BV1HJC45EFJ-C

更新时间:2024-10-30 05:36:17
品牌:ROHM
描述:BV1HJC45EFJ-C是一款车载用单通道高边开关。内置输出异常模式接地故障检测功能(过电流限制功能)、电源故障检测功能、负载开路检测功能和、过热保护功能、低电压时输出OFF功能,还具有检测到异常时的诊断信息输出功能。

BV1HJC45EFJ-C 概述

BV1HJC45EFJ-C是一款车载用单通道高边开关。内置输出异常模式接地故障检测功能(过电流限制功能)、电源故障检测功能、负载开路检测功能和、过热保护功能、低电压时输出OFF功能,还具有检测到异常时的诊断信息输出功能。

BV1HJC45EFJ-C 数据手册

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Datasheet  
Automotive IPD Series  
Built-in Output Diagnosis  
1ch High Side Switch  
BV1HJC45EFJ-C  
General Description  
Key Specifications  
BV1HJC45EFJ-C is a 1ch high side switch for automotive  
application. It has a built-in overcurrent limit function,  
thermal shutdown protection function, open load  
detection function, low power output-OFF function and  
short-to-VCC detection function. It is equipped with  
diagnostic output function for abnormality detection.  
Power Supply Operating Range  
ON-Resistance (Tj = 25 °C)  
Overcurrent Limit  
Standby Current (Tj = 25 °C)  
Active Clamp Tolerance (Tj = 25 °C)  
6 V to 28 V  
45 mΩ (Typ)  
5.0 A (Min)  
0.5 µA (Max)  
120 mJ  
Package  
HTSOP-J8  
W (Typ) x D (Typ) x H (Max)  
4.9 mm x 6.0 mm x 1.0 mm  
Features  
Built-in Dual TSD (Note 1)  
AEC-Q100 Qualified (Note2)  
Built-in Overcurrent Protection Function (OCP)  
Built-in Thermal Shutdown Protection Function  
(TSD)  
Built-in Open Load Detection Function  
Built-in Short-to-VBB Detection Function  
Built-in Low Voltage Output OFF Function (UVLO)  
Built-in Reverse Battery Connection Protection  
Built-in Diagnostic Output  
Low On-Resistance Single Nch MOSFET Switch  
Monolithic power management IC with control unit  
(CMOS) and power MOSFET mounted on a single  
chip  
(Note 1) Two type of built-in temperature protection:  
Junction temperature, and ΔTj protection that detects sudden temperature rise  
of the Power-MOS  
(Note 2) Grade 1  
Application  
Resistance load, inductance load and capacitance  
load for automotive application  
Typical Application Circuit  
RST1PU  
RST2PU  
VBB  
CVBB  
RIN  
IN  
RST1  
ST1  
ST2  
MCU  
OUT  
BV1HJC45EFJ-C  
RL  
RST2  
GND  
Product structure: Silicon integrated circuit This product has no designed protection against radioactive rays  
www.rohm.com  
© 2021 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 14 • 001  
TSZ02201-0G5G1G400110-1-2  
09.Feb.2023 Rev.002  
1/31  
 
 
 
 
 
 
BV1HJC45EFJ-C  
Contents  
General Description........................................................................................................................................................................1  
Features..........................................................................................................................................................................................1  
Application ......................................................................................................................................................................................1  
Key Specifications ..........................................................................................................................................................................1  
Package..........................................................................................................................................................................................1  
Typical Application Circuit ...............................................................................................................................................................1  
Contents .........................................................................................................................................................................................2  
Pin Configuration ............................................................................................................................................................................3  
Pin Description................................................................................................................................................................................3  
Block Diagram ................................................................................................................................................................................3  
Definition.........................................................................................................................................................................................4  
Absolute Maximum Ratings ............................................................................................................................................................5  
Recommended Operating Conditions.............................................................................................................................................5  
Thermal Resistance........................................................................................................................................................................6  
Electrical Characteristics...............................................................................................................................................................10  
Typical Performance Curves.........................................................................................................................................................11  
Measurement Circuit.....................................................................................................................................................................16  
Switching Time Measurement Condition................................................................................................................................18  
Timing Chart .................................................................................................................................................................................19  
Function Description.....................................................................................................................................................................20  
Application Circuit Diagram...........................................................................................................................................................25  
I/O Equivalence Circuits................................................................................................................................................................26  
Operational Notes.........................................................................................................................................................................27  
Ordering Information.....................................................................................................................................................................29  
Marking Diagram ..........................................................................................................................................................................29  
Physical Dimension and Packing Information...............................................................................................................................30  
Revision History............................................................................................................................................................................31  
www.rohm.com  
© 2021 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0G5G1G400110-1-2  
09.Feb.2023 Rev.002  
2/31  
 
BV1HJC45EFJ-C  
Pin Configuration  
(TOP VIEW)  
1
8
IN  
GND  
ST1  
ST2  
OUT  
7
6
5
2
3
4
OUT  
OUT  
OUT  
EXP-PAD = VBB  
Pin Description  
Pin No.  
Pin Name  
IN  
Function  
Input pin. Pull-down resistor is connected internally.  
Active High to turn on the switch.  
