BD8388FV-M [ROHM]
BD8388FV-M是耐压高达40V的串行输入并行输出控制LED驱动器。根据三线串行数据，可打开/关闭8通道开漏输出。采用小型封装，非常有助于节省空间。;
| 型号： | BD8388FV-M |
| 厂家： | 
ROHM |
| 描述： | BD8388FV-M是耐压高达40V的串行输入并行输出控制LED驱动器。根据三线串行数据，可打开/关闭8通道开漏输出。采用小型封装，非常有助于节省空间。 驱动 驱动器 |
| 文件： | 总21页 (文件大小：1807K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
Serial-in Parallel-out LED Driver
8ch LED Driver IC for Automotive
with 3-line Serial Interface
BD8388FV-M
General Description
Key Specifications
Input Voltage Range:
Output Voltage Range:
DC Output Current:
Output ON Resistance:
Static Current:
The BD8388FV-M is a serial-in parallel-out controlled
LED driver with 40 V output voltage rating.
With the input of 3-line serial data, it turns the 8ch open
drain output on/off.
3.0 V to 5.5 V
40 V(Max)
50 mA(Max)
6 Ω(Typ)
Due to its compact size, it is optimal for small space.
0 μA(Typ)
Operating Temperature Range: -40 °C to +125 °C
Features
AEC-Q100 Qualified(Note 1)
Open Drain Output
Package
SSOP-B16
W(Typ) x D(Typ) x H(Max)
5.00 mm x 6.40 mm x 1.35 mm
3-line Serial Control + Enable Signal
Cascade Connection Compatible
SSOP-B16 Package
Internal 8ch Power Transistor
Output Slew Rate 20 V/μs(Typ)
(for Low EMC Noise)
(Note 1) Grade 1
Application
For Indicator of Cluster Panel
SSOP-B16
Typical Application Circuit
VCC
VBAT
VCC
D0
D1
D2
D3
D4
D5
D6
D7
OEN_B
LATCH
RST_B
CLK
Micro
Computer
SERIN
SEROUT
GND
VCC
VCC
D0
D1
D2
D3
D4
D5
D6
D7
OEN_B
LATCH
RST_B
CLK
SERIN
SEROUT
GND
VBAT: Battery
Figure 1. Typical Application Circuit
〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays
.
www.rohm.com
TSZ02201-0T2T0B100260-1-2
01.Aug.2018 Rev.001
© 2018 ROHM Co., Ltd. All rights reserved.
1/18
TSZ22111 • 14 • 001
BD8388FV-M
Pin Configuration
Pin Descriptions
Pin No.
Pin Name
Function
Power supply voltage input
Serial data input
Drain output 0
1
2
3
4
5
6
VCC
SERIN
D0
(TOP VIEW)
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
VCC
SERIN
D0
GND
CLK
D7
D1
Drain output 1
D2
Drain output 2
D3
Drain output 3
D1
D6
Reset invert input
(Low: Shift register data 0)
7
RST_B
D2
D5
Output enable
(High: Output OFF)
8
9
OEN_B
SEROUT
LATCH
D3
D4
Serial data output
RST_B
OEN_B
LATCH
SEROUT
Latch signal input
(High: Data latch)
10
11
12
13
14
15
16
D4
D5
Drain output 4
Drain output 5
Drain output 6
Drain output 7
Clock input
GND
Figure 2. Pin Configuration
D6
D7
CLK
GND
Block Diagram
VCC
D0
D1
D2
D3
D4
D5
D6
D7
SERIN
CLK
SEROUT
LATCH
RST_B
OEN_B
GND
Figure 3. Block Diagram
2/18
www.rohm.com
TSZ02201-0T2T0B100260-1-2
01.Aug.2018 Rev.001
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
BD8388FV-M
Description of Function
If there is no description, please refer as typical value.
1. Serial Communication
The serial I/F is composed of a shift register which changes the CLK and SERIN serial signals to parallel signals, and a
register to store those signals with a LATCH signal. The registers are reset by applying a voltage below VTL to the RST_B
pin, and D7 to D0 become open. To prevent erroneous LED lighting, please apply voltage below VTL to RST_B during
start-up.
CLK
8bit
8bit
Shift
Register
Driver
SERIN
LATCH
Register
Figure 4. Block Diagram of Serial Communication
(1) Serial Communication Timing
The 8bit serial data input from the SERIN pin is taken into the shift register by the rising edge of the CLK signal, and
is recorded in the register by the rising edge of the LATCH signal. The recorded data is valid until the next rising
edge of the LATCH signal.
