BM60059FV-C [ROHM]
内置绝缘电压2500Vrms、输入输出延迟时间450ns、最小输入脉冲宽度400ns的绝缘元件的栅极驱动器。内置故障信号输出功能、低电压时误动作防止功能（UVLO）、短路保护功能（SCP）、米勒钳位功能、温度监测功能、开关控制、栅极恒流驱动功能、栅极状态监视功能。;
| 型号： | BM60059FV-C |
| 厂家： | 
ROHM |
| 描述： | 内置绝缘电压2500Vrms、输入输出延迟时间450ns、最小输入脉冲宽度400ns的绝缘元件的栅极驱动器。内置故障信号输出功能、低电压时误动作防止功能（UVLO）、短路保护功能（SCP）、米勒钳位功能、温度监测功能、开关控制、栅极恒流驱动功能、栅极状态监视功能。 开关 栅极驱动 脉冲 驱动器 |
| 文件： | 总49页 (文件大小：1500K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Datasheet
Gate Driver Providing Galvanic Isolation Series
Isolation Voltage 2500 Vrms
1ch Gate Driver Providing Galvanic Isolation
BM60059FV-C
General Description
Key Specifications
The BM60059FV-C is a gate driver with an isolation
voltage of 2500 Vrms. It has an I/O delay time of 450
ns, minimum input pulse width of 400 ns, and
incorporates the fault signal output function, under
voltage lockout (UVLO) function, short circuit protection
(SCP) function, active miller clamping function,
temperature monitoring, switching controller function,
gate constant current driving function and output state
feedback function.
◼
◼
◼
◼
Isolation Voltage:
2500 Vrms
24 V
450 ns (Max)
400 ns
Maximum Gate Drive Voltage:
I/O Delay Time:
Minimum Input Pulse Width:
Package
SSOP-B28W
W (Typ) x D (Typ) x H (Max)
9.2 mm x 10.4 mm x 2.4 mm
Features
◼
◼
◼
◼
◼
◼
AEC-Q100 Qualified(Note 1)
Fault Signal Output Function
Under Voltage Lockout Function
Short Circuit Protection Function
Fast Turn Off Function for Short Circuit Protection
Soft Turn Off Function for Short Circuit Protection
(Adjustable turn off time)
◼
◼
◼
◼
◼
◼
Active Miller Clamping
Temperature Monitor
Switching Controller
Gate Constant Current Driving Function
Output State Feedback Function
UL1577 Recognized: File No. E356010
(Note 1) Grade1
Applications
◼
◼
◼
◼
Automotive Inverter System
Automotive DCDC Converter
Industrial Inverter System
UPS System
Typical Application Circuit
GND1
FLT
GND2
OUT2
DIS
OUT1L
OUT1HG
OUTREF
VCC2
INA
ECU
TO_SEL
SENSOR
OSFB
FB
VCC2
RTC
TC
TO2
COMP
V_BATT
VREG
FET_G
SENSE
GND1
TO1
V_BATT
Filter
Filter
SCPIN2
SCPIN1
PROOUT1
PROOUT2
GND2
snubber
GND1
VCC2
GND2
+
CVCC2
GND2
GND1
CVBATT
CVREG
〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays.
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BM60059FV-C
Contents
General Description........................................................................................................................................................................1
Features..........................................................................................................................................................................................1
Applications ....................................................................................................................................................................................1
Key Specifications ..........................................................................................................................................................................1
Package..........................................................................................................................................................................................1
Typical Application Circuit ...............................................................................................................................................................1
Contents .........................................................................................................................................................................................2
Recommended Range of External Constants.................................................................................................................................3
Pin Descriptions..............................................................................................................................................................................3
Pin Configurations ..........................................................................................................................................................................3
Block Diagram ................................................................................................................................................................................4
Absolute Maximum Ratings ............................................................................................................................................................4
Thermal Resistance........................................................................................................................................................................5
Recommended Operating Conditions.............................................................................................................................................5
Insulation Related Characteristics ..................................................................................................................................................5
Electrical Characteristics.................................................................................................................................................................6
Typical Performance Curves...........................................................................................................................................................9
UL1577 Ratings Table...................................................................................................................................................................27
Description of Pins and Cautions on Layout of Board...................................................................................................................28
Description of Functions and Examples of Constant Setting ........................................................................................................30
1. Fault Status Output ............................................................................................................................................................30
2. Under Voltage Lockout (UVLO) Function...........................................................................................................................30
3. Short Circuit Protection (SCP) Function.............................................................................................................................31
4. Miller Clamp Function ........................................................................................................................................................32
5. Gate Constant Current Driving Function ............................................................................................................................33
6. Output State Feedback Function........................................................................................................................................34
7. Switching Regulator ...........................................................................................................................................................34
8. Temperature Monitor Function ...........................................................................................................................................35
9. I/O Condition Table.............................................................................................................................................................36
Selection of Components Externally Connected...........................................................................................................................37
I/O Equivalence Circuits................................................................................................................................................................38
Operational Notes.........................................................................................................................................................................42
Ordering Information.....................................................................................................................................................................44
Marking Diagram ..........................................................................................................................................................................44
Physical Dimension and Packing Information...............................................................................................................................45
Revision History............................................................................................................................................................................46
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BM60059FV-C
Recommended Range of External Constants
Pin Configurations
(TOP VIEW)
Recommended Value
Pin Name
Symbol
RTC
Unit
kΩ
GND2
PROOUT2
PROOUT1
SCPIN1
SCPIN2
TO1
1
2
3
4
5
6
7
8
9
28 GND1
27 SENSE
26 FET_G
25 VREG
24 V_BATT
23 COMP
22 FB
Min
Typ
Max
TC
1.25
-
50
(As Temperature
monitor)
TC
RTC
0.1
1
10
MΩ
(No Temperature
monitor)
V_BATT
VCC2
CVBATT
CVCC2
CVREG
3
-
-
-
-
μF
μF
μF
0.4
0.3
TO2
VREG
1
10
TC
21 OSFB
20 SENSOR
19 TO_SEL
18 INA
CVREG : For supplying gate charge current of MOS for fly back
converter and driving internal transformer.
VCC2
OUTREF 10
OUT1HG 11
OUT1L 12
OUT2 13
CVCC2 : For supplying gate charge current of MOS FET/IGBT.
17 DIS
16 FLT
GND2 14
15 GND1
Pin Descriptions
Pin No.