Ground pin  
1
2
GND  
ST1  
ST2  
3
4
Self–diagnostic output pin 1  
Self-diagnostic output pin 2  
Switch output pin  
5
OUT  
OUT  
OUT  
OUT  
VBB  
6
Switch output pin  
7
8
Switch output pin  
Switch output pin  
EXP-PAD  
Power input pin, switch input pin  
Block Diagram  
VBB  
lnternal  
supply  
UVLO  
clamp  
charge  
pump  
IN  
Gate Driver  
Over current  
detction  
Control  
Logic  
Power  
limitation  
thermal  
shut down  
ST1  
ST2  
Open load  
detection  
Battery short  
detection  
OUT  
Reverse  
Battery  
GND  
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© 2021 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0G5G1G400110-1-2  
09.Feb.2023 Rev.002  
3/31  
BV1HJC45EFJ-C  
Definition  
IBB  
VBB  
VDS VBB  
IOUT  
OUT  
IIN  
IN  
VOUT  
IST  
ST1,ST2  
VST  
GND  
IGND  
Figure 1. Voltage and Current Definition  
www.rohm.com  
© 2021 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0G5G1G400110-1-2  
09.Feb.2023 Rev.002  
4/31  
BV1HJC45EFJ-C  
Absolute Maximum Ratings (Ta = 25 °C)  
Parameter  
Symbol  
Rating  
Unit  
VBB - OUT Voltage  
VDS  
VBB  
VIN  
-0.3 to Internal clamp (Note 1)  
-0.3 to +40  
V
V
Power Supply Voltage  
Input Voltage  
-0.3 to +7.0  
- 0.3 to +7.0  
Internal limit (Note 2)  
10  
V
Diagnostic Output Voltage  
Output Current  
VST  
IOUT  
IST  
V
A
Diagnostic Output Current  
Junction Temperature Width  
Storage Temperature Range  
Maximum Junction Temperature  
mA  
°C  
°C  
°C  
Tj  
-40 to +150  
-55 to +150  
+150  
Tstg  
Tjmax  
Active Clamp Energy (Single Pulse)  
Tj(START) = 25 °C, IOUT = 2 A (Note 3) (Note 4)  
EAS (25 °C)  
EAS (150 °C)  
VBBLIM  
120  
60  
mJ  
mJ  
V
Active Clamp Energy (Single Pulse)  
Tj(START) = 150 °C, IOUT = 2 A(Note 3)(Note 4)  
Supply Voltage  
28  
for Short Circuit Protection (Note 5)  
Supply Voltage  
for Reverse-Battery Connection Protection  
VRBPLIM  
18  
V
(Note 1) Internally limited by output clamp voltage.  
(Note 2) Internally limited by fixed over current limit.  
(Note 3) Maximum active clamp energy using single pulse of IOUT(START) = 2 A and VBB = 14 V.  
(Note 4) Not 100% tested.  
(Note 5) Maximum power supply voltage that can detect short circuit protection.  
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit  
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is  
operated over the absolute maximum ratings.  
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the  
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by  
increasing board size and copper area so as not to exceed the maximum junction temperature rating.  
Caution 3: When IC turns off with an inductive load, reverse energy is generated. This energy can be calculated by the following equation:  
1
퐵퐵  
2
퐿  
=
× 퐿 × 퐼푂푈푇 푆푇퐴푅푇 × 1 −  
(
)
2
퐵퐵 − 푉퐷푆  
Where:  
L is the inductance of the inductive load.  
IOUT(START) is the output current at the time of turning off.  
The BV1HJC45EFJ-C integrates the active clamp function to internally absorb the reverse energy EL which is generated when the inductive load is  
turned off. When the active clamp operates, the thermal shutdown function does not work. Decide a load so that the reverse energy EL is active  
clamp tolerance EAS (refer to Figure 23. Active Clamp Energy vs Output Current) or under when inductive load is used.  
Recommended Operating Conditions  
Min  
Typ  
Max  
Parameter  
Symbol  
Unit  
Power Supply Voltage Operating Range  
Operating Temperature  
VBB  
Topr  
fIN  
6
-40  
-
14  
-
28  
+150  
1
V
°C  
Input Frequency  
-
kHz  
www.rohm.com  
© 2021 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0G5G1G400110-1-2  
09.Feb.2023 Rev.002  
5/31  
BV1HJC45EFJ-C  
Thermal Resistance(Note 1)  
Parameter  
Symbol  
Typ  
Unit  
Condition  
HTSOP-J8  
(Note 2)  
130.3  
36.8  
25.9  
20  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
1s  
2s  
Between Junction and Surroundings Temperature  
(Note 3)  
(Note 4)  
(Note 2)  
(Note 3)  
(Note 4)  
θJA  
Thermal Resistance  
2s2p  
1s  
Between Junction and the top center  
of the outside surface of the component package  
Thermal Characterization Parameter (Note 5)  
ΨJT  
8
2s  
6
2s2p  
(Note 1) The thermal impedance is based on JESD51-2A (Still-Air) standard. It is used the chip of BV1HJC45EFJ-C.  
(Note 2) JESD51-3 standard FR4 114.3 mm x 76.2 mm x 1.57 mm 1-layer (1s)  
(Top copper foil: ROHM recommended Footprint + wiring to measure, 2 oz. copper.)  
