BU64240GWZ-E2 [ROHM]
VOICE COIL MOTOR CONTROLLER;型号: | BU64240GWZ-E2 |
厂家: | ROHM |
描述: | VOICE COIL MOTOR CONTROLLER 电动机控制 |
文件: | 总24页 (文件大小:938K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Datasheet
Linear Constant Current
VCM Driver
BU64240GWZ
●General Description
●Key Specifications
The BU64240GWZ is designed to drive voice coil motor
(VCM). The drivers include ISRC (intelligent slew rate
control) to reduce mechanical ringing to optimize the
camera’s auto focus capabilities.
■
■
■
■
■
Power supply range
Standby current
Internal resistance
Master clock
Output maximum current
2.3 to 4.8 V
0 µA (typ.)
1.5 Ω (typ.)
400 kHz (typ.)
130 mA (typ.)
●Features
■
■
■
■
■
■
2.3 V min driver power supply
Current sink output
10 bit resolution current control
ISRC mechanical ringing compensation
2-wire serial interface
●Package
W (Typ.) ×D (Typ.) ×H (Max.)
1.30 mm × 0.77 mm × 0.33 mm
Integrated current sense resistor
UCSP30L1
●Applications
■
Autofocus in mobile camera modules
Driving VCM actuators
■
●Typical Application Circuit
0.1 to 10µF
VCC
VCC
VCC
PS
Power Save
TSD & UVLO
Band Gap
GPIO
ISINK
OUT
HOST
SDA
2-wire Serial Bus
Interface
2-wire
serial
Pre-driver
&
Master
Ringing Control
SCL
10
V/I
Convertor
OSC
10 bit DAC
RNF
Band Gap
VREF
1.8V
GND
Figure 1. Typical Application Circuit
○Product structure:Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays
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●Pin Configuration
1
2
3
A
B
PS
SCL
SDA
OUT
GND
VCC
BU64240GWZ
Figure 2. Pin configuration (TOP VIEW)
●Pin Description
Ball Name
PS
Function
Power save
SDA
Serial data input
Serial clock input
Current output
Ground
SCL
OUT
GND
VCC
Power supply voltage
●Block Diagram
VCC
VCC
Power Save
TSD & UVLO
Band Gap
PS
OUT
2-wire serial Bus
Interface
SDA
SCL
Pre-driver
&
Ringing Control
10
V/I
Convertor
OSC
10 bit DAC
VREF
RNF
Band Gap
GND
Figure 3. Block Diagram
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●Absolute Maximum Ratings
Parameter
Power supply voltage
Power save input voltage
Control input voltage*1
Power dissipation
Symbol
VCC
VPS
VIN
Limit
- 0.5 to + 5.5
- 0.5 to + 5.5
- 0.5 to + 5.5
220*2
Unit
V
V
V
Pd
mW
°C
°C
°C
mA
Operating temperature range
Junction temperature
Storage temperature range
Output current
Topr
- 25 to + 85
125
Tjmax
Tstg
- 55 to + 125
+ 200*3
IOUT
*1
*2
*3
VIN is 2-wire serial interface input pins (SCL, SDA)
UCSP30L1 package. Reduced by 2.2 mW/°C over 25 °C when mounted on a glass epoxy board (50 mm × 58 mm × 1.75 mm; 8 layers)
Must not exceed Pd, ASO, or Tjmax of 125 °C
●Recommended Operating Ratings
Parameter
Power supply voltage
Power save input voltage
Control input voltage*1
2-wire serial interface frequency
Output current
Symbol
VCC
Min.
Typ.
Max.
4.8
Unit
V
2.3
0
3.0
VPS
-
-
-
-
4.8
V
VIN
0
4.8
V
FCLK
-
400
130*4
kHz
mA
IOUT
-
*1
*4
VIN is 2-wire serial interface input pins (SCL, SDA)
Must not exceed Pd, ASO
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●Electrical Characteristics (Unless otherwise specified Ta = 25 °C, VCC = 3.0 V)
Limit
Parameter
Symbol
Unit
Conditions
Min.
Typ.
Max.
