BD9A201FP4-LBZ [ROHM]
本产品面向工业设备市场、可保证长期稳定供货。是适合这些用途的产品。BD9A201FP4-LBZ是内置低导通电阻的功率MOSFET的同步整流降压DC/DC转换器。采用电流模式控制方式，容易进行相位补偿设定，负载响应性能良好。具有电源良好输出功能，可进行系统的时序控制。;
| 型号： | BD9A201FP4-LBZ |
| 厂家： | 
ROHM |
| 描述： | 本产品面向工业设备市场、可保证长期稳定供货。是适合这些用途的产品。BD9A201FP4-LBZ是内置低导通电阻的功率MOSFET的同步整流降压DC/DC转换器。采用电流模式控制方式，容易进行相位补偿设定，负载响应性能良好。具有电源良好输出功能，可进行系统的时序控制。 转换器 |
| 文件： | 总34页 (文件大小：1396K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
2.7 V to 5.5 V Input, 2 A Integrated MOSFET
Single Synchronous Buck DC/DC Converter
BD9A201FP4-LBZ
General Description
Key Specifications
This is the product guarantees long time support in
Industrial market.
BD9A201FP4-LBZ is
Input Voltage Range:
Output Voltage Range:
Output Current:
2.7 V to 5.5 V
0.8 V to VIN x 0.7 V
2 A (Max)
a
synchronous buck DC/DC
converter with built-in low on-resistance power MOSFETs.
It is a current mode control DC/DC converter and features
high-speed transient response. Phase compensation can
also be set easily. Power Good function makes it possible
for system to control sequence.
Switching Frequency:
High-side FET ON Resistance:
Low-side FET ON Resistance:
Shutdown Current:
1000 kHz (Typ)
50 mΩ (Typ)
50 mΩ (Typ)
0 μA (Typ)
Package
W (Typ) x D (Typ) x H (Max)
2.8 mm x 2.92 mm x 0.95 mm
Features
TSOT23-8L
Long Time Support Product for Industrial Applications
Single Synchronous Buck DC/DC Converter
Constant PWM Mode Control
Power Good Function
Over Voltage Protection (OVP)
Over Current Protection (OCP)
Short Circuit Protection (SCP)
Thermal Shutdown Protection (TSD)
Under Voltage Lockout Protection (UVLO)
TSOT23-8L Package
TSOT23-8L
Applications
Industrial Equipment
Products for Industrial Equipment such as NC Machine
Tools
Secondary Power Supply and Adapter Equipment
Communication Infrastructure Equipment
Typical Application Circuit
BD9A201FP4-LBZ
VEN
VIN
EN
PGD
VIN
BST
SW
0.1 μF
CIN
VOUT
GND
ITH
L
R1
R2
COUT
FB
RCOMP
CCOMP
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays.
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Pin Configuration
(TOP VIEW)
EN
VIN
1
2
3
4
8
7
6
5
BST
SW
GND
FB
PGD
ITH
Pin Descriptions
Pin No. Pin Name
Function
Enable pin. The device starts up with setting VEN to 2.0 V (Min) or more. The device enters the
shutdown mode with setting VEN to 0.8 V (Max) or less.
1
2
3
4
5
6
7
8
EN
VIN
GND
FB
Power supply pin. Connecting 0.1 µF (Typ) and 10 µF (Typ) ceramic capacitors is recommended.
The detail of a selection is described in Selection of Components Externally Connected 1. Input
Capacitor.
Ground pin.
Output voltage feedback pin. See Selection of Components Externally Connected 3. Output
Voltage Setting for the output voltage setting.
Output pin of the Error Amplifier and input of the Current Comparator. See Selection of
Components Externally Connected 4. Phase Compensation Components for the phase
compensation setting.
ITH
Power good pin. This pin is an open drain output that requires a pull-up resistor. See Function
Explanations (3) Power Good for setting the resistance. If not used, this pin can be left floating or
connected to the ground.
PGD
SW
Switch pin. This pin is connected to the source of the High-side FET and the drain of the Low-
side FET. Connect a bootstrap capacitor of 0.1 µF between this pin and the BST pin. In addition,
connect an inductor considering the direct current superimposition characteristic.
Pin for bootstrap. Connect a bootstrap capacitor of 0.1 µF between this pin and the SW pin. The
voltage of this pin is the gate drive voltage of the High-side FET.
BST
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Block Diagram
PGD 6
2 VIN
8 BST
7 SW
3 GND
Power
Good
Current
Comparator
VREF
EN
FB
1
4
Error
Amplifier
R
S
Q
SLOPE
Driver
Logic
CLK
OSC
Soft
Start
VIN
UVLO
SCP
OVP
TSD
VIN
ITH 5
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Description of Blocks
1. VREF
This block generates the internal reference voltage.
2. UVLO
The UVLO block is for under voltage lockout protection. The device is shutdown when input voltage (VIN) falls to 2.45 V
(Typ) or less. The threshold voltage has the 100 mV (Typ) hysteresis.
3. SCP
This block is for short circuit protection. After soft start is completed, if the FB voltage of output falls to 0.4 V (Typ) or less
and remain in that state for 1 ms (Typ), the device is shutdown for 16 ms (Typ) and re-operates.
4. OVP
This block is for output over voltage protection. When the FB voltage VFB exceeds VFBTH x 110 % (Typ) or more, the output
MOSFETs are off to prevent the increase in the output voltage. After the VFB falls VFBTH x 107 % (Typ) or less, the device is
returned to normal operation condition. Switching operation restarts after VFB or less VFBTH (Typ).
