BD9204F [ROHM]
Silicon Monolithic Integrated Circuit; 硅单片集成电路型号: | BD9204F |
厂家: | ROHM |
描述: | Silicon Monolithic Integrated Circuit |
文件: | 总5页 (文件大小:181K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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STRUCTURE
PRODUCT
Silicon Monolithic Integrated Circuit
White LED Driver for LCD Backlights
TYPE
BD9204F
FEATURE
・ Input voltage range 7V-15V
・ Built-in 3ch boost DCDC converter (current mode)
・ OVP, SCP, OPEN protection
・ Analog dimming, PWM dimming enable
・ Under voltage lock out (UVLO)
・ Fail pin annotate abnormal state
・ SOP28 package
○ ABSOLUTE MAXIMUM RATINGS (Ta=25℃)
PARAMETER
Symbol
Limit
Unit
Power Supply Voltage
Vccmax
Pd
20
V
mW
℃
Power Dissipation
750 *1
Operating Temperature Range
Storage Temperature Range
Topr
Tstg
-40~+85
-55~+150
℃
*1 Pd derated at 6.0 mW/℃ for temperature above Ta=25℃,
mounted on 70mm×70mm×1.6mm 1 layer(cupper area 70mm×70mm)glass-epoxy PCB.
This product is not designed for protection against radioactive rays.
○ OPERATING CONDITIONS (Ta=25℃)
PARAMETER
Power Supply Voltage
Symbol
VCC
Limit
Unit
V
7~15
REV. A
2/4
○ELECTRICAL CHARACTERISTICS(unless otherwise specified VCC=12V, Ta=25℃)
Limit
TYP.
PARAMETER
Symbol
UNIT
Conditions
MIN.
MAX.
【Total Current Consumption】
Circuit Current
ICC
IST
-
-
4.7
0
-
mA
uA
STB=H, SEL=L, PWM=L
STB=L
Standby Current
10
【VREG】
VREG Output Voltage
VREG
IREG
4.8
5.0
3.6
5.2
V
IO=0mA, CREG=1uF
VREG=5.25V
(input externally)
VREG input current
2.16
5.04
mA
STB=H, SEL=L, PWM=L
【Boost Driving Pin】
ION=-10mA
and internal power supply
Between output N
N1, N2, N3 resistance1
RONH
RONL
-
-
4.0
2.0
-
-
Ω
Ω
N1, N2, N3 resistance2
【Error-Amp block】
ILED threshold voltage
COMP1,2,3 sink current
COMP1,2,3 source current
【CT Oscillator block】
Oscillation Frequency
【SOFT START】
ION=10mA
VFB
(-2%)
1.5
100
100
(+2%)
V
VREF=1.5V
VLED=2.0V
VLED=1.0V
ICOMPSI
ICOMPSO
-
-
-
-
uA
uA
FRT
270
300
330
kHz
RT=160kΩ
SS source current
ISS
-
-
1.0
5.0
-
-
uA
V
SS END pin voltage
【OVP and SCP detection】
Over Voltage Protection voltage
OVP hysteresis
VSS
VOVP
VOVPHYS
VSCP
1.65
2.0
2.35
V
V
V
V
Sweep up
-
0.05
-
0.05
0.20
0.05
-
0.35
-
Sweep down
Sweep down
Sweep up
Short Circuit Protection voltage
SCP hysteresis
VSCPHYS
【Fail pin】
Low level voltage (normal state)
Leak current (abnormal state)
CP pin charge current
CP detect voltage
VFAIL
ILFAIL
ICP
-
-
-
-
0.2
-
0.5
V
uA
uA
V
IOFAIL=1mA
VOFAIL=4V
VCP=0V
2
-
1
VCP
2.0
-
【SEL pin】
Input Low voltage
VSELL
VSELM
VSELH
-0.3
1.6
4.2
-
-
-
0.8
3.0
-
V
V
V
CH1,CH2,CH3=enable
CH1,CH2,=enable
CH1=enable
Input Middle voltage
Input High voltage
【STB pin】
Input Low voltage
VSTBYL
VSTBYH
-0.3
2.0
-
-
0.8
-
V
V
Input High voltage
【PWM pin】
Input Low voltage
VPWML
VPWMH
-0.3
3.0
-
-
1.2
-
V
V
Input High voltage
(This product is not designed for protection against radioactive rays.)
REV. A
3/4
VIN
VCC
GND
○ BLOCK DIAGRAM
BD9204F
ADIM
VCC
N1
OCP1
STB
PDIM
FAIL
RT
PGND
SS
ILED1
GND
STB
VREF
PWM
SEL
OVP1
GND1
GND1
VIN
COMP1
STB
VREF
PDIM
SEL
N2
OCP2
ILED2
PGND
FAIL
OVP2
FAIL
GND1
VIN
VREG
COMP2
REG
COMP3
CP
N3
OCP3
ILED3
PGND
PGND
VIN
PGND
OVP3
UVLO
GND1
○PACKEGE, MARKING SPECIFICATION
SOP-28
BD9204F
Lot No.
