BD65499MUV_技术文档

Datasheet

Driver for Digital Still Camera

1-2ch Lens Drivers

for SLRs (Single-lens Reflex)

BD65499MUV

●General Description

●Key Specifications

Power supply voltage (V_CC):

The BD65499MUV motor driver provides built–in boost

converter and 1ch H-bridge FULL ON driver.

Integrated boost converter for high voltage and large

current H-bridge, especially designed for mobile system

piezoelectric element with a compact surface mount

package.

2.7 to 3.6V

Motor power supply voltage (V_P):

Circuit current:

Stand-by current:

Control input voltage:

Control input frequency:

Serial clock input frequency:

Turn On time:

4.0 to 27.0V

2.8mA(Typ.)

1µA (Max.)

0 to V_CCV

300kHz(Max.)

5MHz(Max.)

150ns(Typ.)

50ns(Typ.)

500mA

●Features

Turn Off time:

H-bridge output current (DC):

Low ON resistance DMOS output

DC/DC boost converter

Output switching speed changeability

(DC/DC converter: 4 step, H-bridge: 2 step)

Charge pump less as using Pch DMOS for high-side

output (H-bridge)

Control input terminal available with 1.8V

With built-in Under Voltage Locked Out protection,

Thermal Shut Down, and Over Current Protection

circuit

Motor voltage supply output current (DC):

300mA

DC/DC converter switching frequency: 750kHz(Typ.)

Output ON resistance

・DC/DC converter Nch. DMOS:

・H-bridge (total):

Operating temperature range:

0.20Ω(Typ.)

0.60Ω(Typ.)

-30 to 85°C

●Package

VQFN028V5050

W(Typ.) x D(Typ.) x H(Max.)

5.00mm x 5.00mm x 1.00mm

●Applications

Small mobile system

Home appliance

Amusement system, etc

VQFN028V5050

●Ordering Information

B D 6 5 4 9 9 M U V -

E 2

Package

Packaging and forming specification

Part Number

MUV: VQFN028V5050 E2: Embossed tape and reel

○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays

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●Block Diagram / Application Example

Bypass filter capacitor

for power supply input

Bypass filter capacitor

for power supply input

Power-saving

H : Active

L : Stand-by

VBAT

1

～100µF

1～100µF

VCC

24

PS

21

Power-saving

BandGap

TSD & UVLOVCC1 & UVLOVCC2

1.8～3.3V

INPUT

SEN

18

19

cl

Serial

Interface

SDATA

Serial data

SCLK 20

10µH

CURRENT SENSE

Comparator

3-wired serial

interface

Power Good

26

27 28

Level Shift

&

SWO

LOGIC

OSC

Pre Driver

1

2

5BIT

DAC

PWM

PGND

VP

6

3

9

10

Serial data setting

for soft start

ERR

100pF

Serial data

3.3kΩ

ERRIN

22

0.022µF

ERROUT

23

1.3kΩ

Motor

control input

Serial data

4

5

OUTA

OUTB

INA

INB

Level Shift

17

16

1.8 3.3V

～

&

H-Bridge

Controller

Pre Driver

7

8

INPUT

REG1.8V

VCC

STATE signal

logic output

Serial data

Power Good

TSD & UVLOVCC2

OUTPUT

CONTROL

12

STATE

cl

Serial data

1.8V OVP

Controller

CLCANCEL

VCC

INP

INN

15

13

AMPOUT

14

Amp

Amp output

Amp input

11

25

N.C.

GND

Figure 1. Block diagram

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●Pin Configuration

22.ERRIN

23.ERROUT

24.VCC

14.AMPOUT

13.INN

12.STATE

11.N.C.

10.VP

25.GND

26.SWO

27.SWO

28.SWO

9.VP

8.OUTB

Figure 2. Pin Configuration (Top View)

●Pin Description

Pin No.

Terminal

GND

PGND

VCC

N.C.

Function

Ground terminal

PS=Lo condition

25

1,2,3,6

24

-

Power ground terminal

Small signal power supply terminal

N.C.