1
Pin Name
GND2
PROOUT2
PROOUT1
SCPIN1
SCPIN2
TO1
Function
Output-side ground pin
Fast turn off pin for short circuit protection
2
3
Soft turn off pin for short circuit protection / Gate voltage input pin
Short circuit detection pin 1
4
5
Short circuit detection pin 2
6
Constant current output pin / Sensor voltage input pin 1
Constant current output pin / Sensor voltage input pin 2
Resistor connection pin for setting constant current source output
Output-side power supply pin
7
TO2
8
TC
9
VCC2
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
OUTREF
OUT1HG
OUT1L
OUT2
Reference voltage pin for constant current driving
Source side MOS buffer driving pin
Sink side output pin
Output pin for Miller Clamp
GND2
GND1
FLT
Output-side ground pin
Input-side ground pin
Fault output pin
DIS
Input enabling signal input pin
INA
Control input pin
TO_SEL
SENSOR
OSFB
Temperature information selecting pin
Temperature information output pin
Output state feedback output pin
FB
Error amplifier inverting input pin for switching controller
Error amplifier output pin for switching controller
Main power supply pin
COMP
V_BATT
VREG
FET_G
SENSE
GND1
Input-side internal power supply pin
MOS FET for transformer drive control pin for switching controller
Current feedback resistor connection pin for switching controller
Input-side ground pin
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BM60059FV-C
Block Diagram
OSC
UVLO_REG
TIMER
GND1
FLT
GND2
OUT2
FLT
OSC
RESET
LOGIC
PREDRIVER
DIS
OUT1L
OUT1HG
OUTREF
VCC2
S
R
Q
OSFB
INA
+
-
TO_SEL
SENSOR
OSFB
FB
LOGIC
+
-
+
-
FLT
VREG
CURRENT
SOURCE
TC
OSC
-
+
+
+
-
TO2
-
DAC
+
MUX
S
R
+
-
COMP
V_BATT
VREG
FET_G
SENSE
GND1
TO1
EDGE
Q
RST
SCPIN2
SCPIN1
PROOUT1
PROOUT2
GND2
REGULATOR
OSC
SLOPE
UVLO_REG
UVLO_BATT
UVLO_VCC2
Q
S
R
MAX.Duty
PREDRIVER
UVLO_BATT
Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
V
Main Power Supply Voltage
VBATTMAX
VREGMAX
VCC2MAX
VINMAX
-0.3 to +40.0(Note 2)
-0.3 to +7.0(Note 2)
-0.3 to +30.0(Note 3)
-0.3 to +7.0(Note 2)
-0.3 to +7.0(Note 2)
10
Input-side Control Block Supply Voltage
Output-side Supply Voltage
V
V
INA, DIS, TOSEL Pin Input Voltage
FLT, OSFB Pin Input Voltage
V
VFLTMAX
IFLT
ISENSOR
VFBMAX
V
FLT, OSFB Pin Output Current
SENSOR Pin Output Current
mA
mA
V
10
FB Pin Input Voltage
-0.3 to VBATT + 0.3 or + 4.3(Note 2)
1
FET_G Pin Output Current (Peak 5 µs)
SCPIN1, SCPIN2 pin Input Voltage
TO1, TO2 Pin Input Voltage
IFET_GPEAK
VSCPINMAX
VTOMAX
ITOMAX
A
-0.3 to +6.0(Note 3)
-0.3 to VCC2 + 0.3(Note 3)
8
V
V
TO1, TO2 Pin Output Current
mA
A
OUT1L Pin Output Current (Peak 5 µs)
OUT2 Pin Output Current (Peak 5 µs)
PROOUT1 Pin Output Current (Peak 10 µs)
PROOUT2 Pin Output Current (Peak 5 µs)
Storage Temperature Range
IOUT1LPEAK
IOUT2PEAK
self limited(Note 4)
self limited(Note 4)
self limited(Note 4)
self limited(Note 4)
-55 to +150
A
IPROOUT1PEAK
IPROOUT2PEAK
Tstg
A
A
°C
°C
Maximum Junction Temperature
Tjmax
+150
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 2) Relative to GND1
(Note 3) Relative to GND2
(Note 4) Should not exceed Tjmax = 150 C
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BM60059FV-C
Thermal Resistance(Note 5)
Thermal Resistance (Typ)
Parameter
Symbol
Unit
1s(Note 7)
2s2p(Note 8)
SSOP-B28W
Junction to Ambient
Junction to Top Characterization Parameter(Note 6)
θJA
112.9
34
64.4
23
°C/W
°C/W
ΨJT
(Note 5) Based on JESD51-2A (Still-Air).
(Note 6) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 7) Using a PCB board based on JESD51-3.
(Note 8) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Material
FR-4
Board Size
Single
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70 μm
Layer Number of
Measurement Board
Material
FR-4
Board Size
114.3 mm x 76.2 mm x 1.6 mmt
2 Internal Layers
4 Layers
Top
Copper Pattern
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Thickness
Footprints and Traces
70 μm
74.2 mm x 74.2 mm
35 μm
74.2 mm x 74.2 mm
70 μm
Recommended Operating Conditions
Parameter
Main Power Supply Voltage
Output-side Supply Voltage
TO1, TO2 pin Input Voltage
Operating Temperature
Symbol
Min
Max
24.0
24
Unit
V
(Note 9)
VBATT
4.5
(Note 10)
VCC2
VUVLO2L
V
(Note 10)
VTO
1.35
-40
3.84
V
+125
Topr
°C
(Note 9) Relative to GND1
(Note 10) Relative to GND2
Insulation Related Characteristics
Parameter
Symbol
RS
Characteristic
> 109
Unit
Ω
Insulation Resistance (VIO = 500 V)
Insulation Withstand Voltage (1 min)
Insulation Test Voltage (1 s)
VISO
2500
Vrms
Vrms
VISO
3000
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BM60059FV-C
Electrical Characteristics
(Unless otherwise specified Ta = -40 °C to +125 °C, VBATT = 5 V to 24 V, VCC2 = VUVLO2L to 24 V)
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
General
Main Power Supply
Circuit Current 1
Main Power Supply
Circuit Current 2
FET_G switching operation
INA, DIS not switching
FET_G Not switching
INA , DIS not switching
FET_G switching operation
INA = 10 kHz,
Duty = 50 %
DIS = L
FET_G switching operation
INA = 20 kHz,
Duty = 50 %
IBATT1
IBATT2
0.5
0.4
1.2
1.1
2.0
1.9
mA
mA
Main Power Supply
Circuit Current 3
IBATT3
0.6
0.6
1.3
1.4
2.1
2.3
mA
mA
Main Power Supply
Circuit Current 4
IBATT4
DIS = L
Output-side Circuit Current
VREG Output Voltage 1
VREG Output Voltage 2
Switching Controller
ICC2
2.8
4.5
4.0
5.0
5.0
4.5
7.6
5.5
-
mA
V
RTC = 10 kΩ
VREG1
VREG2
5 V ≤ VBATT ≤ 24 V
V
VBATT = 4.5 V
5 V ≤ VBATT ≤ 24 V
IFET_G = 0 A (open)
VBATT = 4.5 V
FET_G Output Voltage H1
FET_G Output Voltage H2
VFETGH1
V
4.5
5.0
5.5
VFETGH2
VFETGL
RONGH
V
V
Ω
4.0
0
4.5
-
-
IFET_G = 0 A (open)
IFET_G = 0 A (open)
FET_G Output Voltage L
FET_G On Resistance
(Source-side)
FET_G On Resistance
(Sink-side)
0.3
12
3
6
IFET_G = -10 mA
IFET_G = +10 mA
RONGL
Ω
0.3
0.6
1.3
Oscillation Frequency
Soft-start Time
fOSC_SW
tSS
kHz
ms
V
170
-
200
-
230
50
FB Threshold Voltage
FB Input Current
VFB
1.47
-0.8
-160
40
1.50
0
1.53
+0.8
-40
IFB
μA
μA
μA
V
COMP Output Sink Current
COMP Output Source Current
V_BATT UVLO Off Voltage
V_BATT UVLO On Voltage
Maximum On Duty
ICOMPSINK
ICOMPSOURCE
VUVLOBATTH
VUVLOBATTL
DONMAX
-80
80
160
4.45
4.35
95
4.05
3.95
75
4.25
4.15
85
V
%
Logic Block
Logic High Level Input Voltage
Logic Low Level Input Voltage
Logic Pull Down Resistance
Logic Pull Up Resistance
Logic Input Filtering Time
VINH
VINL
RIND
RINU
tINFIL
0.7 x VREG
-
-
5.5
0.3 x VREG
100
V
V
kΩ
kΩ
ns
INA, DIS, TO_SEL
INA, DIS, TO_SEL
INA, TO_SEL
DIS
0
25
25
80
50
50
130
100
180
INA, DIS
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BM60059FV-C
Electrical Characteristics - continued
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Output
OUT1HG H Level
Output Voltage
