BM6112FV-C_技术文档

Datasheet

Gate Driver Providing Galvanic Isolation Series

Isolation Voltage 3750 Vrms

1ch Gate Driver Providing Galvanic Isolation

BM6112FV-C

General Description

Key Specifications

BM6112FV-C is a gate driver with isolation voltage of

3750 Vrms, I/O delay time of 150 ns, and incorporates

fault signal output function, ready signal output function,

under voltage lockout (UVLO) function, short circuit

protection (SCP) function, active miller clamping function,

output state feedback function and temperature monitor

function.



Isolation Voltage

Maximum Gate Drive Voltage:

I/O Delay Time:

3750 Vrms

20 V

150 ns (Max)

90 ns

Minimum Input Pulse Width:

Package

SSOP-B28W

W (Typ) x D (Typ) x H (Max)

9.2 mm x 10.4 mm x 2.4 mm

Features



AEC-Q100 Qualified ^{(Note 1)}

Fault Signal Output Function

Ready Signal Output Function

Under Voltage Lockout Function

Short Circuit Protection Function

Active Miller Clamping Function

Output State Feedback Function

Temperature Monitor Function

UL1577 (pending)

(Note 1) Grade1

Applications



Automotive Inverter

Automotive DC-DC Converter

Industrial Inverter System

UPS System

Typical Application Circuit

1pin

〇Product structure : Silicon integrated circuit 〇This product has no designed protection against radioactive rays.

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Contents

General Description..............................................................................................................................................................1

Features ................................................................................................................................................................................1

Applications..........................................................................................................................................................................1

Key Specifications................................................................................................................................................................1

Package.................................................................................................................................................................................1

Typical Application Circuit....................................................................................................................................................1

Contents................................................................................................................................................................................2

Recommended Range of External Constants ......................................................................................................................3

Pin Configuration..................................................................................................................................................................3

Pin Description .....................................................................................................................................................................3

Block Diagram.......................................................................................................................................................................4

Absolute Maximum Ratings..................................................................................................................................................4

Thermal Resistance ..............................................................................................................................................................5

Recommended Operating Conditions ..................................................................................................................................5

Insulation Related Characteristics........................................................................................................................................5

Electrical Characteristics......................................................................................................................................................6

Typical Performance Curves.................................................................................................................................................8

Application Information......................................................................................................................................................22

I/O Equivalence Circuit .......................................................................................................................................................28

Operational Notes...............................................................................................................................................................31

Ordering Information ..........................................................................................................................................................33

Marking Diagram.................................................................................................................................................................33

Physical Dimension and Packing Information....................................................................................................................34

Revision History..................................................................................................................................................................35

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Recommended Range of External Constants

Pin Configuration

(TOP VIEW)

Recommended Value

Pin Name Symbol

Unit

GND1

NC

28

27

VEE2

PROOUT2

PROOUT1

1

2

Min

1.25

0.1

Typ

-

Max

50

-

TC

R_TC

kΩ

µF

26 NC

3

VCC1

VCC2

VREG

C_VCC1

C_VCC2

C_VREG

0.22

-

4

25 VCC1

OUT2

VREG

TC

0.2

-

5

24

23

22

21

20

19

18

17

16

NC

0.01

0.1

0.47

6

NC

7

NC

TO

8

SENSOR

RDY

INB

GND2

SCPIN2

SCPIN1

VCC2

OUT1H

OUT1L

9

10

11

12

13

INA

ENA

FLT

GND1

15

VEE2 14

Pin Description

Pin No.

1

Pin Name

VEE2

PROOUT2

PROOUT1

OUT2

VREG

TC

Function

Output-side negative power supply pin

Soft turn-off pin 2

2

3

Soft turn-off pin 1 / Gate voltage input pin

Gate control pin for active miller clamping

4

5

Power supply pin for driving MOSFET for active miller clamping

Resistor connection pin for setting constant current source output

Constant current output pin / Sensor voltage input pin

Output-side ground pin

6

7

TO

8

GND2

SCPIN2

SCPIN1

VCC2

OUT1H

OUT1L

VEE2

GND1

FLT

9

Short circuit current detection pin 2

Short circuit current detection pin 1

Output-side positive power supply pin

Source-side output pin

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

Sink-side output pin

Output-side negative power supply pin

Input-side ground pin

Fault output pin

ENA

Input pin for enabling control input signal

Control input pin

INA

INB

Control input pin

RDY

Ready output pin

SENSOR

NC

Temperature information output pin

Non connection

NC

Non connection

NC

Non connection

VCC1

NC

Input-side power supply pin

Non connection

NC

Non connection

GND1

Input-side ground pin

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Block Diagram

Absolute Maximum Ratings

Parameter

Symbol

V_CC1MAX

V_CC2MAX

V_EE2MAX

Rating

Unit

V

Input-side Supply Voltage

-0.3 to +7.0^{(Note 2)}

-0.3 to +24.0^{(Note 3)}

-15.0 to +0.3^{(Note 3)}

Output-side Positive Supply Voltage

Output-side Negative Supply Voltage

V

Maximum Difference between Output-side Positive and

Negative Supply Voltages

V_MAX2

30.0

V

INA, INB, ENA Pin Input Voltage

FLT, RDY Pin Input Voltage

FLT, RDY Pin Output Current

SENSOR Pin Output Current

SCPIN1, SCPIN2 Pin Input Voltage

TO Pin Input Voltage

V_INMAX

V_FLTMAX,V_RDYMAX

I_FLT,I_RDY

I_SENSOR

-0.3 to V_CC1+0.3 or +7.0^{(Note 2)}

V

-0.3 to +7.0^{(Note 2)}

10

mA

V

10

V_SCPINMAX

V_TOMAX

-0.3 to V_CC2+0.3 or +24.0^{(Note 3)}

V

TO Pin Output Current

I_TOMAX

1

mA

°C

Storage Temperature Range

Maximum Junction Temperature

Tstg

-55 to +150

+150

Tjmax

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing

board size and copper area so as not to exceed the maximum junction temperature rating.