-

11

-

9,10

26,27,28

4,5

7,8

17

VP

VP power supply terminal

Nch power FET output terminal

H-bridge output terminal ch.A

H-bridge output terminal ch.B

Control input terminal A

Control input terminal B

STATE output terminal

Amp plus input terminal

Amp minus input terminal

-

SWO

OUTA

OUTB

INA

HiZ

Lo

HiZ

Lo

16

INB

12

STATE

INP

15

13

INN

14

AMPOUT Buffer Amp output terminal

ERRIN Error Amp input terminal

ERROUT Error Amp output terminal

22

23

21

PS

Power-saving terminal

18

SEN

3-wired serial enable input terminal

3-wired serial data input terminal

3-wired serial clock input terminal

19

SDATA

20

SCLK

* Short-circuit on an implementation pattern about the following each of the same terminal name. Power ground (PGND), VP power supply terminal (VP), Nch

power FET output terminal (SWO), H-bridge output terminal ch.A (OUTA), H-bridge output terminal ch.B (OUTB).

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●Absolute Maximum Ratings

Parameter

Symbol

Limit

Unit

Power supply voltage

VP Power supply voltage

SWO supply voltage

V_CC

V_P

-0.3 to +4.5

-0.3 to +30.0

V

V_SWO

Control input voltage

V_IN

V_AMP

Pd1

Pd2

Pd3

Tjmax

Tstg

I_VPDC

I_VPP

-0.3 to V_CC+0.3

880*¹

V

Amp input and output voltage

Power dissipation 1

V

mW

°C

Power dissipation 2

3260*²

4560*³

Power dissipation 3

Junction temperature

150

Storage temperature range

VP power supply load current (DC)

VP power supply load current (peak*⁵)

H-bridge output current (DC)

-55 to +150

-300 to +300*⁴

-500 to +500*⁴

°C

mA

I_OUT

H-bridge output current (peak 1*⁶)

I_OUTP1

I_OUTP2

-1000 to +1000*⁴

mA

H-bridge output current (peak 2*⁷)

-2000 to +2000*⁴

*¹Reduced by 7.0mW / °C , when mounted on a one layer glass epoxy board

(74.2mm×74.2mm×1.6mm front and back radiation of heat copper foil 20.2mm²,Ta=25°C)

*²Reduced by 26.0mW / °C , when mounted on a four layers glass epoxy board

(74.2mm×74.2mm×1.6mm front and back radiation of heat copper foil 20.2mm²,

2

^ndand 3^rdradiation of heat copper foil 5505mm², Ta=25°C).

*³Reduced by 36.4mW / °C , when mounted on a four layers glass epoxy board

(74.2mm×74.2mm×1.6mm ,All layers radiation of heat copper foil 5505mm², Ta=25°C).

*⁴Pd, ASO, and never exceed Tjmax=150°C.

*⁵A peak electric current value after having smoothed by 20µF bypass condenser

which is connected between VP and GND.

And which is drifted when the H-bridge works as Forward / Reverse.

*⁶On time≦10µs and Duty≦30%.

*⁷On time≦5µs and Duty≦15%.

●Recommended Operating Ratings

Symbol

Limit

Unit

Parameter

Power supply voltage

V_CC

V_P

2.7 to 3.6

4.0 to 27.0

0 to V_CC

0 to 300

0 to 5

V

VP power supply voltage

SWO supply voltage

V_SWO

V_IN

V

Control input voltage

V

Amplifier input-output voltage

INA, INB input frequency

SCLK frequency

V_AMP

F_IN

V

kHz

MHz

°C

S_CL

T_opr

Operating temperature range

-30 to 85

* VP supply voltage contains soft start mode (V_P= 4V to 14V). VP voltage setting range is 14 to 25V.

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●Electrical Characteristics (Unless otherwise specified Ta=25°C, V_CC=3.3V, VBAT=8V, V_P=20V)

Limit

Typ.

Unit

Conditions

Parameter

Symbol

Min.

Max.

All circuits

Circuit current during

stand-by operation

I_CCST

I_CC

-

0

1

µA

Stand-by mode PS=0V

Active mode PS =Hi,ERRIN= V_CC

INP= V_CC/2,INN=AMPOUT

,

Circuit current

1.5

2.8

5.0

mA

Control input (IN= PS, INA, INB, SEN, SCLK, SDATA)

High-level input voltage

Low-level input voltage

High-level input current

Low-level input current

Logic output (OUT=STATE)

Hi output 0

V_INH

V_INL

I_INH

I_INL

1.45

0

-

V_CC

0.5

60

1

V

15

-1

30

0

µA

V_IN=3V

V_IN=0V

H_O0

H_O1

L_O

1.6

1.8

2.0

-

V

LSET=1’b0 no load mode

Hi output 1

V_CC-0.3 V_CC-0.15

LSET=1’b1 0.5mA source condition

0.5mA sink condition

Lo output

-

0.15

0.3

Under voltage Locked out (UVLO circuit)

UVLO voltage 1(VCC)

UVLO voltage 2(VCC)