Power Consumption
Standby current
Power save pin = L = VPSL
ICCST
ICC
-
-
0
5
µA
Power save pin = H = VPSH
SCL = 400 kHz
Circuit current
0.6
1.0
mA
Power Save Input (VPS = PS)
High level input voltage
Low level input voltage
High level input current
Low level input current
VPSH
VPSL
IPSH
IPSL
1.26
0
-
-
-
-
VCC
0.5
10
V
V
VPS = 3 V
VPS = 0 V
- 10
- 10
µA
µA
10
Control Input (VIN = SCL, SDA)
High level input voltage
Low level input voltage
Low level output voltage
High level input current
Low level input current
Under Voltage Lock Out
UVLO voltage
VINH
1.26
0
-
-
-
-
-
VCC
0.5
0.4
10
V
V
VINL
VINOL
IINH
-
V
IIN = + 3.0 mA (SDA)
- 10
- 10
µA
µA
Input voltage = 0.9 x VIN
Input voltage = 0.1 x VIN
IINL
10
VUVLO
MCLK
1.6
- 5
-
-
2.2
5
V
Master Clock
MCLK frequency
%
MCLK = 400 kHz
10 Bit D/A Converter (for Controlling Output Current)
Resolution
DRES
DNL
INL
-
10
-
-
bits
LSB
LSB
Differential nonlinearity
Integral nonlinearity
Output Current Performance
Output current resolution
Output maximum current
Zero code offset current
Output voltage
- 1
- 4
1
4
-
IORES
IOMAX
IOOFS
VOUT
-
126
130
1
-
µA
mA
mA
mV
V
Per 1 DAC code step
DAC_code = 0x3FF
DAC_code = 0x000
Output current = 100 mA
117
143
5
0
-
150
-
200
VCC
2.0
Maximum applied voltage
Output resistance
VOMAX
ROUT
-
-
1.5
Ω
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●Typical Performance Curves
4.0
3.5
3.0
2.5
Ta = + 25 ℃
Ta = + 85 ℃
2.0
1.5
1.0
0.5
0.0
Ta = - 25 ℃
2
2.5
3
3.5
4
4.5
5
VCC (V)
Figure 4. Output resistance
140
120
100
80
Ta = - 25 ℃
Ta = + 85 ℃
60
Ta = + 25 ℃
40
20
VCC = 3.0 V
0
0
128 256 384 512 640 768 896 1024
DAC code
Figure 5. Output current vs. DAC code
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170
150
130
110
90
170
150
130
110
90
VCC = 3.0 V
Ta = + 25 ℃
VCC = 3.0 V
Ta = + 25 ℃
Direct
Direct
70
70
ISRC (slew_rate = 00b)
ISRC (slew_rate = 01b)
50
50
30
0
30
20
40
60
80
0
20
40
Time(ms)
60
80
Time (ms)
Figure 6. Displacement vs. settling time (slew_rate = 00b)
Figure 7. Displacement vs. settling time (slew_rate = 01b)
170
170
VCC = 3.0 V
Ta = + 25 ℃
VCC = 3.0 V
Ta = + 25 ℃
Direct
Direct
150
130
110
90
150
130
110
90
70
70
ISRC (slew_rate = 11b)
ISRC (slew_rate = 10b)
50
30
50
30
0
20
40
60
80
0
20
40
60
80
Time (ms)
Time (ms)
Figure 8. Displacement vs. settling time (slew_rate = 10b)
Figure 9. Displacement vs. settling time (slew_rate = 11b)
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●2-wire serial BUS Format (Fast mode SCL = 400 kHz)
Write mode R/W = 0)
Output from Master
Output from Slave
(
Update
R/W
W2 W1 W0
M D9 D8 A D7 D6 D5 D4 D3 D2 D1 D0 A
S
0
0
0
1
1
0
0
0
A
1 EN
Read mode
W2 W1 W0
W2 W1 W0
S
S
0
0
0
0
0
0
1
1
1
1
0
0
1
A
A
1 EN
1 EN
M
M
A
A
※ ※
Update W (register address)
Write
CD9 CD8
CD7 CD6 CD5 CD4 CD3 CD2 CD1 CD0
0
0
nA
Read
P : stop signal
S : start signal
A : acknowledge
nA : non acknowledge
: Don't care
※
Register name
Setting item
Description
R/W
EN
M
Read/Write mode
0 = Write mode (0x18 address), 1 = Read mode (0x19 address)
0 = Output is Hi-Z
1 = Constant current sink/sequence start
Driver output status