(Note 2) Relative to GND1

(Note 3) Relative to GND2

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Thermal Resistance ^{(Note 4)}

Thermal Resistance (Typ)

Parameter

Symbol

Unit

1s^{(Note 6)}

2s2p^{(Note 7)}

SSOP-B28W

Junction to Ambient

Junction to Top Characterization Parameter^{(Note 5)}

θ_JA

112.9

34

64.4

23

°C/W

Ψ_JT

(Note 4) Based on JESD51-2A(Still-Air)

(Note 5) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside

surface of the component package.

(Note 6) Using a PCB board based on JESD51-3.

(Note 7) Using a PCB board based on JESD51-7.

Layer Number of

Measurement Board

Material

FR-4

Board Size

Single

114.3mm x 76.2mm x 1.57mmt

Top

Copper Pattern

Thickness

Footprints and Traces

70μm

Layer Number of

Measurement Board

Material

FR-4

Board Size

114.3mm x 76.2mm x 1.6mmt

2 Internal Layers

4 Layers

Top

Copper Pattern

Bottom

Copper Pattern

Thickness

Copper Pattern

Thickness

Footprints and Traces

70μm

74.2mm x 74.2mm

35μm

74.2mm x 74.2mm

70μm

Recommended Operating Conditions

Parameter

Input-side Supply Voltage

Symbol

Min

4.5

14

Max

5.5

20

Unit

V

(Note 8)

V_CC1

(Note 9)

Output-side Positive Supply Voltage

Output-side Negative Supply Voltage

V_CC2

V

(Note 9)

V_EE2

-12

0

V

Maximum Difference between Output-side Positive and Negative

Supply Voltages

V_MAX2

Topr

-

28

V

Operating Temperature

-40

+125

°C

(Note 8) Relative to GND1

(Note 9) Relative to GND2

Insulation Related Characteristics

Parameter

Symbol

R_S

Characteristic

>10⁹

Unit

Ω

Insulation Resistance (V_IO= 500 V)

Insulation Withstand Voltage / 1 min

Insulation Test Voltage / 1 s

V_ISO

3750

Vrms

V_ISO

4500

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Electrical Characteristics

(Unless otherwise specified, Ta = -40 °C to +125 °C, V_CC1= 4.5 V to 5.5 V, V_CC2= 14 V to 20 V, V_EE2= -12 V to 0 V)

Parameter

Symbol

Min

Typ

Max

Unit

Conditions

General

1.9

3.9

7.8

Input-side Circuit Current 1

Input-side Circuit Current 2

Input-side Circuit Current 3

Input-side Circuit Current 4

Output-side Circuit Current

Logic Block

I_CC11

I_CC12

I_CC13

I_CC14

I_CC2

mA

OUT1L = L

OUT1H = H

2.1

4.3

8.6

INA = 10 kHz, Duty = 50 %

INA = 20 kHz, Duty = 50 %

R_TC= 4.7 kΩ

2.3

4.6

9.2

1.26

2.80

4.60

Logic High Level Input Voltage

Logic Low Level Input Voltage

Logic Pull-down Resistance

Logic Pull-up Resistance

Logic Input Filtering Time

ENA Input Filtering Time

Output

V_INH

V_INL

2.0

0

-

V_CC1

0.8

100

90

V

INA, INB, ENA

INA, ENA

INB

R_IND

R_INU

t_INFIL

t_ENAFIL

25

-

50

-

kΩ

ns

µs

INA, INB

4

10

20

I_OUT1H= -40 mA

I_OUT1L= 40 mA

OUT1H ON Resistance

OUT1L ON Resistance

R_OUT1H

R_OUT1L

-

0.20

0.45

Ω

V_CC2= 15 V

Guaranteed by design

OUT1H, OUT1L Maximum Current

I_OUT1MAX

20

-

A

I_PROOUT1= 40 mA

PROOUT1 ON Resistance

PROOUT1 Maximum Current

R_PRO1

-

0.5

-

1.1

-

Ω

V_CC2= 15 V

Guaranteed by design

I_PRO1MAX

3

A

I_PROOUT2= 40 mA

Guaranteed by design

PROOUT2 ON Resistance

PROOUT2 Maximum Current

R_PRO2

-

0.20

-

0.45

-

Ω

V_CC2= 15 V

Guaranteed by design

I_PRO2MAX

5

A

Turn ON Time

t_ON

t_OFF

40

90

0

150

+30

ns

Turn OFF Time

Propagation Distortion

t_PDIST

-30

t_OFF- t_ON

Load = 1 nF

Guaranteed by design

Rise Time

Fall Time

t_RISE

-

30

50

ns

Load = 1 nF

Guaranteed by design

t_FALL

I_OUT2= -10 mA

OUT2 ON Resistance (Source)

OUT2 ON Resistance (Sink)

OUT2 Maximum Current

R_OUT2H

R_OUT2L

-

2.0

-

4.5

-

Ω

A

I_OUT2= 10mA

I_OUT2MAX

Guaranteed by design

0.4

1.8

-

OUT2 ON Threshold Voltage

OUT2 Output Delay Time

VREG Output Voltage

V_OUT2ON

t_DOUT2

V_REG

2.0

135

5.0

-

2.2

195

5.5

-

V

ns

Relative to VEE2

4.5

100

V

Relative to VEE2

CM

kV/µs

Common Mode Transient Immunity

Guaranteed by design

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Electrical Characteristics - continued

(Unless otherwise specified, Ta = -40 °C to 125 °C, V_CC1= 4.5 V to 5.5 V, V_CC2= 14 V to 20 V, V_EE2= -12 V to 0 V)

Parameter

Symbol

Min

Typ

Max

Unit

Conditions

Temperature Monitor

TC Pin Voltage

V_TC

I_TO

-

0.94

200

90.0

10.0

1.0

0

-

V

μA

%

TO Pin Output Current

Maximum Duty

196

88.0

9.0

204

92.0

11.0

1.4

R_TC= 4.7 kΩ

D_MAX

D_MIN

V_TO= 3.84 V

V_TO= 1.35 V

Minimum Duty

%

SENSOR Output Frequency

Duty Accuracy 1 (Actual - Typ)

Duty Accuracy 2 (Actual - Typ)

Duty Accuracy 3 (Actual - Typ)

