BD63940EFV [ROHM]
Silicon monolithic integrated circuits; 硅单片集成电路
| 型号： | BD63940EFV |
| 厂家： | 
ROHM |
| 描述： | Silicon monolithic integrated circuits |
| 文件： | 总5页 (文件大小：130K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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STRUCTURE
PRODUCT SERIES
TYPE
Silicon monolithic integrated circuits
Bipolar stepping motor driver
BD63940EFV
FUNCTION
・PWM constant current controllable two H bridge driver
・Forward, Reverse, Brake mode
・Parallel IN control
○Absolute maximum ratings(Ta=25℃)
Item
Symbol
VCC1,2
Limit
Unit
Supply voltage
-0.2～+36.0
V
1
1.1※
4.0※
W
Power dissipation
Pd
2
W
Input voltage for control pin
RNF maximum voltage
VIN
VRNF
IOUT
Topr
-0.2～+5.5
V
0.5
1.2※
V
A/phase
℃
3
Maximum output current
Operating temperature range
Storage temperature range
Junction temperature
-25～+85
-55～+150
+150
Tstg
℃
Tjmax
℃
1
2
3
※
※
※
70mm×70mm×1.6mm glass epoxy board. Derating in done at 8.8mW/℃ for operating above Ta=25℃.
4-layer recommended board. Derating in done at 32.0mW/℃ for operating above Ta=25℃.
Do not, however exceed Pd, ASO and Tjmax=150℃.
○Recommended operating conditions (Ta=-25～+85℃)
Item
Supply voltage
Output current
Symbol
VCC1,2
IOUT
Min.
19
-
Typ.
24
Max.
28
0.9※
Unit
V
4
0.7
A/phase
4
※
Do not, however exceed Pd, ASO.
This product isn’t designed for protection against radioactive rays.
Status of this document
The Japanese version of this document is the formal specification.
A customer may use this translation version only for a reference to help reading the formal version.
If there are any differences in translation version of this document, formal version takes priority.
REV. A
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○Electrical characteristics (Unless otherwise specified Ta=25℃, VCC1,2=24V)
Limit
Item
Symbol
Unit
Conditions
Min.
Typ.
Max.
Whole
Circuit current at standby
Circuit current
ICCST
ICC
-
-
0.6
2.7
2.0
7.0
mA
mA
PS=L
PS=H, VREFX=0.4V
Control input (IN1A, IN1B, IN2A, IN2B, PS)
H level input voltage
L level input voltage
VINH
VINL
2.0
-
-
-
-
V
V
0.8
Output (OUT1A, OUT1B, OUT2A, OUT2B)
IOUT=0.7A,
Output ON resistance
RON
-
-
1.4
-
1.8
10
Ω
Sum of upper and lower
Output leak current
Current control
ILEAK
μA
RNFX input current
VREFX input current
VREFX input voltage range
Comparator offset
IRNF
IVREF
VREF
VCOF
tONMIN
-40
-2.0
0
-20
-0.1
-
-
μA
μA
V
RNFX=0V
-
VREFX=0V
0.4
20
1.2
-20
0.3
0
mV
μs
VREFX=0.4V
Minimum on time
0.7
R=39kΩ,C=1000pF
REV. A
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○Package outline
Product No.
BD63940
Lot No.
HTSSOP-B24 (Unit: mm)
○Block diagram
○Pin No. / Pin name
Pin No.
Pin name
Pin No.
13
Pin name
IN1A
15 VCC1
1
2
PGND
IN2B
VREF2
CR2
13
IN1A
16 OUT1A
18 OUT1B
IN1B 11
LOGIC
14
PGND
VCC1
OUT1A
RNF1
OUT1B
OUT2B
RNF2
OUT2A
VCC2
NC
Predriver
9
CR1
ONE
3
15
17 RNF1
SHOT
4
16
OCP
VREF1 10
5
NC
17
Current
Limit
6
TEST
GND
PS
18
Comp.
22 VCC2
7
19
24
2
IN2A
IN2B
CR2
21 OUT2A
19 OUT2B
LOGIC
8
20
Predriver
4
ONE
9
CR1
21
SHOT
20 RNF2
10
11
12
VREF1
IN1B
NC
22
OCP
23
VREF2
3
1
Current
Limit
Comp.
24
IN2A
6
8
TEST
PS
PGND
RESET
Regulator
NC : Non Connection
PGND 14
GND
TSD
7
UVLO
OVLO
REV. A
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○Operation Notes
(1) Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating
conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as
a short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum
ratings, consider adding circuit protection devices, such as fuses.
(2) Power supply lines
As return of current regenerated by back EMF of motor happens, take steps such as putting capacitor
between power supply and GND as an electric pathway for the regenerated current. Be sure that there is
no problem with each property such as emptied capacity at lower temperature regarding electrolytic
capacitor to decide capacity value. If the connected power supply does not have sufficient current
absorption capacity, regenerative current will cause the voltage on the power supply line to rise, which
combined with the product and its peripheral circuitry may exceed the absolute maximum ratings. It is
recommended to implement a physical safety measure such as the insertion of a voltage clamp diode
between the power supply and GND pins.
(3) GND potential
The potential of GND pin must be minimum potential in all operating conditions.
(4) Metal on the backside (Define the side where product markings are printed as front)
The metal on the backside is shorted with the backside of IC chip therefore it should be connected to
GND. Be aware that there is a possibility of malfunction or destruction if it is shorted with any potential
other than GND.
(5) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual
operating conditions. This IC exposes its frame of the backside of package. Note that this part is assumed
to use after providing heat dissipation treatment to improve heat dissipation efficiency . Try to occupy as
wide as possible with heat dissipation pattern not only on the board surface but also the backside.
(6) Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause
the IC to malfunction.
(7) ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
(8) Thermal shutdown circuit
The IC has a built-in thermal shutdown circuit (TSD circuit). If the chip temperature becomes
Tjmax=150℃, and higher, coil output to the motor will be open. The TSD circuit is designed only to shut
the IC off to prevent runaway thermal operation. It is not designed to protect or indemnify peripheral
equipment. Do not use the TSD function to protect peripheral equipment.
(9) Ground Wiring Pattern
When using both large current and small signal GND patterns, it is recommended to isolate the two
ground patterns, placing a single ground point at the ground potential of application so that the pattern
wiring resistance and voltage variations caused by large currents do not cause variations in the small
signal ground voltage. Be careful not to change the GND wiring pattern of any external components,
either.
(10) Mounting errors and Inter-pin short
When attaching to a printed circuit board, pay attention to the direction of the IC and displacement.
Improper attachment may lead to destruction of the IC. There is also possibility of destruction from short
circuits which can be caused by foreign matter entering between outputs or an output and the power
supply or GND.
(11) TEST pin
Be sure to connect TEST pin to GND.
REV. A
Notice
N o t e s
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, commu-
nication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
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© 2009 ROHM Co., Ltd. All rights reserved.
R0039
A
相关型号：
BD63940EFV-E
the ultra simple type that provides the minimum function for driving stepping motor and various protection circuits.
ROHM
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