(Note 3)JESD51-5 standard FR4 114.3 mm x 76.2 mm x 1.60 mm 2-layers (2s)  
(Top copper foil: ROHM recommended Footprint + wiring to measure/  
Copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm,  
copper (top & reverse side) 2 oz)  
(Note 4) JESD51-5/-7 standard FR4 114.3 mm x 76.2 mm x 1.60 mm 4-layers (2s2p)  
(Top copper foil: ROHM recommended Footprint + wiring to measure/  
2 inner layers and copper foil area on the reverse side of PCB: 74.2 mm x 74.2 mm,  
copper (top & reverse side/inner layers) 2 oz/1 oz)  
(Note 5) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface  
of the component package.  
PCB Layout 1 layer (1s)  
Footprint  
100 mm2  
600 mm2  
1200 mm2  
Figure 2. PCB Layout 1 Layer (1s)  
Dimension  
Value  
Board Finish Thickness  
Board Dimension  
1.57 mm ± 10 %  
76.2 mm x 114.3 mm  
FR4  
Board Material  
Copper Thickness (Top Layer)  
Copper Foil Area Dimension  
0.070 mm (Cu: 2 oz)  
Footprint/100 mm2/600 mm2/1200 mm2  
www.rohm.com  
© 2021 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0G5G1G400110-1-2  
09.Feb.2023 Rev.002  
6/31  
BV1HJC45EFJ-C  
Thermal Resistance – continued  
PCB Layout 2 layers (2s)  
Top Layer  
Bottom Layer  
Top Layer  
Bottom Layer  
Via  
Isolation Clearance Diameter: ≥ 0.6 mm  
Cross Section  
Figure 3. PCB Layout 2 Layers (2s)  
Dimension  
Board Finish Thickness  
Board Dimension  
Value  
1.60 mm ± 10 %  
76.2 mm x 114.3 mm  
FR4  
Board Material  
Copper Thickness (Top/Bottom Layers)  
Thermal Vias Separation/Diameter  
0.070 mm (Cu + Plating)  
1.2 mm/0.3 mm  
www.rohm.com  
© 2021 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0G5G1G400110-1-2  
09.Feb.2023 Rev.002  
7/31  
BV1HJC45EFJ-C  
Thermal Resistance – continued  
PCB Layout 4 layers (2s2p)  
TOP Layer  
2nd/Bottom Layers  
3rd Layer  
Top Layer  
2nd Layer  
3rd Layer  
Bottom Layer  
Via  
Isolation Clearance Diameter: ≥ 0.6 mm  
Cross Section  
Figure 4. PCB Layout 4 Layers (2s2p)  
Dimension  
Board Finish Thickness  
Value  
1.60 mm ± 10 %  
Board Dimension  
76.2 mm x 114.3 mm  
FR4  
Board Material  
Copper Thickness (Top/Bottom Layers)  
Copper Thickness (Inner Layers)  
Thermal Vias Separation/Diameter  
0.070 mm (Cu + Plating)  
0.035 mm  
1.2 mm/0.3 mm  
www.rohm.com  
© 2021 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0G5G1G400110-1-2  
09.Feb.2023 Rev.002  
8/31  
BV1HJC45EFJ-C  
Thermal Resistance – continued  
Transient Thermal Resistance (Single Pulse)  
Figure 5. Transient Thermal Resistance  
Thermal Resistance (θJA vs Copper foil area- 1s)  
Figure 6. Thermal Resistance  
www.rohm.com  
© 2021 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0G5G1G400110-1-2  
09.Feb.2023 Rev.002  
9/31  
BV1HJC45EFJ-C  
Electrical Characteristics (unless otherwise specified VBB = 6 V to 28 V, Tj = -40 °C to 150 °C)  
Limit  
Parameter  
Power Supply  
Symbol  
Unit  
Condition  
Min  
Typ  
Max  
VBB = 14 V, VIN = 0 V,  
VOUT = 0 V, Tj = 25 °C  
IBBL1  
IBBL2  
-
-
-
-
0.5  
20  
µA  
µA  
Standby current  
VBB = 14 V, VIN = 0 V,  
VOUT = 0 V, Tj = 150 °C  
Operating Current  
IBBH  
-
-
-
2.0  
3.5  
5.0  
1.0  
mA  
V
VBB = 14 V, VIN = 5 V, VOUT = open  
UVLO Detection Voltage  
UVLO Hysteresis Voltage  
Input  
VUVLO  
VUVHYS  
-
-
V
High Level Input Voltage  
Low Level Input Voltage  
Input Hysteresis Voltage  
High Level Input Current  
Low Level Input Current  
Power MOS Output  
VINH  
VINL  
VHYS  
IINH  
2.1  
-
-
-
V
V
-
-
0.9  
-
0.3  
50  
-
V
-
150  
+10  
µA  
µA  
VIN = 5 V  
VIN = 0 V  
IINL  
-10  
RON1  
RON2  
-
-
45  
-
60  
90  
mΩ  
mΩ  
mΩ  
μA  
VBB = 8 V to 28 V, Tj = 25 °C  
VBB = 8 V to 28 V, Tj = 150 °C  
VBB = 6 V, Tj = 25 °C  
Output ON Resistance  
RON3  
-
-
75  
IOUTL1  
IOUTL2  
SRON  
SROFF  
tOUTON  
tOUTOFF  
VDS  
-
-
0.5  
10  
VIN = 0 V, VOUT = 0 V, Tj = 25 °C  
VIN = 0 V, VOUT = 0 V, Tj = 150 °C  
VBB = 14 V, RL = 6.5 Ω  
Output Leak Current  
-
-
μA  
Output Slew Rate when ON  