OUT1HG L Level
Output Voltage
VCC2 - 0.8
-
-
-
-
IOUT1HG = -40 mA
IOUT1HG = +40 mA
VOUT1HGH
VOUT1HGL
V
V
0.6
Relative to VCC2
(Absolute Value)
IOUT1L = 40 mA
VOUTREF
ROUT1L
1.96
-
2.00
0.15
2.04
0.30
V
OUTREF Reference Voltage
OUT1L On Resistance
Ω
VCC2 = 15 V,
Guaranteed by design
INA, DIS
IOUTMAX1
10
-
-
A
OUT1L Maximum Current
210
210
100
330
330
160
450
450
220
OUT1 Turn On Time
tPON
tPOFF
tDEAD
ns
ns
ns
OUT1 Turn Off Time
INA, DIS
OUT1HG-OUT1L Dead Time
Between
OUT1HG
and
-
25
50
OUT1HG L to H Transition Time
tOUT1HGLH
ns
VCC2 = 1000 pF
Guaranteed by design
IPROOUT1 = 40 mA
IPROOUT2 = 40 mA
IOUT2 = 40 mA
PROOUT1 On Resistance
PROOUT2 On Resistance
OUT2 On Resistance
OUT2 On Threshold Voltage
OUT2 On Delay Time
0.4
0.2
0.25
1.8
-
0.9
0.4
0.45
2.0
70
2.0
0.9
1.00
2.2
115
-
RONPRO1
RONPRO2
RON2
VOUT2ON
tOUT2ON
CM
Ω
Ω
Ω
V
ns
100
-
kV/μs
Common Mode Transient Immunity
Guaranteed by design
5 V
tPOFF
2.5 V
INA
OUT1HG
OUT1L
2.5 V
tPON
90 %
90 %
tDEAD
90 %
10 %
tDEAD
tOUT1HGLH
90 %
OUT1HG
10 %
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BM60059FV-C
Electrical Characteristics - continued
Parameter
Temperature Monitor
TC Voltage
Symbol
Min
Typ
Max
Unit
Conditions
VTC
0.980
0.975
-22
8
87.5
47.0
5.6
1.000
1.000
0
1.020
1.025
+22
14
92.5
53.0
14.4
+13
1.0
V
mA
μA
kHz
%
TO1, TO2 Output Current
TO1, TO2 Output Current Offset
SENSOR Output Frequency
SENSOR Output Duty1
SENSOR Output Duty2
SENSOR Output Duty3
TO1,TO2 Input Voltage Offset
TO_SEL Switching Time
SENSOR On Resistance
(Source-side)
ITO
RTC = 10 kΩ
ITOOFFSET
fOSC_TO
DSENSOR1
DSENSOR2
DSENSOR3
VTOOFFSET
tTOSEL
RTC = 10 kΩ
10
90.0
50.0
10.0
0
VTO1 = VTO2 = 1.35 V
VTO1 = VTO2 = 2.59 V
VTO1 = VTO2 = 3.84 V
Guaranteed by design
%
%
mV
μs
-13
-
-
RSENSORH
RSENSORL
-
-
60
60
160
160
Ω
Ω
ISENSOR = -5 mA
ISENSOR = +5 mA
SENSOR On Resistance
(Sink-side)
Protection Functions
VREG UVLO Off Voltage
VREG UVLO On Voltage
VREG UVLO Filtering Time
VREG UVLO Delay Time
(OUT1HG)
VREG UVLO Delay Time
(FLT)
Output-side UVLO Off
Threshold Voltage
VUVLO1H
VUVLO1L
tUVLO1FIL
4.05
3.95
2
4.25
4.15
10
4.45
4.35
30
V
V
μs
tDUVLO1OUT1HG
tDUVLO1FLT
VUVLO2H
2
2
10
10
30
30
μs
μs
V
10.7
9.7
2
11.7
10.7
10
12.7
11.7
30
Output-side UVLO On
Threshold Voltage
VUVLO2L
V
Output-side UVLO
Filtering Time
Output-side UVLO Delay Time
(OUT1HG)
Output-side UVLO Delay Time
(FLT)
tUVLO2FIL
μs
μs
μs
V
tDUVLO2OUT1HG
tDUVLO2FLT
VSCDET
2
10
30
3
-
65
Short Current Detection
Voltage
0.67
0.02
0.02
0.02
1
0.70
0.07
0.05
0.05
-
0.73
0.11
0.08
0.08
35
Short Current Detection
Delay Time (OUT1HG)
Short Current Detection
Delay Time (PROOUT1)
Short Current Detection
Delay Time (PROOUT2)
Short Current Detection
Delay Time (FLT)
tDSCPOUT1HG
tDSCPPRO1
tDSCPPRO2
tDSCPFLT
μs
μs
μs
μs
OUT1HG = 1 kΩ Pull up
PROOUT1 = 30 kΩ
Pull up
PROOUT2 = 30 kΩ
Pull up
100
30
-
160
-
220
110
80
PROOUT2 On Time
Soft Turn Off Release Time
FLT Output On Resistance
Fault Output Holding Time
Gate State H Detection
Threshold Voltage
tPRO2ON
tSCPOFF
RFLTL
ns
μs
Ω
OUT1L = 30 kΩ Pull up
30
40
IFLT = 5 mA
tFLTRLS
30
50
ms
VOSFBH
VOSFBL
4.5
4.0
5.0
4.5
5.5
5.0
V
V
Gate State L Detection
Threshold Voltage
OSFB Output Filtering Time
OSFB Output On Resistance
OSFB Output Holding Time
tOSFBFIL
ROSFBL
tOSFBRLS
5.0
-
7.4
30
40
9.8
80
50
μs
Ω
IOSFB = 5 mA
30
ms
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Typical Performance Curves
(Reference data)
2.00
1.75
1.50
1.25
1.00
0.75
0.50
2.00
1.75
1.50
VBATT = 4.5 V
Ta = +125 °C
Ta = +25 °C
1.25
1.00
0.75
0.50
VBATT = 24 V
VBATT = 14 V
Ta = -40 °C
-40
0
40
80
120
4
8
12
16
20
24
Temperature : Ta [°C]
Main Power SupplyVoltage : VBATT [V]
Figure 1. Main Power Supply Circuit Current 1 vs
Main Power Supply Voltage
Figure 2. Main Power Supply Circuit Current 1 vs
Temperature
(FET_G switching operation, INA not switching)
(FET_G switching operation, INA not switching)
1.9
1.9
1.6
1.3
1.0
0.7
0.4
1.6
1.3
1.0
0.7
0.4
VBATT = 4.5 V
Ta = +125 °C
Ta = +25 °C
VBATT = 24 V
VBATT = 14 V
Ta = -40 °C
4
8
12
16
20
24
-40
0
40
80
120
Main Power SupplyVoltage : VBATT [V]
Temperature : Ta [°C]
Figure 3. Main Power Supply Circuit Current 2
vs Main Power Supply Voltage
Figure 4. Main Power Supply Circuit Current 2
vs Temperature
(FET_G not switching, INA not switching)
(FET_G not switching, INA not switching)
www.rohm.com
TSZ02201-0818ACH00070-1-2
28.Jul.2021 Rev.002
© 2017 ROHM Co., Ltd. All rights reserved.
9/46
TSZ22111 • 15 • 001
BM60059FV-C
Typical Performance Curves - continued
(Reference data)
2.0
1.8
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
VBATT = 4.5 V
1.6
Ta = +125 °C
Ta = +25 °C
1.4
1.2
1.0
VBATT = 24 V
VBATT = 14 V
Ta = -40 °C
0.8
0.6
4
9
14
19
24
-40
0
40
80
120
Main Power SupplyVoltage : VBATT [V]
Temperature : Ta [°C]
Figure 5. Main Power Supply Circuit Current 3 vs Main
Power Supply Voltage
Figure 6. Main Power Supply Circuit Current 3 vs
Temperature
(FET_G switching operation, INA = 10 kHz,
Duty = 50 %)
(FET_G switching operation, INA = 10 kHz,
Duty = 50 %)
2.2
2.2
2.0
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
1.8
VBATT = 4.5 V
Ta = +125 °C
Ta = +25 °C
1.6
1.4
1.2
VBATT = 24 V
VBATT = 14 V
1.0
Ta = -40 °C
0.8
0.6
4
8
12
16
20
24
-40
0
40
80
120
Main Power SupplyVoltage : VBATT [V]
Temperature : Ta [°C]
Figure 7. Main Power Supply Circuit Current 4 vs
Main Power Supply Voltage
Figure 8. Main Power Supply Circuit Current 4 vs
Temperature
(FET_G switching operation, INA = 20 kHz,
Duty = 50 %)
(FET_G switching operation, INA = 20 kHz,
Duty = 50 %)
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TSZ02201-0818ACH00070-1-2
28.Jul.2021 Rev.002
© 2017 ROHM Co., Ltd. All rights reserved.
10/46
TSZ22111 • 15 • 001
BM60059FV-C
Typical Performance Curves - continued
(Reference data)
7.6
6.8
6.0
5.2
4.4
3.6
2.8
7.6
6.8
6.0
VCC2 = 24 V
Ta = +25 °C
Ta = +125 °C
5.2
4.4
3.6
2.8
Ta = -40 °C
VCC2 = 15 V
VCC2 = 14 V
14
16
18
20
22
24
-40
0
40
80
120
Output-Side SupplyVoltage : VCC2 [V]
Temperature : Ta [°C]
Figure 9. Output-side Circuit Current vs
Output-Side Supply Voltage
(RTC = 10kΩ)
Figure 10. Output-side Circuit Current vs
Temperature
(RTC = 10kΩ)
5.50
5.25
5.00
4.75
4.50
4.25
4.00
5.50
5.25
5.00
4.75
4.50
4.25
4.00
VBATT = 14 V
VBATT = 24 V
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
VBATT = 4.5 V
4
8
12
16
20
24
-40
0
40
80
120
Temperature : Ta [°C]
Main Power SupplyVoltage : VBATT [V]
Figure 11. VREG Output Voltage vs
Main Power Supply Voltage
Figure 12. VREG Output Voltage vs
Temperature
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TSZ02201-0818ACH00070-1-2
28.Jul.2021 Rev.002
© 2017 ROHM Co., Ltd. All rights reserved.
