BV1HJC45EFJ-C
更新时间:2024-10-30 05:36:17
品牌:ROHM
描述:BV1HJC45EFJ-C是一款车载用单通道高边开关。内置输出异常模式接地故障检测功能(过电流限制功能)、电源故障检测功能、负载开路检测功能和、过热保护功能、低电压时输出OFF功能,还具有检测到异常时的诊断信息输出功能。
BV1HJC45EFJ-C 概述
BV1HJC45EFJ-C是一款车载用单通道高边开关。内置输出异常模式接地故障检测功能(过电流限制功能)、电源故障检测功能、负载开路检测功能和、过热保护功能、低电压时输出OFF功能,还具有检测到异常时的诊断信息输出功能。
BV1HJC45EFJ-C 数据手册
通过下载BV1HJC45EFJ-C数据手册来全面了解它。这个PDF文档包含了所有必要的细节,如产品概述、功能特性、引脚定义、引脚排列图等信息。
PDF下载Datasheet
Automotive IPD Series
Built-in Output Diagnosis
1ch High Side Switch
BV1HJC45EFJ-C
General Description
Key Specifications
BV1HJC45EFJ-C is a 1ch high side switch for automotive
application. It has a built-in overcurrent limit function,
thermal shutdown protection function, open load
detection function, low power output-OFF function and
short-to-VCC detection function. It is equipped with
diagnostic output function for abnormality detection.
◼
◼
◼
◼
◼
Power Supply Operating Range
ON-Resistance (Tj = 25 °C)
Overcurrent Limit
Standby Current (Tj = 25 °C)
Active Clamp Tolerance (Tj = 25 °C)
6 V to 28 V
45 mΩ (Typ)
5.0 A (Min)
0.5 µA (Max)
120 mJ
Package
HTSOP-J8
W (Typ) x D (Typ) x H (Max)
4.9 mm x 6.0 mm x 1.0 mm
Features
◼
◼
◼
◼
Built-in Dual TSD (Note 1)
AEC-Q100 Qualified (Note2)
Built-in Overcurrent Protection Function (OCP)
Built-in Thermal Shutdown Protection Function
(TSD)
◼
◼
◼
◼
◼
◼
◼
Built-in Open Load Detection Function
Built-in Short-to-VBB Detection Function
Built-in Low Voltage Output OFF Function (UVLO)
Built-in Reverse Battery Connection Protection
Built-in Diagnostic Output
Low On-Resistance Single Nch MOSFET Switch
Monolithic power management IC with control unit
(CMOS) and power MOSFET mounted on a single
chip
(Note 1) Two type of built-in temperature protection:
Junction temperature, and ΔTj protection that detects sudden temperature rise
of the Power-MOS
(Note 2) Grade 1
Application
◼
Resistance load, inductance load and capacitance
load for automotive application
Typical Application Circuit
RST1PU
RST2PU
VBB
CVBB
RIN
IN
RST1
ST1
ST2
MCU
OUT
BV1HJC45EFJ-C
RL
RST2
GND
○Product structure: Silicon integrated circuit ○This product has no designed protection against radioactive rays
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Contents
General Description........................................................................................................................................................................1
Features..........................................................................................................................................................................................1
Application ......................................................................................................................................................................................1
Key Specifications ..........................................................................................................................................................................1
Package..........................................................................................................................................................................................1
Typical Application Circuit ...............................................................................................................................................................1
Contents .........................................................................................................................................................................................2
Pin Configuration ............................................................................................................................................................................3
Pin Description................................................................................................................................................................................3
Block Diagram ................................................................................................................................................................................3
Definition.........................................................................................................................................................................................4
Absolute Maximum Ratings ............................................................................................................................................................5
Recommended Operating Conditions.............................................................................................................................................5
Thermal Resistance........................................................................................................................................................................6
Electrical Characteristics...............................................................................................................................................................10
Typical Performance Curves.........................................................................................................................................................11
Measurement Circuit.....................................................................................................................................................................16
Switching Time Measurement Condition................................................................................................................................18
Timing Chart .................................................................................................................................................................................19
Function Description.....................................................................................................................................................................20
Application Circuit Diagram...........................................................................................................................................................25
I/O Equivalence Circuits................................................................................................................................................................26
Operational Notes.........................................................................................................................................................................27
Ordering Information.....................................................................................................................................................................29
Marking Diagram ..........................................................................................................................................................................29
Physical Dimension and Packing Information...............................................................................................................................30
Revision History............................................................................................................................................................................31
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Pin Configuration
(TOP VIEW)
1
8
IN
GND
ST1
ST2
OUT
7
6
5
2
3
4
OUT
OUT
OUT
EXP-PAD = VBB
Pin Description
Pin No.
