BD94121F-GE2 [ROHM]
LED Driver,;
| 型号： | BD94121F-GE2 |
| 厂家： | 
ROHM |
| 描述： | LED Driver, |
| 文件： | 总27页 (文件大小：2885K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
PFC Direct current resonance type
White LED Driver for Large LCD
BD94121F
General Description
Key Specifications
BD94121F is a current resonance type LED Driver with
frequency-controlled LED current. It can connect to PFC
directly and can use half-bridge structure reducing the
number of external components.
Operating Power Supply Voltage Range:
9.0V to 18.0V
Minimum Oscillator Frequency:
67kHz
(RRT=27kΩ,RADJ=44kΩ,VFB=3.2V)
It incorporates some protection functions against fault
conditions such as Over-Voltage Protection, LED Short
Detection (IS High Detection) and LED Open Detection
(IS Low Detection).
Operating Current:
Operating Temperature Range:
2.3mA (Typ)
-40°C to +85°C
Package
W(Typ) x D(Typ) x H(Max)
11.20mm x 7.80mm x 2.01mm
SOP18
Features
Pin pitch
1.27mm
20V High Rating Process
1 Channel Push-pull Control
Current and Voltage Feedback by Driving
Frequency
Adjustable Soft Start
Adjustable Timer Latch
Under-Voltage Detection for IC’s Power Line
Output Over-Voltage Protection
Output Error Signal from FAIL Terminal
Shift to Save Mode by STB Terminal
Burst Control by External PWM Signal
Analog Dimming by External DC Signal
Conversion Function from Pulse to DC
Applications
TV, Computer Display, LCD Backlighting.
Figure. 1 SOP18
Typical Application Circuit
< Primary Side >
VCC
GND
GND
VCC
PDIM
STB
PDIM
PVIN
ON/OFF
PWMIN
GND
PWM
ERR
FAIL
T1
PDIM
CSS CSDON
CFBVS
CFBIS
RFBVS
RFBIS
RADJ
RRT
RS
CCP
< Secondary Side >
Figure. 2 Typical Application Circuit(s)
〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays
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BD9412F
Contents
General Description....................................................................................................................................................1
Features.......................................................................................................................................................................1
Applications ................................................................................................................................................................1
Key Specifications......................................................................................................................................................1
Package .......................................................................................................................................................................1
Typical Application Circuit.........................................................................................................................................1
Absolute Maximum Ratings.......................................................................................................................................3
Recommended Operating Conditions......................................................................................................................3
External Components Recommended Range..........................................................................................................3
Pin Configuration........................................................................................................................................................3
Physical Dimension and Marking Diagram..............................................................................................................3
Electrical Characteristics...........................................................................................................................................4
Pin Description............................................................................................................................................................6
