BD6383EFV_12 [ROHM]
High Performance, High Reliability 36V Stepping Motor Driver Series; 高性能，高可靠性36V步进电机驱动器系列
| 型号： | BD6383EFV_12 |
| 厂家： | 
ROHM |
| 描述： | High Performance, High Reliability 36V Stepping Motor Driver Series |
| 文件： | 总9页 (文件大小：271K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Stepping Motor Driver series
High Performance, High Reliability
36V Stepping Motor Driver Series
BD6383EFV, BD6385EFV, BD6387EFV, BD6389FM
No.12009EAT04
●Description
BD6387EFV, BD6385EFV, BD6383EFV, BD6389FM are the high-grade type that provides the highest function and highest
reliance in the ROHM stepping motor driver series. This series has the perfect various protection circuits and reduces IC’s
generation of heat by adopting low-ON resistance DMOS and high heat-radiation power package.
As for its basic function, it is a low power consumption bipolar PWM constant current-drive driver with power supply’s rated
voltage of 36V and rated output current of 1.0A～2.2A. For the input interface, the CLK-IN drive mode and the parallel IN
drive mode are compatible with each other, so please choose an input mode according to needs of application. There are
excitation modes of FULL STEP & HALF STEP (2 kinds), QUARTER STEP mode, and for current decay mode, the ratio of
FAST DECAY & SLOW DECAY can be freely set, so the optimum control conditions for every motor can be realized. In
addition, being able to drive with one system of power supply makes contribution to the set design’s getting easy.
●Feature
1) Power supply: one system drive (rated voltage of 36V)
2) Rated output current: 1.0A, 1.5A, 2.0A, 2.2A
3) Low ON resistance DMOS output
4) CLK-IN drive mode (built-in translator circuit)
5) Parallel IN drive mode
6) Stepping motor／DC motor(×2) drives are selectable
7) PWM constant current control (self oscillation)
8) Built-in spike noise cancel function (external noise filter is unnecessary)
9) FULL STEP & HALF STEP (two kinds), applicable to QUARTER STEP
10) Applicable to the μSTEP drive
11) Current decay mode switching function (linearly variable FAST/SLOW DECAY ratio)
12) Normal rotation & reverse rotation switching function
13) Power save function
14) Built-in logic input pull-down resistor
15) Power-on reset function
16) Thermal shutdown circuit (TSD)
17) Over current protection circuit (OCP)
18) Under voltage lock out circuit (UVLO)
19) Over voltage lock out circuit (OVLO)
20) Malfunction prevention at the time of no applied power supply (Ghost Supply Prevention)
21) Electrostatic discharge: 6kV (HBM specification)
22) Adjacent pins short protection
23) Inverted mounting protection
24) Microminiature, ultra-thin and high heat-radiation (exposed metal type) HTSSOP package
(BD6387EFV/BD6385EFV/BD6383EFV)
25) FIN heat-radiating type HSOP package (BD6389FM)
26) Pin-compatible line-up (BD6387EFV/BD6385EFV/BD6383EFV or BD6389FM)
●Application
PPC, multi-function printer, laser beam printer, ink jet printer, monitoring camera, WEB camera, sewing machine, photo
printer, FAX, scanner, mini printer, toy, and robot etc.
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.A
1/8
Technical Note
BD6383EFV, BD6385EFV, BD6387EFV, BD6389FM
●Absolute maximum ratings(Ta=25℃)
Item
Supply voltage
Symbol
VCC0,1,2
BD6387EFV
BD6385EFV
BD6383EFV
BD6389FM
Unit
-0.2～+36.0
V
W
1
2
3
4
1.6※
4.7※
2.8※
5.2※
Power dissipation
Pd
W
Input voltage for control pin
RNF maximum voltage
VIN
VRNF
IOUT
-0.2～+5.5
V
0.5
V
A/phas
e
5
5
5
5
Maximum output current
2.0※
1.5※
1.0※
2.2※
Operating temperature range
Storage temperature range
Junction temperature
Topr
Tstg
-25～+75
-55～+150
150
℃
℃
Tjmax
℃
1
2
3
4
5
※
※
※
※
※
70mm×70mm×1.6mm glass epoxy board. Derating in done at 12.8mW/℃ for operating above Ta=25℃.