Duty Accuracy 4 (Actual - Typ)

f_SENSOR

D_ACC1

D_ACC2

D_ACC3

D_ACC4

0.7

kHz

%

-2.0

-1.3

-1.1

-1.0

+2.0

+1.3

+1.1

+1.0

3.0 V ≤ V_TO≤ 3.84 V

2.5 V ≤ V_TO< 3.0 V

2.0 V ≤ V_TO< 2.5 V

1.35 ≤ V_TO< 2.0 V

0

%

0

%

0

%

SENSOR ON Resistance

(Source-side)

R_SENSORH

-

60

160

Ω

I_SENSOR= -5 mA

I_SENSOR= 5 mA

SENSOR ON Resistance

(Sink-side)

R_SENSORL

Protection Functions

Input-side UVLO OFF Voltage

Input-side UVLO ON Voltage

Input-side UVLO Filtering Time

Output-side UVLO OFF Voltage

Output-side UVLO ON Voltage

V_UVLO1H

V_UVLO1L

t_UVLO1FIL

V_UVLO2H

V_UVLO2L

4.05

3.95

2

4.25

4.15

10

4.45

4.35

30

V

µs

V

11.5

10.5

12.5

11.5

13.5

12.5

V

Output-side UVLO Filtering

Time

t_UVLO2FIL

t_DUVLO2OUT

t_DUVLO2RDY

2

10

30

µs

Output-side UVLO Delay Time

(OUT1H, OUT1L)

Output-side UVLO Delay Time

(RDY)

3

-

65

0.10

0.20

0.22

0.30

I_SCPIN1,I_SCPIN2= 1mA

SCPIN Input Voltage

V_SCPIN

V

SCPIN Leading Edge

Blanking Time

SCPIN1, SCPIN2

Guaranteed by Design

t_SCPINLEB

0.10

µs

Short Circuit Detection Voltage

V_SCDET

t_SCPFIL

0.67

0.15

0.70

0.30

0.73

0.45

V

SCPIN1, SCPIN2

Short Circuit Detection

Filtering Time

µs

FLT Delay Time

t_DFLT

t_PRO2ON

V_OSFBH

V_OSFBL

t_OSFBFIL

R_RDYL

0.2

0.5

160

5.0

4.5

7.4

30

0.9

220

-

µs

ns

V

PROOUT2 ON Time

100

PROOUT1 H Detection Voltage

PROOUT1 L Detection Voltage

OSFB Output Filtering Time

RDY Output ON Resistance

FLT Output ON Resistance

-

5.0

-

V

9.8

80

μs

Ω

I_RDY= 5 mA

I_FLT= 5 mA

R_FLTL

-

30

Ω

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Typical Performance Curves

(Reference data)

8.0

7.5

7.0

6.5

6.0

5.5

5.0

4.5

4.0

3.5

3.0

2.5

2.0

1.5

8.0

7.5

7.0

6.5

6.0

5.5

5.0

4.5

4.0

3.5

3.0

2.5

2.0

1.5

Ta = +125 °C

Ta = +25 °C

Ta = -40 °C

V_CC1= 5.5 V

V_CC1= 5.0 V

V_CC1= 4.5 V

-50

-25

0

25

50

75

100 125

4.50

4.75

5.00

5.25

5.50

Input-side Supply Voltage: V_CC1[V]

Temperature: Ta [°C]

Figure 1.

Figure 2.

Input-side Circuit Current 1

vs Input-side Supply Voltage

Input-side Circuit Current 1 vs Temperature

6.0

5.5

5.0

4.5

4.0

3.5

3.0

2.5

2.0

1.5

6.0

5.5

5.0

4.5

4.0

3.5

3.0

2.5

2.0

1.5

Ta = +125 °C

Ta = +25 °C

Ta = -40 °C

V_CC1= 5.5 V

V_CC1= 5.0 V

V_CC1= 4.5 V

-50

-25

0

25

50

75

100 125

4.50

4.75

5.00

5.25

5.50

Input-side Supply Voltage: V_CC1[V]

Temperature: Ta [°C]

Figure 4.

Figure 3.

Input-side Circuit Current 2

vs Input-side Supply Voltage

Input-side Circuit Current 2 vs Temperature

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Typical Performance Curves - continued

(Reference data)

9.0

8.0

9.0

8.0

7.0

6.0

5.0

4.0

3.0

2.0

7.0

Ta = +125 °C

Ta = +25 °C

Ta = -40 °C

6.0

V_CC1= 5.5 V

V_CC1= 5.0 V

5.0

4.0

3.0

2.0

V_CC1= 4.5 V

4.50

4.75

5.00

5.25

5.50

-50

-25

0

25

50

75

100 125

Input-side Supply Voltage: V_CC1[V]

Temperature: Ta [°C]

Figure 5.

Figure 6.

Input-side Circuit Current 3

vs Input-side Supply Voltage

Input-side Circuit Current 3 vs Temperature

10.0

9.0

8.0

7.0

6.0

5.0

4.0

3.0

2.0

10.0

9.0

8.0

7.0

6.0

5.0

4.0

3.0

2.0

Ta = +125 °C

Ta = +25 °C

Ta = -40 °C

V_CC1= 5.5 V

V_CC1= 5.0 V

V_CC1= 4.5 V

4.50

4.75

5.00

5.25

5.50

-50

-25

0

25

50

75

100 125

Input-side Supply Voltage: V_CC1[V]

Temperature: Ta [°C]

Figure 7.

Figure 8.

Input-side Circuit Current 4

vs Input-side Supply Voltage

Input-side Circuit Current 4 vs Temperature

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Typical Performance Curves - continued

(Reference data)

5.0

4.5

5.0

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

4.0

V_CC2= 20 V

Ta = +125 °C

Ta = +25 °C

3.5

3.0

2.5

2.0

1.5

1.0

V_CC2= 15 V

V_CC2= 14 V

Ta = -40 °C

14

15

16

17

18

19

20

-50

-25

0

25

50

75

100 125

Temperature: Ta [°C]

Output-side Positive Supply Voltage: V_CC2[V]

Figure 9.

Figure 10.