(2) Serial Communication Data
The serial data input configuration of the SERIN pin is shown below:
First →
→ Last
d7 d6 d5 d4 d3 d2 d1 d0
Data
Data
Output
Condition
Pin
d7 d6 d5 d4 d3 d2 d1 d0
ON
OFF
ON
OFF
ON
OFF
ON
OFF
ON
OFF
ON
OFF
ON
OFF
ON
OFF
1
0
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
1
0
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
1
0
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
1
0
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
1
0
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
1
0
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
1
0
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
1
0
D7
D6
D5
D4
D3
D2
D1
D0
* Indicate don’t care.
www.rohm.com
TSZ02201-0T2T0B100260-1-2
01.Aug.2018 Rev.001
© 2018 ROHM Co., Ltd. All rights reserved.
3/18
TSZ22111 • 15 • 001
BD8388FV-M
Description of Function - continued
(3) Enable Signal
By applying voltage VTH or more to the OEN_B pin, D7 to D0 become open forcibly.
All output terminals become PWM operation by having the PWM signal to the OEN_B pin at the same time.
VTH
L
H
OEN_B
(Input)
VTL
VBAT
VOL
LED OFF
D7 to D0
(Output)
LED ON
LED ON
ON
ILED
LED OFF
OFF
Figure 5. PWM Dimming Control
(4) SEROUT
A cascade connection can be made (connecting at least 2 or more IC’s in serial). Serial signal input from SERIN is
transferred into the receiver IC by the falling edge of the CLK signal. Since this functionality gives enough margins
for the setup time prior to the rising edge of the CLK signal on the receiver IC (using the exact same CLK signal of
the sender IC), the application reliability can be improved as cascade connection functionality.
LATCH
SERIN
CLK
d7
d6
d5
d4
d3
d2
d1
d0
1
2
3
4
5
6
7
8
d7
SEROUT
Figure 6. SEROUT Output Signal
2. Cascade Connection
As an application, BD8388FV-M can turn on 9 or more LED lights. By making a cascade connection between 2 ICs, the
LED application of up to 16 lights can be constructed. In this case, connect the SEROUT pin of the sender IC and the
SERIN pin of the receiver IC. When send 16bit signal to the sender IC, the serial data is sent to the receiver IC from the
SEROUT pin of the sender IC. In addition, it is possible to construct 3 or more applications.
Receiver IC
Sender IC
LATCH
SERIN
CLK
d15 d14 d13
d10
d9
d8
d7
d6
d5
d2
d1
d0
6
1
2
3
7
8
9
10
11
14
15
16
Figure 7. Cascade Connection
www.rohm.com
TSZ02201-0T2T0B100260-1-2
01.Aug.2018 Rev.001
© 2018 ROHM Co., Ltd. All rights reserved.
4/18
TSZ22111 • 15 • 001
BD8388FV-M
Absolute Maximum Ratings (Ta=-40 °C to +125 °C)
Parameter
Symbol
VCC
Rating
Unit
V
Power Supply Voltage
-0.3 to +7
VD0, VD1,
VD2, VD3,
VD4, VD5,
VD6, VD7
Output Pin Voltage
(D0, D1, D2, D3, D4, D5, D6, D7)
-0.3 to +40
V
VSERIN
VRST_B
VCLK
VOEN_B
,
,
SERIN, RST_B, CLK, OEN_B, LATCH
Pin Voltage
,
-0.3 to +VCC
V
,
VLATCH
SEROUT Pin Voltage
VSEROUT
-0.3 to +VCC
V
Power Dissipation(Note 1)
Storage Temperature Range
DC Output Current
Pd
887
-55 to +150
50
mW
°C
Tstg
IOMAX_DC
IOMAX_PLS
Tjmax
mA
mA
°C
Pulse Output Current(Note 2)
150
Maximum Junction Temperature
150
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 1) Pd decreased at 7.5 mW/℃ for temperatures Ta=25 °C or more, mounted on 70 mm x 70 mm x 1.6 mm Glass-epoxy PCB.
(Note 2) Do not exceed Pd. Time to impress ≤ 200 ms.
Thermal Resistance(Note 3)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 5)
2s2p(Note 6)
SSOP-B16
Junction to Ambient
Junction to Top Characterization Parameter(Note 4)
θJA
140.9
6
77.2
5
°C/W
°C/W
ΨJT
(Note 3) Based on JESD51-2A(Still-Air).