Output Slew Rate when OFF  
Propagation Delay when ON  
Propagation Delay when OFF  
Output Clamp Voltage  
-
0.3  
0.3  
60  
60  
50  
1.0  
1.0  
120  
120  
55  
V/µs  
V/µs  
µs  
-
VBB = 14 V, RL = 6.5 Ω  
-
VBB = 14 V, RL = 6.5 Ω  
-
µs  
VBB = 14 V, RL = 6.5 Ω  
45  
V
VIN = 0 V, IOUT = 10 mA  
Diagnostics  
Diagnostic Output L Voltage  
Diagnostic Output Leak Current  
VSTL  
ISTL  
-
-
-
-
0.5  
10  
V
IST = 1 mA  
VST = 5 V  
µA  
Propagation Delay Time when  
Diagnostic Output is ON  
tSTON  
-
-
120  
50  
240  
100  
µs  
µs  
VBB = 14 V, RL = 6.5 Ω  
VBB = 14 V, RL = 6.5 Ω  
Propagation Delay Time when  
Diagnostic Output is OFF  
tSTOFF  
Protection Circuit  
Overcurrent Limit Value  
ILIM  
VSHV  
VOLD  
IOLD  
5.0  
8.0  
12.0  
A
V
VDS = 5 V  
Short-to-VCC Detection Voltage  
Load Open Detection Voltage  
Load Open Detection Sink Current  
Thermal Shutdown (Note 1)  
VBB-1.8 VBB-1.2 VBB-0.5  
VIN = 0 V  
2.0  
3.0  
10  
4.0  
30  
200  
-
V
VIN = 0 V  
-
µA  
°C  
°C  
°C  
VIN = 0 V, VOUT = 5 V  
TTSD  
150  
175  
15  
Thermal Shutdown Hysteresis (Note 1)  
TTSDHYS  
TDTJ  
-
-
∆Tj Protection Temperature (Note 1)  
120  
-
(Note 1) Not 100% tested.  
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© 2021 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0G5G1G400110-1-2  
09.Feb.2023 Rev.002  
10/31  
BV1HJC45EFJ-C  
Typical Performance Curves  
(Unless otherwise specified VBB = 14 V, IN = 5 V, Tj = 25 °C)  
0.5  
0.4  
0.3  
0.2  
0.1  
0
20  
15  
10  
5
0
0
5
10 15 20 25 30 35 40  
Power Supply Voltage: VBB [V]  
-50  
0
50  
100  
150  
Junction Temperature: Tj [ºC]  
Figure 7. Standby Current vs Power Supply Voltage  
Figure 8. Standby Current vs Junction Temperature  
4.5  
4
4.5  
4
3.5  
3
3.5  
3
2.5  
2
2.5  
2
1.5  
1
1.5  
1
0.5  
0
0.5  
0
0
5
10 15 20 25 30 35 40  
Power Supply Voltage: VBB [V]  
-50  
0
50  
100  
150  
Junction Temperature: Tj [ºC]  
Figure 9. Circuit Current vs Power Supply Voltage  
Figure 10. Circuit Current vs Junction Temperature  
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© 2021 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0G5G1G400110-1-2  
09.Feb.2023 Rev.002  
11/31  
BV1HJC45EFJ-C  
Typical Performance Curves - continued  
(Unless otherwise specified VBB = 14 V, IN = 5 V, Tj = 25 °C)  
6
5
4
3
2
1
0
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
VINH  
VINL  
-50  
0
50  
100  
150  
-50  
0
50  
100  
150  
Junction Temperature: Tj [ºC]  
Junction Temperature: Tj [°C]  
Figure 11. UVLO Detection Voltage vs Junction Temperature  
Figure 12. Input Voltage vs Junction Temperature  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
-50  
0
50  
100  
150  
0
5
10 15 20 25 30 35 40  
Power Supply Voltage: VBB [V]  
Junction Temperature: Tj [ºC]  
Figure 13. Input Current vs Junction Temperature  
Figure 14. Output ON Resistance vs Supply Voltage  
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© 2021 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0G5G1G400110-1-2  
09.Feb.2023 Rev.002  
12/31  
BV1HJC45EFJ-C  
Typical Performance Curves - continued  
(Unless otherwise specified VBB = 14 V, IN = 5 V, Tj = 25 °C)  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
10  
8
6
4
2
0
0
50  
100  
150  
-50  
0
50  
100  
150  
Junction Temperature: Tj [°C]  
Junction Temperature: Tj [ºC]  
Figure 15. Output ON Resistance vs Junction Temperature  
Figure 16. Output leak Current vs Junction Temperature  
1.2  
1.0  
0.8  
0.6  
175  
150  
125  
100  
tOUTON  
75  
tOUTOFF  
0.4  
SROFF  
50  
25  
0
0.2  
SRON  
0.0  
-50  
0
50  
100  
150  
-50  
0
50  
100  
150  
Junction Temperature: Tj [ºC]  
Junction Temperature: Tj [ºC]  
Figure 17. Output Slew Rate vs Junction Temperature  
Figure 18. Output ON, OFF Propagation Delay Time  
vs Junction Temperature  
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© 2021 ROHM Co., Ltd. All rights reserved.  