11/46
TSZ22111 • 15 • 001
BM60059FV-C
Typical Performance Curves - continued
(Reference data)
5.50
5.25
5.00
4.75
0.30
0.20
0.10
0.00
-0.10
-0.20
-0.30
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
4.50
4.25
4.00
4
8
12
16
20
24
4
8
12
16
20
24
Main Power SupplyVoltage : VBATT [V]
Main Power SupplyVoltage : VBATT [V]
Figure 14. FET_G Output Voltage L vs
Main Power Supply Voltage
Figure 13. FET_G Output Voltage H vs
Main Power Supply Voltage
1.3
1.1
0.9
0.7
0.5
0.3
12.0
10.5
9.0
Ta = +125 °C
Ta = +25 °C
Ta = +25 °C
Ta = +125 °C
7.5
6.0
4.5
Ta = -40 °C
Ta = -40 °C
12 16
3.0
4
8
20
24
4
8
12
16
20
24
Main Power SupplyVoltage : VBATT [V]
Main Power SupplyVoltage : VBATT [V]
Figure 15. FET_G On Resistance (Source-side)
vs Main Power Supply Voltage
Figure 16. FET_G On Resistance (Sink-side)
vs Main Power Supply Voltage
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TSZ02201-0818ACH00070-1-2
28.Jul.2021 Rev.002
© 2017 ROHM Co., Ltd. All rights reserved.
12/46
TSZ22111 • 15 • 001
BM60059FV-C
Typical Performance Curves - continued
(Reference data)
230
220
50.0
42.5
35.0
27.5
20.0
12.5
5.0
210
Ta = -40 °C
Ta = +25 °C
200
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
190
180
Ta = +125 °C
170
4
8
12
16
20
24
4
8
12
16
20
24
Main Power SupplyVoltage : VBATT [V]
Main Power SupplyVoltage : VBATT [V]
Figure 17. Oscillation Frequency vs
Main Power Supply Voltage
Figure 18. Soft-start Time vs Main Power
Supply Voltage
1.53
1.52
1.51
1.50
1.49
1.48
1.47
0.8
0.6
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
0.4
0.2
0.0
Ta = +25 °C
Ta = -40 °C
-0.2
-0.4
-0.6
-0.8
Ta = +125 °C
4
8
12
16
20
24
4
8
12
16
20
24
Main Power SupplyVoltage : VBATT [V]
Main Power SupplyVoltage : VBATT [V]
Figure 19. FB Threshold Voltage vs Main
Power Supply Voltage
Figure 20. FB Input Current vs Main
Power Supply Voltage
www.rohm.com
TSZ02201-0818ACH00070-1-2
28.Jul.2021 Rev.002
© 2017 ROHM Co., Ltd. All rights reserved.
13/46
TSZ22111 • 15 • 001
BM60059FV-C
Typical Performance Curves - continued
(Reference data)
160
140
120
100
80
-40
Ta = -40 °C
-60
Ta = +125 °C
Ta = +25 °C
-80
-100
-120
Ta = +125 °C
Ta = +25 °C
-140
-160
60
Ta = -40 °C
40
4
8
12
16
20
24
4
8
12
16
20
24
Main Power SupplyVoltage : VBATT [V]
Main Power SupplyVoltage : VBATT [V]
Figure 21. COMP Sink Current vs Main
Power Supply Voltage
Figure 22. COMP Source Current vs Main
Power Supply Voltage
6
5
4
3
2
1
0
95
93
91
89
87
85
83
81
79
77
75
Ta = +125 °C
Ta = -40 °C
Ta = +25 °C
Ta = +25 °C
Ta = -40 °C
3.95
4.05
4.15
4.25
4.35
4.45
4
8
12
16
20
24
Main Power SupplyVoltage : VBATT [V]
Main Power SupplyVoltage : VBATT [V]
Figure 24. Maximum On Duty vs Main
Power Supply Voltage
Figure 23. FLT Voltage vs Main Power Supply Voltage
(V_BATT UVLO On / Off Voltage)
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TSZ02201-0818ACH00070-1-2
28.Jul.2021 Rev.002
© 2017 ROHM Co., Ltd. All rights reserved.
14/46
TSZ22111 • 15 • 001
BM60059FV-C
Typical Performance Curves - continued
(Reference data)
100
85
70
55
40
25
3.5
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
3.0
H Level
Ta = +25 °C
Ta = -40 °C
2.5
2.0
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
L Level
Ta = +125 °C
1.5
4.5
4.7
4.9
5.1
5.3
5.5
4.5
4.7
4.9
5.1
5.3
5.5
VREG Output Voltage : VREG [V]
VREG Output Voltage : VREG [V]
Figure 25. Logic High/Low Level Input
Voltage vs VREG Output Voltage
Figure 26. Logic Pull Down Resistance vs VREG
Output Voltage
180
170
160
150
140
130
120
110
100
90
100
85
70
55
40
25
Ta = +125 °C
Ta = -40 °C
Ta = +25 °C
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
4.9 5.1
80
4.5
4.7
4.9
5.1
5.3
5.5
4.5
4.7
5.3
5.5
VREG Output Voltage : VREG [V]
VREG Output Voltage : VREG [V]
Figure 28. Logic Input Filtering Time vs
VREG Output Voltage
Figure 27. Logic Pull Up Resistance vs
VREG Output Voltage
www.rohm.com
TSZ02201-0818ACH00070-1-2
28.Jul.2021 Rev.002
© 2017 ROHM Co., Ltd. All rights reserved.
15/46
TSZ22111 • 15 • 001
BM60059FV-C
Typical Performance Curves - continued
(Reference data)
0.0
-0.1
-0.2
-0.3
0.60
0.50
0.40
0.30
0.20
0.10
0.00
Ta = +125 °C
Ta = -40 °C
-0.4
Ta = +125°C
Ta = +25 °C
-0.5
-0.6
-0.7
-0.8
Ta = -40 °C
14
16
18
20
22
24
14
16
18
20
22
24
Output-side SupplyVoltage : VCC2 [V]
Output-side SupplyVoltage : VCC2 [V]
Figure 29. OUT1HG H Level Output
Voltage vs Output-side Supply Voltage
(IOUT1HG = -40 mA)
Figure 30. OUT1HG L Level Output
Voltage vs Output-side Supply Voltage
(IOUT1HG = +40 mA)
2.04
2.03
2.02
2.01
2.00
1.99
1.98
1.97
1.96
0.30
0.25
0.20
0.15
0.10
0.05
0.00
Ta = +125 °C
Ta = +25 °C
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
Ta = -40 °C
14
16
18
20
22
24
14
16
18
20
22
24
Output-side SupplyVoltage : VCC2 [V]
Output-side SupplyVoltage : VCC2 [V]
Figure 31. OUTREF Reference Voltage vs
Output-side Supply Voltage
(Relative to VCC2)
Figure 32. OUT1L On Resistance vs Output-side
Supply Voltage
(IOUT1L = 40 mA)
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TSZ02201-0818ACH00070-1-2
28.Jul.2021 Rev.002
© 2017 ROHM Co., Ltd. All rights reserved.
16/46
TSZ22111 • 15 • 001
BM60059FV-C
Typical Performance Curves - continued
(Reference data)
410
360
410
360
310
260
210
Ta = +125 °C
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
310
260
210
Ta = -40 °C
Ta = +25 °C
14
16
18
20
22
24
14
16
18
20
22
24
Output-side SupplyVoltage : VCC2 [V]
Output-side SupplyVoltage : VCC2 [V]
Figure 33. OUT1 Turn On Time vs
Output-side Supply Voltage
Figure 34. OUT1 Turn Off Time vs
Output-side Supply Voltage
50
40
30
20
10
0
220
200
180
160
140
120
100
Ta = +125 °C
Ta = +25 °C
Ta = -40 °C
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
14
16
18
20
22
24
14
16
18
20
22
24
Output-side SupplyVoltage : VCC2 [V]
Output-side SupplyVoltage : VCC2 [V]
Figure 35. OUT1HG - OUT1L Dead Time
vs Output-side Supply Voltage
Figure 36. OUT1HG L to H Transition Time
vs Output-side Supply Voltage
(Between OUT1HG and VCC2 = 1000 pF)
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TSZ02201-0818ACH00070-1-2
28.Jul.2021 Rev.002
© 2017 ROHM Co., Ltd. All rights reserved.