V_UVLO1VCC

V_UVLO2VCC

1.8

-

2.2

V

Serial data reset

SWO output, H bridge output,

AMPOUT : OFF

2.25

2.65

The difference voltage between each

UVLO start voltage of Serial data set

and out put OFF

UVLO voltage difference

12(VCC)

V_UVLOD12VCC

0.1

0.4

0.75

V

FULL ON driver block

Output ON resistance

High-side and Low-side ON resistance

total

R_ON

-

0.60

0.85

Ω

Turn On time 0

Turn On time 1

Turn Off time

Amp

T_on0

T_on1

T_off0

-

300

150

50

700

500

400

ns

TR=1’h0

TR=1’h1

TR=1’hx

Common mode input

voltage range

INP voltage input ,INN=AMPOUT

(no load)

V_LOPI

0.1

-

V_CC-0.1

V

Input bias current

I_BI

I_OH

I_OL

-3

0

-

3

-

µA

Output source current

Output sink current

2.5

0.2

mA INP= V_CC/2,INN=AMPOUT

0.3

-

INP=1 to 2V (or 2 to 1V) input,

INN=AMPOUT, reaction velocity

Slew Rate

S_R

0.7

1.5

-

V/µs

GB width product

G_B

1.0

1.6

3.0

1.8

-

MHz

Over voltage protection

STEP UP DC/DC converter

Output Nch. ON resistance

Oscillation frequency

Soft start

O_VP

2.0

V

In case of AMPOVP=1’d1

D_CRON

D_COSC

SS_ST

S_V14

-

0.20

750

0.50

900

Ω

600

kHz

4.26

13.58

19.5

24.5

5.33

14.0

20.0

25.0

6.40

14.42

20.5

25.5

ms SSSET=3’d5

Reference voltage 14

Reference voltage 20

Reference voltage 25

V

VPSET=5’d14

VPSET=5’d20

VPSET=5’d25

S_V20

S_V25

(VP voltage after soft start

completion)[V] x PG[%]

Power Good

P_G

83

90

97

%

(VP voltage after soft start

completion)[V] x PGHYS[%]

Power Good hysteresis

Current limit

P_GHYS

D_CLIM

63

70

77

-

%

A

2.0

3.6

SWO current

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●Typical Performance Curves

5.0

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

Top 85°C

Mid 25°C

Low -30°C

Top 85°C

Mid 25°C

Low -30°C

4.0

3.0

2.0

1.0

0.0

Operating range

(2.7V～3.6V)

Operating range

(2.7V～3.6V)

0

1

2

3

4

0

1

2

3

4

Supply voltage : V_CC[V]

Figure 4. Circuit current

Figure 3. Stand-by mode circuit current

200

150

100

50

200

150

100

50

Top 85°C

Mid 25°C

Low -30°C

Top 85°C

Mid 25°C

Low -30°C

0

100

200

300

400

500

0

100

200

300

400

500

Output Current : I_OUT[mA]

Figure 5. H-bridge output High-side ON resistance

(V_P=20V, V_CC=3.3V)

Figure 6. H-bridge output Low-side ON resistance

(V_P=20V, V_CC=3.3V)

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0.5

0.4

0.3

0.2

0.1

0.5

0.4

0.3

0.2

0.1

0.0

Operating range

(4V～27V)

Top 85°C

Mid 25°C

Low -30°C

Top 85°C

Mid 25°C

Low -30°C

0.0

0

6

12

18

24

30

0

6

12

18

24

30

Supply voltage : V_P[V]

Figure 7. H-bridge output High-side ON resistance

(V_Pdependency, V_CC=3.3V)

Figure 8. H-bridge output Low-side ON resistance

(V_Pdependency, V_CC=3.3V)

900

1.05

1.04

1.03

1.02

1.01

1.00

0.99

0.98

0.97

0.96

0.95

850

800

750

700

650

600

-50

-25

0

25

50

75

100

-50

-25

0

25

50

75

100

Ambient temperature : Ta [°C]

Figure 9. DC/DC switching frequency

(Temperature dependency)

Figure 10. Error amplifier threshold voltage

(Temperature dependency)

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100

90

80

70

60

50

40

30

20

10

0

10

100

1000

Load current : I_L[mA]

Figure 11. DC/DC power conversion efficiency

(VBAT=6V, V_P=20V)

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●Function Description

(1) Reset

Mode

STATE terminal

(STATESEL=3’d0)

PS terminal CLCANCEL

cl

1

SWO output H-bridge output

0

Stand-by mode

L

HiZ

(reset)

Circuit start up and the

voltage boost start

Condition that the voltage

boost complete

In case that it takes

UVLOVCC1 (Serial data

set)

In the case that it takes

UVLOVCC2 or TSD

H

0

Normal

(after ic=1)

H

0

H

0

1

L

HiZ

(reset)

H

0

1

0

L

SWO current limit

Latched in HiZ Latched in HiZ

STATE terminal output

Cl invalid

1

(set)

Normal

or *⁸

H

*

Regarding the return of UVLOVCC2 and TSD, The VP voltage setting DAC output soft starts from 0V.