TSZ22111 • 15 • 001  
TSZ02201-0G5G1G400110-1-2  
09.Feb.2023 Rev.002  
13/31  
BV1HJC45EFJ-C  
Typical Performance Curves - continued  
(Unless otherwise specified VBB = 14 V, IN = 5 V, Tj = 25 °C)  
55  
53  
51  
49  
47  
45  
43  
41  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
-50  
0
50  
100  
150  
Junction Temperature: Tj [ºC]  
-50  
0
50  
100  
150  
Figure 19. Output Clamp Voltage vs  
Junction Temperature  
Junction Temperature: Tj [ºC]  
Figure 20. Diagnostic Output Low Voltage  
vs Junction Temperature  
250  
200  
150  
100  
50  
5
4
3
2
1
0
tSTON  
tSTOFF  
0
-50  
0
50  
100  
150  
-50  
0
50  
100  
150  
Junction Temperature: Tj [ºC]  
Junction Temperature: Tj [ºC]  
Figure 21. Diagnostic Output ON, OFF  
Propagation Delay Time vs Junction Temperature  
Figure 22. Open Load Detection Voltage  
vs Junction Temperature  
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Typical Performance Curves - continued  
(Unless otherwise specified VBB = 14 V, IN = 5 V, Tj = 25 °C)  
Tj(start) = 25 ºC  
1000  
100  
Tj(start) = 150 ºC  
10  
0.1  
1.0  
10.0  
Output Current: IOUT [A]  
Figure 23. Active Clamp Energy vs Output Current  
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Measurement Circuit  
VBB  
VBB  
VBB  
ST1, ST2  
VBB  
ST1, ST2  
IN  
IN  
VIN  
VIN  
OUT  
OUT  
GND  
GND  
Figure 24. Standby Current  
Low-Level Input Current  
Figure 25. Operating Current  
Output Leak Current  
Diagnostic Output Leak Current  
VBB  
VBB  
VBB  
VBB  
IN  
IN  
ST1, ST2  
ST1, ST2  
VIN  
OUT  
VIN  
OUT  
GND  
GND  
1 kΩ  
Figure 26. UVLO Detection Voltage  
UVLO Hysteresis Voltage  
High Level Input Voltage  
Low Level Input Voltage  
Input Hysteresis Voltage  
High Level Input Current  
Thermal Shutdown  
Figure 27. Output ON Resistance  
Output Clamp Voltage  
Thermal Shutdown Hysteresis  
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Measurement Circuit - continued  
VBB  
VBB  
VBB  
ST1, ST2  
VBB  
IN  
IN  
10 kΩ  
ST1, ST2  
Monitor  
Monitor  
IST  
VIN  
VIN  
OUT  
OUT  
Monitor  
GND  
1 kΩ  
GND  
6.5 Ω  
Figure 28. Output ON Slew Rate  
Output OFF Slew Rate  
Figure 29. Diagnostic Output Low Voltage  
Output ON Propagation Delay Time  
Output OFF Propagation Delay Time  
Diagnostic Output ON Propagation Delay Time  
Diagnostic Output OFF Propagation Delay Time  
VBB  
VBB  
IN  
10 kΩ  
ST1, ST2  
OUT  
GND  
Figure 30. Open Load Detection Voltage  
Open Load Detection Sink Current  
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Switching Time Measurement Condition  
VBB  
VINL  
VINH  
SRON  
VBB  
OUT  
IN  
tOUTOF  
80 %  
5 V  
IN  
80 %  
20 %  
20 %  
OUT  
10 kΩ 10 kΩ  
6.5 Ω  
tOUTON  
SROF  
ST1  
ST2  
ST1  
ST2  
GND  
tSTON  
tSTOFF  
Figure 31. Switching Time Measurement Diagram  
Figure 32. Switching Time Measurement Waveform  
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Timing Chart  
VBB  
IN  
VINH  
VINL  
tOUTOFF  
SRON  
20 %  
80 %  
80 %  
20 %  
OUT  
tOUTON  
SROFF  
ST1  
ST2  
tSTON  
tSTOFF  
Figure 33. Timing Chart  
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Function Description  
1. Protection Function  
Table 1. Detection and Release Conditions of Each Protection Function and Diagnostic Output  
Mode  
Conditions  
IN  
ST1  
ST2  
Standby  
Operating  
-
Low  
High  
Low  
Low  
Low  
Low  
High  
High  
High  
High  
High  
High  
High  
High  
High  
Low  
Low  
High  
Low  
Low  
High  
Low  
High  
Low  
High  
Low  
High  
Low  
High  
High  
High  
High  
Normal  
Condition  
-
Detect VOUT ≥ 3.0 V (Typ)  
Release VOUT ≤ 2.4 V (Typ)  
Detect VOUT > VBB - 1.2 V (Typ)  
Release VOUT < VBB - 2.0 V (Typ)  
Detect VBB ≤ 5.0 V (Max)  
Release VBB ≥ 6.0 V (Max)  
Detect Tj ≥ 175 °C (Typ)  
Release Tj ≤ 160 °C (Typ)  
Detect ΔTj ≥ 120 °C (Typ)  
Release ΔTj ≤ 80 °C (Typ)  
Detect IOUT ≥ 8.0 A (Typ)  
Release IOUT < 8.0 A (Typ)  
Open Load Detect (OLD)  
Short to VBB Detection  
Low  
High  
High  
High  
High  
High  
High  
High  
High  
High  
Low Voltage Output OFF  
(UVLO)  
Thermal Shutdown  
(TSD) (Note 1)  
ΔTj Protection (Note 2)  
Over Current Protection  
(OCP)  
(Note 1) Thermal shutdown is automatically restored to normal operation.  