I/O Equivalent Circuits................................................................................................................................................7
Block Diagram.............................................................................................................................................................8
Typical Performance Curves .....................................................................................................................................9
Pin Function Description .........................................................................................................................................10
Detection Condition List of the Protection Functions ..........................................................................................15
Behavior List of the Protect Function ....................................................................................................................15
Application Example ................................................................................................................................................16
Timing Chart..............................................................................................................................................................17
Operational Notes.....................................................................................................................................................20
Ordering Information................................................................................................................................................22
Marking Diagrams.....................................................................................................................................................22
Physical Dimension, Tape and Reel Information...................................................................................................23
Revision History .......................................................................................................................................................24
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BD9412F
Absolute Maximum Ratings (Ta = 25°C)
Parameter
Symbol
VCC
Rating
20
Unit
V
Supply Voltage
STB, PWM2DC, N2, N1
Terminal Voltage
VSTB,VPWM2DC,VN2,VN1
20
V
RT, FB, IS, VS, PWMCMP, CP,
PWMIN, ADIM, SS, FAIL,
COMPSD Terminal Voltage
VRT,VFB,VIS,VVS,VPWMCMP,
VCP,VPWMIN,VADIM,VSS
,
5.5
V
VFAIL,VCOMPSD
Power Dissipation
Pd
Topr
Tjmax
Tstg
0.69 (Note 1)
-40 to +85
150
W
°C
°C
°C
Operating Temperature Range
Junction Temperature
Storage Temperature Range
-55 to +150
(Note 1) Derating in done 5.5 mW/°C for operating above Ta≥25°C (Mount on 1-layer 70.0mm x 70.0mm x 1.6mm board)
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Conditions (Ta= -40°C to +85°C)
Parameter
Symbol
Range
9.0 to 18.0
60 to 500
30 to 300
0.09 to 30
0 to 5
Unit
V
Power Supply Voltage
VCC
PWMIN Input Frequency Range
Oscillation Frequency
fPWMIN
fOUT
fPWM2DC
VADIM
Hz
kHz
kHz
V
PWM2DC Input Voltage Range
ADIM Input Voltage Range
ADIM Range with Linearity IS
VADIMLIN
0.5 to 2.1
V
External Components Recommended Range (Ta= -40°C to +85°C)
Parameter
RT Connection Resistance
CP Connection Capacitance
ADIM Connection Capacitance
SS Connection Capacitance
Symbol
Range
Unit
kΩ
µF
RRT
20 to 200
CCP
0.01 to 2.2 (Note 2)
0.22 to 10 (Note 2)
0.01 to 0.1 (Note 2)
CADIM
CSS
µF
µF
(Note 2) Please set connection capacitance above Min value of Recommended Range according to temperature characteristic and DC bias characteristic.
Pin Configuration
Physical Dimension and Marking Diagram
Product Name
(TOP VIEW)
(Max 11.55 (include.BURR))
BD94121F
BD94121F
Figure. 3 Pin Configuration
Lot No.
(UNIT : mm)
PKG : SOP18
Drawing No. : EX115-5001
SOP18(Unit:mm)
Figure. 4 Physical Dimension and Marking Diagram
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BD9412F
Electrical Characteristics (Unless otherwise specified Ta=25°C, VCC=12V)
Limit
Parameter
【Whole Device】