Output-side Circuit Current vs

Output-side Circuit Current vs Temperature

Output-side Positive Supply Voltage

6.0

5.0

4.0

3.0

2.0

1.0

0.0

100.0

87.5

75.0

62.5

50.0

37.5

25.0

Pull-up to 5 V

Ta = +125 °C

Ta = +25 °C

Ta = -40 °C

V_CC1= 4.5 V

V_CC1= 5.0 V

V_CC1= 5.5 V

Ta = -40 °C

Ta = 125 °C

-50

-25

0

25

50

75

100 125

0.8

1.0

1.2

1.4

1.6

1.8

2.0

Logic Input Voltage: V_IN[V]

Temperature: Ta [°C]

Figure 11.

Figure 12.

RDY Voltage vs Logic Input Voltage

(Logic High/Low Level Input Voltage)

Logic Pull-down Resistance vs Temperature

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Typical Performance Curves - continued

(Reference data)

100.0

87.5

90

80

70

60

50

40

30

20

V_CC1= 4.5 V

V_CC1= 5.0 V

V_CC1= 5.5 V

75.0

V_CC1= 4.5 V

V_CC1= 5.0 V

V_CC1= 5.5 V

62.5

50.0

37.5

25.0

-50

-25

0

25

50

75

100 125

-50

-25

0

25

50

75

100 125

Temperature: Ta [°C]

Figure 13.

Figure 14.

Logic Pull-up Resistance vs Temperature

Logic Input Filtering Time vs Temperature

20

18

16

14

12

10

8

0.45

0.40

0.35

0.30

0.25

0.20

0.15

0.10

0.05

0.00

V_CC1= 5.5 V

V_CC1= 5.0 V

V_CC2= 14 V

V_CC2= 15 V

V_CC2= 20 V

V_CC1= 4.5 V

6

4

-50

-25

0

25

50

75

100 125

-50

-25

0

25

50

75

100 125

Temperature: Ta [°C]

Figure 15.

Figure 16.

ENA Input Filtering Time vs Temperature

OUT1H ON Resistance vs Temperature

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Typical Performance Curves - continued

(Reference data)

1.1

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

0.45

0.40

0.35

0.30

0.25

0.20

0.15

V_CC2= 14 V

V_CC2= 15 V

V_CC2= 20 V

0.10

0.05

0.00

V_CC2= 14 V

V_CC2= 15 V

V_CC2= 20 V

-50

-25

0

25

50

75

100 125

-50

-25

0

25

50

75

100 125

Temperature: Ta [°C]

Figure 17.

Figure 18.

OUT1L ON Resistance vs Temperature

PROOUT1 ON Resistance vs Temperature

0.45

0.40

0.35

0.30

0.25

0.20

0.15

0.10

0.05

0.00

150

140

130

120

110

100

90

V_CC2= 14 V

V_CC2= 15 V

V_CC2= 20 V

V_CC2= 14 V

V_CC2= 15 V

V_CC2= 20 V

80

70

60

50

40

-50

-25

0

25

50

75

100 125

-50

-25

0

25

50

75

100 125

Temperature: Ta [°C]

Figure 19.

Figure 20.

PROOUT2 ON Resistance vs Temperature

Turn ON Time vs Temperature

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Typical Performance Curves - continued

(Reference data)

150

140

130

120

110

100

90

50

40

30

20

10

0

V_CC2= 20 V

V_CC2= 15 V

V_CC2= 14 V

80

V_CC2= 14 V

70

V_CC2= 15 V

V_CC2= 20 V

60

50

40

-50

-25

0

25

50

75

100 125

-50

-25

0

25

50

75

100

125

Temperature: Ta [°C]

Figure 21. Turn OFF Time vs Temperature

Figure 22. Rise Time vs Temperature

50

40

30

20

10

0

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

V_CC2= 14 V

V_CC2= 15 V

V_CC2= 20 V

V_CC2= 15 V

V_CC2= 14 V

-50

-25

0

25

50

75

100 125

-50

-25

0

25

50

75

100 125

Temperature: Ta [°C]

Figure 23. Fall Time vs Temperature

Figure 24.

OUT2 ON Resistance (Source) vs Temperature

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Typical Performance Curves - continued

(Reference data)

4.5

4.0

2.20

2.15

2.10

2.05

2.00

1.95

1.90

1.85

1.80

3.5

V_CC2= 14 V

V_CC2= 15 V

V_CC2= 20 V

3.0

2.5

2.0

1.5

1.0

0.5

0.0

V_CC2= 14 V

V_CC2= 15 V

V_CC2= 20 V

-50

-25

0

25

50

75

100 125

-50

-25

0

25

50

75

100 125

Temperature: Ta [°C]

Figure 25.

Figure 26.

OUT2 ON Resistance (Sink) vs Temperature

OUT2 ON Threshold Voltage vs Temperature

5.1

5.0

4.9

4.8

4.7

4.6

4.5

200

180

160

140

120

100

80

Ta = +125 °C

Ta = +25 °C

Ta = -40 °C

V_CC2= 20 V

V_CC2= 15 V

V_CC2= 14 V

60

40

20

0

-50

-25

0

25

50

75

100 125

14

15

16

17

18

19

20

Temperature: Ta [°C]

Output-side Positive Supply Voltage: V_CC2[V]

Figure 27.

Figure 28.

OUT2 Output Delay Time vs Temperature

VREG Output Voltage vs

Output-side Positive Supply Voltage

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Typical Performance Curves - continued

(Reference data)

1.00

204

203

202

201

200

199

198

197

196

0.98

V_CC2= 20 V

V_CC2= 15 V

V_CC2= 14 V

V_CC2= 20 V

V_CC2= 14 V

V_CC2= 15 V

0.96

0.94

0.92

0.90

0.88

-50

-25

0

25

50

75

100 125

-50

-25

0

25

50

75

100 125

Temperature: Ta [°C]

Figure 29.

Figure 30.

TC Pin Voltage vs Temperature

TO Pin Output Current vs Temperature

92.0

91.5

91.0

90.5

90.0

89.5

89.0

88.5

88.0

11.0

10.8

10.6

10.4

10.2

10.0

9.8

V_CC2= 14 V

V_CC2= 15 V

V_CC2= 20 V

9.6

V_CC2= 20 V

V_CC2= 15 V

V_CC2= 14 V

9.4

9.2

9.0

-50

-25

0

25

50

75

100 125

-50

-25

0

25

50

75

100 125

Temperature: Ta [°C]

Figure 31.