When it takes current limit three times consecutively in CLCANCEL=1’b0 , It stop the SWO output and H bridge output.

As for the return of the current limit, it is reset the PS terminal. (refer to Figure 12).

8

*

When the SWO output is ON, it does sense of an SWO output current. And when its value is more than current l

Current limit, it makes SWO output HiZ. The movement in CLCANCEL=1’b1 is Figure 13.

PWM Cycle

SWO terminal

Nch power FET output

ON

Hiz

ON

Hiz

ON

Hiz

ON

Hiz

ON

Hiz

ON

Latched in Hiz

Current Limit

SWO output current

0A

①

②

③

H-bridge Output

cl

Latched in Hiz

Normal Operation

Figure 12. SWO output current limit timing chart

CLCANSEL=1’d0 cl Effective

Latched SWO and H-bridge in HiZ when the current limit detect three times consecutively

PWM Cycle

SWO terminal

Nch power FET output

ON

Hiz

ON

Hiz

ON

Hiz

ON

Hiz

ON

Hiz

ON

Hiz

ON

Hiz

Current Limit

SWO output current

0A

H-bridge Output

cl (set 1)

Normal Operation

Figure 13. SWO output current limit timing chart

CLCANCEL=1’d1 cl invalidity

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(2) Logic output setting, STATE terminal output voltage

LSET

0

1

STATE terminal output

0 / 1.8V output

0 / V_CCoutput

(3) Selection of the internal output signal of STATE terminal

STATESEL

Signal name

=3’d

Function

ic & Power Good & uvlovcc2 ic, Power Good, UVLOVCC2, TSD, (cl | CLCANCEL) .If any one of

0

1

& tsd& (cl | CLCANCEL)

those signals is “0”(stand-by or abnormal condition) outputs Lo.

S_POWERGOOD &

S_UVLOVCC2 & S_TSD &

S_(cl | CLCANCEL)

S_ POWERGOOD, S_UVLOVCC2, S_TSD, S_(cl | CLCANCEL) If any

one of those signals is “0”(stand-by or abnormal condition) outputs Lo.

2

3

4

5

6

7

ic

Normal circuit condition signal (In stand-by mode, it outputs Lo signal)

Power Good signal for the latch (Original signal is Power Good)

S_POWERGOOD

S_UVLOVCC2

-

VCCUVLO2 signal for the latch (Original signal is uvlovcc2)

(In UVLO active mode, it outputs Lo signal)

-

Thermal shut down signal for the latch (Original signal is TSD)

(In Thermal shutdown condition, it outputs Lo signal)

S_TSD

S_(cl | CLCANCEL)

Current limit signal for the latch (Original signal is (cl | CLCANCEL)

* “&” means AND logic. “|” means OR logic.

(4) STATE terminal output voltage setting

S_POWER

GOOD &

S_UVLOVC

S_POWER S_UVLOVC

GOOD C2

S_(cl |

CLCANCEL)

C2 &

S_TSD

PS

terminal

Mode

STATESET S_TSD &

S_(cl |

CLCANCEL)

STATESEL=3’ STATESEL=3’STATESEL=3’STATESEL=3’STATESEL=3’

d1

d3

d4

d6

d7

L

Stand-by mode

L

0

(reset)

V_CC< V_UVLO1VCC

condition

L

H

(reset)

Circuit start up and the

voltage boost start

H

L

H

(after ic=1)

Condition that the

voltage boost complete

H

L→H

In the condition of

Boost voltage<（setting

70%）

H→L

(latch)

H→L

(latch)

H

(fix)

H

(fix)

H

(fix)

0

In the case of

V_UVLO1VCC< V_CC

V_UVLO2VCC

H→L

(latch)

H

(fix)

H→L

(latch)

H

(fix)

H

(fix)

H

0

1

<

H→L

(latch)

H

(fix)

H

(fix)

H→L

(latch)

H

(fix)

In the case of TSD

In the case of

CLCANCEL=1’b0 and

Current limit condition

In the condition of

STATESET=1’b1

H→L

(latch)

H

(fix)

H

(fix)

H

(fix)

H→L

(latch)

H

(set)

H

(set)

H

(set)

H

(set)

H

(set)

* At the time of the falling edge of STATE terminal, it does latch the first changing signal from 1 to 0 in S_POWERGOOD, S_UVLOVCC2, S_TSD, S_(cl |

CLCANCEL) and other signals are hold as 1.