Symbol
Unit
Conditions
Min
Typ
Max
fOUT=60kHz,
VPWMCOMP=0V
VSTB=0V
Circuit Current
ICC1
ICC2
－
－
2.3
0
5.0
20
mA
µA
Circuit Current at Stand-by
【STB Block】
VSTH
VSTL
2.0
VCC
V
V
System ON
System OFF
STB Pin High Voltage
STB Pin Low Voltage
－
－
-0.3
+0.8
【VCC UVLO Block】
VCC Operation Voltage
VCC UVLO Hysteresis
VVCCUVP
7.5
8.0
8.5
V
V
⊿VVCCUVP
0.37
0.50
0.63
【OSC Block】
RT Terminal voltage
VRT
1.05
1.50
1.95
V
【PWMIN Block】
PWMIN Pin High Voltage
PWMIN Pin Low Voltage
VPWMINH
VPWMINL
1.8
-
-
5.0
V
V
-0.3
+0.8
【Soft Start Block】
Setting Current for Soft Start Timer
and COMPSD Timer
ISS
1.5
2.0
2.5
µA
V
VSSEND
VSDON
2.30
1.90
2.50
2.00
2.70
2.10
Soft Start Ended Voltage
Setting Voltage for COMPSD
Timer
V
【Feed Back Block】
VADIM=2.1V,
VPWM2DC=12V
VADIM=1.1V,
VPWM2DC=12V
VADIM=0.5V,
VPWM2DC=12V
IS Threshold Voltage 1
IS Threshold Voltage 2
IS Threshold Voltage 3
VIS1
VIS2
VIS3
0.466
0.239
0.102
0.477
0.250
0.114
0.488
0.261
0.126
V
V
V
IS Threshold Voltage 4
IS Source Current 1
IS Source Current 2
VS Source Voltage
VVS
IIS1
IIS2
IVS
1.212
－
1.250
－
1.288
0.9
V
µA
µA
µA
VPWMIN=2.5V
40
50
60
VPWMIN=0V, VIS=0.8V
－
－
0.9
IS sweep down
VADIM=0.4V
IS COMP Detection Voltage 1
IS COMP Detection Voltage 2
VISCOMP1
VISCOMP2
0.020
0.90
0.050
1.00
0.080
1.10
V
V
IS sweep up
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BD9412F
Electrical Characteristics – continued (Unless otherwise specified Ta=25°C, VCC= 12V)
Limit
Parameter
Symbol
Unit
Conditions
Min
Typ
Min
【Output Block】
1.5
4.5
3.0
9.0
6.0
18.0
6.0
N1 Output Sink Resistance
N1Output Source Resistance
N2 Output Sink Resistance
N2 Output Source Resistance
MAX DUTY
RN1SI
RN1SO
Ω
Ω
1.5
3.0
RN2SI
Ω
4.5
9.0
18.0
47.0
400
RN2SO
Ω
MAX DUTY
tOFF
43.0
100
45.0
200
%
ns
fOUT=60kHz
N1-N2,N2-N1Dead Time
Output Frequency
(minimum frequency setting)
【Timer Block】
RRT=27kΩ,RADJ=44kΩ,
VFB=3.2V
fOUTMIN
60.3
67.0
73.7
kHz
VCP
ICP
1.90
0.85
2.00
1.00
2.10
1.15
V
Setting Voltage for CP Time
Setting Current for CP Time
【ADIM Block】
µA
VADIM=2.2V,
VPWM2DC=12V
VADIM=5V,
VPWM2DC=12V
VPWM2DC=3V
ADIM Pin Inflow Current 1
IADIM1
IADIM2
-5
0
+5
37
µA
µA
ADIM Pin Inflow Current 2
19
28
IPWM2DC
4
6
-
8
µA
V
PWM2DC Pin Inflow Current
PWM2DC Pin High Voltage
VPWM2DCH
VPWM2DCL
1.8
-0.3
5.0
PWM2DC Pin Low Voltage
PWM2DC Pin Selected Voltage to
High Impedance
-
+0.8
V
VPWM2DCZ
7.5
8.0
8.5
V
PWM2DC=sweep up
【COMPSD Block】
VCOMPSD
RFAIL
3.88
-
4.00
100
4.12
200
V
COMPSD Detection Voltage
【FAIL Block】
Ω
FAIL Pin ON-Resistance
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BD9412F
Pin Description
Pin No.
Pin Name
VCC
IN/OUT
IN
Function
Rating [V]
-0.3 to +20
1
2
3
Power Supply Pin for IC (Built-In UVLO Function)
Power ON/OFF Control Pin for IC
Power OFF when STB=L and Power ON when STB=H.
STB
IN
IN
-0.3 to +20
-
GND
Ground Pin for Internal Signal in IC
Drive Frequency Setting Pin
Basic Frequency is set by the resistor between RT and
GND and Drive Frequency Modulation Range is set by
the resistor between RT and FB.
4
RT
OUT
-0.3 to +5.5
Error Amplifier Output pin for LED Current feedback and
LED Voltage feedback
5
FB
OUT
-0.3 to +5.5
6
7
IS
IN
IN
Error Amplifier Input pin for LED Current feedback
-0.3 to +5.5
-0.3 to +5.5
VS
Error Amplifier Input pin for LED Open Voltage feedback
PWM Comparator Input Pin which controls PWM
operation during brightness adjustment.
N1 and N2 output stop when PWMCMP=L, and they
output Max Duty when PWMCMP=H
8
9
PWMCMP
CP
IN
-0.3 to +5.5
-0.3 to +5.5
Timer Latch Setting Pin
In abnormal case, 1µA (Typ) will be charged to the
capacitor connected to CP, and IC becomes latch status
after output operation stops at CP>2V(Typ)
OUT
10
11
PWMIN
ADIM
IN
IN
PWM Signal Input Pin for burst brightness adjustment
DC Signal Input Pin for analog dimming
-0.3 to +5.5
-0.3 to +5.5
Soft Start timer and COMPSD timer Setting Pin
During start-up, 2µA (Typ) will be charged to connected
capacitor. At SS>2.0V(typ), COMPSD can start to
detect. At SS>2.5V (typ), CP can accept charge
operation.