(Note 2) Protect function by detecting PowerMOS sharp increase of temperature difference with control circuit.  
This IC has a built-in protection detection function as mentioned above and outputs the abnormal condition  
with ST1 and ST2 pins.  
ST1 is output for output detect and each protect function.  
ST1 change from High to Low when OUT rise by near VBB during normal operation.  
And change from Low to High when detect each protection or OUT is less than VBB - 1.2 V (Typ).  
ST2 is output for open load detection and Short to VBB detection during IN = Low.  
It is self-rest and operation becomes normal when each protection releases after detecting.  
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Function Description - continued  
2. Overcurrent Protection  
This IC has a built-in overcurrent protection function. When overcurrent flows in the output, the output current is limited  
to 8.0 A (Typ) and self-diagnostic output 1 (ST1) becomes High.  
3. Thermal Shutdown and ΔTj Protection Detection  
3.1 Thermal Shutdown Protection  
This IC has a built-in thermal shutdown protection function. When the IC chip temperature exceeds175 °C (Typ), the  
output is turned OFF and self-diagnostic output 1 (ST1) becomes High. When the temperature goes below 160 °C  
(Typ), output will self-reset and operation becomes normal.  
3.2 ΔTj Protection  
This IC has a built-in ΔTj protection function that turns OFF the output when the temperature difference (TDTJ  
)
between the POWER-MOS unit (TPOWER-MOS) and the control unit (TAMB) in the IC is 120 °C (Typ) or more. ΔTj  
protection also has a built-in hysteresis (TDTJHYS) that returns the output to normal state when the temperature  
difference becomes 80 °C (Typ) or less.  
Figure 34 shows the timing chart of thermal shutdown protection and ΔTj protection during output short to GND fault.  
IN  
ILIMH  
IOUT  
TTSD  
TPOWER-MOS  
TTSDHYS  
TAMB  
TDTJHYS  
TDTJ  
TSD  
Operation  
ΔTj Protection Operation  
ST1  
TSD Detect  
TSD Release  
(Note 1)  
Figure 34. Thermal Shutdown Protection and ΔTj Protection Timing Chart  
(Note 1) When output voltage falls to output ON detection voltage (VSHV) or less at the output to GND is shorted or rare short, IC is judged that the output  
voltage is abnormal. Hence, ST1, ST2 may not be able to turn low.  
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Function Description - continued  
4. Open Load Detection  
VBB  
5 V  
VBB  
SOLD  
ROLD  
OUT  
IN  
Internal  
supply  
SW1  
RL  
ST1  
ST2  
R1  
R2  
logic  
R
PD  
VOLD  
Figure 35. Open Load Detection Block Diagram  
Open load can be detected by connecting an external resistance ROLD between power supply VBB and output.  
When output load is disconnected during input is low, diagnostic output the ST1 pin is turned to low to indicate abnormality.  
To reduce the standby current of the system, an open load resistance switch SOLD is recommended.  
When the SW1 is OFF, voltage of the OUT does not fall to GND level. Because, when the IN pin is low, the voltage of the  
OUT pin does not become under or equal to the Output ON Detection Voltage (VDSDET). To pulled down the OUT pin, pulled  
down resistance RPD is recommended. The resistance RPD is 4.3 kΩ or less for outflow current from the OUT pin.  
4.1 When the OUT is pulled down by the load (Normal function)  
The value of external resistance ROLD is decided based on used minimum power supply voltage (VBB), internal  
resistance R1 and R2 and open detection voltage VOLD. External resistance RPD is unnecessary.  
The equation for calculating the ROLD value is shown below.  
ꢆꢆ  
× ꢇ ꢈ  
+ ꢈ  
ꢊ(푀푖푛)  
ꢉ(푀푖푛)  
ꢂꢃꢄ  
<
− ꢇ ꢏ(ꢐꢑꢒ) ꢓ 푅ꢔ(ꢐꢑꢒ) [Ω]  
ꢌꢍꢎ(Max)  
The above formula is summarized as follows.  
ꢂꢃꢄ < ꢕꢕ × 75 × 103 − ꢖ00 × 103 [Ω]  
ROLD value is fell below the above calculated result.  
4.2 If the SW is OFF, the output is no longer pulled down by the load  
The value of external resistance ROLD is decided based on used minimum power supply voltage (VBB), external  
resistance RPD and open detection voltage VOLD  
.
The equation for calculating the ROLD value is shown below.  
× ꢈ  
푃ꢎ  
ꢆꢆ  
ꢂꢃꢄ  
<
− 푅ꢗꢄ [Ω]  
ꢌꢍꢎ(Max)  
When RPD is 4.3 kΩ, the above formula is summarized as follows.  
ꢂꢃꢄ < ꢕꢕ × 1.075 × 103 − 4.ꢖ × 103 [Ω]  
ROLD value is fell below the above calculated result  
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Function Description - continued  
5. Other Detection  
5.1 GND open protection  
5 V  
VBB  
Clamp  
IN  
Internal  
supply  
ST1  
ST2  
Control  
logic  
OUT  
GND  
Figure 36. GND Open Detection Block Diagram  
When GND of the IC is open, the output is switched OFF regardless of the input voltage.  