17/46
TSZ22111 • 15 • 001
BM60059FV-C
Typical Performance Curves - continued
(Reference data)
2
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
1.8
Ta = +125 °C
1.6
1.4
Ta = +125 °C
Ta = +25 °C
1.2
Ta = +25 °C
Ta = -40 °C
1
0.8
0.6
0.4
Ta = -40 °C
14
16
18
20
22
24
14
16
18
20
22
24
Output-side SupplyVoltage : VCC2 [V]
Output-side SupplyVoltage : VCC2 [V]
Figure 37. PROOUT1 On Resistance vs
Output-side Supply Voltage
(IPROOUT1 = 40 mA)
Figure 38. PROOUT2 On Resistance vs
Output-side Supply Voltage
(IPROOUT2 = 40 mA)
2.2
2.1
2
0.95
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
0.85
0.75
0.65
0.55
0.45
0.35
0.25
Ta = +125 °C
Ta = +25 °C
Ta = -40 °C
1.9
1.8
14
16
18
20
22
24
14
16
18
20
22
24
Output-side SupplyVoltage : VCC2 [V]
Output-side SupplyVoltage : VCC2 [V]
Figure 39. OUT2 On Resistance vs Output
Side Supply Voltage
Figure 40. OUT2 On Threshold Voltage vs
Output Side Supply Voltage
(IOUT2 = 40 mA)
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TSZ02201-0818ACH00070-1-2
28.Jul.2021 Rev.002
© 2017 ROHM Co., Ltd. All rights reserved.
18/46
TSZ22111 • 15 • 001
BM60059FV-C
Typical Performance Curves - continued
(Reference data)
115
1.020
1.010
1.000
0.990
0.980
Ta = +125 °C
Ta = +125 °C
Ta = +25 °C
95
75
Ta = -40 °C
Ta = +25 °C
Ta = -40 °C
55
35
14
16
18
20
22
24
14
16
18
20
22
24
Output-side SupplyVoltage : VCC2 [V]
Output-side SupplyVoltage : VCC2 [V]
Figure 41. OUT2 On Delay Time vs
Output-side Supply Voltage
Figure 42. TC Voltage vs Output-side
Supply Voltage
1.025
1.015
1.005
0.995
0.985
0.975
10
Ta = +125 °C
Ta = +25 °C
1
Ta = -40 °C
0.1
1
10
100
14
16
18
20
22
24
TC Resistance : RTC [kΩ]
Output-side SupplyVoltage : VCC2 [V]
Figure 43. TO1, TO2 Output Current vs
Output-side Supply Voltage
(RTC = 10 kΩ)
Figure 44. TO Output Current vs TC Resistance
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TSZ02201-0818ACH00070-1-2
28.Jul.2021 Rev.002
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19/46
TSZ22111 • 15 • 001
BM60059FV-C
Typical Performance Curves - continued
(Reference data)
14
13
12
11
100
90
80
70
60
50
40
30
20
10
0
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
Ta = -40 °C
Ta = +25 °C
10
9
Ta = +125 °C
8
14
16
18
20
22
24
1
1.5
2
2.5
3
3.5
4
Output-side SupplyVoltage : VCC2 [V]
TO1, TO2 pin Input Voltage : VTO [V]
Figure 45. SENSOR Output Frequency vs
Output-side Supply Voltage
Figure 46. SENSOR Output Duty vs TO1, TO2
pin Input Voltage
53
52
51
50
49
48
47
92.5
91.5
90.5
89.5
88.5
87.5
Ta = +25°C
Ta = -40°C
Ta = +25 °C
Ta = -40 °C
Ta = +125 °C
Ta = +125 °C
14
16
18
20
22
24
14
16
18
20
22
24
Output Side SupplyVoltage : VCC2 [V]
Output-side SupplyVoltage : VCC2 [V]
Figure 47. SENSOR Output Duty1 vs Output-side
Supply Voltage
Figure 48. SENSOR Output Duty2 vs Output-side
Supply Voltage
(VTO1 = VTO2 = 1.35 V)
(VTO1 = VTO2 = 2.59 V)
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TSZ02201-0818ACH00070-1-2
28.Jul.2021 Rev.002
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20/46
TSZ22111 • 15 • 001
BM60059FV-C
Typical Performance Curves - continued
(Reference data)
14.4
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
12.2
Ta = +25 °C
Ta = -40 °C
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
10
Ta = +125 °C
7.8
5.6
14
16
18
20
22
24
14
16
18
20
22
24
Output-side SupplyVoltage : VCC2 [V]
Output Side SupplyVoltage : VCC2 [V]
Figure 49. SENSOR Output Duty3 vs
Output-side Supply Voltage
(VTO1 = VTO2 = 3.84 V)
Figure 50. TO_SEL Switching Time vs
Output-side Supply Voltage
160
130
100
70
160
130
100
70
Ta = +125 °C
Ta = +25 °C
Ta = +125 °C
Ta = +25 °C
40
40
Ta = -40 °C
Ta = -40 °C
10
10
4.5
4.75
5
5.25
5.5
4.5
4.75
5
5.25
5.5
VREG Output Voltage : VREG [V]
VREG Output Voltage : VREG [V]
Figure 51. SENSOR On Resistance (Source-side)
vs VREG Output Voltage
Figure 52. SENSOR On Resistance (Sink-side)
vs VREG Output Voltage
(ISENSOR = -5 mA)
(ISENSOR = +5 mA)
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TSZ02201-0818ACH00070-1-2
28.Jul.2021 Rev.002
© 2017 ROHM Co., Ltd. All rights reserved.
21/46
TSZ22111 • 15 • 001
BM60059FV-C
Typical Performance Curves - continued
(Reference data)
6
30
26
22
18
14
10
6
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
5
4
3
2
1
0
2
-40
0
40
80
120
3.95
4.05
4.15
4.25
4.35
4.45
VREG Output Voltage : VREG [V]
Temperature : Ta [°C]
Figure 53. FLT Voltage vs VREG Output Voltage
(VREG UVLO On / Off Voltage)
Figure 54. VREG UVLO Filtering Time vs
Temperature
30
26
22
18
14
10
6
30
26
22
18
14
10
6
2
2
-40
0
40
80
120
-40
0
40
80
120
Temperature : Ta [°C]
Temperature : Ta [°C]
Figure 56. VREG UVLO Delay Time (FLT) vs
Temperature
Figure 55. VREG UVLO Delay Time (OUT1HG)
vs Temperature
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TSZ02201-0818ACH00070-1-2
28.Jul.2021 Rev.002
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22/46
TSZ22111 • 15 • 001
BM60059FV-C
Typical Performance Curves - continued
(Reference data)
6
5
4
3
2
1
0
30
26
22
18
14
10
6
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
2
-50
-25
0
25
50
75
100 125
9.7
10.2
10.7
11.2
11.7
12.2
12.7
Output-side UVLO On/Off Threshold Voltage :
Temperature : Ta [°C]
VUVLO2L/VUVLO2H [V]
Figure 57. FLT Voltage vs Output-side UVLO On/Off
Voltage
Figure 58. Output-side UVLO Filtering Time vs
Temperature
30
26
22
18
14
10
6
63
53
43
33
23
13
3
2
-50 -25
0
25
50
75 100 125
-50 -25
0
25
50
75 100 125
Temperature : Ta [°C]
Temperature : Ta [°C]
Figure 60. Output-side UVLO Delay Time (FLT)
vs Temperature
Figure 59. Output-side UVLO Delay Time
(OUT1HG) vs Temperature
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TSZ02201-0818ACH00070-1-2
28.Jul.2021 Rev.002
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23/46
TSZ22111 • 15 • 001
BM60059FV-C
Typical Performance Curves - continued
(Reference data)
0.11
0.08
0.05
0.02
0.73
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
0.72
0.71
0.7
0.69
0.68
0.67
14
16
18
20
22
24
14
16
18
20
22
24
Output-side SupplyVoltage : VCC2 [V]
Output-side SupplyVoltage : VCC2 [V]
Figure 61. Short Current Detection Voltage vs
Output-side Supply Voltage
Figure 62. Short Current Detection Delay Time
(OU1HG) vs Output-side Supply Voltage
(OUT1HG = 1 kΩ Pull Up)
0.08
0.07
0.06
0.05
0.04
0.03
0.02
0.08
0.07
0.06
0.05
0.04
0.03
0.02
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
Ta = -40 °C
Ta = +125 °C
Ta = +25 °C
14
16
18
20
22
24
14
16
18
20
22
24
Output-side SupplyVoltage : VCC2 [V]
Output-side SupplyVoltage : VCC2 [V]
Figure 63. Short Current Detection Delay Time
(PROOUT1) vs Output-side Supply Voltage
Figure 64. Short Current Detection Delay Time
(PROOUT2) vs Output-side Supply Voltage
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Typical Performance Curves - continued
(Reference data)
220
200
180
160
140
120
100
Ta = +125 °C
Ta = +25 °C
Ta = -40 °C
31
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
26
21
16
11
6
Maximum
of the jitter
Minimum
of the jitter
Ta = +25 °C
Ta = -40 °C
16
Ta = +125 °C
1
14
18
20
22
24
14
16
18
20
22
24
Output-side SupplyVoltage : VCC2 [V]
Output-side SupplyVoltage : VCC2 [V]
Figure 65. Short Current Detection Delay Time
(FLT) vs Output-side Supply Voltage
Figure 66. PROOUT2 On Time vs Output-side
Supply Voltage
110
100
90
80
70
60
50
40
30
20
10
Ta = +125 °C
Ta = -40 °C
Ta = +25 °C
Maximum
of the jitter
80
Ta = +125 °C
Ta = +25 °C
70
Minimum
of the jitter
60
Ta = +25 °C
50
Ta = +125 °C
Ta = -40 °C
16
40
Ta = -40 °C
30
4.5
4.7
4.9
5.1
5.3
5.5
14
18
20
22
24
VREG Output Voltage : VREG [V]
Output-side SupplyVoltage : VCC2 [V]
Figure 67. Soft Turn Off Release Time vs
Output-side Supply Voltage
Figure 68. FLT Output On Resistance vs VREG
Output Voltage (IFLT = 5 mA)
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Typical Performance Curves - continued
(Reference data)
50
45
5.5
5.25
5
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
H Level
40
4.75
4.5
4.25
4
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
L Level
35
30
Ta = -40 °C
Ta = +25 °C
Ta = +125 °C
4.5
4.7
4.9
5.1
5.3
5.5
14
16
18
20
22
24
VREG Output Voltage : VREG [V]
Output-side SupplyVoltage : VCC2 [V]
Figure 69. Fault Output Holding Time vs VREG
Output Voltage
Figure 70. Gate State H/L Detection Threshold
Voltage vs Output-side Supply Voltage
9.8
8.6
7.4
6.2
5
80
70
60
50
40
30
20
10
Ta = +125 °C
Ta = +25 °C
Ta = -40 °C
4.5
4.7
4.9
5.1
5.3
5.5
-50 -25
0
25
50
75
100 125
Temperature : Ta [°C]
VREG Output Voltage : VREG [V]
Figure 71. OSFB Output Filtering Time vs
VREG Output Voltage
Figure 72. OSFB Output On Resistance vs
VREG Output Voltage (IOSFB = 5 mA)
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BM60059FV-C
Typical Performance Curves - continued
(Reference data)
50
45
Ta = -40 °C
Ta = +25 °C
40
Ta = +125 °C
35
30
4.5
4.7
4.9
5.1
5.3
5.5
VREG Output Voltage : VREG [V]
Figure 73. OSFB Output Holding Time vs
VREG Output Voltage
UL1577 Ratings Table
Following values are described in UL Report.