Pin Name
IN
Function
Input pin. Pull-down resistor is connected internally.
Active High to turn on the switch.
Ground pin
1
2
GND
ST1
ST2
3
4
Self–diagnostic output pin 1
Self-diagnostic output pin 2
Switch output pin
5
OUT
OUT
OUT
OUT
VBB
6
Switch output pin
7
8
Switch output pin
Switch output pin
EXP-PAD
Power input pin, switch input pin
Block Diagram
VBB
lnternal
supply
UVLO
clamp
charge
pump
IN
Gate Driver
Over current
detction
Control
Logic
Power
limitation
thermal
shut down
ST1
ST2
Open load
detection
Battery short
detection
OUT
Reverse
Battery
GND
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Definition
IBB
VBB
VDS VBB
IOUT
OUT
IIN
IN
VOUT
IST
ST1,ST2
VST
GND
IGND
Figure 1. Voltage and Current Definition
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Absolute Maximum Ratings (Ta = 25 °C)
Parameter
Symbol
Rating
Unit
VBB - OUT Voltage
VDS
VBB
VIN
-0.3 to Internal clamp (Note 1)
-0.3 to +40
V
V
Power Supply Voltage
Input Voltage
-0.3 to +7.0
- 0.3 to +7.0
Internal limit (Note 2)
10
V
Diagnostic Output Voltage
Output Current
VST
IOUT
IST
V
A
Diagnostic Output Current
Junction Temperature Width
Storage Temperature Range
Maximum Junction Temperature
mA
°C
°C
°C
Tj
-40 to +150
-55 to +150
+150
Tstg
Tjmax
Active Clamp Energy (Single Pulse)
Tj(START) = 25 °C, IOUT = 2 A (Note 3) (Note 4)
EAS (25 °C)
EAS (150 °C)
VBBLIM
120
60
mJ
mJ
V
Active Clamp Energy (Single Pulse)
Tj(START) = 150 °C, IOUT = 2 A(Note 3)(Note 4)
Supply Voltage
28
for Short Circuit Protection (Note 5)
Supply Voltage
for Reverse-Battery Connection Protection
VRBPLIM
18
V
(Note 1) Internally limited by output clamp voltage.
(Note 2) Internally limited by fixed over current limit.
(Note 3) Maximum active clamp energy using single pulse of IOUT(START) = 2 A and VBB = 14 V.
(Note 4) Not 100% tested.
(Note 5) Maximum power supply voltage that can detect short circuit protection.
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
Caution 3: When IC turns off with an inductive load, reverse energy is generated. This energy can be calculated by the following equation:
1
푉퐵퐵
2
퐸퐿
=
× 퐿 × 퐼푂푈푇 푆푇퐴푅푇 × ꢀ1 −
ꢁ
(
)
2
푉퐵퐵 − 푉퐷푆
Where:
L is the inductance of the inductive load.
IOUT(START) is the output current at the time of turning off.
The BV1HJC45EFJ-C integrates the active clamp function to internally absorb the reverse energy EL which is generated when the inductive load is
turned off. When the active clamp operates, the thermal shutdown function does not work. Decide a load so that the reverse energy EL is active
clamp tolerance EAS (refer to Figure 23. Active Clamp Energy vs Output Current) or under when inductive load is used.
Recommended Operating Conditions
Min
Typ
Max
Parameter
Symbol
Unit
Power Supply Voltage Operating Range
Operating Temperature
VBB
Topr
fIN
6
-40
-
14
-
28
+150
1
V
°C
Input Frequency
-
kHz
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Thermal Resistance(Note 1)
Parameter
Symbol
Typ
Unit
Condition
HTSOP-J8
(Note 2)
130.3
36.8
25.9
20
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
1s
2s
Between Junction and Surroundings Temperature
(Note 3)
(Note 4)
(Note 2)
(Note 3)
(Note 4)
θJA
Thermal Resistance
2s2p
1s
Between Junction and the top center
of the outside surface of the component package
Thermal Characterization Parameter (Note 5)
ΨJT
8
2s
6
2s2p
(Note 1) The thermal impedance is based on JESD51-2A (Still-Air) standard. It is used the chip of BV1HJC45EFJ-C.