* At the time of a change VPSET[3:0] , it ignore the falling edge of the STATE terminal.

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(5) Operation timing chart

Item

Symbol

T_EN

Max.

100

Unit

µs

V_CC> V_UVLO1VCCand the time after(PS=Lo to Hi) until 3 wire

communication

Start up(PS=Lo to Hi) , V_CC> V_UVLO2VCCand the time after the cancellation

TSD until normal condition

T_RETURN

100

µs

* When V_CC> V_UVLO2VCCand TSD is released and PS set from Lo to

Hi the resulting condition is T_EN= T_RETURN

T_EN

VBAT

V_UVLO2VCC

V_UVLO1VCC

V_CC

PS

ic

VPU

VPSET[4:0] setting

change

VPSET[4:0] setting

change

Soft Start Period

Soft Change

Setting Value 1

Power Good 90%

Power Good Hysteresis 70%

V_P

Setting Value 2

VBAT - VF

0V

Power Good

Normal Logic

Output

Hiz

H-bridge Output

Figure 14. Start up and Stop sequence

*The period of soft start and soft change is Power Good=1'b0(fix).

After soft start and soft change, 90% of setting value and Power Good=1'b1.

With hysteresis, it is 70% and Power Good=1'b0.

T_EN

T_RETURN

VBAT

S_UVLOVCC2=1’b1 set to 1’b0 : latch

V_UVLO2VCC

V_UVLO1VCC

V_CC

PS

ic

VPU

Soft Start Period

Setting Value

Power Good 90%

Power Good Hysteresis 70%

V_P

VBAT - VF

0V

Power Good

Normal Logic

Output

Normal Logic

Output

Hiz

H-bridge Output

Figure 15. UVLOVCC2 (or TSD) operation and cancellation sequence

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(6) AMPOUT terminal over voltage protection circuit

1. Monitoring AMPOUT voltage, And when it reach more than 1.8V, it make Class-A Amp output Pch. CMOS(M1) OFF

and stop the energy supply from VCC.

2. Because the constant current I is active, it decrease the voltage in high value of AMPOUT toward GND direction.

3. It returns when the voltage of AMPOUT is less than 1.8V(typ.)

AMPOVP

AMPOUT1.8V over voltage protection

0

1

OFF (Default)

ON

VCC

AMPOVP

Power Save

OVP

1.8V

1.8Vref

Control

Amp

INP

INN

M1

AMPOUT

I=0.3mA typ.

Figure 16. Over voltage protection circuit of AMP block

(7) In the case of amplifier unused

Use with connecting INN = AMPOUT terminal, and INP = GND.

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●Boost Converter Block Explanation

(1)Output voltage setting

VPSET

=5’d

VPSET

=5’d

VPSET

=5’d

VPSET

=5’d

VP voltage

V

VP voltage

V

-

0

1

2

3

4

5

6

7

SWO HiZ

8

9

16

17

18

19

20

21

22

23

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

24

25

10

11

12

13

14

15

inhibited

14

15

* With the application circuit as Figure 1, V_P=VBAT-VF when VPU=1’b0.

(2)Soft start / soft change setting

SSSET

Soft start setting

=4’d

Soft start setting

=4’d

-

ms/25V

5.33(default)

1.07

ms/25V

8.53

9.60

10.67

11.73

12.80

13.87

14.93

16.00

-

8

0

1

2

3

4

5

6

7

9

10

11

12

13

14

15

2.13

3.20

4.27

5.33

6.40

7.47

* Typical time between starting step up and finishing soft start at VPSET[4:0]=5’d25 (25V)setting.

Ex.) VPSET[4:0]=5’d14 (VP voltage is 14V setting), SSSET[3:0]=4’d5 (=5.33ms/25V)

Soft start time)

=（VPSET setting voltage[V]）×(SSSET setting time[ms/25V]) / 25[V]

= 14[V] × 5.33[ms/25V] / 25[V]

= 2.98ms

(3) SWO switching speed control function

* As considering efficiency and switching noise to VCC voltage supply, default setting value of PON and NON[1:0] are determined.