Mode select
M=0=ISRC mode disabled
M=1=ISRC mode enabled
000b = Output current setting
001b = Parameter setting 1
010b = Parameter setting 2
011b = Parameter setting 3
100b = Parameter setting 4
Register data
W2W1W0
Register address
D9 to D0
Data bits
●Register Update Timing
EN – Register is updated during the 3rd ACK response during a 3 byte 2-wire serial command
Wx – Register is updated during the 2nd ACK response during a 3 byte 2-wire serial command
M – Register is updated during the 3rd ACK response during a 3 byte 2-wire serial command
Dx – Register is updated during the 3rd ACK response during a 3 byte 2-wire serial command
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●Register Map
Address
000b
Bit
Bit Name
Function
D[9:0]
D[9:8]
D[7:3]
D2
C_DAC[9:0]
Point C DAC code setting[9:0]
rf[4:0]
Resonant frequency setting[4:0]
001b
D[1:0]
D[9:0]
D[9:0]
D[9:8]
D[7:5]
D[4:0]
slew_rate[1:0]
A_DAC[9:0]
B_DAC[9:0]
Slew rate speed setting[1:0]
Point A DAC code setting[9:0]
Point B DAC code setting[9:0]
010b
011b
100b
str[2:0]
stt[4:0]
Step resolution setting[2:0]
Step time setting[4:0]
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●Characteristics of the SDA and SCL Bus Lines for 2-wire Serial Interface ( Ta = - 25 to +85 °C, VCC = 2.3 to 4.8 V )
STANDARD-MODE*5
FAST-MODE*5
Unit
Parameter
Symbol
Min.
0
Max.
Min.
0
Max.
Pulse width of spikes which must be suppressed by
the input filter
tSP
50
50
ns
µs
µs
µs
µs
µs
ns
µs
µs
Hold time (repeated) start condition. The first clock
pulse is generated after this period.
tHD;STA
tLOW
4.0
4.7
4.0
4.7
0
-
0.6
1.3
0.6
0.6
0
-
Low period of the SCL clock
High period of the SCL clock
Set-up time for repeated START condition
Data hold time
-
-
tHIGH
-
-
tSU;STA
tHD;DAT
tSU;DAT
tSU;STO
tBUF
-
-
3.45
0.9
Data set-up time
250
4.0
4.7
-
-
-
100
0.6
1.3
-
-
-
Set-up time for stop condition
Bus free time between a stop and start condition
*5
STANDARD-MODE and FAST-MODE 2-wire serial interface devices must be able to transmit or receive at the designated speed.
The maximum bit transfer rates are 100 kbit/s for STANDARD-MODE devices and 400 kbit/s for FAST-MODE devices.
This transfer rates is based on the maximum transfer rate. For example the bus is able to drive 100 kbit/s clocks with FAST-MODE.
●2-wire Serial Interface Timing
tHIGH
SCL
SCL
SDA
tSU : STA
tSU : STO
tHD : STA
tHD : DAT
tSU : DAT
tLOW
tHD : STA
tBUF
SDA
STOP BIT
START BIT
Figure 10. Serial Data Timing
Figure 11. Start and Stop Bit Timing
●Initialization Sequence
Item
Symbol Min. Typ. Max. Unit
Setup time for external power save pin tPS;r
0
0
-
-
-
-
-
-
-
-
µs
µs
µs
µs
Hold time for external power save pin
2-wire serial data start time
tPS;f
ti2c;s
ti2c;p
15
1.3
2-wire serial data stop time
VCC
Power save signal
2-wire serial data
Input data
tPS;r ti2c;s
ti2c;p
tPS;f
Figure 12. Timing Between Applying Power (VCC) Until Input of Serial Data
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●Power Dissipation
Package: UCSP30L1
0.22 W
Ambient Temperature: Ta (°C)
(This value is not guaranteed value.)
