BV1LC105FJ-C_技术文档

Datasheet

Automotive IPD Series

1ch/2ch Low Side Switch IC

BV1LC105FJ-C / BM2LC105FJ-C

Features

■ AEC-Q100 Qualified

Product Summary

(Note1)

■ Built-in overcurrent limiting circuit(OCP)

■ Built-in thermal shutdown circuit(TSD)

■ Built-in active clamp circuit

On-state resistance (T_j=25°C, Typ)

Overcurrent limit (T_j=25°C, Typ)

Output clamp voltage (Min)

105mΩ

6A

42V

■ Built-in Open load detection circuit(OLD) at output off

■ Direct control enabled from CMOS logic IC, etc.

■ Built-in diagnostic(ST) output function

■ On-state resistance R_DS(ON)=105mΩ(Typ)

(when V_IN5V, I_out=0.8A, Tj25C)

Active clamp energy (T_j=25°C)

150mJ

■ Monolithic power management IC with the control

block (CMOS) and power MOS FET mounted on a

single chip

Package

SOP-J8

W(Typ) x D(Typ) x H(Max)

4.90mm x 6.00mm x 1.65mm

■ Surface mount package SOP-J8

(Note 1) Grade1

General Description

BV1LC105FJ-C is 1ch, BM2LC105FJ-C is 2ch

automotive low side switch IC, which has built-in

overcurrent limiting circuit, thermal shutdown circuit,

overvoltage (active clamp) protection circuit and open

load detection circuit.

Applications

Low side switch for driving resistive, Inductive load,

Capacitive load

Ordering Information

B V 1 L C 1 0 5 F J

C E

2

Packaging and forming specification

C：High-reliability product

E2：Embossed tape and reel

V1:1ch, M2:2ch

On-state Resistance Package

L ：Low side SW

C ：Self-restart TSD

(Built-in diagnostic(ST)

output function)

105：105mΩ

(Tj=25℃,Typ)

FJ：SOP-J8

Line up

On-state

resistance

(Typ)

Ordering

Information

Total channel

Package

Ordering Information

number

(Typ)

1

2

BV1LC105FJ-CE2

BM2LC105FJ-CE2

105mΩ

6A

SOP-J8

○Product structure: Silicon monolithic integrated circuit

This product is not designed to protect it from radiation.

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Block Diagrams

1

8

IN1

OUT1

Active Clamp

Circuit

Open Load

Detection

Thermal

Shutdown

Overcurrent

Limiting

Circuit

2

3

7

6

ST1

N.C.

GND1

N.C.

4

5

N.C.

1

8

OUT1

IN1

Active Clamp

Circuit

Open Load

Detection

Thermal

Shutdown

Overcurrent

Limiting

Circuit

2

3

7

6

ST1

IN2

GND1

OUT2

Active Clamp

Circuit

Open Load

Detection

Thermal

Shutdown

Overcurrent

Limiting

Circuit

4

5

ST2

GND2

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Pin Configurations

1

2

3

4

8

7

6

5

OUT

GND

N.C.

1

2

3

4

8

7

6

5

OUT1

GND1

OUT2

GND2

IN

ST

IN1

ST1

IN2

BV1LC105FJ-C

BM2LC105FJ-C

N.C.

ST2

Pin Descriptions

 BV1LC105FJ-C

Pin No.

Symbol

IN

Function

1

2

3

4

5

6

7

8

Input pin. Input pin is used to internally connect a pull-down resistor.

ST

Self-diagnostic output pin

N.C pin^{(Note 1)}

GND pin

N.C.

GND

OUT

Output pin

(Note 1) N.C.Pin is recommended to short with GND. N.C.Pin can be open because it isn’t connect it inside of IC.

 BM2LC105FJ-C

Pin No.

Symbol

IN1

Function

1

2

3

4

5

6

7

8

Input pin 1. Input pin is used to internally connect a pull-down resistor.

ST1

Self-diagnostic output pin 1

IN2

Input pin 2. Input pin is used to internally connect a pull-down resistor.