PON

=1’b

VCC side switching speed control

Comment

0

1

P2 operate

P3 operate

default

Use to reduce the noise at SWO turning ON

NON

=2’b

00

01

1x

PGND side switching speed control

Comment

N1 operate

N2 operate

N3 operate

default

Use to reduce the noise at SWO turning OFF

VCC

P2

N2

P3

SWO

33Ω

100Ω

33Ω

N1

N3

PGND

Figure 17. SWO circuit

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(4) Power good filter function

Power good filter works when V_Pdrops lower than 70%(typ.) of VP setting voltage, and the filer is reset when VP

voltage increase higher than 90%(typ.) of VP setting voltage. When V_Pdrops lower than 70% and it takes longer than

5.3ms (typ.) to recover, Power Good signal turns from Hi to Lo.

* When PGFIL_=1’b0(default), power good filter is enabled, and when PGFIL_=1’b1, disabled.

Conditions Ta=25°C, V_CC=3.3V

Design value

Items

Units

ms

Min.

Typ.

Max.

6.4

Power good filter time

4.2

5.3

Load sudden change

(ex. Resonance point)

Abnormal overload

Setting value

90%

V_P

70%

Power Good

Filter active

Filter active 5.3ms

* VP voltage recovering to 90% * VP voltage keeping less than 90% of

of setting value by 5.3ms

setting value for 5.3ms or more

Figure 18. Power good filter timing chart

PGFIL_=1’b0(default) setting

(5) Over voltage protection

When VP voltage increase +15%(typ.) more than VP setting voltage(or indicated setting voltage in soft start / soft change

time), OVP works and output of SWO turns to HiZ. OVP detect threshold voltage has hysteresis, and after OVP works

when VP terminal voltage becomes under +10%(typ.) more than VP setting voltage, SWO switching restarts OVP function

doesn’t work when in stand-by state or VPU=1’b0.

OVP release

OVP active voltage

OVP release voltage

Indicated voltage

OVP active

Setting value

OVP active

VBAT - VF

OVP release

V_P

0V

Hiz

ON

HiZ

SWO

Soft start

（VPSET=0 to setting value）

Soft change

（VPSET=setting value to 0）

Boost operation

Normal operation

STOP

Figure 19. OVP function timing chart

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●H-bridge Block

(1) H-bridge input and output truth table

INPUT

MODE

OUTPUT

OUTB

L

H

Z

L

H

L

Z

Input

method

PS*⁹

INA

L

H

L

H

L

H

X

INB

X

L

H

L

H

X

OUTA

Output mode

Short brake

Forward

Reverse

Open(default)

Forward

Reverse

Short brake

Open

L

H

L

Z

H

L

0

EN/IN

(default)

H

IN/IN

-

1

L

Z

L

X

L; Low, H; High, X; Don’t care, Z; Hi impedance

*⁹PS terminal input logic High; IC active condition, Low; IC stand-by condition

(2) Output switching speed

Condition Ta=25°C, V_CC=3.3V, V_P=20V, Load 100Ω

Unit; ns

Rise Time

Turn On Time

(T_ON

Turn Off Time

Fall Time

Dead Time

(Dead Time)

TR

)

(T_OFF

)

(T_R)

350

50

(T_F)

1’h0

1’h1

300

150

50

20

80

70

* Dead Time in generated by internal timer.

* Rise Time and Fall Time are defined by the ability of pre-driver of H-bridge.

1.45V

1.0V

T_IN

Control input

0.5V

T_ON

T_OFF

100%

0%

90%

50%

10%

Dead

Time

Dead

Time

50%

10%

Output current

-10%

-50%

-90%

-50%

-90%

-100%

T_F

T_R

T_F

T_R

Figure 20. Definition of input-output AC characteristic

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●3-wired Serial

(1) 3-wired serial communication spec

Mode

PS

SEN

SCLK

SDATA

Stand-by mode

Lo

Input disable

Data latch

Invalid

communication mode

Hi

Input disable

SDATA latch in a

rising edge

Write mode

Lo

* Input SCLK=Lo when V_CC> V_UVLO1VCCor the time between start up (PS=Lo to Hi) and 3-wired serial communication (T_EN).

T_SENS

T_CKH

T_CKL

T_CK

T_DS

T_DH

T_SENET_SH

SEN

SCLK

7BIT ADDR

7

MSB

6

5

4

3

2

1

0

7

6

5

4

3

2

1

0

SDATA

MSB

Figure 21. 3-wired serial communication

Item

Symbol

Min.