5. TSD
The TSD block is for thermal protection. The device is shutdown when the junction temperature Tj reaches to 175 °C
(Typ) or more. The device is automatically restored to normal operation with a hysteresis of 25 °C (Typ) when the Tj goes
down.
6. Soft Start
The Soft Start circuit slows down the rise of output voltage during start-up and controls the current, which allows the
prevention of output voltage overshoot and inrush current. The internal soft start time is 1 ms (Typ).
7. Error Amplifier
The block is an error amplifier and its inputs are the internal reference voltage and the FB voltage. Phase compensation
can be set by connecting a resistor and a capacitor to the ITH pin.
8. Current Comparator
The Current Comparator block compares the output voltage of the Error Amplifier and the Slope signal to determine the
switching duty.
9. Driver Logic
This block controls switching operation and various protection functions.
10.OSC
This block generates the oscillating frequency.
11.Power Good
This block is for power good function. When the output voltage reaches within ±7 % (Typ) of the setting voltage, the built-
in open drain Nch MOSFET connected to the PGD pin is turned off and the PGD pin becomes Hi-Z (High impedance).
When the output voltage reaches outside ±10 % (Typ) of the setting voltage, the open drain Nch MOSFET is turned on.
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Absolute Maximum Ratings (Ta = 25 °C)
Parameter
Symbol
Rating
Unit
Input Voltage
VIN
VSW
-0.3 to +7
-0.3 to VIN + 0.3
-3 to VIN + 0.3
-0.3 to +14
-0.3 to +7
V
V
SW Voltage
SW Voltage (10 ns pulse width)
Voltage from GND to BST
Voltage from SW to BST
FB Voltage
VSWAC
VBST
V
V
ΔVBST-SW
VFB
V
-0.3 to +7
V
ITH Voltage
VITH
-0.3 to +7
V
EN Voltage
VEN
-0.3 to VIN
-0.3 to +7
V
PGD Voltage
VPGD
Tjmax
Tstg
V
Maximum Junction Temperature
Storage Temperature Range
150
°C
°C
-55 to +150
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing
board size and copper area so as not to exceed the maximum junction temperature rating.
Thermal Resistance (Note 1)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 3)
2s2p(Note 4)
TSOT23-8L
Junction to Ambient
Junction to Top Characterization Parameter (Note 2)
θJA
185.4
31.0
85.4
26.0
°C/W
°C/W
ΨJT
(Note 1) Based on JESD51-2A (Still-Air).
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface
of the component package.
(Note 3) Using a PCB board based on JESD51-3.
(Note 4) Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
Material
FR-4
Board Size
Single
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
70 μm
Footprints and Traces
Thermal Via (Note 5)
Layer Number of
Measurement Board
Material
FR-4
Board Size
114.3 mm x 76.2 mm x 1.6 mmt
2 Internal Layers
Pitch
Diameter
4 Layers
1.20 mm
Φ0.30 mm
Top
Copper Pattern
Bottom
Thickness
70 μm
Copper Pattern
Thickness
35 μm
Copper Pattern
Thickness
70 μm
Footprints and Traces
74.2 mm x 74.2 mm
74.2 mm x 74.2 mm
(Note 5) This thermal via connects with the copper pattern of all layers.
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Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
Input Voltage
VIN
Topr
IOUT
VOUT
2.7
-40
0
-
-
-
-
5.5
+85
V
°C
A
Operating Temperature (Note 1)
Output Current (Note 1)
Output Voltage Setting (Note 2)
2
0.8
VIN x 0.7
V
(Note 1) Tj must be 125 °C or less under the actual operating environment. Life time is derated at junction temperature greater or than 125 °C.
(Note 2) Use under the condition of VOUT ≥ VIN × 0.1 [V].