Figure 32.

Maximum Duty vs Temperature

Minimum Duty vs Temperature

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Typical Performance Curves - continued

(Reference data)

1.4

1.3

1.2

1.1

1.0

2.0

1.5

1.0

0.5

0.0

V_CC2= 20 V

V_CC2= 15 V

V_CC2= 14 V

-0.5

-1.0

-1.5

-2.0

0.9

V_CC2= 20 V

V_CC2= 15 V

V_CC2= 14 V

0.8

0.7

-50

-25

0

25

50

75

100 125

-50

-25

0

25

50

75

100 125

Temperature: Ta [°C]

Figure 34.

Figure 33.

Duty Accuracy 1 (Actual - Typ) vs Temperature

SENSOR Output Frequency vs Temperature

1.2

1.0

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

-0.2

-0.4

-0.6

-0.8

-1.0

-1.2

-1.4

-0.2

-0.4

-0.6

-0.8

-1.0

-1.2

V_CC2= 20 V

V_CC2= 15 V

V_CC2= 14 V

V_CC2= 20 V

V_CC2= 15 V

V_CC2= 14 V

-50

-25

0

25

50

75

100 125

-50

-25

0

25

50

75

100 125

Temperature: Ta [°C]

Figure 35.

Figure 36.

Duty Accuracy 2 (Actual - Typ) vs Temperature

Duty Accuracy 3 (Actual - Typ) vs Temperature

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Typical Performance Curves - continued

(Reference data)

160

140

120

100

80

1.0

0.8

0.6

V_CC2= 14 V

V_CC2= 15 V

V_CC2= 20 V

V_CC2= 14 V

V_CC2= 15 V

V_CC2= 20 V

0.4

0.2

0.0

-0.2

-0.4

-0.6

-0.8

-1.0

60

40

20

0

-50

-25

0

25

50

75

100 125

-50

-25

0

25

50

75

100 125

Temperature: Ta [°C]

Figure 38.

Figure 37.

Duty Accuracy 4 (Actual - Typ) vs Temperature

SENSOR ON Resistance (Source) vs Temperature

6.0

5.0

4.0

3.0

2.0

1.0

0.0

160

140

120

100

80

Pull-up to 5 V

V_CC2= 14 V

V_CC2= 15 V

V_CC2= 20 V

Ta = +125 °C

Ta = +25 °C

Ta = -40 °C

60

40

20

0

-50

-25

0

25

50

75

100 125

4.00 4.05 4.10 4.15 4.20 4.25 4.30 4.35 4.40

Input-side Supply Voltage: V_CC1[V]

Temperature: Ta [°C]

Figure 39.

Figure 40.

RDY Voltage vs Input-side Supply Voltage

SENSOR ON Resistance (Sink) vs Temperature

(Input-side UVLO ON/OFF Voltage)

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Typical Performance Curves - continued

(Reference data)

6.0

5.0

4.0

3.0

2.0

1.0

0.0

30

Pull-up to 5 V

25

V_CC2= 20 V

V_CC2= 15 V

V_CC2= 14 V

Ta = -40 °C

Ta = +25 °C

Ta = +125 °C

20

15

10

5

0

10.0 10.5 11.0 11.5 12.0 12.5 13.0 13.5 14.0

Output-side Positive Supply Voltage: V_CC2[V]

-50

-25

0

25

50

75

100 125

Temperature: Ta [°C]

Figure 41.

Figure 42.

Input-side UVLO Filtering Time vs Temperature

RDY Voltage vs Output-side Positive Supply Voltage

(Output-side UVLO ON/OFF Voltage)

30

25

20

15

10

5

28

24

V_CC2= 14 V

V_CC2= 15 V

V_CC2= 20 V

V_CC2= 14 V

20

V_CC2= 15 V

V_CC2= 20 V

16

12

8

4

0

-50

-25

0

25

50

75

100 125

-50

-25

0

25

50

75

100 125

Temperature: Ta [°C]

Figure 43.

Figure 44.

Output-side UVLO Delay Time (OUT1H, OUT1L)

vs Temperature

Output-side UVLO Filtering Time vs Temperature

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Typical Performance Curves - continued

(Reference data)

70

60

50

40

30

20

0.22

0.20

0.18

0.16

0.14

0.12

0.10

0.08

0.06

0.04

0.02

0.00

V_CC2= 14 V

V_CC2= 15 V

V_CC2= 20 V

V_CC2= 15 V

V_CC2= 14 V

10

0

-50

-25

0

25

50

75

100 125

-50

-25

0

25

50

75

100 125

Temperature: Ta [°C]

Figure 45.

Figure 46.

Output-side UVLO Delay Time (RDY)

vs Temperature

SCPIN Input Voltage vs Temperature

0.30

0.28

0.26

0.24

0.22

0.20

0.18

0.16

0.14

0.12

0.10

0.73

0.72

0.71

0.70

0.69

0.68

0.67

V_CC2= 20 V

V_CC2= 15 V

V_CC2= 14 V

V_CC2= 15 V

V_CC2= 20 V

-50

-25

0

25

50

75

100 125

-50

-25

0

25

50

75

100 125

Temperature: Ta [°C]

Figure 47.

Figure 48.

SCPIN Leading Edge Blanking Time vs Temperature

Short Circuit Detection Voltage vs Temperature

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Typical Performance Curves - continued

(Reference data)

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.45

0.40

0.35

0.30

V_CC2= 14 V

V_CC2= 15 V

V_CC2= 20 V

V_CC2= 14 V

V_CC2= 15 V

V_CC2= 20 V

0.25

0.20

0.15

-50

-25

0

25

50

75

100 125

-50

-25

0

25

50

75

100 125

Temperature: Ta [°C]

Figure 49.

Figure 50.

Short Circuit Detection Filtering Time vs Temperature

FLT Delay Time vs Temperature

10.0

9.5

9.0

8.5

8.0

7.5

7.0

6.5

6.0

5.5

5.0

220

200

180

160

140

120

100

V_CC2= 14 V

V_CC2= 15 V

V_CC2= 20 V

V_CC1= 4.5 V

V_CC1= 5.0 V

V_CC1= 5.5 V

-50

-25

0

25

50

75

100 125

-50

-25

0

25

50

75

100 125

Temperature: Ta [°C]

Figure 51.