Figure 13. Power dissipation Pd (W)
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●I/O equivalence circuit
VCC
SCL
SDA
VCC
VCC
SCL
SDA
OUT
PS
VCC
PS
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●Controlling Mechanical Ringing
A voice coil motor (VCM) is an actuator technology that is intrinsically noisy due to the properties of the mechanical
spring behavior. As current passes through the VCM, the lens moves and oscillates until the system reaches a steady
state. The BU64240GWZ lens driver is able to control mechanical oscillations by using the integrated ISRC (intelligent
slew rate control) function. ISRC is operated by setting multiple control parameters that are determined by the intrinsic
characteristics of the VCM. The following steps illustrate how to best utilize ISRC to minimize mechanical oscillations.
・Step A1 – Determining the Resonant Frequency of the VCM
Each VCM has a resonant frequency that can either be provided by the manufacturer or measured. The resonant
frequency of an actuator determines the amount of ringing (mechanical oscillation) experienced after the lens as been
moved to a target position and the driver output current held constant. To determine the resonant frequency, f0, input a
target DAC code by modifying the 10 bit C_DAC[9:0] value in register W2W1W0 = 000b that will target a final lens
position approximately half of the actuator’s full stroke. Take care to not apply too much current so that the lens does
not hit the mechanical end of the actuator as this will show an incorrect resonant period. In order to start movement of
the lens to the DAC code that was set in C_DAC[9:0], the EN bit must be set to 1.
T
0
Time (ms)
Figure 14. Actuator Displacement Waveform (ISRC Disabled)
The resonant frequency (Hz) of the actuator can be calculated with Equation 1 using the resonant period observed in
Figure 14.
f0 = (T)-1
Equation1. Resonant Frequency vs. Time Period Relationship
After calculating the correct resonant frequency, program the closest value in the W2W1W0 = 001b register using the 5
bit rf[4:0] values from Table 1. When calculating the resonant frequency take care that different actuator samples’
resonant frequencies might vary slightly and that the frequency tolerance should be taken into consideration when
selecting the correct driver resonant frequency value.
Table 1. f0 Settings (rf[4:0])
rf[4:0]
00000
00001
00010
00011
00100
00101
00110
00111
f0
rf[4:0]
01000
01001
01010
01011
01100
01101
01110
01111
f0
rf[4:0]
10000
10001
10010
10011
10100
10101
10110
10111
f0
rf[4:0]
11000
11001
11010
11011
11100
11101
11110
11111
f0
-
-
85 Hz
90 Hz
95 Hz
100 Hz
105 Hz
110 Hz
115 Hz
120 Hz
125 Hz
130 Hz
135 Hz
140 Hz
145 Hz
150 Hz
-
50 Hz
55 Hz
60 Hz
65 Hz
70 Hz
75 Hz
80 Hz
-
-
-
-
-
-
-
-
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・Step A2 – Selecting the Autofocus Algorithm’s Target DAC Codes
The ISRC algorithm is a proprietary technology developed to limit the ringing of an actuator by predicting the magnitude
of ringing created by an actuator and intelligently controlling the output signal of the driver to minimize the ringing effect.
Due to the ringing control behavior of ISRC, it is unable to operate properly unless the lens is floating (lens lifted off of the
mechanical end of the actuator). As such the ringing control behavior is broken into three separate operational areas in
order to provide the most optimally controlled autofocus algorithm.
ISRC Mode
Direct Mode
Step Mode
C
B
A
0
DAC code
A: lens displacement = 0 µm
B: all lenses floating
C: final lens position
Figure 15. Lens Displacement vs. DAC Code
Figure 15 illustrates the different operational modes that control the autofocus algorithm. Due to ISRC requiring a
floating lens, points A and B need to bet set in order to create a floating condition. Point A corresponds to the maximum
amount of current that can be applied to all VCM units without floating the lens. Point B corresponds to the minimum
amount of current that can be applied to the VCM so that all actuator units are floating. It should be noted that the target
DAC codes could vary between different actuator units and that sufficient evaluation should be performed before
selecting the point A and B target DAC codes. Point C is the final lens target position determined by the level of focus
required for the image capture.
