：	ROHM
描述：	BD61245EFV是内置电机驱动部，通过功率DMOSFET构成H桥的单芯片驱动器。与以往机型相比，减少了搭载零件，简化了参数设置，从而提高了使用便利性。电机驱动驱动器
文件：	总29页 (文件大小：1537K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BD61245EFV [ROHM]

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