(Note 2) JESD51-3 standard FR4 114.3 mm x 76.2 mm x 1.57 mm 1-layer (1s)
(Top copper foil: ROHM recommended Footprint + wiring to measure, 2 oz. copper.)
(Note 3)JESD51-5 standard FR4 114.3 mm x 76.2 mm x 1.60 mm 2-layers (2s)
(Top copper foil: ROHM recommended Footprint + wiring to measure/
Copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm,
copper (top & reverse side) 2 oz)
(Note 4) JESD51-5/-7 standard FR4 114.3 mm x 76.2 mm x 1.60 mm 4-layers (2s2p)
(Top copper foil: ROHM recommended Footprint + wiring to measure/
2 inner layers and copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm,
copper (top & reverse side/inner layers) 2 oz/1 oz)
(Note 5) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface
of the component package.
■
PCB Layout 1 layer (1s)
Footprint
100 mm2
600 mm2
1200 mm2
Figure 2. PCB Layout 1 Layer (1s)
Dimension
Value
Board Finish Thickness
Board Dimension
1.57 mm ± 10 %
76.2 mm x 114.3 mm
FR4
Board Material
Copper Thickness (Top Layer)
Copper Foil Area Dimension
0.070 mm (Cu: 2 oz)
Footprint/100 mm2/600 mm2/1200 mm2
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Thermal Resistance – continued
■
PCB Layout 2 layers (2s)
Top Layer
Bottom Layer
Top Layer
Bottom Layer
Via
Isolation Clearance Diameter: ≥ 0.6 mm
Cross Section
Figure 3. PCB Layout 2 Layers (2s)
Dimension
Board Finish Thickness
Board Dimension
Value
1.60 mm ± 10 %
76.2 mm x 114.3 mm
FR4
Board Material
Copper Thickness (Top/Bottom Layers)
Thermal Vias Separation/Diameter
0.070 mm (Cu + Plating)
1.2 mm/0.3 mm
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Thermal Resistance – continued
■
PCB Layout 4 layers (2s2p)
TOP Layer
2nd/Bottom Layers
3rd Layer
Top Layer
2nd Layer
3rd Layer
Bottom Layer
Via
Isolation Clearance Diameter: ≥ 0.6 mm
Cross Section
Figure 4. PCB Layout 4 Layers (2s2p)
Dimension
Board Finish Thickness
Value
1.60 mm ± 10 %
Board Dimension
76.2 mm x 114.3 mm
FR4
Board Material
Copper Thickness (Top/Bottom Layers)
Copper Thickness (Inner Layers)
Thermal Vias Separation/Diameter
0.070 mm (Cu + Plating)
0.035 mm
1.2 mm/0.3 mm
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Thermal Resistance – continued
■
Transient Thermal Resistance (Single Pulse)
Figure 5. Transient Thermal Resistance
■
Thermal Resistance (θJA vs Copper foil area- 1s)
Figure 6. Thermal Resistance
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Electrical Characteristics (unless otherwise specified VBB = 6 V to 28 V, Tj = -40 °C to 150 °C)
Limit
Parameter
Power Supply
Symbol
Unit
Condition
Min
Typ
Max
VBB = 14 V, VIN = 0 V,
VOUT = 0 V, Tj = 25 °C
IBBL1
IBBL2
-
-
-
-
0.5
20
µA
µA
Standby current
VBB = 14 V, VIN = 0 V,
VOUT = 0 V, Tj = 150 °C
Operating Current
IBBH
-
-
-
2.0
3.5
5.0
1.0
mA
V
VBB = 14 V, VIN = 5 V, VOUT = open
UVLO Detection Voltage
UVLO Hysteresis Voltage
Input
VUVLO
VUVHYS
-
-
V
High Level Input Voltage
Low Level Input Voltage
Input Hysteresis Voltage
High Level Input Current
Low Level Input Current
Power MOS Output
VINH
VINL
VHYS
IINH
2.1
-
-
-
V
V
-
-
0.9
-
0.3
50
-
V
-
150
+10
µA
µA
VIN = 5 V
VIN = 0 V
IINL
-10
RON1
RON2
-
-
45
-
60
90
mΩ
mΩ
mΩ
μA
VBB = 8 V to 28 V, Tj = 25 °C
VBB = 8 V to 28 V, Tj = 150 °C
VBB = 6 V, Tj = 25 °C
Output ON Resistance
RON3
-
-
75
IOUTL1
IOUTL2
SRON
SROFF
tOUTON
tOUTOFF
VDS
-
-
0.5
10
VIN = 0 V, VOUT = 0 V, Tj = 25 °C
VIN = 0 V, VOUT = 0 V, Tj = 150 °C