4-layer recommended board. Derating in done at 37.6mW/℃ for operating above Ta=25℃.
70mm×70mm×1.6mm glass epoxy board. Derating in done at 22.4mW/℃ for operating above Ta=25℃.。
4-layer recommended board. Derating in done at 41.6mW/℃ for operating above Ta=25℃.
Do not, however exceed Pd, ASO and Tjmax=150℃.
●Operating conditions(Ta= -25～+75℃)
Item Symbol
Supply voltage VCC0,1,2
BD6387EFV
BD6385EFV
BD6383EFV
BD6389FM
Unit
10～28
V
A/phas
e
6
6
6
6
1.7※
1.2※
0.7※
1.9※
Output current(DC)
IOUT
※6 Do not however exceed Pd, ASO.
●Electrical characteristics
Applicable to all the series (Unless otherwise specified Ta=25℃, Vcc0,1,2=24V)
Limit
Item
Symbol
Unit
Condition
Min.
Typ.
Max.
Whole
Circuit current at standby
Circuit current
ICCST
ICC
-
-
1.0
4.5
3.0
10
mA
mA
PS=L
PS=H, VREFX=2V
Control input (SELECT, CW_CCW, CLK, PS, MODE0, MODE1, ENABLE)
H level input voltage
VINH
VINL
IINH
IINL
2.0
-
-
-
-
0.8
85
-
V
L level input voltage
V
H level input current
35
-10
50
0
μA
μA
VIN=5V
VIN=0V
L level input current
Output (OUT1A, OUT1B, OUT2A, OUT2B)
I
OUT =±1.5A,
Output ON resistance (BD6387EFV)
Output ON resistance (BD6385EFV)
Output ON resistance (BD6383EFV)
Output ON resistance (BD6389FM)
RON
RON
RON
-
-
-
0.8
1.0
1.5
1.04
1.3
Ω
Ω
Ω
Sum of upper and lower
IOUT =±1.0A,
Sum of upper and lower
I
OUT =±0.5A,
1.95
Sum of upper and lower
IOUT =±1.7A,
RON
-
-
0.7
-
0.91
10
Ω
Sum of upper and lower
Output leak current
Current control
ILEAK
μA
RNFXS input current
RNFX input current
VREFX input current
VREFX input voltage range
MTHX input current
MTHX input voltage range
Comparator threshold
Minimum on time
IRNFS
IRNF
-2.0
-40
-2.0
0
-0.2
-20
-0.1
-
-
-
μA
μA
μA
V
RNFXS =0V
RNFX=0V
IVREF
VREF
IMTH
-
VREFX=0V
2.0
-
-2.0
0
-0.1
-
μA
V
MTHX=0V
VMTH
VCTH
tONMIN
3.5
0.44
1.2
0.36
0.3
0.4
0.7
V
VREFX=2V
μs
R=39kΩ,C=1000pF
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© 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.A
2/8
Technical Note
BD6383EFV, BD6385EFV, BD6387EFV, BD6389FM
●Terminal function
1) BD6387EFV / BD6385EFV / BD6383EFV
Pin
No.
Pin name
Function
Pin
No.