However, self-diagnostic output (ST1, ST2) is not flagged. When an inductive load is connected,  
the active clamp operates when the GND pin is open  
5.2 Reverse-Battery Connection Protection  
VBB  
clamp  
DRV  
OUT  
Reverse  
Battery  
VBAT  
GND  
Figure 37. Reverse-Battery Connection Block Diagram  
When the battery connection is reversed, an excessive amount of current will flow to internal part of IC  
and this may sometimes lead to IC destruction.  
As a countermeasure, this IC has a built-in reverse battery connection protection function without external  
components such as resistors and diodes.  
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Function Description - continued  
5.3 MCU I/O Protection  
VBB  
5 V  
Internal  
supply  
Clamp  
IN  
ST1  
ST2  
Control  
logic  
OUT  
MCU  
GND  
Figure 38. MCU I/O Protection  
Negative surge voltage to the IN pin, the ST1 pin and the ST2 pin may cause damage to the MCU's I/O pins. In order to  
prevent those damages, it is recommended to insert limiting resistors between IC pins and MCU.  
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Application Circuit Diagram  
RST1PU  
RST2PU  
VBB  
CVBB  
RIN  
IN  
ROLD  
OUT  
RST1  
ST1  
ST2  
MCU  
BV1HJC45EFJ-C  
RPD  
RL  
RST2  
GND  
Figure 39. Application Circuit Diagram  
Symbol  
Value  
Purpose  
RIN  
4.7 kΩ  
4.7 kΩ  
10 kΩ  
1 µF  
Limit resistance for negative surge  
Limit resistance for negative surge  
RST1, RST2  
RST1PU, RST2PU  
CVBB  
Pull up ST1/ST2 pin to MCU power supply, these pins are open drain output  
For battery line voltage spike filter  
RPD  
4.3 kΩ  
2 kΩ  
For output pulled down  
ROLD  
For open load detection  
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I/O Equivalence Circuits  
IN  
ST1, ST2  
10 kΩ  
150 Ω  
ST1  
ST2  
IN  
100 kΩ  
VBB  
VBB  
OUT  
VBB  
OUT  
227 kΩ  
273 kΩ  
VBB  
Resistance values shown in the diagrams above are typical values.  
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Operational Notes  
1.  
2.  
Reverse Connection of Power Supply  
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when  
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power  
supply pins.  
Power Supply Lines  
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at  
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic  
capacitors.  
3.  
4.  
Ground Voltage  
Except for pins the output and the input of which were designed to go below ground, ensure that no pins are at a  
voltage below that of the ground pin at any time, even during transient condition.  
Ground Wiring Pattern  
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but  
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal  
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations  
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.  
5.  
6.  
Recommended Operating Conditions  
The function and operation of the IC are guaranteed within the range specified by the recommended operating  
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical  
characteristics.  
Inrush Current  
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may  
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power  
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring,  
and routing of connections.  
7.  
Testing on Application Boards  
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may  
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply  
should always be turned off completely before connecting or removing it from the test setup during the inspection  
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during  
transport and storage.  
8.  
9.  
Inter-pin Short and Mounting Errors  
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in  
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.  
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)  
and unintentional solder bridge deposited in between pins during assembly to name a few.  
Unused Input Pins  
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and  
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small  
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and  
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the  
power supply or ground line.  
10. Ceramic Capacitor  
When using a ceramic capacitor, determine a capacitance value considering the change of capacitance with  
temperature and the decrease in nominal capacitance due to DC bias and others.  
11. Thermal Shutdown Function (TSD)  
This IC has a built-in thermal shutdown function that prevents heat damage to the IC. Normal operation should  
always be within the IC’s maximum junction temperature rating. If however the rating is exceeded for a continued  
period, the junction temperature (Tj) will rise which will activate the TSD function that will turn OFF power output pins.  
When the Tj falls below the TSD threshold, the circuits are automatically restored to normal operation.  
Note that the TSD function operates in a situation that exceeds the absolute maximum ratings and therefore, under  
no circumstances, should the TSD function be used in a set design or for any purpose other than protecting the IC  
from heat damage.  
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Operational Notes – continued  
12. Over Current Protection Function (OCP)  
This IC incorporates an integrated overcurrent protection function that is activated when the load is shorted. This  
protection function is effective in preventing damage due to sudden and unexpected incidents. However, the IC  
should not be used in applications characterized by continuous operation or transitioning of the protection function.  
13. Active Clamp Operation  
The IC integrates the active clamp function to internally absorb the reverse energy EL which is generated when the  
inductive load is turned off. When the active clamp operates, the thermal shutdown function does not work. Decide a  
load so that the reverse energy EL is active clamp tolerance EAS (refer to Figure 23. Active Clamp Energy vs Output  
Current) or under when inductive load is used.  
14. Open Power Supply Pin  
When the power supply pin (VBB) becomes open at ON (IN = High), the output is switched to OFF regardless of  
input voltage. If an inductive load is connected, the active clamp operates when VBB is open and becomes the same  
potential as that on the ground. At this time, the output voltage drops down to -50 V (Typ).  
15. Open GND Pin  
When the GND pin becomes open at ON (IN = High), the output is switched to OFF regardless of input voltage. If an  
inductive load is connected, the active clamp operates when the GND pin is open.  