VBB = 14 V, RL = 6.5 Ω
Output Leak Current
-
-
μA
Output Slew Rate when ON
Output Slew Rate when OFF
Propagation Delay when ON
Propagation Delay when OFF
Output Clamp Voltage
-
0.3
0.3
60
60
50
1.0
1.0
120
120
55
V/µs
V/µs
µs
-
VBB = 14 V, RL = 6.5 Ω
-
VBB = 14 V, RL = 6.5 Ω
-
µs
VBB = 14 V, RL = 6.5 Ω
45
V
VIN = 0 V, IOUT = 10 mA
Diagnostics
Diagnostic Output L Voltage
Diagnostic Output Leak Current
VSTL
ISTL
-
-
-
-
0.5
10
V
IST = 1 mA
VST = 5 V
µA
Propagation Delay Time when
Diagnostic Output is ON
tSTON
-
-
120
50
240
100
µs
µs
VBB = 14 V, RL = 6.5 Ω
VBB = 14 V, RL = 6.5 Ω
Propagation Delay Time when
Diagnostic Output is OFF
tSTOFF
Protection Circuit
Overcurrent Limit Value
ILIM
VSHV
VOLD
IOLD
5.0
8.0
12.0
A
V
VDS = 5 V
Short-to-VCC Detection Voltage
Load Open Detection Voltage
Load Open Detection Sink Current
Thermal Shutdown (Note 1)
VBB-1.8 VBB-1.2 VBB-0.5
VIN = 0 V
2.0
3.0
10
4.0
30
200
-
V
VIN = 0 V
-
µA
°C
°C
°C
VIN = 0 V, VOUT = 5 V
TTSD
150
175
15
Thermal Shutdown Hysteresis (Note 1)
TTSDHYS
TDTJ
-
-
∆Tj Protection Temperature (Note 1)
120
-
(Note 1) Not 100% tested.
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Typical Performance Curves
(Unless otherwise specified VBB = 14 V, IN = 5 V, Tj = 25 °C)
0.5
0.4
0.3
0.2
0.1
0
20
15
10
5
0
0
5
10 15 20 25 30 35 40
Power Supply Voltage: VBB [V]
-50
0
50
100
150
Junction Temperature: Tj [ºC]
Figure 7. Standby Current vs Power Supply Voltage
Figure 8. Standby Current vs Junction Temperature
4.5
4
4.5
4
3.5
3
3.5
3
2.5
2
2.5
2
1.5
1
1.5
1
0.5
0
0.5
0
0
5
10 15 20 25 30 35 40
Power Supply Voltage: VBB [V]
-50
0
50
100
150
Junction Temperature: Tj [ºC]
Figure 9. Circuit Current vs Power Supply Voltage
Figure 10. Circuit Current vs Junction Temperature
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Typical Performance Curves - continued
(Unless otherwise specified VBB = 14 V, IN = 5 V, Tj = 25 °C)
6
5
4
3
2
1
0
2.5
2.0
1.5
1.0
0.5
0.0
VINH
VINL
-50
0
50
100
150
-50
0
50
100
150
Junction Temperature: Tj [ºC]
Junction Temperature: Tj [°C]
Figure 11. UVLO Detection Voltage vs Junction Temperature
Figure 12. Input Voltage vs Junction Temperature
100
90
80
70
60
50
40
30
20
10
0
90
80
70
60
50
40
30
20
10
0
-50
0
50
100
150
0
5
10 15 20 25 30 35 40
Power Supply Voltage: VBB [V]
Junction Temperature: Tj [ºC]
Figure 13. Input Current vs Junction Temperature
Figure 14. Output ON Resistance vs Supply Voltage
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Typical Performance Curves - continued
(Unless otherwise specified VBB = 14 V, IN = 5 V, Tj = 25 °C)
90
80
70
60
50
40
30
20
10
0
10
8
6
4
2
0
0
50
100
150
-50
0
50
100
150
Junction Temperature: Tj [°C]
Junction Temperature: Tj [ºC]
Figure 15. Output ON Resistance vs Junction Temperature
Figure 16. Output leak Current vs Junction Temperature
1.2
1.0
0.8
0.6
175
150
125
100
tOUTON
75
tOUTOFF
0.4
SROFF
50
25
0
0.2
SRON
0.0
-50
0
50
100
150
-50
0
50
100
150
Junction Temperature: Tj [ºC]
Junction Temperature: Tj [ºC]
Figure 17. Output Slew Rate vs Junction Temperature
Figure 18. Output ON, OFF Propagation Delay Time
vs Junction Temperature
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Typical Performance Curves - continued
(Unless otherwise specified VBB = 14 V, IN = 5 V, Tj = 25 °C)
55
53
51
49
47
45
43
41
0.5
0.4
0.3
0.2
0.1
0.0
-50
0
50
100
150
Junction Temperature: Tj [ºC]
-50
0
50
100
150