○ PIN No. & PIN NAME
No. name
function
No.
15
name
function
1
2
3
4
5
6
VREF analog dimming signal input
FAIL abnormal state output
ILED1 CH1 current signal feedback input
16 COMP1 CH1 error amplifier output
17 COMP2 CH2 error amplifier ouput
18 COMP3 CH3 error amplifier output
SS
RT
soft start setting
oscillation frequency setting
OCP3 CH3 DCDC over current protection
19
20
SEL
power on channel select input
PGND power ground pin
UVLO
the voltage monitor input for UVLO
7
8
9
N3
OCP2 CH2 DCDC over current protection
N2 CH2 DCDC switching output
CH3 DCDC switching output
21
22
23
24
25
26
27
28
GND
PWM
OVP1
OVP2
OVP3
CP
analog ground pin
PWM dimming signal input
CH1 boost voltage monitor input
CH2 boost voltage monitor input
CH3 boost voltage monitor input
latch OFF timer setting
10 OCP1 CH1 DCDC over current protection
11
12
13
N1
CH1 DCDC switching output
ON/OFF logic input
STB
VCC Power pin
ILED3 CH3 current signal feedback input
ILED2 CH2 current signal feedback input
14 VREG internal power supply output
REV. A
4/4
○ Operation Notes
1) Absolute maximum ratings
An excess in the absolute maximum rating, such as supply voltage, temperature range of operating conditions, etc., can break down
the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over rated values will
expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses.
2) GND voltage
The potential of GND pin must be minimum potential in all condition. As an exception, the circuit design allows voltages up to -0.3 V
to be applied to the ICT pin.
3) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
4) Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error or
if pins are shorted together.
5) Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction.
6) Mutual impedance
Power supply and ground wiring should reflect consideration of the need to lower mutual impedance and minimize ripple
as much as possible (by making wiring as short and thick as possible or rejecting ripple by incorporating inductance and capacitance).
7) External components
The input DC voltage or DC current or temperature of external components such as inductor or capacitor affects its electrical character.
.
The ripple current through capacitor over regulation also affect to its reliability. External components should be chosen and made sure,
considering the margins in all operational condition.
8) Regarding input pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions
are formed at the intersection of these P layers with the N layers of other elements, creating a parasitic diode or transistor. For example,
as shown in the figures below, the relation between each potential is as follows:
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes can occur inevitable in the structure of the IC. The operation of parasitic diodes can result in mutual interference
among circuits, operational faults, or physical damage. Accordingly, methods by which parasitic diodes operate, such as applying
a voltage that is lower than the GND (P substrate) voltage to an input pin, should not be used. Although the circuit design allows voltages
up to -0.3 V to be applied to the ICT pin, voltages lower than this may cause the behavior described above. Use caution when designing
the circuit.
Transistor (NPN)
Resistor
(Pin A)
B
(Pin B)
E
C
GND
N
P+
P+
P+
P+
P
P
N
N
N
N
N
N
P substrate
P substrate
Parasitic elements
(Pin B)
Parasitic elements
(Pin A)
GND
GND
C
B
Parasitic elements
E
Other Adjacent Elements
GND
GND
Simplified structure of a Monolithic IC
Parasitic elements
REV. A
Notice
N o t e s
No copying or reproduction of this document, in part or in whole, is permitted without the
consent of ROHM Co.,Ltd.
The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter
"Products"). If you wish to use any such Product, please be sure to refer to the specifications,
which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or
implicitly, any license to use or exercise intellectual property or other rights held by ROHM and
other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the
use of such technical information.
The Products specified in this document are intended to be used with general-use electronic
equipment or devices (such as audio visual equipment, office-automation equipment, commu-
nication devices, electronic appliances and amusement devices).
The Products specified in this document are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a
Product may fail or malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard
against the possibility of physical injury, fire or any other damage caused in the event of the
failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM
shall bear no responsibility whatsoever for your use of any Product outside of the prescribed
scope or not in accordance with the instruction manual.
The Products are not designed or manufactured to be used with any equipment, device or
system which requires an extremely high level of reliability the failure or malfunction of which
may result in a direct threat to human life or create a risk of human injury (such as a medical
instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuel-
controller or other safety device). ROHM shall bear no responsibility in any way for use of any
of the Products for the above special purposes. If a Product is intended to be used for any
such special purpose, please contact a ROHM sales representative before purchasing.
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R1010
A
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