Pin name
Function
1
2
3
4
NC
RNF1
RNF1S
NC
Non connection
Connection terminal of resistor for output
current detection
21
22
23
24
VCC0
NC
Power supply terminal
Non connection
Ground terminal
Input terminal of current limit comparator
Non connection
GND
MODE0
Motor excitation mode setting terminal
5
6
7
8
9
OUT1B
NC
H bridge output terminal
Non connection
25
26
27
28
29
MODE1
ENABLE
VREF2
MTH2
Motor excitation mode setting terminal
Output enable terminal
OUT1A
NC
H bridge output terminal
Non connection
Output current value setting terminal
Current decay mode setting terminal
Non connection
VCC1
Power supply terminal
Non connection
NC
Connection terminal of CR for setting PWM
frequency
10
11
NC
30
31
CR2
NC
Connection terminal of CR for setting PWM
frequency
Non connection
CR1
12
13
14
15
16
17
NC
Non connection
32
33
34
35
36
37
VCC2
NC
Power supply terminal
Non connection
MTH1
Current decay mode setting terminal
Output current value setting terminal
Input mode select terminal
VREF1
SELECT
OUT2A
NC
H bridge output terminal
Non connection
CW_CCW Motor rotating direction setting terminal
OUT2B
NC
H bridge output terminal
Non connection
NC
Non connection
Clock input terminal
18
19
20
CLK
38
39
40
RNF2S
RNF2
GND
Input terminal of current limit comparator
for advancing the electrical angle.
Connection terminal of resistor for output
current detection
Power save terminal
PS
Terminal for testing
(used by connecting with GND)
Ground terminal
TEST
2) BD6389FM
Pin
No.
Pin name
Function
Pin
No.
Pin name
Function
1
2
NC
Non connection
19
20
VCC2
NC
Power supply terminal
Non connection
Connection terminal of CR for setting PWM
frequency
CR1
3
4
5
6
MTH1
VREF1
SELECT
Current decay mode setting terminal
Output current value setting terminal
Input mode select terminal
21
22
23
24
NC
Non connection
OUT2A
NC
H bridge output terminal
Non connection
CW_CCW Motor rotating direction setting terminal
Clock input terminal
OUT2B
H bridge output terminal
7
8
9
CLK
25
26
27
NC
Non connection
for advancing the electrical angle.
PS
Power save terminal
RNF2S
RNF2
Input terminal of current limit comparator
Terminal for testing
(used by connecting with GND)
Connection terminal of resistor for output
current detection
TEST
Fin terminal
Fin terminal
FIN
10
FIN
FIN
28
FIN
(used by connecting with GND)
(used by connecting with GND)
Connection terminal of resistor for output
current detection
GND
Ground terminal
RNF1
11
12
13
14
15
MODE0
MODE1
ENABLE
VREF2
MTH2
Motor excitation mode setting terminal
Motor excitation mode setting terminal
Output enable terminal
29
30
31
32
33
RNF1S
NC
Input terminal of current limit comparator
Non connection
OUT1B
NC
H bridge output terminal
Non connection
Output current value setting terminal
Current decay mode setting terminal
OUT1A
H bridge output terminal
Connection terminal of CR for setting PWM
frequency
16
CR2
34
NC
Non connection
Non connection
Non connection
Power supply terminal
Power supply terminal
17
18
NC
NC
35
36
VCC1
VCC0
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© 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.A
3/8
Technical Note
BD6383EFV, BD6385EFV, BD6387EFV, BD6389FM
●Block diagram･Application circuit diagram･Input output equivalent circuit diagram
Resistor for current. detecting
Setting range is
0.1Ω～0.3Ω.
Set the PWM frequency.
Setting range is
C:470pF～4700pF
R:10kΩ～100kΩ.
Buffer
Current Limit Comp.
VREF1
DAC
VCC1
OUT1A
Predriver
Logic
CR1
CR
Timer
OUT1B
1000pF
39kΩ
0.2Ω
RNF1
Be sure to short VCC0, VCC1 &
OCP
MTH1
CLK
RNF1S
MODE0
MODE1
VCC0
GND
Reg
100uF
0.1uF
CW_CCW
ENABLE
SELECT
Translator
TSD
OVLO
UVLO
Bypass capacitor.
Setting range is
RESET
PS
Set the PWM frequency.