Figure 19. Output Clamp Voltage vs
Junction Temperature
Junction Temperature: Tj [ºC]
Figure 20. Diagnostic Output Low Voltage
vs Junction Temperature
250
200
150
100
50
5
4
3
2
1
0
tSTON
tSTOFF
0
-50
0
50
100
150
-50
0
50
100
150
Junction Temperature: Tj [ºC]
Junction Temperature: Tj [ºC]
Figure 21. Diagnostic Output ON, OFF
Propagation Delay Time vs Junction Temperature
Figure 22. Open Load Detection Voltage
vs Junction Temperature
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Typical Performance Curves - continued
(Unless otherwise specified VBB = 14 V, IN = 5 V, Tj = 25 °C)
Tj(start) = 25 ºC
1000
100
Tj(start) = 150 ºC
10
0.1
1.0
10.0
Output Current: IOUT [A]
Figure 23. Active Clamp Energy vs Output Current
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Measurement Circuit
VBB
VBB
VBB
ST1, ST2
VBB
ST1, ST2
IN
IN
VIN
VIN
OUT
OUT
GND
GND
Figure 24. Standby Current
Low-Level Input Current
Figure 25. Operating Current
Output Leak Current
Diagnostic Output Leak Current
VBB
VBB
VBB
VBB
IN
IN
ST1, ST2
ST1, ST2
VIN
OUT
VIN
OUT
GND
GND
1 kΩ
Figure 26. UVLO Detection Voltage
UVLO Hysteresis Voltage
High Level Input Voltage
Low Level Input Voltage
Input Hysteresis Voltage
High Level Input Current
Thermal Shutdown
Figure 27. Output ON Resistance
Output Clamp Voltage
Thermal Shutdown Hysteresis
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Measurement Circuit - continued
VBB
VBB
VBB
ST1, ST2
VBB
IN
IN
10 kΩ
ST1, ST2
Monitor
Monitor
IST
VIN
VIN
OUT
OUT
Monitor
GND
1 kΩ
GND
6.5 Ω
Figure 28. Output ON Slew Rate
Output OFF Slew Rate
Figure 29. Diagnostic Output Low Voltage
Output ON Propagation Delay Time
Output OFF Propagation Delay Time
Diagnostic Output ON Propagation Delay Time
Diagnostic Output OFF Propagation Delay Time
VBB
VBB
IN
10 kΩ
ST1, ST2
OUT
GND
Figure 30. Open Load Detection Voltage
Open Load Detection Sink Current
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Switching Time Measurement Condition
VBB
VINL
VINH
SRON
VBB
OUT
IN
tOUTOF
80 %
5 V
IN
80 %
20 %
20 %
OUT
10 kΩ 10 kΩ
6.5 Ω
tOUTON
SROF
ST1
ST2
ST1
ST2
GND
tSTON
tSTOFF
Figure 31. Switching Time Measurement Diagram
Figure 32. Switching Time Measurement Waveform
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Timing Chart
VBB
IN
VINH
VINL
tOUTOFF
SRON
20 %
80 %
80 %
20 %
OUT
tOUTON
SROFF
ST1
ST2
tSTON
tSTOFF
Figure 33. Timing Chart
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Function Description
1. Protection Function
Table 1. Detection and Release Conditions of Each Protection Function and Diagnostic Output
Mode
Conditions
IN
ST1
ST2
Standby
Operating
-
Low
High
Low
Low
Low
Low
High
High
High
High
High
High
High
High
High
Low
Low
High
Low
Low
High
Low
High
Low
High
Low
High
Low
High
High
High
High
Normal
Condition
-
Detect VOUT ≥ 3.0 V (Typ)
Release VOUT ≤ 2.4 V (Typ)
Detect VOUT > VBB - 1.2 V (Typ)
Release VOUT < VBB - 2.0 V (Typ)
Detect VBB ≤ 5.0 V (Max)
Release VBB ≥ 6.0 V (Max)
Detect Tj ≥ 175 °C (Typ)
Release Tj ≤ 160 °C (Typ)
Detect ΔTj ≥ 120 °C (Typ)
Release ΔTj ≤ 80 °C (Typ)
Detect IOUT ≥ 8.0 A (Typ)
Release IOUT < 8.0 A (Typ)
Open Load Detect (OLD)
Short to VBB Detection
Low
High
High
High
High
High
High
High
High
High
Low Voltage Output OFF
(UVLO)
Thermal Shutdown
(TSD) (Note 1)
ΔTj Protection (Note 2)
Over Current Protection
(OCP)
(Note 1) Thermal shutdown is automatically restored to normal operation.