12
SS
OUT
-0.3 to +5.5
Error Indication Signal Output Pin
Normal : L, Error : Open
Abnormal Over Voltage Detection Pin
When detecting abnormality, output operation stops and
IC becomes latch status after 2 clocks.
Pulse to DC converting pin
13
14
FAIL
OUT
IN
-0.3 to +5.5
-0.3 to +5.5
COMPSD
15
PWM2DC
IN
Pulse Signal is translated to flat dc level by 100kΩ
resistor in IC and the capacitor connected to ADIM.
-0.3 to +20
16
17
18
PGND
N2
IN
Power Ground for external MOSFET drive
-
OUT
OUT
Output pin for external FET drive circuit (Channel N2)
Output pin for external FET drive circuit (Channel N1)
-0.3 to +20
-0.3 to +20
N1
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BD9412F
I/O Equivalent Circuits
STB
RT
FB
REF
REF
VCC
REF
VCC
10KΩ
160KΩ
300KΩ
20Ω
STB
FB
RT
130KΩ
50KΩ
GND
GNDGND
GND
GND
GND
GND
GND
GND
GND
IS
VS
PWMCMP
REF
REF
REF
REF
REF
REF
REF
REF
VCC
PWMCMP
20Ω
100KΩ
1KΩ
VS
100kΩ
10KΩ
IS
10KΩ
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
CP
PWMIN
ADIM
2.2V
REF
VCC
REF
VCC
REF
100KΩ
350Ω
100KΩ
PWMIN
GND
CP
100KΩ
GND
ADIM
GND
GND
GND
GND
GND
GND
GND
GND
GND
SS
FAIL
COMPSD
REF
REF
REF
VCC
50Ω
350Ω
100KΩ
FAIL
COMPSD
SS
GND
GND
GND
GND
GND
GND
GND
GND
PWM2DC
N2
N1
VCC
VCC
VCC
VCC
REF
REF
400KΩ
100KΩ
N2
N1
PWM2DC
100KΩ
90KΩ
90KΩ
GND
GND
GND
GND
PGND PGND PGND
PGND PGND PGND
Figure. 5 I/O equivalent circuit
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BD9412F
Block Diagram
RT
VCC
PWMIN
VCC
UVLO
BLOCK
OSC
PWM
BLOCK
SYSTEM
BLOCK
STB
ON / OFF
BLOCK
STB
FB
CT
VCC
IS
N1
N2
Feedback
BLOCK
VS
DR
V
LOGIC
BLOCK
BLOCK
CT
PWM
BLOCK
SS
PWMCMP
ADIM
Analog
Dimming
PGND
PWM2DC
GND
PROTECT
BLOCK
COMPSD
CP
FAIL
Figure. 6 Block Diagram
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BD9412F
Typical Performance Curves
5
70
68
66
64
62
60
58
56
54
52
50
VCC=12V
RRT=100kΩ
RADJ=none
Ta=25°C
4
3
2
1
0
8
10
12
14
CC
16
18
-40 -20
0
20
40
60
80 100
Temperature : Ta [°C]
Supply Voltage : V [V]
Figure 8. Output Frequency vs Temperature
Figure 7. Operating Current vs Power Supply Voltage
1.0
0.8
0.6
0.4
0.2
0.0
50
48
46
44
42
40
Ta=25°C
VCC=12V
VCC=12V
RRT=100kΩ
VPWMCMP=OPEN
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
-40
-20
0
20
40
60
80
100
ADIMVoltage:VADIM[V]
Temperature : Ta [°C]
Figure 10. IS Voltage vs ADIM Voltage
Figure 9. MAX DUTY vs Temperature
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BD9412F
Pin Function Description
PIN.1 VCC
This is power supply pin for the IC. Normal operation range (Typ) is from 9V to 18V. Please place ceramic
capacitor bigger than 0.1µF as bypass capacitor between VCC and GND. It is for noise elimination.