ST2

Self-diagnostic output pin 2

GND pin 2

GND2

OUT2

GND1

OUT1

Output pin 2

GND pin 1

Output pin 1

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Definition

VBAT

RL

IOUT

I_ST

OUT

V_MCUR_ST

ST

VOUT,VDS

V

ST

I_IN

IN GND

V_IN

C_ST

V_IN

Figure 1. Definition

Absolute Maximum Ratings (T_j=25°C)

Parameter

Symbol

V_DS

Ratings

Unit

Drain-Source voltage in output block

Input voltage

-0.3 to +42 ^{(Note 1)}

-0.3 to +7.0

V

V_IN

Output current (DC)

I_OUT(OCP)

V_ST

3.0(Internally limited) ^{(Note 2)}

-0.3 to +7.0

A

Diagnostic output voltage

Diagnostic output current

V

I_ST

10

mA

Active clamp energy (Single pulse)

T_j(start)= 25°C ^{(Note 3)}

E_AS(25°C)

150

50

mJ

Active clamp energy (Single pulse)

T_j(start)= 150°C ^{(Note 3) (Note 4)}

E_AS(150°C)

Operating temperature range

Storage temperature range

Maximum junction temperature

T_j

-40 to +150

-55 to +150

150

°C

T_stg

T_jmax

(Note 1) Please refer to P.21 “Operation Notes”, when is used at less than -0.3V.

(Note 2) Internally limited by the overcurrent limiting circuit.

(Note 3) Maximum Active clamp energy, using single non-repetitive pulse of I_AR=1.9A, V_BAT= 16V .

1

V_BAT

LI_AR²・ ( 1 -

)

E_AS

=

2

V_BAT- V_OUT(CL)

(Note 4) Not 100% tested.

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Thermal Characteristics ^{(Note 1)}

Parameter

Symbol

Ratings

Unit

Conditions

SOP-J8(1ch ON)

(Note 2)

167.9

105.8

85.6

°C / W

1s

2s

(Note 3)

(Note 4)

Thermal Resistance between channel and ambient temperature

θ_JA

2s2p

Parameter

Symbol

Ratings

Unit

Conditions

SOP-J8(All ch ON)

(Note 2)

141.5

84.1

67.1

°C / W

1s

2s

(Note 3)

(Note 4)

Thermal Resistance between channel and ambient temperature

θ_JA

2s2p

(Note 1) The thermal impedance is based on JESD51 - 2A (Still - Air) standard . It is used the chip of BM2LC105FJ-C

(Note 2) JESD51 - 3 compliance FR4 114.3 mm × 76.2 mm × 1.57 mm 1 layer (1s)

(top layer copper：Rohm recommend land pattern + measurement wiring, copper thickness 2oz)

(Note 3) JESD51 -5 compliance FR4 114.3 mm × 76.2 mm × 1.60 mm

2 layer (2s)

(top layer copper：Rohm recommend land pattern + measurement wiring, bottom layer copper area：74.2 mm × 74.2 mm、

Copper thickness (top and bottom layers) 2 oz)

(Note 4) JESD51 -5 / -7 compliance FR4 114.3 mm × 76.2 mm × 1.60 mm

4 layer (2s2p)

(top layer copper：Rohm recommend land pattern + measurement wiring / 2 layer, 3 layer, bottom layer copper area: 74.2 mm × 74.2 mm,

Copper thickness (top and bottom layers / inner layer) 2 oz / 1oz)

■

PCB layout 1 layer (1s)

Footprint Only

Figure 2. PCB layout 1 layer (1s)

Dimension

Board finish thickness

Board dimension

Value

1.57 mm ± 10%

76.2 mm x 114.3 mm

FR4

Board material

Copper thickness (Top layer)

0.070mm (Cu:2oz)

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■

PCB layout 2layers (2s)

Top Layer

Bottom Layer

Cross section

Top Layer

Bottom Layer

Figure 3. PCB layout 2layer (2s)

Dimension

Board finish thickness

Board dimension

Value

1.60 mm ± 10%

76.2 mm x 114.3 mm

FR4

Board material

Copper thickness (Top/Bottom layers)

0.070mm (Cu + Plating)

■

PCB layout 4layers (2s2p)