(Note 2) Protect function by detecting PowerMOS sharp increase of temperature difference with control circuit.
This IC has a built-in protection detection function as mentioned above and outputs the abnormal condition
with ST1 and ST2 pins.
ST1 is output for output detect and each protect function.
ST1 change from High to Low when OUT rise by near VBB during normal operation.
And change from Low to High when detect each protection or OUT is less than VBB - 1.2 V (Typ).
ST2 is output for open load detection and Short to VBB detection during IN = Low.
It is self-rest and operation becomes normal when each protection releases after detecting.
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Function Description - continued
2. Overcurrent Protection
This IC has a built-in overcurrent protection function. When overcurrent flows in the output, the output current is limited
to 8.0 A (Typ) and self-diagnostic output 1 (ST1) becomes High.
3. Thermal Shutdown and ΔTj Protection Detection
3.1 Thermal Shutdown Protection
This IC has a built-in thermal shutdown protection function. When the IC chip temperature exceeds175 °C (Typ), the
output is turned OFF and self-diagnostic output 1 (ST1) becomes High. When the temperature goes below 160 °C
(Typ), output will self-reset and operation becomes normal.
3.2 ΔTj Protection
This IC has a built-in ΔTj protection function that turns OFF the output when the temperature difference (TDTJ
)
between the POWER-MOS unit (TPOWER-MOS) and the control unit (TAMB) in the IC is 120 °C (Typ) or more. ΔTj
protection also has a built-in hysteresis (TDTJHYS) that returns the output to normal state when the temperature
difference becomes 80 °C (Typ) or less.
Figure 34 shows the timing chart of thermal shutdown protection and ΔTj protection during output short to GND fault.
IN
ILIMH
IOUT
TTSD
TPOWER-MOS
TTSDHYS
TAMB
TDTJHYS
TDTJ
TSD
Operation
ΔTj Protection Operation
ST1
TSD Detect
TSD Release
(Note 1)
Figure 34. Thermal Shutdown Protection and ΔTj Protection Timing Chart
(Note 1) When output voltage falls to output ON detection voltage (VSHV) or less at the output to GND is shorted or rare short, IC is judged that the output
voltage is abnormal. Hence, ST1, ST2 may not be able to turn low.
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Function Description - continued
4. Open Load Detection
VBB
5 V
VBB
SOLD
ROLD
OUT
IN
Internal
supply
SW1
RL
ST1
ST2
R1
R2
logic
R
PD
VOLD
Figure 35. Open Load Detection Block Diagram
Open load can be detected by connecting an external resistance ROLD between power supply VBB and output.
When output load is disconnected during input is low, diagnostic output the ST1 pin is turned to low to indicate abnormality.
To reduce the standby current of the system, an open load resistance switch SOLD is recommended.
When the SW1 is OFF, voltage of the OUT does not fall to GND level. Because, when the IN pin is low, the voltage of the
OUT pin does not become under or equal to the Output ON Detection Voltage (VDSDET). To pulled down the OUT pin, pulled
down resistance RPD is recommended. The resistance RPD is 4.3 kΩ or less for outflow current from the OUT pin.
4.1 When the OUT is pulled down by the load (Normal function)
The value of external resistance ROLD is decided based on used minimum power supply voltage (VBB), internal
resistance R1 and R2 and open detection voltage VOLD. External resistance RPD is unnecessary.
The equation for calculating the ROLD value is shown below.
ꢅ
ꢆꢆ
× ꢇ ꢈ
ꢅ
+ ꢈ
ꢋ
ꢊ(푀푖푛)
ꢉ(푀푖푛)
푅ꢂꢃꢄ
<
− ꢇ 푅ꢏ(ꢐꢑꢒ) ꢓ 푅ꢔ(ꢐꢑꢒ) ꢋ [Ω]
ꢌꢍꢎ(Max)
The above formula is summarized as follows.