Figure 52.

OSFB Output Filtering Time vs Temperature

PROOUT2 ON Time vs Temperature

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Typical Performance Curves - continued

(Reference data)

80

70

80

70

60

50

40

30

20

10

0

V_CC1= 4.5 V

V_CC1= 5.0 V

V_CC1= 5.5 V

60

50

40

30

20

10

0

V_CC1= 4.5 V

V_CC1= 5.0 V

V_CC1= 5.5 V

-50

-25

0

25

50

75

100 125

-50

-25

0

25

50

75

100 125

Temperature: Ta [°C]

Figure 53.

Figure 54.

RDY Output ON Resistance vs Temperature

FLT Output ON Resistance vs Temperature

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Application Information

1. Description of Pins and Cautions on Layout of Board

(1) VCC1 (Input-side power supply pin)

The VCC1 pin is a power supply pin on the input side. To suppress voltage fluctuations due to the driving current of the

internal transformer, connect a bypass capacitor between the VCC1 and GND1 pins.

(2) GND1 (Input-side ground pin)

The GND1 pin is a ground pin on the input side.

(3) VCC2 (Output-side positive power supply pin)

The VCC2 pin is a positive power supply pin on the output side. To suppress voltage fluctuations due to the OUT1H pin

or the OUT1L pin output current and due to the driving current of the internal transformer and output current, connect a

bypass capacitor between the VCC2 and GND2 pins.

(4) VEE2 (Output-side negative power supply pin)

The VEE2 pin is a negative power supply pin on the output side. To suppress voltage fluctuations due to the OUT1H pin

or the OUT1L pin output current and due to the driving current of the internal transformer and output current, connect a

bypass capacitor between the VEE2 and GND2 pins. Connect the VEE2 pin to the GND2 pin when no negative power

supply is used.

(5) GND2 (Output-side ground pin)

The GND2 pin is a ground pin on the output side. Connect the GND2 pin to the emitter or source of output device.

(6) INA, INB, ENA (Control input pin)

The INA, INB, and ENA pins are pins used to determine output logic.

ENA

L

H

INB

Don’t care

INA

Don’t care

OUT1H

Hi-Z

H

OUT1L

L

H

L

H

Hi-Z

(7) FLT (Fault output pin)

The FLT pin is an open drain pin used to output a fault signal when short circuit protection (SCP) function is activated,

and will be released at the rising edge of the ENA.

State

FLT

Hi-Z

L

While in normal operation

When a Fault occurs (SCP)

(8) RDY (Ready output pin)

The RDY pin shows the status of three internal protection features which are VCC1 UVLO, VCC2 UVLO and output

state feedback (OSFB). The term "output state feedback" shows whether the PROOUT1 pin voltage (High or Low)

corresponds to input logic or not.

Status

RDY

Hi-Z

L

While in normal operation

VCC1 UVLO or VCC2 UVLO or Output state feedback

(9) SENSOR (Temperature information output pin)

This is a pin which outputs the voltage of the TO pin converted to Duty cycle.

(10) OUT1H, OUT1L (Source-side, Sink-side output pin)

The OUT1H pin is a source side pin used to drive the gate of a power device. The OUT1L pin is a sink side pin used to

drive the gate of a power device. The OUT1H pin is also used to monitor gate voltage for active miller clamping function.

(11) OUT2 (Gate control pin for active miller clamping)

The OUT2 pin is a pin used for controlling the external MOSFET to prevent an increase in gate voltage due to the miller

current of the power device connected to the OUT1H pin or the OUT1L pin.

(12) VREG (Power supply pin for driving MOSFET for active miller clamping)

The VREG pin is a power supply pin for active miller clamping (Typ 5 V). Be sure to connect a capacitor between the

VREG pin and the VEE2 pin to prevent oscillation and to suppress voltage fluctuations due to the OUT2 pin output

current.

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Description of Pins and Cautions on Layout of Board – continued

(13) PROOUT1, PROOUT2 (Soft turn-off pin / Gate voltage input pin)

These are pins for soft turn off of the gate of the power device when short circuit protection is activated. Both the

PROOUT1 pin and the PROOUT2 pin turn on for t_PRO2ON(Typ 160 ns) from short circuit detection. After t_PRO2ON(Typ

160ns), only the PROOUT1 pin continues to turn on. The PROOUT1 pin is also used to monitor gate voltage for output

state feedback function.

(14) SCPIN1, SCPIN2 (Short circuit current detection pin)

The SCPIN1 pin and the SCPIN2 pin are pins used to detect current for short-current protection. When the SCPIN1 pin

or the SCPIN2 pin voltage exceeds V_SCDET(Typ 0.7 V), SCP function will be activated. This may cause the IC to

malfunction in an open state. To avoid such trouble, connect the SCPIN1 pin or the SCPIN2 pin to the GND2 pin

respectively if either of which is not used. In order to prevent the wrong detection due to noise, the noise mask time

t_SCPFIL(Typ 0.3 µs) is set.

(15) TC (Resistor connection pin for setting constant current source output)

The TC pin is a resistor connection pin for setting the constant current output. If an arbitrary resistance value is

connected between the TC pin and the VEE2 pin, it is possible to set the constant current value output from the TO pin.

(16) TO (Constant current output pin / Sensor voltage input pin)

The TO pin is constant current output or voltage input pin. It can be used as a sensor input by connecting an element

with arbitrary impedance between the TO pin and the GND2 pin.

2. Description of Functions and Examples of Constant Setting

(1) Active Miller Clamping Function

When OUT1H Hi-Z and the OUT1H pin voltage < V_OUT2ON(Typ 2 V), the OUT2 pin outputs High signal and the external

MOSFET is turned ON. Once OUT2 is turned High, OUT2 remains High even if OUT1H exceeds V_OUT2ON(Typ 2 V).

When OUT1H = High, the OUT2 pin outputs Low signal and the external MOSFET is turned OFF.