Electrical Characteristics (Unless otherwise specified Ta = 25 °C, VIN = 5 V, VEN = 5 V)
Parameter
Input Supply
Symbol
Min
Typ
Max
Unit
Conditions
Shutdown Current
ISTBY
IOPR
VUVLO1
VUVLO2
-
-
0
10
μA
µA
VEN = 0 V
IOUT = 0 A
No switching
Operating Circuit Current
350
500
UVLO Detection Threshold Voltage
UVLO Release Threshold Voltage
Enable
2.350
2.425
2.450
2.550
2.550
2.700
V
V
VIN falling
VIN rising
EN Threshold Voltage High
EN Threshold Voltage Low
EN Input Current
VENH
VENL
IEN
2.0
GND
-
-
-
VIN
0.8
10
V
V
5
µA
Power Good
VFBTH
x 0.87
VFBTH
x 0.90
VFBTH
x 1.07
VFBTH
x 1.04
VFBTH
x 0.90
VFBTH
x 0.93
VFBTH
x 1.10
VFBTH
x 1.07
VFBTH
x 0.93
VFBTH
x 0.96
VFBTH
x 1.13
VFBTH
x 1.10
VFB Falling
VFB Rising
VFB Rising
Falling (Fault) Voltage
Rising (Good) Voltage
Rising (Fault) Voltage
Falling (Good) Voltage
VPGDFF
VPGDRG
VPGDRF
VPGDFG
V
V
V
V
VFB Falling
VPGD = 5 V
PGD Output Leakage Current
PGD FET ON Resistance
PGD Low Level Voltage
ILKPGD
RPGD
-
-
-
0
5
µA
Ω
100
0.1
200
0.2
PGDVL
V
IPGD = 1 mA
Reference Voltage, Error Amplifier, Soft Start
FB Threshold Voltage
FB Input Current
VFBTH
IFB
0.792
0.800
0.808
V
-
-
1
µA
µA
VFB = 0.8 V
VFB = 0.7 V
VFB = 0.9 V
10
20
40
ITH Source Current
ITH Sink Current
IITHSO
IITHSI
tSS
µA
ms
10
20
40
Soft Start Time
0.5
1.0
2.0
SW (MOSFET)
Switching Frequency
Max Duty
fOSC
DMAX
RONH
RONL
800
1000
-
1200
-
kHz
%
70
-
High-side FET ON Resistance
Low-side FET ON Resistance
Protection
50
50
100
100
mΩ
mΩ
ΔVBST-SW = 5 V
-
Short Circuit Protection Detection
VSCP
0.28
0.40
0.52
V
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Typical Performance Curves
450
400
350
300
250
200
150
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
V
V
IN
= 2.7 V
V
= 5.0 V
IN
= 2.7 V
= 5.0 V
IN
V
IN
-40
-20
0
20
40
60
80
-40
-20
0
20
40
60
80
Temperature : Ta [°C]
Temperature : Ta [°C]
Figure 1. Shutdown Current vs Temperature
Figure 2. Operating Circuit Current vs Temperature
1200
0.810
V
IN
V
IN
= 2.7 V
= 2.7 V
1150
1100
1050
1000
950
V
IN
V
IN = 5.0 V
= 5.0 V
0.805
0.800
0.795
0.790
900
850
800
-40
-20
0
20
40
60
80
-40
-20
0
20
40
60
80
Temperature : Ta [°C]
Temperature : Ta [°C]
Figure 3. Switching Frequency vs Temperature
Figure 4. FB Threshold Voltage vs Temperature
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Typical Performance Curves – continued
35
35
30
25
20
15
10
5
V
V
IN
= 2.7 V
= 2.7 V
V
= 5.0 V
IN
IN
30
25
20
15
10
5
V
IN = 5.0 V
0
0
-40
-20
0
20
40
60
80
-40
-20
0
20
40
60
80
Temperature : Ta [°C]
Temperature : Ta [°C]
Figure 5. ITH Sink Current vs Temperature
Figure 6. ITH Source Current vs Temperature
140
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
VIN
= 2.7 V
V
= 2.7 V
= 5.0 V
IN
120
100
80
60
40
20
0
V
IN = 3.3 V
V
IN
VIN
= 5.0 V
-40
-20
0
20
40
60
80
-40
-20
0
20
40
60
80
Temperature : Ta [°C]
Temperature : Ta [°C]
Figure 7. Soft Start Time vs Temperature
Figure 8. High-side FET ON Resistance vs Temperature
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Typical Performance Curves – continued
140
2.700
2.650
2.600
2.550
2.500
2.450
2.400
2.350
2.300
VIN
= 2.7 V
120
100
80
60
40
20
0
V
IN = 3.3 V
VIN = 5.0 V
UVLO Release (VIN rising)
UVLO Detection (VIN falling)
-40
-20
0
20
40
60
80
-40
-20
0
20
40
60
80
Temperature : Ta [°C]
Temperature : Ta [°C]
Figure 9. Low-side FET ON Resistance vs Temperature
Figure 10. UVLO Threshold Voltage vs Temperature
10
2.0
V
IN = 5 V
VIN = VEN = 5 V
9
8
7
6
5
4
3
2
1
0
1.8
1.6
1.4
1.2
1.0
0.8
VENH (High Level)
VENL (Low Level)
-40
-20
0
20
40
60
80
-40
-20
0
20
40
60
80
Temperature : Ta [°C]
Temperature : Ta [°C]
Figure 11. EN Threshold Voltage vs Temperature
Figure 12. EN Input Current vs Temperature
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Typical Performance Curves – continued
Time: 1 ms/div
VIN: 5 V/div
Time: 1 ms/div
VIN: 5 V/div
VEN: 5 V/div
VEN: 5 V/div
VOUT: 1 V/div
VSW: 5 V/div
VOUT: 1 V/div
VSW: 5 V/div
Figure 13. Start-up at RLOAD = 0.9 Ω
(VEN = VIN, VIN = 5 V, VOUT = 1.8 V)
Figure 14. Shutdown at RLOAD = 0.9 Ω
(VEN = VIN, VIN = 5 V, VOUT = 1.8 V)
Time: 1 ms/div
Time: 1 ms/div
VIN: 5 V/div
VIN: 5 V/div
VEN: 5 V/div
VEN: 5 V/div
VOUT: 1 V/div
VSW: 5 V/div
VOUT: 1 V/div
VSW: 5 V/div
Figure 15. Start-up at RLOAD = 0.9 Ω
(VEN = 0 V to 5 V, VIN = 5 V, VOUT = 1.8 V)
Figure 16. Shutdown at RLOAD = 0.9 Ω
(VEN = 5 V to 0 V, VIN = 5 V, VOUT = 1.8 V)
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Typical Performance Curves – continued
Time: 1 μs/div
Time: 1 μs/div
VOUT: 20 mV/div
VSW: 2 V/div
VOUT: 20 mV/div
VSW: 2 V/div
Figure 17. Output Voltage Ripple
(VIN = 5 V, VOUT = 1.8 V, IOUT = 0 A)
Figure 18. Output Voltage Ripple
(VIN = 5 V, VOUT = 1.8 V, IOUT = 2 A)
Time: 1 μs/div
Time: 1 μs/div
VIN: 100 mV/div
VIN: 100 mV/div
VSW: 2 V/div
VSW: 2 V/div
Figure 19. Input Voltage Ripple
(VIN = 5 V, VOUT = 1.8 V, IOUT = 0 A)
Figure 20. Input Voltage Ripple
(VIN = 5 V, VOUT = 1.8 V, IOUT = 2 A)
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Function Explanations
1. Basic Operation
(1) Enable Control
The startup and shutdown can be controlled by the EN voltage VEN. When VEN becomes 2.0 V (Min) or more, the
internal circuit is activated and the device starts up. When VEN becomes 0.8 V (Max) or less, the device is shutdown.