Parameter
Side 1 (Input-side) Circuit Current
Side 2 (Output-side) Circuit Current
Side 1 (Input-side) Consumption Power
Side 2 (Output-side) Consumption Power
Isolation Voltage
Value
1.2
Unit
Conditions
mA
mA
mW
mW
Vrms
°C
VBATT = 14 V, OUT1HG = H, OUT1L = L
VCC2 = 15 V, OUT1HG = H, OUT1L = L
VBATT = 14 V, OUT1HG = H, OUT1L = L
VCC2 = 15 V, OUT1HG = H, OUT1L = L
5.0
16.8
75
2500
125
150
150
1.3
Maximum Operating (Ambient) Temperature
Maximum Junction Temperature
Maximum Storage Temperature
Maximum Data Transmission Rate
°C
°C
MHz
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BM60059FV-C
Description of Pins and Cautions on Layout of Board
1. V_BATT (Main power supply pin)
This is the main power supply pin. Connect a bypass capacitor between the V_BATT pin and the GND1 pin in order to
suppress voltage variations.
2. GND1 (Input-side ground pin)
This is the ground pin on the input-side.
3. VCC2 (Output-side power supply pin)
The VCC2 pin is a power supply pin on the output-side. To reduce voltage fluctuations due to the driving current of the
internal transformer and output current, connect a bypass capacitor between the VCC2 pin and the GND2 pin.
4. GND2 (Output-side ground pin)
This is the ground pin on the output-side. Connect the GND2 pin to the emitter/source of output device.
5. INA (Control input pin), DIS (Input enabling signal input pin)
These are the pins for determining the output logic.
DIS
H
INA
X
OUT1HG
OUT1L
H
H
L
L
L
L
L
L
H
Hi-Z
X: Don't care
6. FLT (Fault output pin)
The FLT pin is an open drain pin that sends a fault signal when a fault occurs (i.e., when the V_BATT UVLO / VREG
UVLO / VCC2 UVLO or short circuit protection function (SCP) is activated).
Status
Normal operation
Fault
FLT
Hi-Z
L
7. OSFB (Output state feedback output pin)
This is an open drain pin which compares gate logic of the output device monitored with the PROOUT1 pin and the DIS
or INA pin input logic, and outputs Low when they disaccord.
PROOUT1
(input)
H
Status
DIS
INA
OSFB
H
H
L
X
X
L
L
Hi-Z
L
L
H
L
Normal operation
Fault
L
L
Hi-Z
Hi-Z
L
L
H
H
X
H
L
L
X
X
Hi-Z
X: Don't care
8. SENSOR (Temperature information output pin), TO_SEL (Temperature information selecting pin)
This is a pin which outputs the voltage of either the TO1 pin or TO2 pin converted to Duty cycle. The TO_SEL pin
determines which information to output, either the TO1 pin or TO2 pin.
TO_SEL
SENSOR Output
L
Output information of the TO1 pin
Output information of the TO2 pin
H
9. FB (Error amplifier inverting input pin for switching controller)
This is a voltage feedback pin of the switching controller. Connect it to the VREG pin when the switching controller is not
used.
10. COMP (Error amplifier output pin for switching controller)
This is the gain control pin of the switching controller. Connect a phase compensation capacitor and resistor. When the
switching controller is not used, connect it to the GND1 pin.
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Description of Pins and Cautions on Layout of Board - continued
11. VREG (Input-side internal power supply pin)
This is the internal power supply pin on the input side. Be sure to connect a capacitor between the VREG pin and the
GND1 pin in order to prevent from oscillation and suppress voltage variation due to FET_G output current and internal
transformer driving current.
It is also possible to supply voltage (4.5 V to 5.5 V) externally to the VREG pin. In this case, please short the VREG pin
and the V_BATT pin.
12. FET_G (MOS FET for transformer drive control pin for switching controller)
This is the MOS FET control pin for the switching controller transformer drive. Leave it open when the switching
controller is not used.
13. SENSE (Current feedback resistor connection pin for switching controller)
This is a pin connected to the resistor of the switching controller current feedback. Connect it to VREG when switching
controller is not used.
14. OUT1HG (Source side MOS buffer driving pin)
This is the buffer driving pin for gate on side. Connect it to the gate pin of the buffer (Pch MOS FET). Also, connect a
resistor ROUT1HG between the OUT1HG pin and the VCC2 pin to control the gate voltage of the buffer.
15. OUTREF (Reference voltage pin for constant current drive)
This is the reference pin for gate constant current drive. Connect a resistor ROUTREF between the VCC2 pin and the
source pin of the buffer (Pch MOS FET). Also, connect the source pin of the buffer to the OUTREF pin.
16. OUT1L (Sink side output pin)
This is the driving pin for gate off side.
17. OUT2 (Output pin for Miller Clamp)
This is the miller clamp pin for preventing a rise of gate voltage. The OUT2 pin should be open when miller clamp
function is not used.
18. PROOUT1 (Soft turn off pin for short circuit protection / Gate voltage input pin), PROOUT2 (Fast turn off pin for short
circuit protection)
This is a pin for soft turn off of output device when short-circuit protection is activated. Both the PROOUT1 pin and the
PROOUT2 pin are turned on for tPRO2ON from short circuit detection. After tPRO2ON, only the PROOUT1 pin is turned on. It
also functions as monitoring gate voltage pin for miller clamp function and output state feedback function.
19. SCPIN1, SCPIN2 (Short circuit detection pin)
These are pins used to detect current for short circuit protection. When the SCPIN1 pin or the SCPIN2 pin voltage is
more than VSCDET, the SCP function is activated. There is a possibility of the IC malfunction in an open state. To avoid
such trouble, short the SCPIN1 or SCPIN2 pin to the GND2 when the SCP function is not used.
20. TC (Resistor connection pin for setting constant current source output)
The TC pin is a resistor connection pin for setting the constant current output for temperature monitor. If an arbitrary
resistance value is connected between the TC pin and the GND2 pin, it is possible to set the constant current value
output from the TO1 pin and the TO2 pin.