200

80

Unit

ns

SCLK period

SCLK high pulse width

SCLK low pulse width

SEN START set up time

SEN END set up time

STROBE high time

T_CK

T_CKH

T_CKL

T_SENS

T_SENE

T_SH

80

120

300

80

DATA set up time (DATA of from SCLK falling to rising)

DATA hold time (DATA of from SCLK rising to falling)

T_DS

T_DH

80

(2) Register map

ADDR W6 W5 W4 W3 W2 W1 W0

D7

D6

D5

D4

D3

D2

MODE

D1

D0

VPU

STATE STATE STATE STATE CLCAN

SET

0

1

2

0

1

0

1

0

LSET

SEL[2] SEL[1] SEL[0]

CEL

VPSET VPSET VPSET VPSET VPSET

[4]

PON NON[1] NON[0]

AMP

[3]

[2]

[1]

[0]

SSSET SSSET SSSET SSSET

[3]

TEST

TR

TEST

OVP

[2]

[1]

[0]

3

4

5

0

1

0

1

0

1

TEST

TEST PGFIL_ TEST

* All value of default value is 0. Stand-by condition (PS=Lo) or V_CC< V_UVLO1VCCcondition does reset the data as the default

And all bits are set as 0.

* TEST Bits and other than address 0 to 2 should be set as 0(default) anytime.

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(3) Serial register address use list

Address

Use

Boost start signal, Logic output signal setting, H-bridge output logic setting, STATE terminal

output cl invalidity signal, STATE terminal output internal select signal setting, STATE terminal

output set signal

0

1

2

3

4

5

Boost voltage setting, SWO switching speed setting

Soft start/Soft change setting, AMPOUT over voltage protection enable, Through rate control

setting

TEST

Power good filter enable signal

(4) Serial register bit function list

Name

Function

Name

LSET

Function

VPU

Boost function start signal

Logic output voltage setting

STATE terminal output c l invalid

signal

MODE

H-bridge output logic setting

CLCANCEL

STATESET

STATE terminal internal output

signal select

STATESEL[2:0]

STATE terminal output setting signal

VPSET[4:0]

SSSET[3:0]

Boost circuit voltage setting

Soft start / soft change setting

PON、NON[1:0]

SWO switching speed setting

Through rate control setting

TR

AMPOUT over voltage protection

enable

TEST data

AMPOVP

TEST

PGFIL_

-

Power good filter enable signal

-

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●Power Dissipation

5000

4560mW

4000

3260mW

3000

2376mW

2000

1700mW

880mW

460mW

1000

0

85°C

100

0

25

50

75

125

150

Ambient temperature : Ta [°C]

Figure 22. Package heat reduction characteristic

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●I/O Equivalence Circuits

PS

SCLK, SDATA, SEN, INA, INB

STATE

SCLK

SDATA

SEN

INA

INB

PS

STATE

SWO, PGND

ERRIN, ERROUT

VP, OUTA, OUTB, PGND

VP

SWO

ERROUT

OUTA

OUTB

ERRIN

PGND

INP, INN

AMPOUT

VCC, N.C.

VCC

N.C.

GND

INP

INN

AMPOUT

Figure 23. I/O equivalence circuit

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●Operational Notes

1) Absolute maximum ratings

Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range may

result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open mode) when

such damage is suffered. The implementation of a physical safety measure such as a fuse should be considered when

use of the IC in a special mode where the absolute maximum ratings may be exceeded is anticipated.

2) Power supply pins and lines

None of the VP line for the H-bridges is internally connected to the VCC power supply line, which is only for the control

logic or analog circuit. Therefore, the VP and VCC lines can be driven at different voltages. Although these lines can be

connected to a common power supply, do not open the power supply pin but connect it to the power supply externally.

Regenerated current may flow as a result of the motor's back electromotive force. Insert capacitors between the power

supply and ground pins to serve as a route for regenerated current. Determine the capacitance in full consideration of

all the characteristics of the electrolytic capacitor, because the electrolytic capacitor may loose some capacitance at

low temperatures. If the connected power supply does not have sufficient current absorption capacity, regenerative

current will cause the voltage on the power supply line to rise, which combined with the product and its peripheral

circuitry may exceed the absolute maximum ratings. It is recommended to implement a physical safety measure such

as the insertion of a voltage clamp diode between the power supply and ground pins.

For this IC with several power supplies and a part consists of the CMOS block, it is possible that rush current may flow

instantaneously due to the internal powering sequence and delays, and to the unstable internal logic, respectively.

Therefore, give special consideration to power coupling capacitance, width of power and ground wirings, and routing of

wiring.