The actuator manufacturer should be able to provide the required current for points A and B, however it is possible to test
these points by slowly increasing the 10 bit value of C_DAC[9:0] and measuring the lens movement using a laser
displacement meter or some other device to measure lens displacement.
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●Controlling the Driver
After following steps A1 and A2 to characterize the VCM performance, the following steps should be followed in order to
properly control the driver settings for optimized autofocus performance.
・Step B1 – Setting Point A, B, and C DAC Codes
Points A, B, and C are defined by 10 bit DAC codes set with the following registers:
Location
Point C
Point A
Point B
W2W1W0 Register
DAC Code Location
C_DAC[9:0]
Description
000b
010b
011b
Final lens position before image capture
Maximum output current without floating the lens
Minimum output current required to float the lens
A_DAC[9:0]
B_DAC[9:0]
・Step B2 – Controlling Direct Mode
Direct mode is when the driver outputs the desired amount of output current with no output current control. The time in
which the lens reaches the position that corresponds to the amount of output current set by the 10 bit DAC code is ideally
instant, ignoring the ringing effects. If the driver is set so that the lens is moved from a resting position to point C with
direct mode, ringing and settling time will be at a maximum.
Direct mode is used either when M = 0 or when M = 1 and the present DAC code is less than the DAC code of point A.
M = 0 = ISRC mode disabled
When ISRC mode is disabled by setting the M bit equal to 0, the lens will traverse to the DAC code set for point C when
the EN bit is set equal to 1.
M = 1 = ISRC mode enabled
The driver automatically uses direct mode if the present DAC code is less than the target DAC code corresponding to
point A. Therefore during ISRC operation when the autofocus sequence has been started by setting the EN bit equal to
1, the driver will automatically decide to use direct mode to output current up to point A and then switch to step mode
before continuing the autofocus sequence.
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・Step B3 – Controlling Step Mode
Step mode is the control period in which the lens is moved by small output current steps. During step mode it is
possible to control the step resolution and step time in order to generate just enough output current to float the lens with
minimal ringing effects. Ringing can be better controlled by choosing a large value for the step time and a small value
for the step resolution with the trade off of a greater settling time. The step time and step resolution should be chosen
depending on the acceptable system limits of ringing vs. settling time.
Step mode is used when M = 1 and the present DAC code is in between point A and point B. Typically this mode is only
used during ISRC operation between point A and B, however it is possible to move the lens to point C using only step
mode if point C is set such that point C is only 1 DAC code greater than point B.
Step mode is controlled by the 5 bit step time, stt[4:0], and 3 bit step resolution, str[2:0], values stored in register
W2W1W0 = 100b.
Table 2. Step Time Settings
stt[4:0]
00000
00001
00010
00011
00100
00101
00110
00111
Step Time
-
stt[4:0]
01000
01001
01010
01011
01100
01101
01110
01111
Step Time
400 µs
450 µs
500 µs
550 µs
600 µs
650 µs
700 µs
750 µs
stt[4:0]
10000
10001
10010
10011
10100
10101
10110
10111
Step Time
800 µs
stt[4:0]
11000
11001
11010
11011
11100
11101
11110
11111
Step Time
1200 µs
1250 µs
1300 µs
1350 µs
1400 µs
1450 µs
1500 µs
1550 µs
50 µs
850 µs
100 µs
150 µs
200 µs
250 µs
300 µs
350 µs
900 µs
950 µs
1000 µs
1050 µs
1100 µs
1150 µs
Table 3. Step Resolution Settings
Step
Resolution
Step
Resolution
Step
Resolution
Step
Resolution
str[2:0]
000
str[2:0]
010
str[2:0]
str[2:0]
110
-
2 LSB
3 LSB
100
101
4 LSB
5 LSB
6 LSB
7 LSB
001
1 LSB
011
111
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・Step B4 – Controlling ISRC Mode
ISRC mode is the control period in which the lens is already floating and the driver smoothly moves the lens based on
the proprietary behavior of the ISRC algorithm. ISRC operation keeps ringing at a minimum while achieving the fastest
possible settling time based on the ISRC operational conditions.