푅ꢂꢃꢄ < 푉ꢕꢕ × 75 × 103 − ꢖ00 × 103 [Ω]
ROLD value is fell below the above calculated result.
4.2 If the SW is OFF, the output is no longer pulled down by the load
The value of external resistance ROLD is decided based on used minimum power supply voltage (VBB), external
resistance RPD and open detection voltage VOLD
.
The equation for calculating the ROLD value is shown below.
ꢅ
× ꢈ
푃ꢎ
ꢆꢆ
푅ꢂꢃꢄ
<
− 푅ꢗꢄ [Ω]
ꢅ
ꢌꢍꢎ(Max)
When RPD is 4.3 kΩ, the above formula is summarized as follows.
푅ꢂꢃꢄ < 푉ꢕꢕ × 1.075 × 103 − 4.ꢖ × 103 [Ω]
ROLD value is fell below the above calculated result
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Function Description - continued
5. Other Detection
5.1 GND open protection
5 V
VBB
Clamp
IN
Internal
supply
ST1
ST2
Control
logic
OUT
GND
Figure 36. GND Open Detection Block Diagram
When GND of the IC is open, the output is switched OFF regardless of the input voltage.
However, self-diagnostic output (ST1, ST2) is not flagged. When an inductive load is connected,
the active clamp operates when the GND pin is open
5.2 Reverse-Battery Connection Protection
VBB
clamp
DRV
OUT
Reverse
Battery
VBAT
GND
Figure 37. Reverse-Battery Connection Block Diagram
When the battery connection is reversed, an excessive amount of current will flow to internal part of IC
and this may sometimes lead to IC destruction.
As a countermeasure, this IC has a built-in reverse battery connection protection function without external
components such as resistors and diodes.
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Function Description - continued
5.3 MCU I/O Protection
VBB
5 V
Internal
supply
Clamp
IN
ST1
ST2
Control
logic
OUT
MCU
GND
Figure 38. MCU I/O Protection
Negative surge voltage to the IN pin, the ST1 pin and the ST2 pin may cause damage to the MCU's I/O pins. In order to
prevent those damages, it is recommended to insert limiting resistors between IC pins and MCU.
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Application Circuit Diagram
RST1PU
RST2PU
VBB
CVBB
RIN
IN
ROLD
OUT
RST1
ST1
ST2
MCU
BV1HJC45EFJ-C
RPD
RL
RST2
GND
Figure 39. Application Circuit Diagram
Symbol
Value
Purpose
RIN
4.7 kΩ
4.7 kΩ
10 kΩ
1 µF
Limit resistance for negative surge
Limit resistance for negative surge
RST1, RST2
RST1PU, RST2PU
CVBB
Pull up ST1/ST2 pin to MCU power supply, these pins are open drain output
For battery line voltage spike filter
RPD
4.3 kΩ
2 kΩ
For output pulled down
ROLD
For open load detection
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I/O Equivalence Circuits
IN
ST1, ST2
10 kΩ
150 Ω
ST1
ST2
IN
100 kΩ
VBB
VBB
OUT
VBB
OUT
227 kΩ
273 kΩ
VBB
Resistance values shown in the diagrams above are typical values.
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Operational Notes
1.
2.
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3.
4.
Ground Voltage
Except for pins the output and the input of which were designed to go below ground, ensure that no pins are at a
voltage below that of the ground pin at any time, even during transient condition.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5.
6.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
characteristics.
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,
and routing of connections.
7.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
8.
9.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
10. Ceramic Capacitor
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
11. Thermal Shutdown Function (TSD)
This IC has a built-in thermal shutdown function that prevents heat damage to the IC. Normal operation should
always be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued
period, the junction temperature (Tj) will rise which will activate the TSD function that will turn OFF power output pins.
When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD function operates in a situation that exceeds the absolute maximum ratings and therefore, under
no circumstances, should the TSD function be used in a set design or for any purpose other than protecting the IC
from heat damage.
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Operational Notes – continued
12. Over Current Protection Function (OCP)
This IC incorporates an integrated overcurrent protection function that is activated when the load is shorted. This
protection function is effective in preventing damage due to sudden and unexpected incidents. However, the IC
should not be used in applications characterized by continuous operation or transitioning of the protection function.