In this shutdown mode, the High-side FET and the Low-side FET are turned off. The start-up with VEN must be at the
same time of the input voltage VIN (VIN = VEN) or after supplying VIN.
VIN
0 V
VEN
VENH
VENL
0 V
VOUT
0 V
Start-up
Shutdown
Figure 21. Start-up and Shutdown with Enable Control Timing Chart
(2) Soft Start
When VEN goes high, soft start function operates and output voltage gradually rises. This soft start function can prevent
overshoot of the output voltage and excessive inrush current. The soft start time tSS is 1 ms (Typ).
(3) Power Good
When the output voltage reaches within ±7 % (Typ) of the setting voltage, the built-in open drain Nch MOSFET
connected to the PGD pin is turned off and the PGD pin becomes Hi-Z (High impedance). When the output voltage
reaches outside ±10 % (Typ) of the setting voltage, the open drain Nch MOSFET is turned on. It is recommended to
connect a pull-up resistor of 10 kΩ to 100 kΩ.
+10 % (Typ)
+7 % (Typ)
VOUT
-7 % (Typ)
-10 % (Typ)
VPGD
0 V
Figure 22. Power Good Timing Chart
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Function Explanations – continued
2. Protection
The protection circuits are intended for prevention of damage caused by unexpected accidents. Do not use the
continuous protection.
(1) Short Circuit Protection (SCP)
The Short Circuit Protection block compares the FB voltage VFB with the internal reference voltage. When the VFB has
fallen to 0.4 V (Typ) or less and remained there for 1 ms (Typ), SCP stops the operation for 16 ms (Typ) and
subsequently initiates a restart. SCP does not operate during the soft start even if the device is in the SCP condition.
Do not to exceed maximum junction temperature rating (Tjmax = 150 °C) during OCP and SCP operation.
Table 1. The Operating Condition of SCP
VEN
VFB
Start-up
SCP
≤ 0.4 V (Typ)
> 0.4 V (Typ)
≤ 0.4 V (Typ)
> 0.4 V (Typ)
-
Disable
Disable
Enable
Disable
Disable
During Soft Start
≥ 2.0 V (Min)
Complete Soft Start
Shutdown
≤ 0.8 V (Max)
(2) Over Current Protection (OCP)
The Over Current Protection function operates by limiting the current that flows through High-side FET at each cycle
of the switching frequency. Over current limit is 6.0 A (Typ).
VOUT
SCP delay time
1 ms (Typ)
SCP delay time
1 ms (Typ)
0.8 V
SCP threshold voltage:
VFB
0.4 V (Typ)
SCP release
High-side
FET gate
Low
Low
Low-side
FET gate
OCP
threshold
6.0 A (Typ)
Inductor Current
(Output Current)
Build-in
IC HICCUP
Delay Signal
16 ms (Typ)
SCP reset
Figure 23. OCP and SCP Timing Chart
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2. Protection – continued
(3) Under Voltage Lockout Protection (UVLO)
When input voltage VIN falls to 2.45 V (Typ) or less, the device is shutdown. When VIN becomes 2.55 V (Typ) or more,
the device starts up. The hysteresis is 100 mV (Typ).
VIN
(= VEN
)
Hysteresis
VUVLOHYS = 100 mV (Typ)
VOUT
UVLO Release
VUVLO2 = 2.55 V (Typ)
UVLO Detection
VUVLO1 = 2.45 V (Typ)
0 V
VOUT
0 V
tSS
Figure 24. UVLO Timing Chart
(4) Thermal Shutdown Protection (TSD)
Thermal shutdown circuit prevents heat damage to the IC. The device should always operate within the IC’s maximum
junction temperature rating (Tjmax = 150 °C). However, if it continues exceeding the rating and the junction temperature
Tj rises to 175 °C (Typ), the TSD circuit is activated and it turns the output MOSFETs off. When the Tj falls below the
TSD threshold, the circuits are automatically restored to normal operation. The TSD threshold has a hysteresis of 25 °C
(Typ). Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings. Therefore, under
no circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
(5) Over Voltage Protection (OVP)
When the FB voltage VFB exceeds VFBTH x 110 % (Typ) or more, the output MOSFETs are off to prevent the increase
in the output voltage. After the VFB falls VFBTH x 107 % (Typ) or less, the output MOSFETs are returned to normal
operation condition.