PIN.2 STB
This PIN is for setting of ON/OFF. It is possible to use as reset when shutting down.
Please set the STB terminal voltage below VCC voltage. In addition, please set below 4V if the voltage is applied
earlier than VCC.
Depending on input voltage to STB pin, the status of IC might be switched (ON/OFF). Please avoid using between
the two status (0.8V to 2.0V)
PIN.3 GND
This is signal system GND for IC inside. Please make it independent from PGND as much as possible (We
recommend this because it has less influence with switching noise which comes from short circuit of PGND and
GND at connector close to GND pin.
Vin
GND_PIN
PGND
GND
Figure. 11
PIN.4 RT
Set up the charge/discharge current by frequency of IC inside.
By changing the resistance value of resistor between RT pin and GND, it is possible to set up basic drive
frequency as following formula;
Basic frequency means output N1, N2 frequency which is determined only with resistor between RT pin and GND.
6000
fOUT
[kHz]
( fOUT 200kHz)
( fOUT 200kHz)
RRT [k]
6673
fOUT
[kHz]
RRT [k] 3.336
1,000
100
10
BD94121F
Error Amp
OSC
FB
IS
VS
RT
CFBIS
CFBVS
RFBIS
RFBVS
RRT
1
10
100
1,000
RT Resistance : RRT [kΩ]
Figure. 13 RRT Resistor connection method
Figure. 12 RT Resistance vs Output Frequency
There is a discrepancy between theoretical formula and actual device. For frequency setting, please thoroughly
verify it with actual application. In addition, frequency may change upon resistor RADJ which is placed between
RT and FB pins
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BD9412F
PIN.5 FB
This is output pin for LED current feedback (IS pin) error amplifier and open LED voltage feedback (VS pin) error
amplifier. The capacitance between FB and IS (1500pF to 0.01µF) also determines start up time of LED current
necessary during phase compensation and brightness adjustment. Capacitance between FB and VS (1500pF to
0.01µF) is for phase compensation of error amplifier.
BD94121F
OSC
Error Amp
Figure. 14 RRT and RADJ Resistor connection method
FB
IS
VS
RT
CFBIS
CFBVS
RFBIS
RFBVS
RADJ
RRT
Moduration width of Output Frequency
150
125
100
75
As shown by left graph, by changing resistor RADJ
between FB and RT, it is possible to determine the
modulation width of frequency.
108.1
Modulation width of frequency determined by the
resistor between FB and RT resistor (Theoretical
formula : Example)
When RADJ=100kΩ , Δ fOUT=108.1kHz
50
25
0
10
100
1000
RADJ Resistance : RADJ [kΩ]
Figure. 15 Modulation width of Output Frequency vs RADJ Resistance
Output Frequency vs FB Voltage
200
180
160
140
120
100
80
167.8
Modulation width of frequency determined by the
resistor between FB and RT resistor (Theoretical
formula : Example)
When RADJ=100kΩ , Δ fOUT=108.1kHz
60
59.7
40
20
0.5
3.2
0
0
1
2
3
4
5
6
FB Voltage : VFB [V]
Figure. 16 Output Frequency vs FB Voltage
The basic drive frequency is determined by resistor RRT which is connected from RT pin to GND. The basic
frequency is the one at VFB=1.5V, and operation frequency range will be fixed with frequency modulation width that
is determined by RADJ under this condition. When RRT=51kΩ, fOUT=127.7kHz becomes to basic drive frequency.
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BD9412F
PIN.6 IS
This is input pin of LED current feedback (IS pin) error amplifier. Please set up as normal voltage (ADIM/4.4)V
(Typ). When IS pin voltage becomes less than (ADIM/8.8)V (Typ) or higher than 1.0V, the output will be stopped
and latched.