13. Active Clamp Operation
The IC integrates the active clamp function to internally absorb the reverse energy EL which is generated when the
inductive load is turned off. When the active clamp operates, the thermal shutdown function does not work. Decide a
load so that the reverse energy EL is active clamp tolerance EAS (refer to Figure 23. Active Clamp Energy vs Output
Current) or under when inductive load is used.
14. Open Power Supply Pin
When the power supply pin (VBB) becomes open at ON (IN = High), the output is switched to OFF regardless of
input voltage. If an inductive load is connected, the active clamp operates when VBB is open and becomes the same
potential as that on the ground. At this time, the output voltage drops down to -50 V (Typ).
15. Open GND Pin
When the GND pin becomes open at ON (IN = High), the output is switched to OFF regardless of input voltage. If an
inductive load is connected, the active clamp operates when the GND pin is open.
16. OUT Pin Voltage
Ensure that keep OUT pin voltage less than (VBB + 0.3 V) at any time, even during transient condition.
Otherwise malfunction or other problems can occur.
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Ordering Information
B V 1 H J C 4 5 E F
J
-
CE 2
V1: 1ch
H: High side switch
Package
EFJ: HTSOP-J8
Product Rank
C: Automotive product
Packaging and Forming Specification
E2: Embossed tape and reel
Marking Diagram
HTSOP-J8 (TOP VIEW)
Part Number Marking
1 H J C 4 5
LOT Number
Pin 1 Mark
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Physical Dimension and Packing Information
Package Name
HTSOP-J8
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Revision History
Date
Revision
Changes
03.Sep.2021
001
New Release
P.5 Absolute Maximum Ratings
Change the condition of EAS from IOUT = 4 A to IOUT = 2 A.
P.6 Thermal Resistance
Figure 2 - Change the size of PCB layout.
P.15 Typical Performance Curves
09.Feb.2023
002
Figure 23 - Change the graph of EAS
.
P.28 Operational Notes
14. Open Power Supply Pin
Change the value of output clamp voltage.
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Notice
Precaution on using ROHM Products
(Note 1)
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅣ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PAA-E
Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Daattaasshheeeett
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE
Rev.001
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BV1HJC45EFJ-C 相关器件
型号 | 制造商 | 描述 | 价格 | 文档 |
BV1HL045EFJ-C | ROHM | BV1HL045EFJ-C是车载用1ch高边开关。内置输出异常模式,即地线短接检测(过电流限制功能)、电源短接检测功能、负载开路检测功能,以及过热保护功能、低电压时输出OFF功能,具有异常检出时诊断输出功能。过电流限制值为2.5A~5.5A。还备有过电流限制值为5.0A~12.0A的BV1HJ045EFJ-C。 | 获取价格 | |
BV1HLC45EFJ-C | ROHM | BV1HLC45EFJ-C是一款车载用单通道高边开关。内置输出异常模式接地故障检测功能(过电流限制功能)、电源故障检测功能、负载开路检测功能和、过热保护功能、低电压时输出OFF功能,还具有检测到异常时的诊断信息输出功能。 | 获取价格 | |
BV1HV050FJ-C | ROHM | BV1HV050FJ-C is a 1ch high side switch for automotive application. It has a built in hiccup mode o | 获取价格 | |
BV1LA025EFJ-C | ROHM | BV1LA025EFJ-C 是车载用1ch低边开关。内置Dual TSD、OCP、有源钳位功能。 | 获取价格 | |
BV1LB025EFJ-C | ROHM | BV1LB025EFJ-C是车载用1ch低边开关。内置Dual TSD、OCP、有源钳位功能。 | 获取价格 | |
BV1LB028FPJ-C | ROHM | BV1LB028FPJ-C是车载用1ch低边开关。内置过电流限制电路、过热保护电路、有源钳位电路。 | 获取价格 | |
BV1LB045FPJ-C | ROHM | BV1LB045FPJ-C是车载用1ch低边开关。内置过电流保护功能、过热保护功能、有源钳位功能。 | 获取价格 | |
BV1LB085FJ-C | ROHM | BV1LB085FJ-C是车载用1ch低边开关。内置过电流限制电路、过热保护电路、有源钳位电路。 | 获取价格 | |
BV1LB085FJ-CE2 | ROHM | Buffer/Inverter Based Peripheral Driver, | 获取价格 | |
BV1LB150FJ-C | ROHM | BV1LB150FJ-C是车载用1ch低边开关。内置过电流限制电路、过热保护电路、有源钳位电路。 | 获取价格 |
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