Top Layer

2nd Layer

3rd Layer

Bottom Layer

Cross section

Top Layer

2nd/3rd/Bottom Layers

Figure 4. PCB layout 4layer (2s2p)

Dimension

Value

1.60 mm ± 10%

76.2 mm x 114.3 mm

FR4

Board finish thickness

Board dimension

Board material

Copper thickness (Top/Bottom layers)

Copper thickness (Inner layers)

0.070mm (Cu + Plating)

0.035mm

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■

Transient Thermal Resistance (Single Pulse) 1ch ON

1000

100

10

1

footprint

2s

2s2p

0

0.0001 0.001

0.01

0.1

Pulse time[s]

Figure 5. Transient Thermal Resistance

1

10

100

1000

■

Transient Thermal Resistance (Single Pulse) All ch ON

1000

100

10

1

footprint

2s

2s2p

0

0.0001 0.001

0.01

0.1

1

10

100

1000

Pulse time[s]

Figure 6. Transient Thermal Resistance

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Electrical Characteristics1 (Unless otherwise specified, 40C  T_j 150C and V_IN3.0V to 5.5V)

Limit

Parameter

Symbol

Unit

Conditions

Min

42

Typ

48

Max

54

Output Clamp Voltage

V_OUT(CL)

R_DS(ON1)

V

V_IN=0V,I_OUT=1mA

On-state Resistance1 (at 25 °C)

-

105

200

135

245

60

85

-

130

250

175

315

80

mΩ V_IN=5V,I_OUT=0.8A,Tj=25°C

mΩ V_IN=5V,I_OUT=0.8A,Tj=150°C

mΩ V_IN=3V,I_OUT=0.8A,Tj=25°C

mΩ V_IN=3V,I_OUT=0.8A,Tj=150°C

μA V_IN=0V,V_OUT=18V,Tj=25°C

μA V_IN=0V,V_OUT=18V,Tj=150°C

On-state Resistance1 (at 150 °C) R_DS(ON1)

On-state Resistance2 (at 25 °C) R_DS(ON2)

On-state Resistance2 (at 150 °C) R_DS(ON2)

-

Leak Current (at 25 °C)

Leak Current (at 150 °C)

Turn-ON TIME1

I_OUT(L)

t_ON1

40

50

200

80

V_IN=0V to 5V, R_L=15Ω, V_BAT=12V,

μs

-

T_j=25°C

V_IN=5V to 0V, R_L=15Ω, V_BAT=12V,

T_j=25°C

Turn-OFF TIME1

Turn-ON TIME2

t_OFF1

-

80

μs

V_IN=OPEN to 5V, R_L=15Ω, V_BAT=12V,

T_j=25°C

t_ON2

-

80

μs

V_IN=5V to OPEN, R_L=15Ω, V_BAT=12V,

T_j=25°C

Turn-OFF TIME2

Slew rate on1

t_OFF2

-

μs

-

100

1.2

1.5

1.2

1.5

2.7

250

500

10

V_IN=0V to 5V, R_L=15Ω, V_BAT=12V,

T_j=25°C

SR_ON1

SR_OFF1

SR_ON2

SR_OFF2

V_IN(TH)

I_IN(H1)

I_IN(H2)

I_IN(L)

0.7

1.0

0.7

1.0

-

V/μs

-

V_IN=5V to 0V, R_L=15Ω, V_BAT=12V,

T_j=25°C

Slew rate off1

-

V/μs

V_IN=OPEN to 5V, R_L=15Ω, V_BAT=12V,

T_j=25°C

Slew rate on2

-

V/μs

V_IN=5V to OPEN, R_L=15Ω, V_BAT=12V,

T_j=25°C

Slew rate off2

V/μs

V

I_OUT=1mA

Input Threshold Voltage

1.5

-

High-level Input Current1

(in normal operation)

125

-

μA V_IN=5V

μA V_IN=0V

High-level Input Current2

-

(in abnormal operation) ^(Note1)

Low-level Input Current

0

-10

(Note1) When Thermal Shutdown circuit or Overcurrent Limiting circuit is ON.