21. TO1, TO2 (Constant current output / Sensor voltage input pin)
The TO1 pin and the TO2 pin are constant current output / sensor voltage input pins for temperature monitor. It can be
used as a sensor input by connecting a device with arbitrary impedance between the TOx pin and the GND2.
Furthermore, the TOx (x = 1 or 2) pin disconnect detection function is built-in.
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Description of Functions and Examples of Constant Setting
1. Fault Status Output
This function is used to output a fault signal from the FLT pin when a fault occurs (i.e., when the under voltage lockout
function (UVLO) or short circuit protection function (SCP) is activated), after fault state cancellation, the FLT pin holds a
fault signal until fault output holding time (tFLTRLS).
Fault occurs (UVLO or SCP)
Status
Status
Normal
FLT pin
Hi-Z
L
Hi-Z
FLT
L
Fault occurs
H
OUT
L
Fault output holding time (tFLTRLS
)
Figure 74. Fault Status Output Timing Chart
2. Under Voltage Lockout (UVLO) Function
The BM60059FV-C incorporates the under voltage lockout (UVLO) function on V_BATT, VREG and VCC2. When the
power supply voltage drops to the UVLO ON voltage, the OUT1HG pin outputs “H” signal and the OUT1L pin and the
FLT pin both output the “L” signal. When the power supply voltage rises to the UVLO OFF voltage, these pins are reset.
However, during the fault output holding time set in “Fault Status Output” section, the OUT1HG pin holds the “H” signal
and the OUT1L pin and the FLT pin hold the “L” signal. In addition, to prevent miss-triggering due to noise, filtering time
tUVLO1FIL and tUVLO2FIL are set on V_BATT, VREG and VCC2.
H
L
INA
VUVLOBATTH
VUVLOBATTL
V_BATT
Hi-Z
FLT(Note 11)
OUT1HG(Note11)
OUT1L(Note11)
L
H
L
Hi-Z
L
H
L
FET_G(Note12)
Hi-Z
Figure 75. V_BATT UVLO Function Operation Timing Chart
H
L
INA
VUVLO1H
VUVLO1L
VREG
Hi-Z
L
H
L
Hi-Z
L
FLT(Note11)
OUT1HG(Note11)
OUT1L(Note11)
H
FET_G(Note12)
Hi-Z
L
Figure 76. VREG UVLO Function Operation Timing Chart
H
L
INA
VUVLO2H
VUVLO2L
VCC2
Hi-Z
L
FLT(Note11)
OUT1HG(Note11)
OUT1L(Not 11)
FET_G
H
L
Hi-Z
Hi-Z
L
H
L
Figure 77. VCC2 UVLO Function Operation Timing Chart
(Note 11) The FLT pin, the OUT1HG pin and the OUTPUT1L pin start operation after fault output holding time.
(Note 12) The FET_G pin starts operation immediately after UVLO reset.
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BM60059FV-C
Description of Functions and Examples of Constant Setting - continued
3. Short Circuit Protection (SCP) Function
When the SCPIN1 pin or the SCPIN2 pin voltage exceeds the VSCDET, the SCP function is activated. When the SCP
function is activated, the OUT1HG pin voltage is set to the “H” level, the OUT1L pin voltage is set to the “Hi-Z” level and
the PROOUT1 pin, the PROOUT2 pin and the FLT pin voltage go to the “L” level first (Fast Turn Off). Next, after tPRO2ON
has passed from the Short Current Detection, the PROOUT2 pin is set to the “Hi-Z” level (Soft Turn Off). And then, when
short-circuit current, the OUT1L pin becomes the “L” level. Finally, when the fault output holding time has elapsed, the
SCP function is released and the FLT pin becomes the “Hi-Z” level. The PROOUT1 pin holds the “L” state until the
OUT1HG pin becomes the “L” level.
Please take note that when the OUT1L pin is “L”, the short-circuit is not detected.
H
L
INA
tSCPOFF
tSCPOFF
VSCDET
SCPINx
(x = 1 or 2)
H
L
Hi-Z
L
Hi-Z
L
Hi-Z
L
Hi-Z
L
OUT1HG
OUT1L
PROOUT1
PROOUT2
FLT
Gate Voltage
tPRO2ON
tPRO2ON
tFLTRLS
tFLTRLS
Figure 78. SCP Operation Timing Chart
START
OUT1L = L, PROOUT1 = L
No
VSCPINx > VSCDET
Yes
OUT1HG = H, OUT1L = Hi-Z,
PROOUT1 = L, PROOUT2 = L, FLT = L
No
Exceed tFLTRLS
Yes
No
Exceed tPRO2ON
Yes
FLT = Hi-Z
PROOUT2 = Hi-Z
No
INA = H, DIS = L
Yes
No
No
VSCPINx ≤ VSCDET
UT1HG = H, OUT1L = Hi-Z,
PROOUT1 = Hi-Z
Yes
Exceed tSCPOFF
Yes
Figure 79. SCP Operation Status Transition Diagram
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BM60059FV-C
Description of Functions and Examples of Constant Setting - continued
4. Miller Clamp Function
When the OUT1HG pin = H, the OUT1 pin = L and the PROOUT1 pin voltage < VOUT2ON, the internal MOS of the OUT2
pin is turned ON and the miller clamp function operates. This state is kept until the OUT1HG pin becomes L and the
OUT1L pin becomes Hi-Z. While the short circuit protection function is activated, miller clamp function operates after the
lapse of soft turn off release time tSCPOFF
.
SCPINx
(x = 1 or 2)
Short current protection
Operated
INA
PROOUT1 Input
OUT2
≥ VSCDET
X
L
X
Hi-Z
Hi-Z
L
X
X
X
≥ VOUT2ON
< VOUT2ON
X
Not operated
L
H
Hi-Z
X: Don't care
VCC2
OUTREF
OUT1HG
PREDRIVER
OUTREF
+
-
OUT1L
PROOUT1
PREDRIVER
PREDRIVER
LOGIC
OUT2
PREDRIVER
+
-
VOUT2ON
GND2
Figure 80. Block Diagram of Miller Clamp Function
H
INA
L
VSCDET
SCPINx
FLT
0 V
Hi-Z
L
H
OUT1HG
OUT1L
L
Hi-Z
L
PROOUT1
OUT2
VOUT2ON
Hi-Z
L
tPON tPOFF
tSCPOFF
tOUT2ON
tFLTRLS
Figure 81. Timing Chart of Miller Clamp Function
SCPINx: SCPIN1 or SCPIN2
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Description of Functions and Examples of Constant Setting - continued
5. Gate Constant Current Driving Function
This IC has a gate constant current driving function. Charge the gate of the output element with a constant current by
connecting buffer (Pch MOS FET MOUT1H) and resistors (ROUTREF, ROUT1HG) as shown in Figure 82. IGATE can be set using
the following formula:
IGATE [A] = VOUTREF [V] /ROUTREF [Ω]
The table below shows the recommended components for the external parts (MOUT1H, ROUTREF, and ROUT1HG). If using
other component for MOUT1H or using resistors outside the recommended range, please make sure that there is no
overshoot or oscillation of the current in the operating temperature condition and current setting.
Recommended Value
Recommended
Symbol
Manufacturer
Unit
Components
Min
-
Max
MOUT1H
ROUTREF
ROUT1HG
ROHM
ROHM
ROHM
RSR015P06HZGTL
-
-
-
0.34
0.5
Ω
MCR Series
LTR Series
2.5
kΩ
VCC2
ROUT1HG
ROUTREF
VOUTREF
OUTREF
PREDRIVER
OUT1HG
MOUT1H
IGATE
+
-
LOGIC
OUT1L
GND2
PREDRIVER
Figure 82. Block Diagram of Gate Constant Current Driving Function
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Description of Functions and Examples of Constant Setting - continued
6. Output State Feedback Function
When the gate logic of output device monitored with the PROOUT1 pin and input logic are compared, and they are
different, the OSFB pin outputs L. In order to prevent the detection error due to delay of input and output, OSFB filter
time tOSFBON is provided. After resolving the mismatch state, hold the OSFB to Low until OSFB output holding time
(tOSFBRLS) is completed.
7. Switching Regulator
(1) Basic action
This IC has a switching controller which turns ON/OFF in synchronous with internal clock. When VBATT voltage is
supplied (VBATT > VUVLOBATTH), the FET_G pin starts switching by soft-start. Output voltage is determined by the
following equation through the external resistance and winding ratio “n” of the flyback transformer
(n = Secondary side winding number / FB side winding number).
VOUT = VFB × {(R1 + R2) / R2} × n [V]
(2) Max Duty
When, for example, the output load is large and the voltage level of the SENSE pin does not reach current detection
level, the output is forcibly turned off by Maximum On Duty (DONMAX).