(Note 4) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 5) Using a PCB board based on JESD51-3.
(Note 6) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Material
FR-4
Board Size
Single
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70 μm
Layer Number of
Measurement Board
Material
FR-4
Board Size
114.3 mm x 76.2 mm x 1.6 mmt
2 Internal Layers
4 Layers
Top
Copper Pattern
Bottom
Copper Pattern
74.2 mm x 74.2 mm
Thickness
Copper Pattern
Thickness
Thickness
Footprints and Traces
70 μm
74.2 mm x 74.2 mm
35 μm
70 μm
Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
Power Supply Voltage
Operating Temperature
VCC
Topr
3.0
-40
-
-
5.5
V
+125
°C
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0T2T0B100260-1-2
01.Aug.2018 Rev.001
5/18
BD8388FV-M
Electrical Characteristics (Unless otherwise specified VCC=3.0 V to 5.5 V, Ta=-40 °C to +125 °C)
Limit
Parameter
Output D0 to D7
Symbol
Unit
Condition
Min
Typ
Max
ON Resistance 1(Note 1)
ON Resistance 2(Note 1)
Output Leakage Current(Note 2)
Logic Input
RON1
RON2
IDL
-
-
-
6
9
-
12
18
Ω
Ω
IDn=20 mA, 4.5 V ≤ VCC ≤ 5.5 V
IDn=20 mA, 3.0 V ≤ VCC < 4.5 V
VDn=39 V
0.3
μA
VCC
x 0.7
Upper Limit Threshold Voltage
Bottom Limit Threshold Voltage
Serial Clock Frequency
Input Leakage Current L
Input Leakage Current H
WHOLE
VTH
VTL
-
-
-
V
V
VCC
x 0.2
-
-
fCLK
IINLL
IINLH
-
1.25
MHz
μA
μA
-5
-
0
0
-
VTL=0 V
VTH=5 V
5
Serial Data Input,
VCC=5.0 V, fCLK=500 kHz,
VTH=VCC, VTL=0 V,
SEROUT=OPEN
Circuit Current
ICC
-
-
0.05
0
1
mA
Static Current
ISTN
50
μA
SEROUT=OPEN
SEROUT
Output Voltage High 1(Note 3)
Output Voltage Low 1(Note 3)
Output Voltage High 2(Note 3)
Output Voltage Low 2(Note 3)
VOH1
VOL1
VOH2
VOL2
4.6
-
4.8
0.2
3.0
0.3
-
V
V
V
V
VCC=5.0 V, ISO=-4 mA
VCC=5.0 V, ISO=4 mA
VCC=3.3 V, ISO=-4 mA
VCC=3.3 V, ISO=4 mA
0.4
-
2.7
-
0.6
(Note 1) IDn: Current flowing to the output Dn pin. (n: 0 to 7)
(Note 2) VDn: Output Dn pin voltage. (n: 0 to 7)
(Note 3) ISO: Current flowing to the SEROUT pin.
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0T2T0B100260-1-2
01.Aug.2018 Rev.001
6/18
BD8388FV-M
Typical Performance Curves
Figure 8. Circuit Current vs Power Supply Voltage
Figure 9. Circuit Current vs Ambient Temperature
Figure 10. On Resistance vs
Power Supply Voltage
(@IDn (Note 1)=20 mA)
Figure 11. On Resistance vs Ambient Temperature
(@IDn(Note 1)=20 mA)
(Note 1) IDn：Current flowing to the output Dn pin. (n: 0 to 7)
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0T2T0B100260-1-2
01.Aug.2018 Rev.001
7/18
BD8388FV-M
Typical Performance Curves - continued
Figure 12. Output Voltage vs Input Current
Figure 13. Output Voltage High vs Power Supply Voltage
(@ISO (Note 3)=-4 mA)
Figure 14. Output Voltage High vs Ambient Temperature
(@ISO (Note 3)=-4 mA)
Figure 15. Output Voltage Low vs Power Supply Voltage
(@ISO (Note 3)=4 mA)
(Note 1) IDn: Current flowing to the output Dn pin. (n: 0 to 7)
(Note 2) VDn: Output Dn pin voltage. (n: 0 to 7)
(Note 3) ISO: Current flowing to the SEROUT pin.