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Electrical Characteristics2 (Unless otherwise specified, 40C  T_j 150C and V_IN3.0V to 5.5V)

Limit

Parameter

Symbol

Unit

Conditions

Min

3

Typ

6

Max

9

Overcurrent Detection Current

Open Load Detection Voltage

ST Output On Voltage1

I_OCP

V_OPEN

V_ST(ON1)

V_ST(ON2)

I_ST(L1)

I_ST(L2)

T_STDET

T_STREL

T _{j d}

A

V

V_IN=5V, V_BAT=12V, Tj=25°C

V_IN=0V

1.5

-

0.2

-

4.5

0.5

20

30

-

V

V_IN=5V，I_ST=1mA

-

ST Output On Voltage2

V

V_IN=0V，V_OUT=4.5V，I_ST=0.5mA

V_IN=5V，V_ST=5V

-

ST Output Leak Current1

-

μA

μs

°C

ST Output Leak Current2

-

V_IN=0V，V_OUT=1.5V，V_ST=5V

V_IN=0V，V_OUT=5V to 1V,

V_MCU=5V，R_ST=10kΩ，C_ST=10pF

ST Output Delay Time Detect

ST Output Delay Time Release

TSD Detection Temperature ^{(Note 2)}

TSD Release Temperature ^{(Note 2)}

3

-

V_IN=0V，V_OUT=1V to 5V,

V_MCU=5V，R_ST=10kΩ，C_ST=10pF

3

150

135

-

175

-

V_IN=5V

T _{j r}

-

TSD Hysteresis ^{(Note 2)}

T_j⊿_HYS

15

-

(Note 2) Not 100% tested.

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Typical Performance Curves (Unless otherwise specified, T_j=25°C,V_IN=5.0V)

54

52

50

48

46

44

42

140

130

120

110

100

90

80

-40

0

40

80

120

150

3

4

5

6

7

Input voltage: V_IN[V]

Junction Temperature: Tj[℃]

Figure 7. Output clamp voltage vs. Junction Temperature

Figure 8. On-state Resistance vs. Input voltage

320

280

240

200

160

120

80

90

80

70

60

50

40

30

20

10

0

VIN=3V

V_IN=3V

V_IN=5V

VIN=5V

40

-40

0

40

80

120

150

-40

0

40

80

120

150

Junction Temperature: Tj[℃]

Figure 10. Leak Current vs. Junction Temperature

Figure 9. On-state Resistance

vs. Junction Temperature

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Typical Performance Curves (Unless otherwise specified, T_j=25°C,V_IN=5.0V) – continued

120

100

80

60

40

20

0

100

80

60

40

20

0

3

4

5

6

7

3

4

5

6

7

Input voltage: V_IN[V]

Figure 11. Turn-ON TIME1 vs. Input voltage

Figure 12. Turn-OFF TIME1 vs. Input voltage

80

60

40

20

0

100

80

60

40

20

0

-40

0

40

80

120

150

-40

0

40

Junction Temperature: Tj[℃]

Figure 13. Turn-ON TIME1 vs. Junction Temperature

80

120

150

Junction Temperature: Tj[℃]

Figure 14. Turn-OFF TIME1 vs. Junction Temperature

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Typical Performance Curves (Unless otherwise specified, T_j=25°C,V_IN=5.0V) – continued

1.2

1.0

0.8

0.6

0.4

0.2

1.5

1.3

1.1

0.9

0.7

0.5

3

4

5

6

7

3

4

5

6

7

Input voltage: V_IN[V]

Figure 15. Slew rate on1 vs. Input voltage

Figure 16. Slew rate off1 vs. Input voltage

1.2

1.0

0.8

0.6

0.4

0.2

1.5

1.3

1.1

0.9

0.7

0.5

150

-40

0

40

80

120

-40

0

40

80

120

150

Junction Temperature: Tj[℃]

Figure 17. Slew rate on1 vs. Junction Temperature

Figure 18. Slew rate off1 vs. Junction Temperature

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Typical Performance Curves (Unless otherwise specified, T_j=25°C,V_IN=5.0V) – continued