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Application Examples
1. VIN = 5 V, VOUT = 1.8 V
Table 2. Specification of Application
Parameter
Symbol
Specification Value
5 V (Typ)
1.8 V (Typ)
2 A
Input Voltage
VIN
VOUT
IOUTMAX
Ta
Output Voltage
Maximum Output Current
Temperature
25 °C
BD9A201FP4-LBZ
VIN
VIN
BST
CBOOT
CIN2
CIN1
VOUT
SW
GND
L
R0
VEN
EN
R1A
R1B
R2
COUT1
COUT2
ITH
CFB
RCOMP
FB
PGD
CCOMP
Figure 25. Application Circuit
Table 3. Recommended Component Values
Part No.
Value
1.5 μH
Part Name
Size Code (mm)
Manufacturer
Murata
Murata
Murata
Murata
Murata
-
L
FDSD0420-H-1R5M
4040
1005
2012
1005
2012
-
(Note 1)
CIN1
0.1 μF (50 V, X5R, ±15 %) GRM155R61H104KE14
22 μF (10 V, X5R, ±20 %) GRM21BR61A226ME51
0.1 μF (50 V, X5R, ±15 %) GRM155R61H104KE14
(Note 2)
CIN2
(Note 3)
CBOOT
(Note 4)
COUT1
47 μF (10 V, X5R, ±20 %)
GRM21BR61A476ME15
COUT2
CFB
-
-
-
-
GRM1555C1H272JE01
MCR01MZPF9101
-
-
-
CCOMP
RCOMP
R1A
2.7 nF (50 V, C0G, ±5 %)
9.1 kΩ (1 %, 1/16 W)
Short
1005
1005
-
Murata
ROHM
-
R1B
30 kΩ (1 %, 1/16 W)
24 kΩ (1 %, 1/16 W)
Short
MCR01MZPF3002
MCR01MZPF2402
-
1005
1005
-
ROHM
ROHM
-
R2
(Note 5)
R0
(Note 1) In order to reduce the influence of high frequency noise, connect a 0.1 μF ceramic capacitor CIN1 as close as possible to the VIN pin and the GND
pin.
(Note 2) For the input capacitor CIN2, take temperature characteristics, DC bias characteristics, etc. into consideration to set to the actual capacitance of no
less than 3 μF.
(Note 3) For the bootstrap capacitor CBOOT, take temperature characteristics, DC bias characteristics, etc. into consideration to set to the actual capacitance
of no less than 0.022 μF.
(Note 4) In case of changing the actual capacitance value due to temperature characteristics, DC bias characteristics, etc. of the output capacitor COUT1 and
COUT2, the loop response characteristics may change. Confirm with the actual application.
(Note 5) R0 is an option, used for feedback’s frequency response measurement. By inserting a resistor at R0, it is possible to measure the frequency response
(phase margin) using a FRA. However, the resistor is not used in actual application, use this resistor pattern in short-circuit mode.
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1. VIN = 5 V, VOUT = 1.8 V – continued
Time: 1 µs/div
100
90
80
70
60
50
40
30
20
10
0
VOUT: 20 mV/div
VSW: 2 V/div
0.001
0.01
0.1
1
10
Output Current : IOUT [A]
Figure 26. Efficiency vs Output Current
Figure 27. Output Ripple Voltage (IOUT = 2 A)
Time: 1 ms/div
180
135
90
80
60
40
20
0
Gain
Phase
VOUT: 100 mV/div
45
IOUT: 1 A/div
0
-45
-90
-20
-40
1
10
100
1000
Frequency [kHz]
Figure 28. Frequency Characteristics (IOUT = 1 A)
Figure 29. Load Transient Response
(IOUT = 0.5 A to 2.0 A)
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Application Examples – continued
2. VIN = 5 V, VOUT = 1.5 V
Table 4. Specification of Application
Parameter
Input Voltage
Symbol
Specification Value
5 V (Typ)
1.5 V (Typ)
2 A
VIN
VOUT
IOUTMAX
Ta
Output Voltage
Maximum Output Current
Temperature
25 °C
BD9A201FP4-LBZ
VIN
VIN
BST
CBOOT
CIN2
CIN1
VOUT
SW
GND
L
R0
VEN
EN
R1A
R1B
R2
COUT1
COUT2
ITH
CFB
RCOMP
FB
PGD
CCOMP
Figure 30. Application Circuit
Table 5. Recommended Component Values
Part No.
Value
Part Name
Size Code (mm)
Manufacturer
Murata
Murata
Murata
Murata
Murata
-
L
1.5 μH
FDSD0420-H-1R5M
4040
1005
2012
1005
2012
-
(Note 1)
CIN1
0.1 μF (50 V, X5R, ±15 %) GRM155R61H104KE14
22 μF (10 V, X5R, ±20 %) GRM21BR61A226ME51
0.1 μF (50 V, X5R, ±15 %) GRM155R61H104KE14
(Note 2)
CIN2
(Note 3)
CBOOT
(Note 4)
COUT1
47 μF (10 V, X5R, ±20 %)
GRM21BR61A476ME15
COUT2
CFB
-
-
-
-
GRM1555C1H272JE01
MCR01MZPF9101
-
-
-
CCOMP
RCOMP
R1A
2.7 nF (50 V, C0G, ±5 %)
9.1 kΩ (1 %, 1/16 W)
Short
1005
1005
-
Murata
ROHM
-
R1B
16 kΩ (1 %, 1/16 W)
18 kΩ (1 %, 1/16 W)
Short
MCR01MZPF1602
MCR01MZPF1802
-
1005
1005
-
ROHM
ROHM
-
R2
(Note 5)
R0
(Note 1) In order to reduce the influence of high frequency noise, connect a 0.1 μF ceramic capacitor CIN1 as close as possible to the VIN pin and the GND
pin.