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0T2T0B100260-1-2
01.Aug.2018 Rev.001
8/18
BD8388FV-M
Typical Performance Curves - continued
Figure 16. Output Voltage Low vs Ambient Temperature
(@ISO (Note 1)=4 mA)
(Note 1) IDn：Current flowing to the output Dn pin. (n: 0 to 7)
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0T2T0B100260-1-2
01.Aug.2018 Rev.001
9/18
BD8388FV-M
Input Signal’s Timing Chart
tCK
50 %
CLK
tCKH
tCKL
tSEST
tSEHD
50 %
SERIN
tLADZ
tSEW
tLAH
50 %
LATCH
Figure 17. Timing Chart of Input Signal
Input Signal’s Timing Rule (Ta=-40 °C to +125 °C, VCC=3.0 V to 5.5 V)
Parameter
Symbol
tCK
Min
800
380
380
780
150
150
380
200
Unit
ns
ns
ns
ns
ns
ns
ns
ns
CLK Period
CLK High Pulse Width
CLK Low Pulse Width
tCKH
tCKL
SERIN High and Low Pulse Width
SERIN Setup Time
tSEW
tSEST
tSEHD
tLAH
SERIN Hold Time
LATCH High Pulse Time
D0 to D7 Output Pin Setup Time
tLADZ
www.rohm.com
TSZ02201-0T2T0B100260-1-2
01.Aug.2018 Rev.001
© 2018 ROHM Co., Ltd. All rights reserved.
10/18
TSZ22111 • 15 • 001
BD8388FV-M
Output Signal’s Timing Chart
50 %
OEN_B
tDOENH
tDOENL
90 %
50 %
OUTPUT
10 %
(D7 to D0)
SRRISE
SRFALL
50 %
tDLAH
LATCH
50 %
OUTPUT
(D7 to D0)
CLK
50 %
tDSOH
tDSOL
50 %
SEROUT
Figure 18. Timing Chart of Output Signal
Output Signal’s Delay Time (Ta=-40 °C to +125 °C, VCC=3.0 V to 5.5 V)
Parameter
Symbol
tDOENH
tDOENL
tDLAH
Min
Typ
Max
3000
2000
3000
350
350
-
Unit
Condition
OEN_B Switching Time (Low→High)
OEN_B Switching Time (High→Low)
LATCH Switching Delay Time
-
-
-
-
-
-
-
-
-
ns
ns
-
ns
SEROUT Propagation Delay Time
tDSOH
-
ns
(Low→High)
SEROUT Propagation Delay Time
tDSOL
-
ns
(High→Low)
Ta=25 °C, VCC=5 V,
RL=500 Ω, VBAT=10 V
Output Rising Slew Rate(Note 1)
Output Falling Slew Rate(Note 1)
SRRISE
SRFALL
20
20
V/μs
V/μs
Ta=25 °C, VCC=5 V,
RL=500 Ω, VBAT=10 V
-
(Note 1) Please refer to the application circuit example on P.12 for measurement conditions. However, LED load is not used and it is shorted.
www.rohm.com
TSZ02201-0T2T0B100260-1-2
01.Aug.2018 Rev.001
© 2018 ROHM Co., Ltd. All rights reserved.
11/18
TSZ22111 • 15 • 001
BD8388FV-M
Application Example
VCC
VBAT
CVCC1
CVBAT
RL
VCC
D0
D1
D2
D3
D4
D5
D6
D7
OEN_B
LATCH
RST_B
CLK
Micro
Computer
SERIN
SEROUT
GND
VCC
RL
CVCC2
VCC
D0
D1
D2
D3
D4
D5
D6
D7
OEN_B
LATCH
RST_B
CLK
SERIN
SEROUT
GND
Figure 19. Application Example
Component Name
Component Value
Product Name
Manufacturer
murata
CVCC1
CVCC2
CVBAT
RL
0.1 μF
0.1 μF
4.7 μF
620 Ω
GCM155R11A104KA01
GCM155R11A104KA01
GCM32ER71H475KA40
ESR10EZPJ621
murata
murata
Rohm
www.rohm.com
TSZ02201-0T2T0B100260-1-2
01.Aug.2018 Rev.001
© 2018 ROHM Co., Ltd. All rights reserved.
12/18
TSZ22111 • 15 • 001
BD8388FV-M
I/O Equivalence Circuit
2. SERIN
10. LATCH
7. RST_B
15. CLK
8. OEN_B
VCC
3. D0
11. D4
4. D1
12. D5
5. D2
13. D6
6. D3
14. D7
11. SEROUT
VCC
www.rohm.com
TSZ02201-0T2T0B100260-1-2
01.Aug.2018 Rev.001
© 2018 ROHM Co., Ltd. All rights reserved.