2.7

2.3

1.9

1.5

1.1

200

150

100

50

VIN(TH) High

V_IN(TH)High

V Low

VIN_IN(₍T_THH₎)Low

0

-40

0

40

Junction Temperature: Tj[℃]

Figure 19. Input voltage vs. Junction Temperature

80

120

3

4

5

6

7

150

Input voltage: V_IN[V]

Figure 20. High-level input current1 (in normal operation)

vs. Input voltage

200

150

100

50

8

7

6

5

4

IN=3V

3

IN=4V

2

1

0

IN=5V

IN=6V

IN=7V

0

-40

0

40

80

120

150

0

2

4

6

8

10

12

Junction Temperature: Tj[℃]

Output voltage: V_OUT[V]

Figure 21. High-level input current1 (in normal

operation) vs. Junction Temperature

Figure 22. Overcurrent detection current

vs. Output voltage

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Typical Performance Curves (Unless otherwise specified, T_j=25°C,V_IN=5.0V) – continued

8

7

6

5

4

3

2

1

0

5

4

3

2

1

0

150

-40

0

40

80

120

-40

0

40

80

120

150

Junction Temperature: Tj[℃]

Figure 23. Overcurrent detection current

vs. Junction Temperature

Figure 24. Open Load Detection Voltage

vs. junction temperature

0.5

0.4

0.3

0.2

0.1

0.0

0.5

0.4

0.3

0.2

0.1

0.0

-40

0

40

80

120

150

-40

0

40

80

120

150

Junction Temperature: Tj[℃]

Figure 25. ST Output On Voltage1

vs. junction temperature

Figure 26. ST Output On Voltage2

vs. junction temperature

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Typical Performance Curves (Unless otherwise specified, T_j=25°C,V_IN=5.0V) – continued

0.30

0.25

0.20

0.15

0.10

0.05

0.00

3.0

2.5

2.0

1.5

1.0

0.5

0.0

-40

0

40

80

120

-40

0

40

80

120

150

Junction Temperature: Tj[℃]

Figure 27. ST Output Leak Current1

vs. junction temperature

Figure 28. ST Output Leak Current2

vs. junction temperature

5

4

3

2

1

0

5

4

3

2

1

0

-40

0

40

80

120

-40

0

40

80

120

150

Junction Temperature: Tj[℃]

Figure 29. ST Output Delay Time Release

vs. junction temperature

Figure 30. ST Output Delay Time

vs. junction temperature

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Measurement circuit for Typical Performance Curves

R_DS(ON)

I_OUT= 0.8A

I_OUT= 1ｍA

= V_OUT/I_OUT

OUT

ST

IN

ST

V

IN

GND

V_IN

Measurement Circuit for Figure 8,9

Measurement Circuit for Figure 7

R_L= 15Ω

A

V_OUT= 18V

V_BAT= 12V

OUT

ST

Monitor

IN

GND

0V to 5V

GND

Monitor

or

5V to 0V

Measurement Circuit for

Figure 11, 12, 13, 14, 15, 16, 17, 18

Measurement Circuit for Figure 10

R_L= 15Ω

V_BAT= 12V

R_L= 15Ω

OUT

ST

V

A

IN

GND

V

V_IN

Measurement Circuit for Figure 19

Measurement Circuit for Figure 20, 21

A

V_OUT

OUT

10kΩ

ST

V

5V

IN

GND

V_IN

Measurement Circuit for Figure 22, 23

Measurement Circuit for Figure 24

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Measurement circuit for Typical Performance Curves – continued

V_OUT= 4.5V

12V

OUT

GND

ST

IN

I_OUT= 0.5ｍA

I_ST= 1mA

V

IN

GND

V_IN

Measurement Circuit for Figure 26

Measurement Circuit for Figure 25

V_OUT= 1.5V

OUT

GND

OUT

A

ST

IN

A

ST

V_ST= 5V

5V

IN

GND

V_IN

Measurement Circuit for Figure 28

Measurement Circuit for Figure 27

1V to 5V

or

5V to 1V

OUT

10kΩ

ST

5V

Monitor

10pF

IN

GND

Measurement Circuit for Figure 29, 30

I/O Pin Truth Table

Operating

Status

Input

Signal

Output

Level

ST

Level

L

H

L

H

L

H

L

Normal

L

H

Overcurrent

Load open

H

L

Clamp

L

H

L

H

L

H

Over

Temperature

H

L

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Timing Chart

V_IN[V]