Setting range is
C:470pF～4700pF
R:10kΩ～100kΩ.
100uF～470uF(electrolytic)
0.01uF～0.1uF(multilayer ceramic etc.)
Buffer
Current Limit Comp.
VREF2
DAC
VCC2
OUT2A
CR2
Predriver
Logic
CR
OUT2B
RNF2
1000pF
39kΩ
Timer
0.2Ω
MTH2
TEST
OCP
RNF2S
Resistor for current. detecting.
Setting range is
0.1Ω～0.3Ω.
Terminal for testing.
Pleaseconnect to GND.
Fig.1 Block diagram & Application circuit diagram of BD6387EFV/BD6385EFV/BD6383EFV/BD6389FM
●Points to notice for terminal description
○CLK／Clock input terminal for advancing the electrical angle
CLK is reflected at rising edge. The Electrical angle advances by one for each CLK input.
Motor’s misstep will occur if noise is picked up at the CLK terminal, so please design the pattern in such a way that
there is no noise plunging.
○MODE0,MODE1／Motor excitation mode setting terminal
Set the motor excitation mode.
MODE0
MODE1
Excitation mode
L
H
L
L
L
FULL STEP
HALF STEP A
HALF STEP B
QUARTER STEP
H
H
H
○CW_CCW Terminal／Motor rotating direction setting terminal
Set the motor’s rotating direction. Change in setting is reflected at the CLK’s rising edge immediately after the change
in setting
CW_CCW
Rotating direction
L
Clockwise (CH2’s current is outputted with a phase lag of 90°in regard to CH1’s current)
Counter Clockwise(CH2’s current is outputted with a phase lead of 90°in regard to CH1’s current)
H
○ENABLE Terminal／Output enable terminal
Turn off forcibly all the output transistors (motor output is open).
At the time of ENABLE=L, electrical angle or operating mode is maintained even if CLK is inputted.
Please be careful because the electrical angle at the time of ENABLE being released (ENABLE=L→H) is different from
the released occasion at the section of CLK=H and from the released occasion at the section of CLK＝L.
ENABLE
Motor output
OPEN (electrical angle maintained)
ACTIVE
L
H
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© 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.A
4/8
Technical Note
BD6383EFV, BD6385EFV, BD6387EFV, BD6389FM
○PS／Power save terminal
PS can make circuit standby state and make motor output OPEN. In standby state, translator circuit is reset (initialized)
and electrical angle is initialized.
Please be careful because there is a delay of 40μs(max.) before it is returned from standby state to normal state and
the motor output becomes ACTIVE.
PS
State
Standby state (RESET)
ACTIVE
L
H
The electrical angle (initial electrical angle) of each excitation mode immediately after RESET is as follows.
Please be careful because the initial state at the time of FULL STEP is different from those of other excitation modes.
Excitation mode
Initial electrical angle
FULL STEP
45°
0°
HALFSTEP A
HALFSTEP B
0°
QUARTER
STEP
0°
○SELECT Terminal／Input mode switching terminal
This is the terminal to set the input mode.
SELECT
Input mode
CLK-IN drive
Parallel IN drive
L
H
●Power dissipation
○HTSSOP-B40 Package (BD6387EFV/BD6385EFV/BD6383EFV)
HTSSOP-B40 has exposed metal on the back, and it is possible to dissipate heat from a through hole in the back. Also, the
back of board as well as the surfaces has large areas of copper foil heat dissipation patterns, greatly increasing power
dissipation. The back metal is shorted with the back side of the IC chip, being a GND potential, therefore there is a
possibility for malfunction if it is shorted with any potential other than GND, which should be avoided. Also, it is
recommended that the back metal is soldered onto the GND to short. Please note that it has been assumed that this
product will be used in the condition of this back metal performed heat dissipation treatment for increasing heat dissipation
efficiency.