3) Ground pins and lines

Ensure a minimum GND pin potential in all operating conditions. Make sure that no pins are at a voltage below the

GND at any time, regardless of whether it is a transient signal or not.

When using both small signal GND and large current PGND patterns, it is recommended to isolate the two ground

patterns, placing a single ground point at the application's reference point so that the pattern wiring resistance and

voltage variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to

change the GND wiring pattern of any external components, either.

The power supply and ground lines must be as short and thick as possible to reduce line impedance.

4) Thermal design

Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating

conditions.

5) Actions in strong magnetic field

Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to malfunction.

6) ASO

When using the IC, set the output transistor for the motor so that it does not exceed absolute maximum ratings or ASO.

7) Thermal shutdown circuit

This IC incorporates a TSD (thermal shutdown) circuit. If the temperature of the chip reaches the following temperature,

the motor coil output will be opened. The TSD circuit is designed only to shut the IC off to prevent runaway thermal

operation. It is not designed to protect the IC or guarantee its operation. Do not continue to use the IC after operating

this circuit or use the IC in an environment where the operation of this circuit is assumed.

TSD ON temperature [°C] (Typ.)

175

Hysteresis temperature [°C] (Typ.)

20

8) After releasing Under Voltage Locked Out (UVLO) or Thermal Shut Down (TSD)

When UVLO, TSD is released, it returns normal operation after 100µs (max).

9) VBAT external power supply

This IC is not equipped with terminal of VBAT, and operate even the VBAT external power supply is lower than 4V

(minimum VP operation voltage). Give consideration that if VBAT external power supply is low and VP setting voltage is

high or load is large, may cause an overcurrent flowing through SWO terminal, and may enable OCP, TSD, etc. In

addition, if the VBAT external power supply has changed during the boost operation (ex. VBAT=HiZ), because of

boosting VP to setting voltage without working soft start / soft change, may cause overcurrent flowing through SWO

terminal. If VBAT external power supply is changing, stop boost operation by setting PS=0V or VPU=1’b0, then set the

soft start function after VBAT power supply voltage is stable.

10) N.C. pin

Always keep N.C. pin open.

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11) Application example

The application circuit is recommended for use. Make sure to confirm the adequacy of the characteristics. When using

the circuit with changes to the external circuit constants, make sure to leave an adequate margin for external

components including static and transitional characteristics as well as dispersion of the IC.

Resistor

Transistor (NPN)

Pin A

Pin B

B

Pin B

C

E

Pin A

B

C

E

N

P⁺

P substrate

GND

P⁺

N

P

N

Parasitic

element

P substrate

GND GND

Parasitic

element

GND

Other adjacent

elements

Parasitic element

Figure 24. Example of Simple IC Architecture

Status of this document

The Japanese version of this document is formal specification. A customer may use this translation version only for a reference

to help reading the formal version.

If there are any differences in translation version of this document formal version takes priority

●Physical Dimension, Tape and Reel Information

VQFN028V5050

5.0 0.1

Tape

Embossed carrier tape

2500pcs

Quantity

E2

Direction

of feed

The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

1PIN MARK

(

)

S

0.08

S

2.7 0.1

7

C0.2

1

8

28

22

14

21

15

0.25

+0.05

-0.04

Direction of feed

1pin

1.0 0.5

Reel

Order quantity needs to be multiple of the minimum quantity.

(Unit : mm)

∗

●Marking Diagram

VQFN028V5050 (TOP VIEW)

Part Number Marking

LOT Number

D 6 5 4 9 9

1PIN MARK

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●Revision History

Date

Revision

001

Changes

3.Aug.2012

New Release

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Notice

Precaution on using ROHM Products

1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you

intend to use our Products in devices requiring extremely high reliability (such as medical equipment ^{(Note 1)}, transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car

accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or

serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.

Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any

damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific

Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or

extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any

special or extraordinary environments or conditions. If you intend to use our Products under any special or

extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of

product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the

ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice - GE

Rev.002

Daattaasshheeeett

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,

please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable

for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice - GE

Rev.002

Daattaasshheeeett

General Precaution

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny

ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s

representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or

liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or

concerning such information.

Notice – WE

Rev.001


型号：	BD65499MUV
厂家：	ROHM
描述：	与简易型相机相比，单反相机可满足高规格要求，因此可使用较大的执行器。该IC除适用于高耐压+大电流输出外，通过小型表面贴装型封装还适用于单反相机等小型系统。
文件：	总25页 (文件大小：746K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BD65499MUV [ROHM]

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