50uA
FB
R2
IS
_
+
12kΩ
R1
Error Amp
ADIM
Gain
1/4.4
Figure. 17 IS Block Diagram
50µA (Typ) current flows from IS pin to external resistor during OFF period of burst brightness adjustment.
Considering Min value of IS source current during burst brightness adjustment, please set that total resistance
from IS Pin to GND is from 8kΩ to 22kΩ. When R2 is 12kΩ in above diagram, please set 8kΩ < R1 + R2 < 22kΩ.
PIN.7 VS
This is input pin of Open LED voltage feedback (VS pin) error amplifier. It has to be 1.25V during LED is open.
When LED is ON, it will be 0.5V to 1.0V. When VS pin becomes over 1.25V, protection circuit will start operation,
and if it becomes more than CP timer set up time (Timer Latch), it will shut down.
Connector
8
7
6
5
FB
R1
Error Amp
_
VS
R2
R3
+
1.25 V
Figure. 18 VS Block Diagram
Please set C1, C2, R1, R2, and R3 value to input 1.25V to VS pin during LED bar’s connector disconnects.
PIN.8 PWMCMP
PWMCOMP pin voltage is fixed by DUTY of drive output N1, N2 in comparison with a saw wave of IC inside. This
pin has 100µA sink/source current capability and when external capacitor is connected between PWMCMP and
GND, IC will operate PWM at brightness start up stage. When N1 and N2 only drive at MaxDuty, please set
PWMCMP=open.
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BD9412F
PIN.9 CP
This pin sets up the time from the point of abnormal detection till shut down (Timer Latch). Having 1µA constant
current charges at external capacitor connected to CP pin, it will shut down when it becomes over 2.0V. During soft
start, there is no charge to CP external capacitor even fulfilling CP pin charge condition (timer latch). External
capacitor is set around 0.01µF to 2.2µF).
VCP CCP 2.0
TCP CCP
2.0106 CCP [sec]
ICP 1.0106
Timer Latch Time TCP
100
10
1uA
Timer latch
Shut-down
1
CCP
2.0V
0.1
0.01
Timer Start
0.001
0.001
0.01
0.1
1
10
CP Capacitance CCP[µF]
Figure. 19 CP Block Diagram
Figure. 20 Timer Latch Time vs CP Capacitance
PIN.10 PWMIN
By inputting PWM pulse signal at PWMIN pin, it is possible to adjust burst brightness. (High level: over 1.8V, Low
level: below 0.8V).
condition
LED condition
Turn On
PWMIN : 1.8V to 5.0V
PWMIN : -0.3V to 0.8V
Turn Off
PIN.11 ADIM
ADIM pin is Input and Output Pin of DC signal for analog dimming. According to ADIM Input level, each pin’s
function is changed as the followings. Pulse-DC translation Circuit is shown in Figure.20.
Needed Signal
from External
DUTY Signal
for Analog Dimming
DC Signal Output
for Analog Dimming
PWM2DCinput level
-0.3V<PWM2DC<6.5V
8.5V<PWM2DC<20V
PWM2DC function
ADIM function
Pulse Signal Input
for Analog Dimming
Mask PWM2DC’s
Function
DC Signal Output
for Analog Dimming
DC Signal Input
for Analog Dimming
The voltage that ADIM voltage multiplies by (1/4.4) becomes IS threshold voltage and it has linear characteristic.
But, ADIM voltage becomes under 0.44V(Typ), IS threshold voltage is clamped at 0.44V/0.44=0.1V(Typ). And
ADIM voltage becomes over 2.2V(Typ), IS threshold voltage is clamped at 2.2V/0.44=0.5V(Typ). When you want
to use linear characteristic range, please set ADIM voltage from 0.5V to 2.1V.
And pulse signal inputs to PWM2DC terminal and IC can average it by IC internal 100kΩ and the capacitor
connected to ADIM terminal (This means pulse to DC signal transfer circuit.). At this time, ADIM ripple level is
changed by ADIM’s capacitance, therefore please set suitable capacitance according to set specification.