OUT1H

OUT2

Hi-Z (Not less than V_OUT2ON

)

L

H

L

Hi-Z (less than V_OUT2ON

)

H

OUT1H, OUT1L

OUT1H

(Monitor gate voltage)

V_OUT2ON

t_DOUT2

(Typ 135 ns)

OUT2

Figure 55. Timing chart of active Miller clamping

(2) Fault Status Output Function

This function is used to output a fault signal from the FLT pin when short-circuit protection is activated and hold the Fault

signal until rising edge of the ENA is put in.

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Description of Functions and Examples of Constant Setting – continued

(3) Under Voltage Lockout (UVLO) Function

BM6112FV-C incorporates under voltage lockout (UVLO) function both on the input and the output sides. When the

power supply voltage drops to UVLO ON voltage, the OUT1L pin and the RDY pin will output a “L” signal. When the

power supply voltage rises to UVLO OFF voltage, these pins will be reset. To prevent malfunctions due to noise, Filtering

time t_UVLO1FILand t_UVLO2FILare set on both input and output sides.

H

INA

L

V_UVLO1H

V_UVLO1L

VCC1

RDY

OUT1H, OUT1L

Hi-Z

L

H

L

Figure 56. Input-side UVLO Function Operation Timing Chart

H

INA

L

V_UVLO2H

V_UVLO2L

VCC2

RDY

OUT1H, OUT1L

Hi-Z

L

H

Hi-Z

L

Figure 57. Output-side UVLO Operation Timing Chart

(4) Short Circuit Protection (SCP) Function

When the SCPIN1 pin voltage or the SCPIN2 pin voltage exceeds a voltage set with V_SCDET(Typ 0.7 V) parameter, SCP

function will be activated. When SCP function is activated, the OUT1H pin and the OUT1L pin voltage will be set to “Hi-

Z” level, and both the PROOUT1 pin and the PROOUT2 pin turn on for t_PRO2ON(Typ 160 ns). After t_PRO2ON(Typ 160 ns),

only the PROOUT1 pin continues to turn on. First, the PROOUT1 pin voltage and the PROOUT2 pin voltage will go to

the “L” level (soft turn-off). Next, when the OUT1H pin voltage < V_OUT2ON(Typ 2 V), the OUT1H pin and the OUT1L pin

become L and the PROOUT1 pin become Hi-Z. Finally, SCP function will be released at the rising edge of the ENA.

H

L

H

INA

t_SCPINLEB

ENA

L

t_ENAFIL

VSCDET

SCPINx

t_SCPFIL

H

OUT1H, OUT1L

Hi-Z

L

Hi-Z

L

Hi-Z

L

Hi-Z

PROOUT1

PROOUT2

t_PRO2ON

t_DFLT

FLT

L

t_DOUT2ON

Gate Voltage

VOUT2ON

Figure 58. SCP Operation Timing Chart

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Short Circuit Protection (SCP) Function – continued

Collector or drain voltage (V_DESAT) at which desaturation protection function operates and the blanking time (t_BLANK

)

determined by external component can be calculated by the formula below.

푅3 +푅2

푉_{퐷퐸푆퐴푇}= 푉

×

– 푉

[V]

푆퐶퐷퐸푇

퐹퐷1

푅3

푅3+푅2+푅1

푅3

푉

> 푉

×

[V]

퐶퐶2푀퐼푁

푆퐶퐷퐸푇

푅2+푅1

푅3+푅2+푅1

푅3

ꢆ

ꢇꢈꢉꢊꢋ

푡_{퐵퐿퐴푁퐾}= − _{푅3+푅2+푅1}× ꢀꢁ × ꢂ_{퐵퐿퐴푁퐾}ꢃ 6.5 × ꢄ0^ꢅ12× ln(ꢄ −

×

)

[s]

(

)

ꢆ

ꢈꢈꢌ

where:

푉_{퐷퐸푆퐴푇}is the collector or drain voltage at which desaturation protection function operates.

푉_퐹퐷1is the forward voltage of the diode.

푉

is the Short Circuit Detection Voltage.

푆퐶퐷퐸푇

푉_{퐶퐶2푀퐼푁}is the minimum Output-side Positive Supply Voltage.

푡_{퐵퐿퐴푁퐾}is the blanking time.

ꢀꢄ is the resistance 1 to determine the 푉_{퐷퐸푆퐴푇}, 푉_{퐶퐶2푀퐼푁}and 푡_{퐵퐿퐴푁퐾}

ꢀꢍ is the resistance 2 to determine the 푉_{퐷퐸푆퐴푇}, 푉_{퐶퐶2푀퐼푁}and 푡_{퐵퐿퐴푁퐾}

ꢀꢁ is the resistance 3 to determine the 푉_{퐷퐸푆퐴푇}, 푉_{퐶퐶2푀퐼푁}and 푡_{퐵퐿퐴푁퐾}

.

ꢂ_{퐵퐿퐴푁퐾}is the capacitance to determine the 푡_{퐵퐿퐴푁퐾}

.

Reference Value

R2

V_DESAT

R1

R3

4.0 V

4.5 V

5.0 V

5.5 V

6.0 V

6.5 V

7.0 V

7.5 V

8.0 V

8.5 V

9.0 V

9.5 V

10.0 V

15 kΩ

39 kΩ

6.8 kΩ

5.1 kΩ

6.8 kΩ

7.5 kΩ

8.2 kΩ

6.8 kΩ

10 kΩ

6.8 kΩ

9.1 kΩ

43 kΩ

36 kΩ

39 kΩ

43 kΩ

62 kΩ

68 kΩ

82 kΩ

91 kΩ

82 kΩ

130 kΩ

91 kΩ

130 kΩ

Figure 59. Block Diagram for DESAT

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Description of Functions and Examples of Constant Setting – continued

(5) Temperature monitor function

The TO Pin Output Current (I_TO) is supplied from the TO pin from the built-in constant current circuit. This current value

can be adjusted in accordance with the resistance value between the TC pin and the VEE2 pin. Furthermore, the TO pin

voltage is converted to Duty and outputs the signal to the SENSOR pin.

ꢆ

푅

ꢋꢈ

ꢎ_푇푂

=

[A]

ꢋꢈ

where:

ꢎ_푇푂is the TO pin Output Current.