13/18
TSZ22111 • 15 • 001
BD8388FV-M
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all
power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on
the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
6. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
7. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
8. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
9. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
www.rohm.com
TSZ02201-0T2T0B100260-1-2
© 2018 ROHM Co., Ltd. All rights reserved.
14/18
TSZ22111 • 15 • 001
01.Aug.2018 Rev.001
BD8388FV-M
Operational Notes - continued
10. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 20. Example of Monolithic IC Structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
www.rohm.com
TSZ02201-0T2T0B100260-1-2
01.Aug.2018 Rev.001
© 2018 ROHM Co., Ltd. All rights reserved.
15/18
TSZ22111 • 15 • 001
BD8388FV-M
Ordering Information
B D 8 3
8
8 F V -
ME 2
Package
Product Rank
FV: SSOP-B16
M: for Automotive
Packaging and forming specification
E2: Embossed tape and reel
(SSOP-B16)
Marking Diagram
SSOP-B16(TOP VIEW)
Part Number Marking
D8388
LOT Number
Pin 1 Mark
www.rohm.com
TSZ02201-0T2T0B100260-1-2
01.Aug.2018 Rev.001
© 2018 ROHM Co., Ltd. All rights reserved.
16/18
TSZ22111 • 15 • 001
BD8388FV-M
Physical Dimension and Packing Information
Package Name
SSOP-B16
www.rohm.com
© 2018 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
TSZ02201-0T2T0B100260-1-2
01.Aug.2018 Rev.001
17/18
BD8388FV-M
Revision History
Date
Rev.
001
Changes
01.Aug.2018
New release of specification.
www.rohm.com
TSZ02201-0T2T0B100260-1-2
01.Aug.2018 Rev.001
© 2018 ROHM Co., Ltd. All rights reserved.
18/18
TSZ22111 • 15 • 001
Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
相关型号：
BD839
Power Bipolar Transistor, 1.5A I(C), 45V V(BR)CEO, 1-Element, NPN, Silicon, TO-202, Plastic/Epoxy, 3 Pin
CDIL
BD83A04EFV-M
该IC是一款适用于LCD背光的白色LED驱动器，内置升压用的MOS和LED驱动用的4通道电流驱动器，非常适合用来驱动高亮度LED。由于LED引脚支持的最大电压为50V，因此适合驱动中型LCD显示器。可通过PWM信号进行调光，最高可设置为20,000：1@100Hz。该产品还支持模拟调光，通过与PWM调光相组合，可以支持更高亮度范围。可控制支持升压应用的DC-DC转换器，工作输入电压范围为4.5V ~ 48V。
ROHM
BD83A14EFV-M (新产品)
This IC is a white LED driver for LCD backlight. It has 4ch current drivers for LED drive, making it ideal for high brightness LED drive. LED pin maximum voltage is 50V, making it suitable for driving medium LCD panels. The dimming is controlled by the PWM signal and can be set up to 20,000: 1@100Hz. It also supports analog dimming and can accommodate even higher brightness ranges by combining with PWM dimming. DC/DC converters can be controlled for boost applications, and the input operating voltage range is 4.5V to 48.0V.
ROHM
BD83A14MUF-M (开发中)
This IC is a white LED driver for LCD backlight. It has 4ch current drivers for LED drive, making it ideal for high brightness LED drive. LED pin maximum voltage is 50V, making it suitable for driving medium LCD panels. The dimming is controlled by the PWM signal and can be set up to 20,000: 1@100Hz. It also supports analog dimming and can accommodate even higher brightness ranges by combining with PWM dimming. DC/DC converters can be controlled for boost applications, and the input operating voltage range is 4.5V to 48.0V.
ROHM
BD83A24MUF-M (开发中)
This IC is a white LED driver for LCD backlight. It has MOS for boost and 4ch current drivers for LED drive, making it ideal for high brightness LED drive. LED pin maximum voltage is 50 V, making it suitable for driving medium LCD panels. The dimming is controlled by the PWM signal and can be set up to 20,000:1@100Hz. It also supports analog dimming and can accommodate even higher brightness ranges by combining with PWM dimming. DC/DC converters can be controlled for boost applications, and the input operating voltage range is 4.5V to 48.0V.
ROHM
©2020 ICPDF网 联系我们和版权申明