IS
PWM2DC
IS High Det
1.0V
0.5V
Pulse
signal
8.0V/7.0V
2.2V
Gain=1/4.4
ADIM
RADIM
100k
0.25V
CADIM
0.1V
0.05V
IS Low Det
2.2V
ADIM
0.44V
Figure. 22 Pulse to DC transfer block diagram
Figure. 21 IS threshold voltage vs ADIM voltage
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BD9412F
PIN.12 SS
This is soft start time and SDON time set up pin. Constant current 2.0µA(Typ) is charged to external capacitor
(0.01µF to 0.1µF). When SS terminal voltage is higher than 2.0V, COMPSD can be detected. When SS terminal
voltage is less than 2.0V, latch protection circuit will not operate. When SS terminal voltage is higher than 2.5V,
soft start completes. When soft start is under operation (SS pin voltage is less than 2.5V), timer latch protection
circuit by CP charge will not operate.
2uA
Finish
SoftStart
ss
Css
2.5V
Where:
POWER
ON
CSS is the capacitance of SS pin
Start
COMPSD
2.0V
Figure. 23 SS Block Diagram
VSSEND CSS 2.5
TSSEND CSS
1.25 106 CSS [sec]
1.0106 CSS [sec]
ISS
VSDON CSS 2.0
2.0106
TSDON CSS
ISS
2.0106
PIN.13 FAIL
This is fail signal output pin of IC. At normal situation, it outputs GND Level and it becomes Open after timer latch
in case any abnormality is detected. The pull up voltage during Open must be set less than rated voltage 5.5V of
FAIL pin. Please connect about 0.1uF capacitor for noise reduction to FAIL pin.
Condition
FAILOutput
GND Level
Open
Normal operation
Abnormal operation
FAIL
Figure. 24 FAIL Block Diagram
PIN.14 COMPSD
This is input pin for over voltage protection circuit comparator. The detection voltage of comparator is
4.0V(Typ),and will start to count 2CLK over voltage detection. After 2CLK count, it will shut down by timer latch.
PIN.15 PWM2DC
Pulse signal inputs to PWM2DC terminal and IC can average it by IC internal 100kΩ and the capacitor connected
to ADIM terminal (This means pulse to DC signal transfer circuit.). When the voltage that is higher than 8V(Typ)
forces to PWM2DC terminal, buffer output in the IC becomes high impedance, and IC function shifts to direct DC
input mode to ADIM. (Refer to the diagram of PIN11 ADIM.)
PIN.16 PGND
This is Power GND pin for output pin N1, N2 at driver part. Please make it independent from GND (Pin 3) pin on
inverter PCB. This pin is not connected to GND pin in IC inside.
PIN.17 N2
This is gate drive output pin for Low Side external Nch FET. Normally please connect it to FET gate through about
10Ω resistor. It is for noise reduction. Gate has to be pull-down to source by resistor of 1kΩ to 10kΩ.
PIN.18 N1
This is gate drive output pin for Low Side external Nch FET. Normally please connect it to FET gate through about
10Ω resistor. It is for noise reduction. Gate has to be pull-down to source by resistor of 1kΩ to 10kΩ.
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BD9412F
Detection Condition List of the Protection Functions (Typ Condition)
Detect Condition
Detection Condition
(ADIM<0.44V)
IS < 0.05V
Protect
Function
Detection
Pin
Timer
Operation
Protection
Type
Release Condition
SS
(ADIM<0.44V)
IS > 0.05V
(0.44V<ADIM<2.2V)
IS < ADIM/8.8
(ADIM>2.2V)
(0.44V<ADIM<2.2V)
IS > ADIM/8.8
(ADIM>2.2V)
IS > 0.25V
LED OPEN
IS
SS>2.0V
2CLK
Latch off
IS < 0.25V
LED SHORT
OVP
IS
IS > 1.0V
SS>2.0V
SS>2.5V
IS < 1.0V
2CLK
CP
Latch off
Latch off
VS
VS > 1.25V
VS < 1.25V
Restart by
release
VCC UVLO
COMPSD
VCC
VCC < 7.5V
-
VCC > 8.0V
-
COMPSD
COMPSD > 4.0V
SS>2.0V
COMPSD < 3.8V
2CLK
Latch off
To reset the latch type protection, please set STB logic to ‘L’ once. Otherwise the detection of VCCUVLO is required. The count number in the list is calculated
with double of output frequency.