(Note 2) For the input capacitor CIN2, take temperature characteristics, DC bias characteristics, etc. into consideration to set to the actual capacitance of no
less than 3 μF.
(Note 3) For the bootstrap capacitor CBOOT, take temperature characteristics, DC bias characteristics, etc. into consideration to set to the actual capacitance
of no less than 0.022 μF.
(Note 4) In case of changing the actual capacitance value due to temperature characteristics, DC bias characteristics, etc. of the output capacitor COUT1 and
COUT2, the loop response characteristics may change. Confirm with the actual application.
(Note 5) R0 is an option, used for feedback’s frequency response measurement. By inserting a resistor at R0, it is possible to measure the frequency response
(phase margin) using a FRA. However, the resistor is not used in actual application, use this resistor pattern in short-circuit mode.
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2. VIN = 5 V, VOUT = 1.5 V – continued
Time: 1 µs/div
VOUT: 20 mV/div
VSW: 2 V/div
100
90
80
70
60
50
40
30
20
10
0
0.001
0.01
0.1
1
10
Output Current : IOUT [A]
Figure 31. Efficiency vs Output Current
Figure 32. Output Ripple Voltage (IOUT = 2 A)
Time: 1 ms/div
180
135
90
80
60
40
20
0
Gain
Phase
VOUT: 100 mV/div
45
IOUT: 1 A/div
0
-45
-20
-40
-90
1
10
100
1000
Frequency [kHz]
Figure 33. Frequency Characteristics (IOUT = 1 A)
Figure 34. Load Transient Response
(IOUT = 0.5 A to 2.0 A)
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Application Examples – continued
3. VIN = 5 V, VOUT = 1.2 V
Table 6. Specification of Application
Parameter
Input Voltage
Symbol
Specification Value
5 V (Typ)
1.2 V (Typ)
2 A
VIN
VOUT
IOUTMAX
Ta
Output Voltage
Maximum Output Current
Temperature
25 °C
BD9A201FP4-LBZ
VIN
VIN
BST
CBOOT
CIN2
CIN1
VOUT
SW
GND
L
R0
VEN
EN
R1A
R1B
R2
COUT1
COUT2
ITH
CFB
RCOMP
FB
PGD
CCOMP
Figure 35. Application Circuit
Table 7. Recommended Component Values
Size Code
Part No.
Value
Part Name
Manufacturer
(mm)
L
1.5 μH
FDSD0420-H-1R5M
4040
Murata
Murata
Murata
Murata
Murata
-
(Note 1)
CIN1
0.1 μF (50 V, X5R, ±15 %) GRM155R61H104KE14
22 μF (10 V, X5R, ±20 %) GRM21BR61A226ME51
0.1 μF (50 V, X5R, ±15 %) GRM155R61H104KE14
1005
2012
1005
2012
-
(Note 2)
CIN2
(Note 3)
CBOOT
(Note 4)
COUT1
47 μF (10 V, X5R, ±20 %)
GRM21BR61A476ME15
COUT2
CFB
-
-
-
-
GRM1555C1H272JE01
MCR01MZPF9101
-
-
-
CCOMP
RCOMP
R1A
2.7 nF (50 V, C0G, ±5 %)
9.1 kΩ (1 %, 1/16 W)
Short
1005
1005
-
Murata
ROHM
-
R1B
10 kΩ (1 %, 1/16 W)
20 kΩ (1 %, 1/16 W)
Short
MCR01MZPF1002
MCR01MZPF2002
-
1005
1005
-
ROHM
ROHM
-
R2
(Note 5)
R0
(Note 1) In order to reduce the influence of high frequency noise, connect a 0.1 μF ceramic capacitor CIN1 as close as possible to the VIN pin and the GND
pin.
(Note 2) For the input capacitor CIN2, take temperature characteristics, DC bias characteristics, etc. into consideration to set to the actual capacitance of no
less than 3 μF.
(Note 3) For the bootstrap capacitor CBOOT, take temperature characteristics, DC bias characteristics, etc. into consideration to set to the actual capacitance
of no less than 0.022 μF.
(Note 4) In case of changing the actual capacitance value due to temperature characteristics, DC bias characteristics, etc. of the output capacitor COUT1 and
COUT2, the loop response characteristics may change. Confirm with the actual application.
(Note 5) R0 is an option, used for feedback’s frequency response measurement. By inserting a resistor at R0, it is possible to measure the frequency response
(phase margin) using a FRA. However, the resistor is not used in actual application, use this resistor pattern in short-circuit mode.
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3. VIN = 5 V, VOUT = 1.2 V – continued
Time: 1 µs/div
VOUT: 20 mV/div
VSW: 2 V/div
100
90
80
70
60
50
40
30
20
10
0
0.001
0.01
0.1
1
10
Output Current : IOUT [A]
Figure 36. Efficiency vs Output Current
Figure 37. Output Ripple Voltage (IOUT = 2 A)
Time: 1 ms/div
180
135
90
80
60
40
20
0
Gain
Phase
VOUT: 100 mV/div
45
IOUT: 1 A/div
0
-45
-20
-40
-90
1
10
100
1000
Frequency [kHz]
Figure 38. Frequency Characteristics (IOUT = 1 A)
Figure 39. Load Transient Response
(IOUT = 0.5 A to 2.0 A)
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Selection of Components Externally Connected
Contact us if not use the recommended component values in Application Examples.