5.0
4.7W
4
Measurement machine：TH156（Kuwano Electric）
Measurement condition：ROHM board
Board size：70*70*1.6mm3
(With through holes on the board)
4.0
3.0
2.0
1.0
The exposed metal of the backside is connected to the board with
solder.
3.6W
3
Board①：1-layer board(Copper foil on the back 0mm2)
Board②：2-layer board(Copper foil on the back 15*15mm2)
Board③：2-layer board(Copper foil on the back 70*70mm2)
Board④：4-layer board(Copper foil on the back 70*70mm2)
Board①：θja=78.1℃/W
Board②：θja=64.1℃/W
Board③：θja=34.7℃/W
Board④：θja=26.6℃/W
1.95W
1.6W
2
1
0
100
125
Ambient Temperature:Ta[℃]
Fig.2 HTSSOP-B40 Derating Curve
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© 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.A
5/8
Technical Note
BD6383EFV, BD6385EFV, BD6387EFV, BD6389FM
○HSOP-M36 Package (BD6389FM/BD6388FM)
HSOP-M36 has a heat-dissipating FIN terminal on the IC side, but it is possible to greatly increase power dissipation by
taking a large heat dissipation pattern, such as with copper foil, on the back as well as the surface of the board. Also, this
terminal is a GND potential, therefore there is a possibility for malfunction or destruction if it is shorted with any potential
other than GND.
4
5.2W
Measurement machine：TH156（Kuwano Electric）
Measurement condition：ROHM board
Board size：70*70*1.6mm3
5.0
(With through holes on the board)
3
4.1W
Board①：1-layer board(Copper foil on the back 0mm2)
Board②：2-layer board(Copper foil on the back 15*15mm2)
Board③：2-layer board(Copper foil on the back 70*70mm2)
Board④：4-layer board(Copper foil on the back 70*70mm2)
4.0
3.0
2.0
1.0
2
1
3.0W
2.8W
Board①：θja=44.6℃/W
Board②：θja=41.6℃/W
Board③：θja=30.5℃/W
Board④：θja=24.0℃/W
0
Ambient Temperature:Ta[℃]
100
125
Fig.3 HSOP-M36 Derating Curve
●Usage Notes
(1) Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If
any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices,
such as fuses.
(2) Connecting the power supply connector backward
Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply
lines. An external direction diode can be added.
(3) Power supply Lines
Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply line,
separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply terminals
to ICs, connect a capacitor between the power supply and the GND terminal. When applying electrolytic capacitors in the
circuit, not that capacitance characteristic values are reduced at low temperatures.
(4) GND Potential
The potential of GND pin must be minimum potential in all operating conditions.
(5) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
Users should be aware that BD6387EFV, BD6385EFV and BD6383EFV have been designed to expose their frames at
the back of the package, and should be used with suitable heat dissipation treatment in this area to improve dissipation.
As large a dissipation pattern should be taken as possible, not only on the front of the baseboard but also on the back
surface. BD6389FM and BD6388FM are both equipped with FIN heat dissipation terminals, but dissipation efficiency can
be improved by applying heat dissipation treatment in this area. It is important to consider actual usage conditions and to
take as large a dissipation pattern as possible.
(6) Inter-pin shorts and mounting errors
When attaching to a printed circuit board, pay close attention to the direction of the IC and displacement. Improper
attachment may lead to destruction of the IC. There is also possibility of destruction from short circuits which can be
caused by foreign matter entering between outputs or an output and the power supply or GND.
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© 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.A
6/8
Technical Note
BD6383EFV, BD6385EFV, BD6387EFV, BD6389FM
(7) Operation in a strong electric field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.
(8) ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
(9) Thermal shutdown circuit
The IC has a built-in thermal shutdown circuit (TSD circuit). If the chip temperature becomes Tjmax=150℃, and higher,
coil output to the motor will be open. The TSD circuit is designed only to shut the IC off to prevent runaway thermal
operation. It is not designed to protect or indemnify peripheral equipment. Do not use the TSD function to protect
peripheral equipment.