Behavior List of the Protect Function
Operation of the Protect Function
Protect Function
N1,N2 Output
Stop after latch
Stop after latch
Stop after latch
Stop immediately
Stop after latch
SS pin
FAIL pin
LED OPEN
LED SHORT
OVP
Low after latch
Low after latch
Low after latch
Low Immediately
Low after latch
High after latch
High after latch
High after latch
High Immediately
High after latch
VCC UVLO
COMPSD
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BD9412F
Application Example
Introduce an application example with BD94121F
Figure. 25 Application Example
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BD9412F
Timing Chart
When it Detects Quick Detection Type Error
2.0V
STB
2.5V
2.0V
2.5V
2.0V
2.5V
2.0V
SS
FB
1.0V
2
ADIM/4.4
1
ADIM/4.4
IS
ADIM/8.8
1.25V
4.0V
1.25V
VS
3
COMPSD
2.0V
CP
FAIL
Figure. 26 Timing Chart 1
[The explanation of quick abnormal detection]
Due to the timing of ① to ③ in the above chart, the IC detects malfunction and starts the output-mute latch without CP
Charge . For ① to ③, the malfunction is detected according to the conditions in the table shown below.
No.
①
②
Content of Abnormal Detection
Abnormal LED current detection
Abnormal LED short detection
Condition of Abnormal Detection
IS<(ADIM/8.8)V
IS>1.0V
③
COMPSD Over Voltage detection
COMPSD≥ 4.0V
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BD9412F
When it Detects Timer Latch Type Error
2.0V
STB
2.5V
2.0V
2.5V
2.0V
SS
FB
3.2V
1.0V
ADIM/4.4
IS
ADIM/8.8
4
1.25V
1.25V
VS
COMPSD
1.80V
2.0V
CP
FAIL
Figure. 27 Timing Chart 2
[The explanation of Time latch type error detection]
Due to the timing of ④ in the above chart, the IC detects abnormal and starts the timer latch charging. For ④, the
abnormal is detected according to the conditions in the table shown below.
No.
Content of Abnormal Detection
Abnormal LED voltage detection
Condition of Abnormal Detection
VS≥ 1.25V
④
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BD9412F
Output Timing Chart
BD94121F outputs the signal that operates the Push-Pull or Half-Bridge which is made up of Nch FET. The output
timing of drive signal is shown in the following chart
SYNC
_ OUT
CT _
’
(can t see it)
PWMIN
FB
FB=0.5V
FB=0.5V
Internal CT
PWMCOMP
’
(can t see it)
CT
N1
VCC
N2
VCC
Figure. 28 Output Timing Chart
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BD9412F
Operational Notes
1.
2.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3.
4.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6.
7.
Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
8.
9.
Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
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BD9412F
Operational Notes – continued
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure xx. Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
15. Over Current Protection Circuit (OCP)
This IC incorporates an integrated over current protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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BD9412F
Ordering Information
B D 9
4
1
2
1
F
-
E 2
Part Number
Package
F:SOP18
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagrams
SOP18(TOP VIEW)
Part Number Marking
LOT Number
B D 9 4 1 2 1 F
1PIN MARK
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BD9412F
Physical Dimension, Tape and Reel Information
Package Name
SOP18
(Max 11.55 (include.BURR))
(UNIT : mm)
PKG : SOP18
Drawing No. : EX115-5001
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BD9412F
Revision History
Revision No.
Date
Page
Changes
001
22.Feb.2016
All
New Release
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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
Rev.003
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Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E
Rev.003
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Daattaasshheeeett
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
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