V_IN

V_IN(TH)

0

t

V_OUT[V]

V_OUT(CL)

V_OUT

V_BAT

I_OUTx R_DS(ON)

0

I_OUT[A]

V_BAT

Z_L+ R_DS(ON)

I_OUT

0

t

Figure 31. Inductive Load Operation

V_IN[V]

tr ≤ 0.1[μs]

tf ≤ 0.1[μs]

5V

V_IN

90%

10%

0

ｔ

V_OUT[V]

t_ON[μs]

t_OFF[μs]

≈12V

≈ 0V

90%

V_OUT

10%

0

ｔ

SR_OFF[V/μs]

SR_ON[V/μs]

Figure 32. Switching Time

V_IN[V]

V_IN

V_IN=0V

0

t

V_OUT[V]

5V

1V

5V

1V

4.5V

V_OUT

1.5V

0

t

V_ST[V]

T_STDET

T_STREL

≈5V

≈0V

5V

≈5V

≈0V

V_ST

2.5V

0

t

Figure 33. ST Output Delay Time

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BV1LC105FJ-C BM2LC105FJ-C

Marking Diagram

 BV1LC105FJ-C

 BM2LC105FJ-C

SOP-J8(TOP VIEW)

Part Number Marking

LOT Number

1 L C 1 0

2 L C 1 0

LOT Number

1PIN MARK

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Physical Dimension, Tape and Reel Information

Package Name

SOP-J8

Tape and Reel information

Embossed carrier tape

Tape

Quantity

2500pcs

E2

Direction

of Feed

The direction is the 1pin of product is at the upper left when you

hold reel on the left hand and pull out the tape on the right hand

Direction of Feed

1pin

※Order quantity need to be multiple of minimum quantity.

Reel

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Operational Notes

1. Grounding Interconnection Pattern

When a small-signal ground and a high-current ground are used, it is recommended to isolate the high-current

grounding interconnection pattern and the small-signal grounding interconnection pattern and establish a single

ground at the reference point of a set so that voltage changes due to the resistance and high current of patterned

interconnects will not cause any changes in the small-signal ground voltage. Pay careful attention to prevent changes

in the interconnection pattern of ground for external components.

The ground lines must be as short and thick as possible to reduce line impedance.

2. Thermal Consideration

The amount of heat generated depends on the On-state resistance and Output current.

Should by any condition the maximum junction temperature Tjmax = 150 °C rating be exceeded by the temperature

increase of the chip, it may result in deterioration of the properties of the chip. The thermal impedance in this

specification is based on recommended PCB and measurement condition by JEDEC standard. Verify the application

and allow sufficient margins in the thermal design.

3. Absolute Maximum Ratings

Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit

between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit

protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings.

4. Inspections on Set Board

If a capacitor is connected to a low-impedance pin in order to conduct inspections of the IC on a set board, stress may

apply to the IC. To avoid that, be sure to discharge the capacitor in each process. In addition, to connect or disconnect

the IC to or from a jig in the testing process, be sure to turn OFF the power supply prior to connecting the IC, and

disconnect it from the jig only after turning OFF the power supply. Furthermore, in order to protect the IC from static

electricity, establish a ground for the IC assembly process and pay utmost attention to transport and store the IC.

5. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in

damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.

Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and

unintentional solder bridge deposited in between pins during assembly to name a few.

6. Ceramic Capacitor

When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with

temperature and the decrease in nominal capacitance due to DC bias and others.

7. Thermal Shutdown Circuit

IC has a built-in thermal shutdown circuit as an overheat-protection measure. The circuit is designed to turn OFF

output when the temperature of the IC chip exceeds 175C (Typ) and return the IC to the normal operation when the

temperature falls below 160C (Typ).

The thermal shutdown circuit is a circuit absolutely intended to protect the IC from thermal runaway, not intended to

protect or guarantee the IC. Consequently, do not operate the IC based on the subsequent continuous use or

operation of the circuit.