ISRC mode is used when M = 1 and the present DAC code is greater than the DAC code for point B. If the target DAC
code for point C is set so that the value is too large and will cause excess ringing, the point C DAC code is automatically
updated with a driver pre-determined value to minimize the ringing effect. When M = 1, the driver will automatically
switch between direct mode, step mode, and ISRC mode when the point A, B, and C DAC code conditions are met.
The condition for this automatic transitioning to occur is when the register values for point A, point B, point C, step time,
and step resolution are all set to values other than 0 and then the sequence will start when the EN bit is set equal to 1.
C
B
ISRC DAC codes*
ISRC mode
A
*
ISRC DAC codes
the details of ISRC
operation are
proprietary
Step mode
Direct mode
0
Time (ms)
Start sequence
Figure 16. Three Modes Sequential Operation (Shown as DAC Codes)
0
Time (ms)
Sequence start point
Figure 17. Three Modes Sequential Operation (Shown as Lens Displacement)
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・Step B5 – Controlling the ISRC Settling Time
The settling time of an actuator is the time it takes for ringing to cease. The BU64240GWZ is able to control the settling
time by modifying the slew rate speed parameter, however care must be taken to balance settling time vs. acceptable
ringing levels. By increasing the slew rate speed there is the possibility to decrease the settling time but the ability to
control ringing is also decreased. Likewise if less ringing is desired then there is a possibility to reduce the ringing level
by using a slower slew rate speed setting at the cost of a longer settling time. The slew rate speed can be set by
modifying the 2 bit slew_rate[1:0] value in register W2W1W0 = 001b. Figure 18 shows the relationship of displacement
vs. settling time.
slew_rate [1:0] = 11b
slew_rate[1:0]=10b
slew_rate [1:0] = 01b
slew_rate [1:0] = 00b
0
C_DAC [9:0] update
Time(ms)
Figure 18. Displacement vs. Settling Time
Table 4. Slew Rate Speed Settings
Slew Rate
Speed
Slew Rate
Speed
Slew Rate
Speed
Slew Rate
Speed
slew_rate[1:0]
00
slew_rate[1:0]
01
slew_rate[1:0]
10
slew_rate[1:0]
11
Slowest
Slow
Fast
Fastest
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・Step B6 – DAC Code Update Timing Considerations
Settling time is controlled by the resonant frequency of the actuator and the driver’s slew rate speed setting. Depending
on the combination of these parameters, the settling time can be such that updating point C with a new DAC code before
the lens has settled at the original point C DAC code can adversely affect the settling time due to increased ringing
effects. Utilize the slew rate speed parameter in order to modify the settling time so that any updates to the point C
DAC code do not occur before the lens has settled.
Please review the following example based on an actuator with a resonant frequency of 100 Hz:
Table 5. Relationship Between Slew Rate Speed and Settling Time Based on a 100 Hz Actuator
f0
slew_rate[1:0]
Settling Time
52 ms
00
01
10
11
42 ms
100 Hz
26 ms
18 ms
In this example the settling time of the actuator can vary by up to ± 5 % due to the internal oscillator (MCLK) having a
variance of ± 5%. The settling time has a proportionally inverse relationship to the resonant frequency and therefore the
settling time can be estimated as:
Table 6. Relationship Between Slew Rate Speed and Settling Time Based on a General Resonant Frequency f0’
f0’
slew_rate[1:0]
Settling Time
00
01
10
11
52 * (100 / f0’) ms
42 * (100 / f0’) ms
26 * (100 / f0’) ms
18 * (100 / f0’) ms
f0’ Hz
Note that the orientation of the camera module can affect the settling time due to the influence of gravity on the lens.
・Step C1 – Power Save Operation
The BU64240GWZ can be set to enter power save mode either by setting the external power save pin = VPSL (typically
0 V). Please note that setting the external power save pin = VPSL will reset all 2-wire serial registers to 0.
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●Operational Notes
(1) Absolute maximum ratings
Use of the IC in excess of absolute maximum ratings such as the applied voltage or operating temperature range
(Topr) may result in IC damage. Assumptions should not be made regarding the state of the IC (short mode or open
mode) when such damage is incurred. The implementation of a physical safety measure such as a fuse should be
considered when there is use of the IC in a special mode where it’s anticipated that the absolute maximum ratings
may be exceeded.