1. Input Capacitor
Use ceramic type capacitor for the input capacitor. The input capacitor is used to reduce the input ripple noise and it is
effective by being placed as close as possible to the VIN pin. Set the capacitor value so that it does not fall to 3 μF
considering the capacitor value variances, temperature characteristics, DC bias characteristics, aging characteristics, and
etc. The PCB layout and the position of the capacitor may lead to IC malfunction. Refer to the notes on the PCB layout on
PCB Layout Design when designing PCB layout. In addition, the capacitor with value 0.1 μF can be connected as close as
possible to the VIN pin and the GND pin in order to reduce the high frequency noise.
2. Output LC Filter
In order to supply a continuous current to the load, the DC/DC converter requires an LC filter for smoothing the output
voltage.
VIN
IL
Inductor saturation current > IOUTMAX + ∆IL/2
L
VOUT
Driver
∆IL
COUT
Maximum Output Current IOUTMAX
t
Figure 40. Waveform of Inductor Current
Figure 41. Output LC Filter Circuit
For example, given that VIN = 5 V, VOUT = 1.8 V, L = 1.5 μH, and the switching frequency fOSC = 1000 kHz, Inductor current
ΔIL can be represented by the following equation.
1
(
)
×
∆퐼퐿 = 푉푂푈푇 × 푉 − 푉푂푈푇
= 0.768 [A]
×퐿
ꢀ푁
ꢁ
ꢂꢃ
×푓
ꢄ푆퐶
The rated current of the inductor (Inductor saturation current) must be more than the sum of the maximum output current
IOUTMAX and 1/2 of the inductor ripple current ΔIL.
Use ceramic type capacitor for the output capacitor COUT. COUT affects the output ripple voltage. Select COUT so that it
must satisfy the required ripple voltage characteristics.
The output ripple voltage can be estimated by the following equation.
1
∆푉푅푃퐿 = ∆퐼퐿 × ꢅꢆ퐸ꢇ푅
+
ꢌ [V]
ꢄ푆퐶
ꢈ×ꢉ
×푓
ꢄꢊꢋ
where:
ꢆ퐸ꢇ푅 is the Equivalent Series Resistance (ESR) of the output capacitor.
For example, given that COUT = 44 μF and RESR = 3 mΩ, ΔVRPL can be calculated as below.
1
∆푉푅푃퐿 = 0.768 퐴 × ꢅ3 푚훺 + ꢈ×44 휇퐹×1ꢍꢍꢍ 푘퐻푧ꢌ = ꢎ.5 [mV]
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2. Output LC Filter – continued
In addition, the charging current ICAP to the output capacitor can be represented by the following equation.
1
(
)
퐼ꢉꢏ푃
=
× ꢐ푂푈푇 + ꢐ퐿푂ꢏ퐷 × 푉푂푈푇 [A]
푡
푆푆
From the above formula, given that VIN = 5 V, VOUT = 3.3 V, L = 1.5 µH, fOSC = 800 kHz (Min), COUT = 44 µF, tSS = 0.5 ms
(Min), and IOUTSS = 2 A, COUTMAX can be calculated as below.
푡
∆ꢀ
푆푆
ꢐ푂푈푇푀ꢏ푋
<
× ꢅ3.8 − 퐼푂ꢇꢇ −
ꢑꢌ − ꢐ푂푈푇 = ꢒ57.9 [μF]
2
ꢄꢊꢋ
ꢁ
If the total capacitance connected to VOUT is more than COUTMAX, over current protection may be activated by the inrush
current at startup and prevented to turn on the output. Confirm this on the actual application.
3. Output Voltage Setting
The output voltage can be set by the feedback resistance ratio connected to the FB pin. For recommended R1 and R2, use
the values in Application Examples.
VOUT
푅 ꢔ푅
ꢓ
푉푂푈푇
=
ꢕ × 0.8 [V]
R1
푅
ꢕ
Error Amplifier
FB
R2
0.8 V
(Typ)
Figure 42. Feedback Resistor Circuit
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Selection of Components Externally Connected – continued
4. Phase Compensation Components
A current mode control buck DC/DC converter is two-pole, one-zero system. Two poles are formed by an error amplifier
and load, and the one zero point is added by phase compensation. The phase compensation resistor R1 determines the
crossover frequency fCRS that the total loop gain of the DC/DC converter is 0 dB. A high value fCRS provides a good load
transient response characteristic but instability. Conversely, a low value fCRS greatly stabilizes the characteristics but the
load transient response characteristic is impaired.
(1) Selection of Phase Compensation Resistor RCOMP
The Phase Compensation Resistance RCOMP can be determined by using the following equation.
ꢖ × 휋 × 푉푂푈푇 × ꢗ × ꢐ푂푈푇
ꢉ푅ꢇ
[Ω]
ꢆꢉ푂푀푃
=
푉퐹퐵 × 퐺푀푃 × 퐺푀ꢏ
where:
푉푂푈푇 is the Output Voltage
is the Crossover Frequency
ꢗ
ꢉ푅ꢇ
ꢐ푂푈푇 is the Output Capacitance
푉퐹퐵 is the Feedback Reference Voltage 0.8 V (Typ)
퐺푀푃 is the Current Sense Gain 13 A/V (Typ)
퐺푀ꢏ is the Error Amplifier Trans conductance 260 µA/V (Typ)
(2) Selection of Phase Compensation Capacitance CCOMP
For stable operations of DC/DC converter, the zero point (phase lead) to cancel the phase lag formed by loads is
determined with CCOMP. Inserting a zero point below 1/9 of the crossover frequency often provides good characteristics.