16. OUT Pin Voltage  
Ensure that keep OUT pin voltage less than (VBB + 0.3 V) at any time, even during transient condition.  
Otherwise malfunction or other problems can occur.  
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Ordering Information  
B V 1 H J C 4 5 E F  
J
-
CE 2  
V1: 1ch  
H: High side switch  
Package  
EFJ: HTSOP-J8  
Product Rank  
C: Automotive product  
Packaging and Forming Specification  
E2: Embossed tape and reel  
Marking Diagram  
HTSOP-J8 (TOP VIEW)  
Part Number Marking  
1 H J C 4 5  
LOT Number  
Pin 1 Mark  
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Physical Dimension and Packing Information  
Package Name  
HTSOP-J8  
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Revision History  
Date  
Revision  
Changes  
03.Sep.2021  
001  
New Release  
P.5 Absolute Maximum Ratings  
Change the condition of EAS from IOUT = 4 A to IOUT = 2 A.  
P.6 Thermal Resistance  
Figure 2 - Change the size of PCB layout.  
P.15 Typical Performance Curves  
09.Feb.2023  
002  
Figure 23 - Change the graph of EAS  
.
P.28 Operational Notes  
14. Open Power Supply Pin  
Change the value of output clamp voltage.  
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Notice  
Precaution on using ROHM Products  
(Note 1)  
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment  
,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,  
bodily injury or serious damage to property (Specific Applications), please consult with the ROHM sales  
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way  
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any  
ROHMs Products for Specific Applications.  
(Note1) Medical Equipment Classification of the Specific Applications  
JAPAN  
USA  
EU  
CHINA  
CLASS  
CLASSⅣ  
CLASSb  
CLASSⅢ  
CLASSⅢ  
CLASSⅢ  
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor  
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate  
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which  
a failure or malfunction of our Products may cause. The following are examples of safety measures:  
[a] Installation of protection circuits or other protective devices to improve system safety  
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure  
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.  
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the  
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our  
Products under any special or extraordinary environments or conditions (as exemplified below), your independent  
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:  
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents  
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust  
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,  
H2S, NH3, SO2, and NO2  
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves  
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items  
[f] Sealing or coating our Products with resin or other coating materials  
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.  
However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble  
cleaning agents for cleaning residue after soldering  
[h] Use of the Products in places subject to dew condensation  
4. The Products are not subject to radiation-proof design.  
5. Please verify and confirm characteristics of the final or mounted products in using the Products.  
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,  
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power  
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect  
product performance and reliability.  
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in  
the range that does not exceed the maximum junction temperature.  
8. Confirm that operation temperature is within the specified range described in the product specification.  
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in  
this document.  
Precaution for Mounting / Circuit board design  
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product  
performance and reliability.  
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must  
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,  
please consult with the ROHM representative in advance.  
For details, please refer to ROHM Mounting specification  
Notice-PAA-E  
Rev.004  
© 2015 ROHM Co., Ltd. All rights reserved.  
Precautions Regarding Application Examples and External Circuits  
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the  
characteristics of the Products and external components, including transient characteristics, as well as static  
characteristics.  
2. You agree that application notes, reference designs, and associated data and information contained in this document  
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely  
responsible for it and you must exercise your own independent verification and judgment in the use of such information  
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses  
incurred by you or third parties arising from the use of such information.  
Precaution for Electrostatic  
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper  
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be  
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,  
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).  
Precaution for Storage / Transportation  
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:  
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2  
[b] the temperature or humidity exceeds those recommended by ROHM  
[c] the Products are exposed to direct sunshine or condensation  
[d] the Products are exposed to high Electrostatic  
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period  
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is  
exceeding the recommended storage time period.  
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads  
may occur due to excessive stress applied when dropping of a carton.  
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of  
which storage time is exceeding the recommended storage time period.  
Precaution for Product Label  
A two-dimensional barcode printed on ROHM Products label is for ROHMs internal use only.  
Precaution for Disposition  
When disposing Products please dispose them properly using an authorized industry waste company.  
Precaution for Foreign Exchange and Foreign Trade act  
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign  
trade act, please consult with ROHM in case of export.  
Precaution Regarding Intellectual Property Rights  
1. All information and data including but not limited to application example contained in this document is for reference  
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any  
other rights of any third party regarding such information or data.  
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the  
Products with other articles such as components, circuits, systems or external equipment (including software).  
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any  
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM  
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to  
manufacture or sell products containing the Products, subject to the terms and conditions herein.  
Other Precaution  
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.  
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written  
consent of ROHM.  
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the  
Products or this document for any military purposes, including but not limited to, the development of mass-destruction  
weapons.  
4. The proper names of companies or products described in this document are trademarks or registered trademarks of  
ROHM, its affiliated companies or third parties.  
Notice-PAA-E  
Rev.004  
© 2015 ROHM Co., Ltd. All rights reserved.  
Daattaasshheeeett  
General Precaution  
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.  
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any  
ROHM’s Products against warning, caution or note contained in this document.  
2. All information contained in this document is current as of the issuing date and subject to change without any prior  
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales  
representative.  
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all  
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or  
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or  
concerning such information.  
Notice – WE  
Rev.001  
© 2015 ROHM Co., Ltd. All rights reserved.  

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