(2) Power supply lines
Regenerated current may flow as a result of the motor's back electromotive force. Insert capacitors between the
power supply and ground pins to serve as a route for regenerated current. Determine the capacitance based on of
all the characteristics of an electrolytic capacitor due to the electrolytic capacitor possibly losing some capacitance at
low temperatures. If the connected power supply does not have sufficient current absorption capacity, regenerative
current will cause the voltage on the power supply line to rise, which combined with the product and its peripheral
circuitry may exceed the absolute maximum ratings. It is recommended to implement a physical safety measure
such as the insertion of a voltage clamp diode between the power supply and GND pins.
(3) Ground potential
Ensure a minimum GND pin potential in all operating conditions.
(4) Heat dissipation
Use a thermal design that allows for a sufficient margin regarding the power dissipation (Pd) during actual operating
conditions.
(5) Use in strong magnetic fields
Use caution when using the IC in the presence of a strong magnetic field as doing so may cause the IC to
malfunction.
(6) ASO
When using the IC, set the output transistor for the motor so that it does not exceed absolute maximum ratings or
ASO.
(7) Thermal shutdown circuit
This IC incorporates a TSD (thermal shutdown) circuit. If the temperature of the chip reaches the below
temperature, the motor coil output will be opened. The thermal shutdown circuit (TSD circuit) is designed only to
shut off the IC to prevent runaway thermal operation. It is not designed to protect the IC or to guarantee its
operation. Do not continue to use the IC after use of the TSD feature or use the IC in an environment where the its
assumed that the TSD feature will be used.
TSD ON temperature [°C]
(Typ.)
Hysteresis temperature [°C]
(Typ.)
150
20
(8) Ground Wiring Pattern
When using GND patterns for both small signal and large currents, it is recommended to isolate the two ground
patterns by placing a single ground point at the application's reference point. This will help to alleviate noise in the
small signal ground voltage due to noise created by the ground pattern wiring resistance for large current blocks. Be
careful not to change the GND wiring pattern of any external components.
(9) Power Save (PS) terminal
PS holds the reset function on logic concurrently. Please release PS after the start-up of VCC. Reset is not normally
done when VCC is short-circuited to PS and it uses it, and there is a possibility of malfunctions.
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BU64240GWZ
●Ordering Part Number (BU64240GWZ)
B U 6 4 2 4 0 G W Z
E2
Part Number
Package
GWZ: UCSP30L1
Packaging and forming specification
E2: Embossed tape and reel
●Physical Dimension Tape and Reel Information (BU64240GWZ)
UCSP30L1 (BU64240GWZ)
1PIN MARK
Lot No.
<Packing specification>
BF
Tape
Embossed carrier tape
3,000 pcs / reel
Quantity
1.30±0.03
E2
Direction of feed
(See neighboring image)
S
1234
1234
1234
1234
1234
1234
0.06
S
Direction of feed
1pin
Reel
6-φ0.20±0.05
0.05 A B
A
B
B
A
1
2
3
0.25±0.05
P=0.4×2
*Order quantity needs to be multiple of the minimum quantity.
(Unit: mm)
●Marking Diagram(TOP VIEW) (BU64240GWZ)
UCSP30L1 (BU64240GWZ)
Product Name
Lot No.
1PIN MARK
BF
X
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●Revision History
Date
Revision
001
Changes
31.May.2013
New Release
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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
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serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
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[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
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H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice - GE
Rev.002
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Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - GE
Rev.002
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General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
相关型号:
BU64291GWZ-TR
Voice Coil Motor Controller, 0.2A, PBGA6, 0.77 X 1.37 MM, 0.33 MM HEIGHT, ROHS COMPLIANT, UCSP-6
ROHM
BU64292GWZ
BU64292GWZ是单向音圈电机(VCM)用驱动器。而且,本驱动器内置ISRC(Intelligent slew rate control)功能,抑制VCM的振铃,充分发挥自动对焦功能。
ROHM
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