8. Overcurrent Limiting Circuit

IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection

circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used

in applications characterized by continuous operation or transitioning of the protection circuit.

9. Overvoltage (Active Clamp) Protection Function

IC has a built-in overvoltage protection function in order for the IC to absorb counter-electromotive force energy

generated when inductive load is turned OFF. Since the input voltage is clamped at 0V. When the active clamp circuit

is activated, the thermal shutdown circuit is disabled.

10. Counter-electromotive Force

Fully ensure that the counter-electromotive force presents no problems in the operation of the IC.

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Operational Notes – continued

11. Negative Current of Output

When supply a negative current from OUT(DRAIN) terminal in the state that supplied the voltage to IN terminal. The

current pass from IN terminal to OUT(DRAIN) terminal through a parasitic transistor and voltage of IN terminal

descend as shown in Figure 34 and Figure 35.

As shown in Figure 34 power MOS is turned on, set the OUT(DRAIN) terminal is more than -0.3V. Because a

negative current may be passed to OUT(DRAIN) terminal from a power supply of the connection of the IN terminal

(MCU, and so on).

As shown in Figure 35 power MOS is turned off, add a restriction resistance higher than 330 Ω to IN terminal.

Because a negative current may be passed to DRAIN terminal from GND of the connection of the IN terminal.

The restriction resistance value, set up in consideration of the voltage descent caused by the IN terminal current.

MCU

GND

(SOURCE)

N+

330Ω

IN

N+

P+

P-

Parasitic Element

N-epi

N+sub

OUT

(DRAIN)

Figure 34. Negative current path (when power MOS is turned on)

MCU

GND

(SOURCE)

N+

330Ω

IN

N+

P+

P-

Parasitic Element

N-epi

N+sub

OUT

(DRAIN)

Figure 35. Negative current path (when power MOS is turned off)

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Revision History

Date

Revision

001

Changes

23.Mar.2017

New Release

P1 Line up was corrected.

P1 General Description was corrected.

P2 Block Dagrams was corrected.

P9 Electrical Characteristics ST Output Delay Time Detect and ST Output Delay

Time Release conditions were corrected.

22.Sep.2017

002

P17 Measurement Circuit for Figjre 29, 30 was corrected.

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Notice

Precaution on using ROHM Products

(Note 1)

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment

,

aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,

bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales

representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way

responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any

ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN

USA

EU

CHINA

CLASSⅢ

CLASSⅣ

CLASSⅡb

CLASSⅢ

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate

safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which

a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety

[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.

Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the

use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our

Products under any special or extraordinary environments or conditions (as exemplified below), your independent

verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents

[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust

[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves

[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items

[f] Sealing or coating our Products with resin or other coating materials

[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning

residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design.

5. Please verify and confirm characteristics of the final or mounted products in using the Products.

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power

exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect

product performance and reliability.

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in

the range that does not exceed the maximum junction temperature.

8. Confirm that operation temperature is within the specified range described in the product specification.

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must

be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,

please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-PAA-E

Rev.003

Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static

characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely

responsible for it and you must exercise your own independent verification and judgment in the use of such information

contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses

incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper

caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be

applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,

isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2

[b] the temperature or humidity exceeds those recommended by ROHM

[c] the Products are exposed to direct sunshine or condensation

[d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period

may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is

exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton.

4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign

trade act, please consult with ROHM in case of export.

Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any

other rights of any third party regarding such information or data.

2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the

Products with other articles such as components, circuits, systems or external equipment (including software).

3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM

will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to

manufacture or sell products containing the Products, subject to the terms and conditions herein.

Other Precaution

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM.

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction

weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

Notice-PAA-E

Rev.003


型号：	BV1LC105FJ-C
厂家：	ROHM
描述：	BV1LC105FJ-C是1ch的车载用低边开关。内置过电流限制电路、过热保护电路、过电压（有源钳位）保护电路、开路检测电路。开关
文件：	总26页 (文件大小：1970K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BV1LC105FJ-C [ROHM]

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