푉_푇퐶is the TC pin Voltage.

ꢀ_푇퐶is the resistance to determine the desired ꢎ_푇푂

.

Figure 60. Block Diagram of Temperature Monitor Function

The SENSOR Duty is calculated according to the following calculating formula.

(V_TO< 1.35 V):

ꢏꢐꢑꢏꢒꢀ ꢓ푢푡푦 = ꢄ0 [%]

(1.35 V ≤ V_TO< 2.5 V):

ꢏꢐꢑꢏꢒꢀ ꢓ푢푡푦 = ꢁꢍ × 푉_푇푂− ꢁꢁ.ꢍ [%]

(2.5 V ≤ V_TO≤ 3.84 V):

ꢏꢐꢑꢏꢒꢀ ꢓ푢푡푦 = ꢁꢍ × 푉_푇푂− ꢁꢍ.9

[%]

(3.84 V < V_TO):

ꢏꢐꢑꢏꢒꢀ ꢓ푢푡푦 = 90 [%]

where:

ꢏꢐꢑꢏꢒꢀ ꢓ푢푡푦 is the duty cycle obtained by converting the TO pin voltage.

푉_푇푂is the TO pin voltage.

100

90

80

70

60

50

40

30

20

10

0

1.35

3.84

1

2

3

4

V_TO[V]

Figure 61. SENSOR Duty vs TO Voltage

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Description of Functions and Examples of Constant Setting – continued

(6) Gate State Monitoring Function

When gate logic and input logic of output device monitored with the PROOUT1 pin are compared, a logic L is output

from the RDY pin when they differ. In order to prevent the detection error due to delay of input and output, OSFB output

filtering time t_OSFBFILis provided.

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I/O Equivalence Circuit

Pin Name

Pin No.

Input Output Equivalence Circuit Diagram

Pin Function

PROOUT2

VCC2

2

Soft turn-off pin 2

OUT1L

PROOUT2, OUT1L

VEE2

13

Sink-side Output pin

VCC2

PROOUT1

3

Soft turn-off pin 1 /

Gate voltage input pin

GND2

VEE2

VCC2

VREG

OUT2

VEE2

OUT2

4

5

Gate control pin for active miller

clamping

Internal Power

Supply

VREG

Power supply pin for driving MOSFET

for active miller clamping

Internal Power

TC

VCC2

Supply

6

Resister connection pin for setting

constant current source output

TO

TC

TO

7

GND2

VEE2

Constant current output pin /

Sensor voltage input pin

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I/O Equivalence Circuit - continued

Pin Name

Pin No.

Input Output Equivalence Circuit Diagram

VCC2

Pin Function

SCPIN2

9

Short circuit current detection pin 2

SCPIN1, SCPIN2

SCPIN1

10

GND2

Short circuit current detection pin 1

VCC2

OUT1H

12

OUT1H

VEE2

Source-side output pin

FLT

Fault output pin

RDY

16

20

17

FLT, RDY

GND1

Ready output pin

ENA

VCC1

Input enabling signal input pin

INA

ENA, INA

18

Control input pin

GND1

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I/O Equivalence Circuit - continued

Pin Name

Pin No.

Input Output Equivalence Circuit Diagram

Pin Function

VCC1

INB

19

Control input pin

GND1

VCC1

SENSOR

21

SENSOR

GND1

Temperature information output pin

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Operational Notes

1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply

pins.

2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the

digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog

block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and

aging on the capacitance value when using electrolytic capacitors.

3. Ground Voltage

Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.

4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but

connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal

ground caused by large currents. Also ensure that the ground traces of external components do not cause variations

on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.

5. Recommended Operating Conditions

The function and operation of the IC are guaranteed within the range specified by the recommended operating

conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical

characteristics.

6. Inrush Current

When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow

instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.

Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing

of connections.

7. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject

the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should

always be turned off completely before connecting or removing it from the test setup during the inspection process. To

prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and

storage.

8. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

9. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and

extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge

acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause

unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power

supply or ground line.

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Operational Notes – continued

10. Regarding the Input Pin of the IC

This IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N

junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode

or transistor. For example (refer to figure below):

When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.

When GND > Pin B, the P-N junction operates as a parasitic transistor.

Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual

interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to

operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be

avoided.

Resistor

Transistor (NPN)

Pin A

Pin B

B

E

C

Pin A

B

C

E

P

P⁺

N

P⁺

P

P⁺

N

Parasitic

Elements

Parasitic

Elements

P Substrate

GND GND

P Substrate

GND

Parasitic

Elements

Parasitic

Elements

N Region

close-by

Figure 62. Example of IC Structure

11. Ceramic Capacitor

When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

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Ordering Information

B M 6

1

2

F

V

-

C E 2

Part Number

Package

FV : SSOP-B28W

Product class

C: for Automotive applications

Packaging and forming specification

E2: Embossed tape and reel

(SSOP-B28W)

Marking Diagram

SSOP-B28W (TOP VIEW)

Part Number Marking

LOT Number

B M 6 1 1 2

Pin 1 Mark

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Physical Dimension and Packing Information

Package Name

SSOP-B28W

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Revision History

Date

Revision

001

Changes

18.Nov.2019

New Release

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Notice

Precaution on using ROHM Products

(Note 1)

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment

,

aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,

bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales

representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any

ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.

Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the

use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our

Products under any special or extraordinary environments or conditions (as exemplified below), your independent

verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.

However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble

cleaning agents for cleaning residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PAA-E

Rev.004

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl₂, H₂S, NH₃, SO₂, and NO₂

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PAA-E

Rev.004


型号：	BM6112FV-C
厂家：	ROHM
描述：	BM6112FV-C is a gate driver with isolation voltage of 3750Vrms, I/O delay time of 150ns, and incorporates fault signal output function, ready signal output function, under voltage lockout (UVLO) function, short circuit protection (SCP) function, active miller clamping function, output state feedback function and temperature monitor function.For sale of this product, please contact the specifications in our sales office. Currently, we don't sell this on the internet distributors now.
文件：	总38页 (文件大小：2989K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BM6112FV-C [ROHM]

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