TSD on temperature [℃] (Typ.)
Hysteresis Temperature [℃] (Typ.)
175
25
(10) Inspection of the application board
During inspection of the application board, if a capacitor is connected to a pin with low impedance there is a possibility
that it could cause stress to the IC, therefore an electrical discharge should be performed after each process. Also, as a
measure again electrostatic discharge, it should be earthed during the assembly process and special care should be
taken during transport or storage. Furthermore, when connecting to the jig during the inspection process, the power
supply should first be turned off and then removed before the inspection.
(11) Input terminal of IC
This IC is a monolithic IC, and between each element there is a P+ isolation for element partition and a P substrate.
This P layer and each element’s N layer make up the P-N junction, and various parasitic elements are made up.
For example, when the resistance and transistor are connected to the terminal as shown in figure 4,
○When GND＞(Terminal A) at the resistance and GND＞(Terminal B) at the transistor (NPN),
the P-N junction operates as a parasitic diode.
○Also, when GND＞(Terminal B) at the transistor (NPN)
The parasitic NPN transistor operates with the N layers of other elements close to the aforementioned
parasitic diode.
Because of the IC’s structure, the creation of parasitic elements is inevitable from the electrical potential relationship. The
operation of parasitic elements causes interference in circuit operation, and can lead to malfunction and destruction.
Therefore, be careful not to use it in a way which causes the parasitic elements to operate, such as by applying voltage
that is lower than the GND (P substrate) to the input terminal.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
C
Pin A
E
C
E
B
N
P+
P+
P+
P+
N
N
P
N
P
N
N
Parasitic
element
P substrate
Parasitic
element
P substrate
GND
GND
GND
GND
Parasitic element
Parasitic element
Other adjacent elements
Fig. 4 Pattern Diagram of Parasitic Element
(12) Ground Wiring Patterns
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,
placing a single ground point at the application's reference point so that the pattern wiring resistance and voltage
variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change
the GND wiring pattern potential of any external components, either.
(13) TEST Terminal
Be sure to connect TEST pin to GND.
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© 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.A
7/8
Technical Note
BD6383EFV, BD6385EFV, BD6387EFV, BD6389FM
●Ordering part number
E F
V
B D 6 3 8 3
-
E 2
パッケージ
包装、フォーミング仕様
形名
EFV
FM
: HTSSOP-B40
: HSOP-M36
E2: リール状エンボステーピング
HTSSOP-B40
<Tape and Reel information>
13.6 0.1
(MAX 13.95 include BURR)
+6
Tape
Embossed carrier tape (with dry pack)
4
−4
(8.4)
Quantity
2000pcs
40
21
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
1
20
1PIN MARK
0.625
+0.05
0.17
−0.03
S
+0.05
−0.04
0.24
M
0.08
0.65
Direction of feed
1pin
0.08
S
Reel
Order quantity needs to be multiple of the minimum quantity.
(Unit : mm)
∗
HSOP-M36
<Tape and Reel information>
18.5 0.1
(MAX 18.75 include BURR)
Tape
Embossed carrier tape (with dry pack)
+6
−4
2.77 0.1
Quantity
1500pcs
4
36
28
27
19
E2
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
(
)
1
9
10
18
0.85
+0.055
−0.045
1PIN MARK
0.27
0.08
S
+0.05
0.37
0.8
−0.04
M
0.08
Direction of feed
1pin
Reel
(Unit : mm)
Order quantity needs to be multiple of the minimum quantity.
∗
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© 2012 ROHM Co., Ltd. All rights reserved.
2012.02 - Rev.A
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Notice
N o t e s
No copying or reproduction of this document, in part or in whole, is permitted without the
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The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
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other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, commu-
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The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
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© 2012 ROHM Co., Ltd. All rights reserved.
R1120
A
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