CCOMP can be calculated with the following equation.
ꢒ
[F]
ꢐꢉ푂푀푃
=
ꢖ × 휋 × ꢆꢉ푂푀푃 × ꢗ
푍
where:
ꢗ
푍
is the zero point to be inserted
(3) Loop Stability
Actually, characteristics will vary depending on PCB layout, arrangement of wiring, kinds of parts used and use
conditions (temperature, etc.). Be sure to check stability and responsiveness with actual apparatus. Phase margin of
at least 45° in the worst conditions is recommended. Gain Phase Analyzer or Frequency Response Analyzer FRA is
used to check frequency characteristics with actual apparatus. Contact the measurement apparatus manufacturer for
measurement method.
5. Bootstrap Capacitor
The bootstrap capacitor 0.1 μF is recommended. Connect the capacitor between the SW pin and the BOOT pin. For the
capacitance, take temperature characteristics, DC bias characteristics, and etc. into consideration to set to the actual
capacitance of no less than 0.022 μF.
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PCB Layout Design
PCB layout design for DC/DC converter is very important. Appropriate layout can avoid various problems concerning power
supply circuit. Figure 43-a to Figure 43-c show the current path in a buck DC/DC converter circuit. The Loop 1 in Figure 43-a
is a current path when H-side switch is ON and L-side switch is OFF, the Loop 2 in Figure 43-b is when H-side switch is OFF
and L-side switch is ON. The thick line in Figure 43-c shows the difference between Loop1 and Loop2. The current in thick
line change sharply each time the switching element H-side and L-side switch change from OFF to ON, and vice versa. These
sharp changes induce a waveform with harmonics in this loop. Therefore, the loop area of thick line that is consisted by input
capacitor and IC should be as small as possible to minimize noise. For more details, refer to application note of switching
regulator series “PCB Layout Techniques of Buck Converter”.
Loop1
VIN
VOUT
L
H-side Switch
CIN
COUT
L-side Switch
GND
GND
Figure 43-a. Current Path when H-side Switch = ON, L-side Switch = OFF
VIN
VOUT
L
H-side Switch
CIN
COUT
Loop2
L-side Switch
GND
GND
Figure 43-b. Current Path when H-side Switch = OFF, L-side Switch = ON
VIN
VOUT
L
CIN
COUT
High-side FET
Low-side FET
GND
GND
Figure 43-c. Difference of Current and Critical Area in Layout
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PCB Layout Design – continued
When designing the PCB layout, pay attention to the following points:
•
•
Connect the input capacitor CIN1 and CIN2 as close as possible to the VIN pin and the GND pin on the same plane as
the IC.
Switching nodes such as SW are susceptible to noise due to AC coupling with other nodes. Route the inductor pattern
L as thick and as short as possible.
•
•
•
The feedback line connected to the FB pin should be as far away from the SW nodes as possible.
Place the output capacitor COUT away from input capacitor CIN1 and CIN2 to avoid harmonics noise from the input.
Separate the reference ground and the power ground and connect them through VIA. The reference ground should be
connected to the power ground that is close to the output capacitor COUT. It is because COUT has less high frequency
switching noise.
•
R0 is provided for the measurement of feedback frequency characteristics (optional). By inserting a resistor into R0, it
is possible to measure the frequency characteristics of feedback (phase margin) using FRA etc. R0 is short-circuited
for normal use.
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I/O Equivalence Circuits
1. EN
4. FB
20 kΩ
20 kΩ
FB
EN
430 kΩ
10 kΩ
570 kΩ
5. ITH
6. PGD
VIN
PGD
60 Ω
40 Ω
ITH
7. SW, 8. BST
VIN
BST
VIN
SW
VIN
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Operational Notes
1.
2.
3.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However,
pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground
due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below
ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions
such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few.
4.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
6.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
8.
9.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
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BD9A201FP4-LBZ
Operational Notes – continued
10. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 44. Example of Monolithic IC Structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
12. Thermal Shutdown Circuit (TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued period, the
junction temperature (Tj) will rise which will activate the TSD circuit that will turn OFF power output pins. When the Tj
falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
13. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This
protection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should
not be used in applications characterized by continuous operation or transitioning of the protection circuit.
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26.Oct.2020 Rev.001
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BD9A201FP4-LBZ
Ordering Information
B D 9 A 2 0
1
F
P
4 - L B Z TL
Package
FP4-Z: TSOT23-8L
Product class
LB: for Industrial applications
Packaging and forming specification
TL: Embossed tape and reel
Marking Diagram
TSOT23-8L (TOP VIEW)
Part Number Marking
LOT Number
AA□
Pin 1 Mark
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26.Oct.2020 Rev.001
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BD9A201FP4-LBZ
Physical Dimension and Packing Information
Package Name
TSOT23-8L
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26.Oct.2020 Rev.001
30/31
BD9A201FP4-LBZ
Revision History
Date
Revision
001
Changes
New Release
26.Oct.2020
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Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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