(3) Pin conditions when switching controller is not used
Implement pin setting as shown below when switching controller is not used.
Pin Number
Pin Name
FB
Treatment Method
Connect to VREG
Connect to GND1
Connect to power supply
Connect a capacitor
No connection
22
23
24
25
26
27
COMP
V_BATT
VREG
FET_G
SENSE
Connect to VREG
Soft start
R2
-
FB
VFB
+
COMP
V_BATT
VREG
FET_G
SENSE
GND1
UVLO_BATT
UVLO_VREG
VOUT
VREG
Slope
COMP
+
R
-
Max Duty
Q
S
OSC
Figure 83. Block Diagram of Switching Controller
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Description of Functions and Examples of Constant Setting - continued
8. Temperature Monitor Function
This IC has a built-in constant current output circuit that supplies a constant current output from the TO1 and TO2 pins.
The current value ITO can be adjusted depending on the resistance value connected between the TC pin and the
GND2 pin. Furthermore, the TO1 pin and the TO2 pin have voltage input function. The SENSOR pin outputs the signal
of the TO1 pin or the TO2 pin voltage converted to Duty. The TO_SEL pin determines which output is selected
whether the TO1 pin or the TO2 pin. When TO_SEL = Low, the TO1 pin is selected. When TO_SEL = High, the TO2
pin is selected. When only one of the TO1 or the TO2 pin is used, connect the other TOx pin to GND2. (x = 1 or 2)
ITO [mA] = 10 × VTC [V] / RTC [kΩ]
VCC2
OSC
x10
TOx
TC
SENSOR
Z
RTC
GND2
x = 1, 2
Figure 84. Block Diagram of Temperature Monitor Function
TO_SEL
4.1 V
1.1 V
TO2 Pin Input Voltage
TO1 Pin Input Voltage
SENSOR Pin Output
Figure 85. Timing Chart of Temperature Monitor Function
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Description of Functions and Examples of Constant Setting - continued
9. I/O Condition Table
Input
Output
No
Status
1
2
3
4
5
6
7
8
9
SCP
○
○
○
H
L
L
L
L
L
L
L
L
L
X
X
X
X
X
X
H
H
H
X
X
X
X
X
X
X
X
X
H
L
H
H
H
H
H
H
H
H
H
Z
L
L
L
L
L
L
L
L
Z
Z
L
Z
L
Z
L
Z
L
L
Z
Z
Z
Z
Z
Z
Z
Z
L→Z
L
L
L
L
L
L
L
Z
Z
Z
Z
Z
Z
Z
Z
Z
L
Z
UVLO
X
X
Z
Z
Z
Z
Z
Z
Z
Z
VREG UVLO
UVLO
X
X
X
X
X
X
○
○
UVLO
X
X
H
L
VCC2 UVLO
V_BATT UVLO
Disable
UVLO
X
X
○
○
UVLO
UVLO
○
H
L
H
L
○
10
11
12
13
○
○
○
○
○
○
○
○
○
○
○
○
L
L
L
L
L
L
L
L
L
L
H
L
H
H
L
L
L
Z
Z
Z
L
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
Z
L
Z
Z
L
Normal Operation
L Input
H
H
H
L
Normal Operation
H Input
L
SCPINx: SCPIN1 or SCPIN2, ○: Power supply voltage > UVLO, X: Don't care, Z: Hi-Z
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BM60059FV-C
Selection of Components Externally Connected
The following are the recommended external components.
ROHM
MCR03EZP
ROHM
MCR series
LTR series
GND1
FLT
GND2
OUT2
DIS
OUT1L
OUT1HG
OUTREF
VCC2
ROHM
INA
ECU
RSR015P06HZGTL
TO_SEL
VCC2
SENSOR
OSFB
FB
TC
TO2
COMP
TO1
V_BATT
ROHM
MCR03EZP
Filter
Filter
V_BATT
SCPIN2
SCPIN1
PROOUT1
PROOUT2
GND2
snubber
VREG
GND1
VCC2
FET_G
SENSE
GND2
GND1
GND2
ROHM
GND1
MCR series
LTR series
ROHM
RB168VYM150FH
ROHM
LTR18EZP
Sumida
CEER117
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BM60059FV-C
I/O Equivalence Circuits
Pin Name
Pin No.
Input Output Equivalent Circuit Diagram
Internal Power
Pin Function
VCC2
SCPIN1
Supply
4
Short circuit detection pin 1
SCPIN2
SCPIN1
SCPIN2
5
6
GND2
Short circuit detection pin 2
TO1
Internal Power
VCC2
Supply
Constant current output pin /
Sensor voltage input pin 1
TO1
TO2
TO2
7
Constant current output pin /
Sensor voltage input pin 2
TC
TC
8
GND2
Resistor connection pin for setting constant
current source output
VCC2
OUTREF
OUTREF
GND2
10
Reference voltage pin for constant current
drive
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BM60059FV-C
I/O Equivalence Circuits - continued
Pin Name
Pin No.
Input Output Equivalent Circuit Diagram
VCC2
Pin Function
OUT1HG
11
OUT1HG
Source side MOS buffer driving pin
GND2
VCC2
OUT1L
Sink side output pin
OUT2
12
13
2
PROOUT2
OUT2
OUT1L
Output pin for Miller Clamp
PROOUT2
GND2
VCC2
Fast turn off pin for short circuit protection
Internal
Power
PROOUT1
Supply
3
PROOUT1
Soft turn off pin for short circuit protection /
Gate voltage input pin
GND2
FLT
Fault output pin
FLT
OSFB
16
21
OSFB
GND1
Output state feedback output pin
VREG
SENSOR
SENSOR
20
Temperature information output pin
GND1
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BM60059FV-C
I/O Equivalence Circuits - continued
Pin Name
Pin No.
Input Output Equivalent Circuit Diagram
Pin Function
VREG
DIS
DIS
17
Input enabling signal input pin
GND1
VREG
INA
18
19
Control input pin
TO_SEL
INA
TO_SEL
Temperature information selecting pin
GND1
VREG
FB
22
FB
Error amplifier inverting input pin
for switching controller
GND1
VREG
COMP
COMP
GND1
23
Error amplifier output pin
for switching controller
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28.Jul.2021 Rev.002
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BM60059FV-C
I/O Equivalence Circuits - continued
Pin Name
Pin No.
Input Output Equivalent Circuit Diagram
Pin Function
V_BATT
VREG
Internal Power
Supply
25
Input-side internal power supply pin
VREG
FET_G
FET_G
26
GND1
MOS FET for transformer drive control
pin for switching controller
VREG
SENSE
27
SENSE
GND1
Current feedback resistor connection pin
for switching controller
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© 2017 ROHM Co., Ltd. All rights reserved.
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28.Jul.2021 Rev.002
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BM60059FV-C
Operational Notes
1.
2.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
4.
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
6.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
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BM60059FV-C
Operational Notes – continued
8.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
9.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
10. Regarding the Input Pin of the IC
This IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N
junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode
or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor
Transistor (NPN)
Pin A
Pin B
Pin B
B
E
C
Pin A
B
C
E
P
P+
P+
N
P+
P
P+
N
N
N
N
N
N
N
Parasitic
Elements
Parasitic
Elements
P Substrate
GND GND
P Substrate
GND
GND
Parasitic
Elements
Parasitic
Elements
N Region
close-by
Figure 86. Example of IC Structure
11. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
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TSZ22111 • 15 • 001
BM60059FV-C
Ordering Information
B M 6 0 0 5 9
F
V -
C E 2
Part Number
Package
FV: SSOP-B28W
Product class
C: for Automotive applications
Packaging and forming specification
E2: Embossed tape and reel
Marking Diagram
SSOP-B28W (TOP VIEW)
Part Number Marking
LOT Number
B M 6 0 0 5 9
Pin 1 Mark
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TSZ22111 • 15 • 001
BM60059FV-C
Physical Dimension and Packing Information
Package Name
SSOP-B28W
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© 2017 ROHM Co., Ltd. All rights reserved.
TSZ22111 • 15 • 001
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28.Jul.2021 Rev.002
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BM60059FV-C
Revision History
Date
Revision
001
Changes
29.Nov.2019
New Release
Page 1 Added “UL1577 Recognized” in the Features column
Page 4 Changed from “power dissipation” to “thermal resistance” in the Caution 2
Page 5 Changed Vcc2 Recommended Operating Condition
Page 6 Changed Vcc2 condition in the Electrical Characteristics
Page 27 Added UL1577 Rating Tables
28.Jul.2021
002
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TSZ22111 • 15 • 001
Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
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